Semiconductor flipper

2. The wafer flipping method of claim 1, comprising gripping said semiconductor work product between a first gripping frame and a second gripping frame.

3. The wafer flipping method of claim 1, comprising receiving pneumatic power from a support into said rotating assembly and supplying said pneumatic power to said gripper.

4. The wafer flipping method of claim 3, comprising using a rotary joint with respective feed and return connections to provide a pneumatic circuit.

5. The wafer flipping method of claim 1, comprising using a slip ring for supplying electrical power from a support to said assembly.

6. The wafer flipping method of claim 1, comprising pushing the semiconductor work product using a plunger pin against respective extended alignment pins of said retractable pins to align said work product.

7. The wafer flipping method of claim 6, comprising operating said alignment pins via solenoids.

8. The wafer flipping method of claim 7, wherein the solenoids are powered through a slip ring from at least one electronic controller mounted outside said rotating assembly.

9. The wafer flipping method of claim 1, wherein said second position is rotated by up to a hundred and eighty degrees from said first position.

10. The wafer flipping method of claim 1, wherein the semiconductor work product is a wafer or a ring.

11. The wafer flipping method of claim 1, comprising operating a release actuator for releasing said semiconductor work product from said gripper when in said second rotated position, said semiconductor work product thereby being released in a predetermined alignment at said second rotated position.

13. The wafer flipping device of claim 12, wherein said rotating assembly comprises a rotary joint for receiving pneumatic power from a support for supply to each of said frame parts.

14. The wafer flipping device of claim 13, wherein said rotary joint is located on a rotation axis of said rotating assembly.

15. The wafer flipping device of claim 12, wherein said rotating assembly comprises a slip ring for supplying electrical power from a support to said assembly.

16. The wafer flipping device of claim 12, wherein alignment pins of said retractable pins are for aligning semiconductor work products of respective ones of a plurality of different sizes or shapes, each size or shape having a respective predetermined alignment.

17. The wafer flipping device of claim 16, wherein said alignment pins are operated via at least one electronic controller mounted outside said rotating assembly, and/or wherein said frame parts are operated via at least one electronic controller mounted outside said rotating assembly.

18. The wafer flipping device of claim 17, wherein said at least one electronic controller is connected to power said alignment pins or said frame parts.

19. The wafer flipping device of claim 18, wherein said alignment pins or said frame parts are powered via a slip-ring.

20. The wafer flipping device of claim 12, wherein said retractable pins are provided in pairs, and at least one of each pair of said alignment pins comprises an alignment pin.

21. The wafer flipping device of claim 12, comprising a pneumatic distribution system for distributing pneumatic fluid from said rotary valve to respective ones of said gripper frame parts.

22. The wafer flipping device of claim 12, wherein said second orientation is rotated by a hundred and eighty degrees from said first orientation.

23. The wafer flipping device of claim 12, wherein the semiconductor work product is a wafer or a ring.