A package mold according to some embodiments includes a first mold body and a second mold body, a mold cavity in the first mold body, a gate in a first side of the mold cavity for supplying liquid mold compound into the mold cavity, a longitudinal vent for releasing gas from the mold cavity in a second side of the mold cavity opposite the first side of the mold cavity, and a transverse vent for releasing gas from the mold cavity in a third side of the mold cavity that extends between the first and second sides of the mold cavity. Methods of packaging an electronic device using the package mold and resulting packaged devices are also disclosed.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The package mold of claim 1, wherein the transverse vent comprises a first transverse vent and a second transverse vent in the third side of the mold cavity.
3. The package mold of claim 1, further comprising another transverse vent for releasing gas from the mold cavity in a fourth side of the mold cavity that is opposite the third side of the mold cavity, and extends from the first side of the mold cavity to the second side of the mold cavity and between the first and second sides of the mold cavity.
4. The package mold of claim 3, wherein the mold cavity-another transverse vent comprises a third transverse vent and a fourth transverse vent in the fourth side of the mold cavity.
6. The packaged semiconductor device of claim 5, wherein the vent support comprises a metal tab having a hole therethrough at the third side of the mold cavity.
7. The packaged semiconductor device of claim 5, wherein the transverse vent comprises a first transverse vent and a second transverse vent at the third side of the mold cavity.
8. The packaged semiconductor device of claim 7, wherein the vent support comprises a first vent support and a second vent support at the third side of the molded package body mold cavity aligning with the first transverse vent and the second transverse vent respectively.
9. The packaged semiconductor device of claim 5, wherein the molded package body further comprises another transverse vent for releasing gas from the mold cavity in a fourth side of the mold cavity that is opposite the third side of the mold cavity, and extends from the first side of the mold cavity to the second side of the mold cavity and between the first and second sides of the mold cavity, and wherein the leadframe further comprises another vent support that extends away from the fourth side of the mold cavity and aligns with the another transverse vent.
10. The packaged semiconductor device of claim 9, wherein the another transverse vent comprises a third transverse vent and a fourth transverse vent at the fourth side of mold cavity.
11. The packaged semiconductor device of claim 10, wherein the another vent support comprises a third vent support and a fourth vent support at the fourth side of the mold cavity aligning with the third transverse vent and the fourth transverse vent respectively.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 22, 2021
October 15, 2024
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