Inlay (40) comprising a substrate (41) and a first zigzag portion (42) formed of a metal wire (421) embedded in an upper face (43) of the substrate (41), the first zigzag portion (42) comprising, alternately, rectilinear segments (422) and bends (423), at least one of the rectilinear segments (422) of the first zigzag portion (42) being disposed, at least in part, in a zone (45) of the upper face (43) of the substrate (41) configured to form a spotface of a cavity of an electronic document, and the inlay (40) comprising a connection wire (47) configured to join together at least the rectilinear segments (422) of the first zigzag portion (42). Method for producing an electronic document (1) comprising such an inlay (40), and electronic document (1).
Legal claims defining the scope of protection, as filed with the USPTO.
2. The inlay according to claim 1, wherein the connection wire comprises a part which intersects at least the at least one first zigzag portion outside a zone of the upper face of the substrate configured to form a deep part of the cavity.
3. The inlay according to claim 2, wherein the connection wire further comprises at least one part disposed next to the at least one first zigzag portion, and the at least one part of the connection wire disposed next to the at least one first zigzag portion further comprises at least one end disposed in the zone of the upper face of the substrate configured to form the deep part of the cavity.
4. The inlay according to claim 3, wherein the at least one of the rectilinear segments of the at least one first zigzag portion forms an angle of between 80° and 100° with respect to a limit between the zone of the upper face of the substrate configured to form the spotface of the cavity and the zone of the upper face of the substrate is configured to form the deep part of the cavity.
5. The inlay according to claim 3, wherein the at least one of the rectilinear segments of the at least one first zigzag portion comprises a second end, which extends in the zone of the upper face of the substrate configured to form the deep part of the cavity.
6. The inlay according to claim 2, wherein the connection wire further comprises a part which intersects at least the at least one first zigzag portion in a zone of the upper face of the substrate configured to be outside the cavity.
7. The inlay according to claim 3, wherein the connection wire further comprises a part which intersects at least the at least one first zigzag portion in a zone of the upper face of the substrate configured to be outside the cavity.
8. The inlay according to claim 2, wherein the at least one of the rectilinear segments of the at least one first zigzag portion forms an angle of between 80° and 100° with respect to a limit between the zone of the upper face of the substrate configured to form the spotface of the cavity and the zone of the upper face of the substrate is configured to form the deep part of the cavity.
9. The inlay according to claim 8, wherein the at least one of the rectilinear segments of the at least one first zigzag portion comprises a second end, which extends in the zone of the upper face of the substrate configured to form the deep part of the cavity.
10. The inlay according to claim 8, wherein the connection wire further comprises a part which intersects at least the at least one first zigzag portion in a zone of the upper face of the substrate configured to be outside the cavity.
11. The inlay according to claim 2, wherein the at least one of the rectilinear segments of the at least one first zigzag portion comprises a second end, which extends in the zone of the upper face of the substrate configured to form the deep part of the cavity.
12. The inlay according to claim 1, wherein the connection wire further comprises a part which intersects at least the at least one first zigzag portion in a zone of the upper face of the substrate configured to be outside the cavity.
13. The inlay according to claim 12, wherein the at least one of the rectilinear segments of the at least one first zigzag portion further comprises at least one end, called a first end, which extends in the zone of the upper face of the substrate configured to be outside the cavity.
14. The inlay according to claim 1, wherein the inlay additionally comprises at least one second zigzag portion disposed, at least in part, in the zone of the upper face of the substrate configured to form the spotface of the cavity.
15. The inlay according to claim 14, wherein the connection wire is additionally configured to join together at least the at least one first zigzag portion and the at least one second zigzag portion.
17. The method according to claim 16, wherein forming the cavity in the body further comprises forming a deep part of the cavity, a zone of the upper face of the substrate being configured to form the deep part of the cavity is machined.
18. The method according to claim 17, wherein a second end of the at least one of the rectilinear segments of the at least one first zigzag portion is then cut by the machine tool.
19. The method according to claim 17, wherein an end of a part of the connection wire disposed next to the at least one first zigzag portion is then cut by the machine tool.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
June 16, 2023
July 30, 2024
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