A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The heat dissipating device of claim 1, further comprising a wick structure disposed in the recessed portion.
3. The heat dissipating device of claim 1, wherein the plurality of heat transfer structures have same length.
4. The heat dissipating device of claim 1, wherein at least one first supporting structure of the plurality of the first supporting structures is disposed between two heat transfer structures.
5. The heat dissipating device of claim 1, wherein one or more first support structures are located only in some of the rows of the heat transfer structures.
6. The heat dissipating device of claim 5, wherein the heat transfer structures are discontinuous in the rows of the heat transfer structures including the one or more first support structures.
13. The method of claim 9, further comprising vacuuming out air from the heat dissipating device prior to sealing the working pipe.
14. The method of claim 9, wherein securing the working pipe to the first casing includes securing the working pipe in an opening in one side in a bonding edge disposed along all sides of the first casing and enclosing the internal space.
15. The method of claim 9, wherein at least one first supporting structure of the plurality of the first supporting structures is disposed between two heat transfer structures.
16. The method of claim 9, wherein one or more first support structures are located only in some of the rows of the heat transfer structures.
17. The method of claim 16, wherein the heat transfer structures are discontinuous in the rows of the heat transfer structures including the one or more first support structures.
18. The method of claim 9, wherein the plurality of heat transfer structures are rectangular-shaped.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
February 23, 2023
December 24, 2024
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