A wire bonding includes a capillary that extrudes a wire; a wire clamp assembly disposed on the capillary; a support disposed on the wire clamp assembly; a wire contact member; and a slide rail that provides a slide hole. The wire clamp assembly includes: a first member; a second member spaced apart from the first member; a first contact member coupled to the first member; and a second contact member coupled to the second member and spaced apart from the first contact member. The first member includes a first body that extends in a first direction and a first tilting member that extends at an acute angle relative to the first direction. The second member includes a second body that extends in the first direction and is spaced apart from the first body in a second direction a second tilting member.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The wire bonding apparatus of claim 1, wherein the wire clamp assembly is rotatable.
3. The wire bonding apparatus of claim 1, wherein the wire clamp assembly is coupled through a slide block to the slide hole.
6. The wire bonding apparatus of claim 5, wherein each of the first and second contact members includes sapphire.
7. The wire bonding apparatus of claim 5, wherein the first member and the second member are connected to each other through a resilient member.
8. The wire bonding apparatus of claim 5, wherein the support is coupled to an upper side of the wire clamp assembly and provides a support through hole that extends in a third direction intersecting the first and second directions.
10. The wire bonding apparatus of claim 9, wherein the wire contact member includes sapphire.
12. The wire bonding apparatus of claim 11, wherein the wire clamp assembly is coupled through a slide block to the slide hole.
13. The wire bonding apparatus of claim 5, further comprising a wire tensioner on the support.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 30, 2022
August 6, 2024
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