Provided in the present invention is a wafer warpage regulation epoxy functional film. The wafer warpage regulation epoxy functional film includes the raw material components, in percentage by mass, 33% of an epoxy resin, 50%-52% of silica, 12%-14% of a curing agent, 1% of a curing accelerator, and 2% of a coloring agent; and the epoxy resin includes a bisphenol F-type epoxy resin and a phenolic epoxy resin. Besides, the above raw material components are stirred and mixed to obtain a slurry, the slurry is coated to a back of a wafer body, and after curing, the epoxy functional film which is formed by the phenolic epoxy resin has high shrinkage and large warpage, to drive the back of the wafer body to warp so as to drive a front of the wafer body to warp backwards.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A wafer warpage regulation epoxy functional film, wherein, in percentage by mass, the wafer warpage regulation epoxy functional film consists of 33% of an epoxy resin, 50%-52% of silica, 12%-14% of a curing agent, 1% of a curing accelerator, and 2% of a coloring agent; the epoxy resin comprises a bisphenol F-type epoxy resin and a phenolic epoxy resin; the curing agent comprises a naphthol curing agent; a hydroxyl equivalent of the naphthol curing agent is 100-120 g/eq; the curing accelerator comprises triphenylphosphine; an epoxy equivalent of the bisphenol F-type epoxy resin is 160-180 g/eq; an epoxy equivalent of the phenolic epoxy resin is 180-190 g/eq; the silica comprises fused silica; the particle size D50 of the fused silica is 0.3 μm; and the coloring agent comprises carbon black, with an average particle size of 31 nm.
2. A preparation method of a wafer warpage regulation epoxy functional film, comprising: mixing and stirring various raw material components in the wafer warpage regulation epoxy functional film of claim 1 to obtain slurry; and coating the slurry to obtain the wafer warpage regulation epoxy functional film.
3. A method for regulating wafer warpage, comprising: in a process of preparing a wafer, attaching a layer of wafer warpage regulation epoxy functional film of claim 1 to a back of a wafer body, after the wafer warpage regulation epoxy functional film is cured, driving the back of the wafer body to warp by means of the wafer warpage regulation epoxy functional film, so as to drive a front of the wafer body to wrap backwards, wherein curing conditions comprise: curing temperature of 220° C., and curing time of 4 h.
4. A preparation method of a wafer, comprising: obtaining a wafer body; attaching a layer of a wafer warpage regulation epoxy functional film of claim 1 to a back of a wafer body, to enter a redistribution layer process; after the redistribution layer process is completed, grinding off the wafer warpage regulation epoxy functional film to obtain the wafer.
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August 21, 2024
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