An integrated circuit device includes a substrate, a peripheral circuit structure disposed on the substrate, the peripheral circuit structure including a peripheral circuit and a lower wiring connected to the peripheral circuit, a conductive plate covering a portion of the peripheral circuit structure, a cell array structure disposed on the peripheral circuit structure with the conductive plate therebetween, the cell array structure including a memory cell array and an insulation layer surrounding the memory cell array, a through hole via passing through the insulation layer in a direction vertical to a top surface of the substrate to be connected to the lower wiring, and an etch guide member disposed in the insulation layer at the same level as the conductive plate to contact a portion of the through hole via.
Legal claims defining the scope of protection, as filed with the USPTO.
3. The integrated circuit device of claim 2, wherein the etch guide member is disposed at one side of the through hole via.
8. The integrated circuit device of claim 7, wherein a material of the etch guide member has an etch selectivity with respect to a material of the insulation layer.
11. The integrated circuit device of claim 10, wherein the through hole via is electrically connected to an upper wiring disposed at a vertical level that is higher than a vertical level of the channel structure.
12. The integrated circuit device of claim 10, wherein a portion of the etch guide member comprises a portion damaged by dry etching in a direction contacting the through hole via.
16. The integrated circuit device of claim 14, wherein the etch guide member is spaced apart from an uppermost layer of the plurality of lower wiring layers contacting the through hole via in a horizontal direction so as not to overlap each other.
17. The integrated circuit device of claim 14, wherein the etch guide member is spaced apart from an uppermost layer of the plurality of lower wiring layers in a vertical direction and is also spaced apart from the plate common source line in a horizontal direction.
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May 17, 2021
October 8, 2024
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