A semiconductor device includes a substrate, at least one semiconductor fin, and at least one epitaxy structure. The semiconductor fin is present on the substrate. The semiconductor fin has at least one recess thereon. The epitaxy structure is present in the recess of the semiconductor fin. The epitaxy structure includes a topmost portion, a first portion and a second portion arranged along a direction from the semiconductor fin to the substrate. The first portion has a germanium atomic percentage higher than a germanium atomic percentage of the topmost portion and a germanium atomic percentage of the second portion.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of manufacturing a semiconductor device, the method comprising: forming a semiconductor fin on a substrate, the semiconductor fin comprising a first material; and embedding a second material different from the first material within the semiconductor fin, wherein the second material has a series of concentration gradients comprising in order from a top region of the second material towards a bottom of the second material a first concentration gradient, a second concentration gradient opposite the first concentration gradient, a third concentration gradient opposite the second concentration gradient, and a fourth concentration gradient opposite the third concentration gradient.
2. The method of claim 1, wherein the series of concentration gradients is a series of germanium concentration gradients.
3. The method of claim 1, further comprising forming a source/drain contact in physical contact with the second material.
4. The method of claim 3, wherein the source/drain contact comprises tungsten.
5. The method of claim 1, further comprising forming a doped region located between the first material and the second material.
6. The method of claim 5, wherein the doped region comprises boron.
7. The method of claim 6, wherein the doped region has a boron concentration from about 1e17 cm−3 to about 1e21 cm−3.
8. A method of manufacturing a semiconductor device, the method comprising: forming a semiconductor fin over a substrate, the semiconductor fin comprising silicon;, and forming a source/drain region of silicon-germanium in a recess in the semiconductor fin, the source/drain region comprising a first region located between a second region and a third region, the first region having a concentration gradient of germanium that is opposite the second region and the third region.
9. The method of claim 8, wherein a germanium concentration within the third region is between about 25%-atomic and about 55%-atomic.
10. The method of claim 8, further comprising forming a source/drain contact in physical contact with the source/drain region of silicon-germanium at an interface above the semiconductor fin.
11. The method of claim 8, further comprising forming a doped layer within the semiconductor fin.
12. The method of claim 11, wherein the doped layer comprises boron.
13. The method of claim 12, wherein a boron concentration within the doped layer is between about 1e17 cm−3 to about 1e21 cm−3.
14. A method of manufacturing a semiconductor device, the method comprising: forming a semiconductor fin over a substrate; and forming a source/drain region within the semiconductor fin, the source/drain region comprising: a first portion at a first distance away from the semiconductor fin, the first portion having a first concentration gradient of germanium; a second portion at a second distance away from the semiconductor fin, the second distance being less than the first distance, the second portion having a second concentration gradient of germanium greater than the first gradient concentration of germanium; a third portion at a third distance away from the semiconductor fin, the third distance being greater than the first distance, the third portion having a third concentration gradient of germanium greater than the first concentration gradient of germanium; and a fourth portion at a fourth distance away from the semiconductor fin greater than the third distance, the fourth portion having a fourth concentration gradient of germanium less than the third concentration gradient of germanium.
15. The method of claim 14, wherein the third concentration gradient of germanium is between about 25%-atomic and about 55%-atomic.
16. The method of claim 14, further comprising forming a doped layer in the semiconductor fin.
17. The method of claim 16, wherein forming the doped layer comprises doping a portion of the semiconductor fin with a first dopant, wherein the doped layer has an uneven distribution of the first dopant.
18. The method of claim 17, wherein a first dopant concentration within the doped layer is between about 1e17 cm−3 to about 1e21 cm−3.
19. The method of claim 18, wherein the first dopant comprises boron.
20. The method of claim 14, further comprising forming a source/drain contact in physical contact with the source/drain region at an interface above the semiconductor fin.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 17, 2023
February 25, 2025
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