Lift pin interface in a substrate support

1. A lift pin interface in an electrostatic chuck, comprising: a dielectric plate having a support surface for a substrate; a conductive plate disposed beneath the dielectric plate and having an opening formed therethrough, wherein the dielectric plate includes a protrusion extending into the opening in the conductive plate; and a lift pin guide disposed in the opening, wherein the lift pin guide includes one or more features that extend from an upper surface of the lift pin guide and that overlap with the protrusion of the dielectric plate, wherein the one or more features include at least one shoulder, wherein the protrusion in the dielectric plate includes a countersink that mates with a shoulder of the at least one shoulder, and wherein the lift pin guide includes a passageway to accommodate a lift pin.

2. The lift pin interface of claim 1, wherein the one or more features include a single inner shoulder disposed around the passageway.

3. The lift pin interface of claim 1, further comprising: an o-ring disposed on the upper surface of the lift pin guide between the lift pin guide and the protrusion.

4. The lift pin interface of claim 1, wherein the one or more features include two shoulders, and wherein the protrusion extends between the two shoulders.

5. The lift pin interface of claim 4, further comprising: an o-ring disposed on the upper surface of the lift pin guide between the two shoulders.

6. The lift pin interface of claim 4, wherein the two shoulders include an inner shoulder disposed around the passageway and an outer shoulder, wherein the countersink mates with the inner shoulder, and wherein the outer shoulder surrounds the protrusion.

7. The lift pin interface of claim 4, wherein the two shoulders have the same length.

8. The lift pin interface of claim 4, wherein the two shoulders have different lengths.

9. The lift pin interface of claim 1, further comprising an insulative coating disposed atop an upper surface of the conductive plate.

10. The lift pin interface of claim 9, further comprising an elastomer bond layer disposed atop the insulative coating.

11. The lift pin interface of claim 1, further comprising a compliant, gap-filling material disposed between an outer periphery of the protrusion and a surrounding portion of the opening.

12. An electrostatic chuck, comprising: a dielectric plate having a support surface for a substrate; one or more electrodes disposed in the dielectric plate; a conductive plate disposed beneath the dielectric plate and having an opening formed therethrough, wherein the dielectric plate includes a protrusion extending into the opening in the conductive plate; and a lift pin guide disposed in the opening, wherein the lift pin guide includes one or more features that extend from an upper surface of the lift pin guide and that overlap with the protrusion of the dielectric plate, wherein the lift pin guide includes a passageway to accommodate a lift pin, wherein the one or more features include either a single inner shoulder disposed around the passageway or a single outer shoulder that surrounds the protrusion, wherein the protrusion in the dielectric plate includes a countersink that mates with the single inner shoulder or the single outer shoulder, and wherein the dielectric plate and the protrusion include openings aligned with the passageway in the lift pin guide to form a lift pin opening such that the lift pin can move sufficiently to extend beyond the support surface of the dielectric plate and to retract beneath the support surface.

13. The electrostatic chuck of claim 12, further comprising: an insulative coating disposed atop an upper surface of the conductive plate; and an elastomer bond layer disposed atop the insulative coating.

14. A substrate support including an electrostatic chuck, comprising: a conductive plate having an opening formed therethrough; a dielectric plate having a support surface for a substrate coupled to the conductive plate, wherein the dielectric plate includes a protrusion extending into the opening in the conductive plate; an elastomer bond layer disposed between the conductive plate and the dielectric plate; one or more electrodes disposed in the dielectric plate and configured to be coupled to a chucking power supply; and a lift pin guide disposed in the opening of the conductive plate, wherein the lift pin guide includes one or more features that extend from an upper surface of the lift pin guide and that overlap with the protrusion of the dielectric plate, wherein the one or more features include a shoulder, wherein the protrusion in the dielectric plate includes a countersink that mates with the shoulder, and wherein the lift pin guide includes a passageway to accommodate a lift pin.

15. The substrate support of claim 14, further comprising: a chucking power supply coupled to the one or more electrodes; an RF power supply coupled to the conductive plate; and an insulative plate disposed beneath the conductive plate to insulate the conductive plate from ground.

16. A lift pin interface in an electrostatic chuck, comprising: a dielectric plate having a support surface for a substrate; a conductive plate disposed beneath the dielectric plate and having an opening formed therethrough, wherein the dielectric plate includes a protrusion extending into the opening in the conductive plate; and a lift pin guide disposed in the opening, wherein the lift pin guide includes one or more features that extend from an upper surface of the lift pin guide and that overlap with the protrusion of the dielectric plate, wherein the one or more features include either a single inner shoulder disposed around the passageway or a single outer shoulder that surrounds the protrusion, wherein the protrusion in the dielectric plate includes a countersink that mates with the single inner shoulder or the single outer shoulder, and wherein the lift pin guide includes a passageway to accommodate a lift pin.