A packaged electronic device includes a package structure with opposite first and second sides spaced apart from one another along a first direction, and opposite third and fourth sides spaced apart from one another along a second direction, as well as first and second leads. The first lead includes a first portion that extends outward from the third side of the package structure and extends downward toward a plane of the first side and away from a plane of the second side. The second lead includes a first portion that extends outward from the third side of the package structure, and the second lead extends upward toward the plane of the second side and away from the plane of the first side to allow connection to another circuit or component, such as a second packaged electronic device, a passive circuit component, a printed circuit board, etc.
Legal claims defining the scope of protection, as filed with the USPTO.
7. The method of claim 6, wherein the third portions of the respective first and third leads extend from the second portion away from the package structure to form gull wing lead shapes for the respective second and fourth leads.
8. The method of claim 6, wherein the third portions of the respective second and fourth leads extend from the second portion toward the package structure to form J-lead shapes for the respective second and fourth leads.
10. The method of claim 5, wherein the third portions of the respective first and third leads extend from the second portion away from the package structure to form gull wing lead shapes for the respective first and third leads.
11. The method of claim 10, wherein the third portion of the second lead extends from the second portion toward the package structure to form a J-lead shape for the second lead.
12. The method of claim 4, wherein the third portion of the second lead extends from the second portion toward the package structure to form a J-lead shape for the second lead.
15. The method of claim 14, wherein the component directly electrically connected to the second lead is a second packaged electronic device.
16. The method of claim 15, wherein the component directly electrically connected to the second lead is a passive circuit component.
17. The method of claim 15, wherein the component directly electrically couples together two leads of the packaged electronic device.
19. The method of claim 8, wherein J-lead shape does not contact the package structure.
20. The method of claim 14, wherein the third portion of the second lead extends from the second portion toward the package structure to form a J-lead shape for the second lead.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
April 27, 2023
August 27, 2024
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