A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The sensor package substrate as claimed in claim 1, wherein a diameter of the third section of the through hole is greater than the diameter of the first section of the through hole.
3. The sensor package substrate as claimed in claim 2, wherein the first section of the through hole is a section closest to the side of the one surface.
4. The sensor package substrate as claimed in claim 3, wherein the second section of the through hole is a section closest to the side of the another surface.
5. The sensor package substrate as claimed in claim 4, wherein the third section of the through hole is shorter than each of the first and second sections of the through hole.
9. The sensor package substrate as claimed in claim 8, wherein the diameter of the third section at a second end connected to the second section is smaller than the diameter of the second section.
10. The sensor package substrate as claimed in claim 9, wherein the diameter of the first section is smaller than the diameter of the second section.
15. The sensor package substrate as claimed in claim 14, wherein a depth position of the electronic component overlaps a depth position of the third section of the through hole.
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August 24, 2022
October 22, 2024
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