Integrated circuit package for isolation dies

1. An isolation device comprising: an isolation die having bond pads; a first lead frame having first leads, the isolation die being mounted on the first lead frame with a portion of the bond pads coupled to respective first leads; first mold material encapsulating the isolation die and the first lead frame forming a first package; a second lead frame having second leads, the first package being mounted on the second lead frame with a portion of the first leads coupled to respective second leads; and second mold material encapsulating the first package and the second lead frame, wherein the second lead frame is a pre-molded lead frame, further comprising a third mold material encapsulating the second lead frame and forming a flat surface on which the first package is mounted.

2. An isolation device comprising: an isolation die having bond pads; a first lead frame having first leads, the isolation die being mounted on the first lead frame with a portion of the bond pads coupled to respective first leads, wherein the first lead frame is plated with a first material; first mold material encapsulating the isolation die and the first lead frame forming a first package; a second lead frame having second leads, the first package being mounted on the second lead frame with a portion of the first leads coupled to respective second leads, wherein the second lead frame is plated with a second material that is different from the first material; and second mold material encapsulating the first package and the second lead frame.

3. A system comprising: a substrate that includes a first voltage domain and a second voltage domain; first circuitry mounted on the substrate in the first voltage domain, the first circuitry having a first signal terminal; second circuitry mounted on the substrate in the second voltage domain, the second circuitry having a second signal terminal; and an isolation device having an input terminal coupled to the first terminal and an output terminal coupled to the second terminal, wherein the isolation device comprises: an isolation die having bond pads; a first lead frame having first leads, the isolation die being mounted on the first lead frame with a portion of the bond pads coupled to respective first leads; first mold material encapsulating the isolation die and the first lead frame forming a first package; a second lead frame having second leads, the first package being mounted on the second lead frame with a portion of the first leads coupled to respective second leads; and second mold material encapsulating the first package and the second lead frame, wherein the second lead frame is a pre-molded lead frame, further comprising a third mold material encapsulating the second lead frame and forming a flat surface on which the first package is mounted.

4. A system comprising: a substrate that includes a first voltage domain and a second voltage domain; first circuitry mounted on the substrate in the first voltage domain, the first circuitry having a first signal terminal; second circuitry mounted on the substrate in the second voltage domain, the second circuitry having a second signal terminal; and an isolation device having an input terminal coupled to the first terminal and an output terminal coupled to the second terminal, wherein the isolation device comprises: an isolation die having bond pads; a first lead frame having first leads, the isolation die being mounted on the first lead frame with a portion of the bond pads coupled to respective first leads, wherein the first lead frame is plated with a first material; first mold material encapsulating the isolation die and the first lead frame forming a first package; a second lead frame having second leads, the first package being mounted on the second lead frame with a portion of the first leads coupled to respective second leads, wherein the second lead frame is plated with a second material that is different from the first material; and second mold material encapsulating the first package and the second lead frame.

5. A method for fabricating an isolation device, the method comprising: fabricating an isolation die having bond pads; mounting the isolation die on a first lead frame having first leads; coupling a portion of the bond pads to respective first leads; encapsulating the isolation die and the first lead frame with a first mold material to form a first package; pre-molding a second lead frame having second leads with a second mold material to form a flat surface on which the first package is to be mounted; mounting the first package on a second lead frame; coupling a portion of the first leads to respective ones of the second leads; and encapsulating the first package and the second lead frame with a second mold material.

6. A method for fabricating an isolation device, the method comprising: fabricating an isolation die having bond pads; mounting the isolation die on a first lead frame having first leads; coupling a portion of the bond pads to respective first leads; encapsulating the isolation die and the first lead frame with a first mold material to form a first package; mounting the first package on a second lead frame having second leads; coupling a portion of the first leads to respective second leads; and encapsulating the first package and the second lead frame with a second mold material, further comprising plating the first lead frame with a first material and plating the second lead frame with a second material that is different from the first material.