The present disclosure provides for integrated cooling systems including backside power delivery and methods of manufacturing the same. An integrated cooling assembly may include a device and a cold plate. The cold plate has a first side and an opposite second side, the first side having a recessed surface, sidewalls around the recessed surface that extend downwardly therefrom to define a cavity, and a plurality of support features disposed in the cavity. The first side of the cold plate is attached to a backside of the device to define a coolant channel therebetween. The cold plate includes a substrate, a dielectric layer disposed on a first surface of the substrate, a first conductive layer disposed between the first surface and the dielectric layer, a second conductive layer disposed on a second surface of the substrate, and thru-substrate interconnects connecting the first conductive layer to the second conductive layer.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The integrated cooling assembly of claim 1, wherein a coefficient of thermal expansion (CTE) of the cold plate is about the same as a CTE of the device.
3. The integrated cooling assembly of claim 1, wherein the second conductive layer comprises a power plane or a ground plane.
4. The integrated cooling assembly of claim 1, wherein the cold plate is attached to the device by direct hybrid bonds formed therebetween, the device being electrically connected to the first conductive layer by the direct hybrid bonds.
5. The integrated cooling assembly of claim 1, wherein the plurality of support features and the sidewalls define a bonding interface with the device.
6. The integrated cooling assembly of claim 5, wherein the first conductive layer is electrically connected to the backside of the device through openings in the dielectric layer, and the openings are disposed between the support features and the backside of the device.
9. The integrated cooling assembly of claim 5, wherein each of the plurality of support features is hybrid bonded to the device at the bonding interface.
10. The integrated cooling assembly of claim 5, wherein each of the plurality of support features is attached to the device by direct dielectric bonds.
12. The integrated cooling assembly of claim 1, wherein the backside of the device comprises a redistribution layer, and the redistribution layer comprises interconnections between the first conductive layer and circuitry on the active side of the device.
13. The integrated cooling assembly of claim 12, wherein the conductive layers and vias of the cold plate form a power/ground delivery network, the bonding comprises direct hybrid bonding, the direct hybrid bonding electrically couples the power/ground delivery network, and the conductive elements are disposed in, on, and/or through the backside of the device.
14. The integrated cooling assembly of claim 12, wherein the cold plate is directly bonded to the device without the use of an intervening adhesive.
16. The integrated cooling assembly of claim 15, wherein the conductive layers and vias of the cold plate form a power/ground delivery network, the bonding comprises direct hybrid bonding, the direct hybrid bonding electrically couples the power/ground delivery network, and the conductive elements are disposed in, on, and/or through the backside of the device.
17. The integrated cooling assembly of claim 15, wherein the cold plate is directly bonded to the device without the use of an intervening adhesive.
19. The integrated cooling assembly of claim 18, wherein the conductive layers and vias of the cold plate form a power/ground delivery network, the bonding comprises direct hybrid bonding, the direct hybrid bonding electrically couples the power/ground delivery network, and the conductive elements are disposed in, on, and/or through the backside of the device.
20. The integrated cooling assembly of claim 18, wherein the cold plate is directly bonded to the device without the use of an intervening adhesive.
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