A package structure includes a die, an encapsulation layer, a redistribution layer structure and an adhesive material. The die includes a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a passivation layer disposed over the semiconductor substrate and around the conductive pads. The encapsulation layer laterally encapsulates the die. the redistribution layer structure is disposed on the die and the encapsulation layer, and includes at least one redistribution layer embedded in at least one polymer layer, and the polymer layer contacts a portion of the passivation layer. The adhesive material is disposed on the die and covers an interface between the polymer layer and the passivation layer.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A package structure, comprising: a die, comprising a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a passivation layer disposed over the semiconductor substrate and around the conductive pads; an encapsulation layer, laterally encapsulating the die; a redistribution layer structure, disposed on the die and the encapsulation layer, and comprising at least one redistribution layer embedded in at least one polymer layer, wherein the polymer layer contacts a portion of the passivation layer; and an adhesive material, disposed on the die and covering an interface between the polymer layer and the passivation layer, wherein the adhesive material has an enclosed shape from a top view, and wherein the encapsulation layer extends to contact portions of the conductive pads.
2. The package structure of claim 1, wherein the enclosed shape comprises a rectangular ring shape or a circular ring shape.
3. The package structure of claim 1, wherein the die has at least one sensing region extending from a top surface of the passivation layer to the semiconductor substrate, and the adhesive material is separated from the at least one sensing region by a non-zero horizontal distance.
4. The package structure of claim 1, wherein the adhesive material is in direct contact with the interface between the polymer layer and the passivation layer.
5. The package structure of claim 1, wherein a top surface of the adhesive material is higher than a top surface of the redistribution layer structure.
6. The package structure of claim 1, wherein the adhesive material has at least one residue protruding from a sidewall thereof.
7. The package structure of claim 1, wherein the adhesive material has at least one void or bubble therein.
8. The package structure of claim 1, further comprising an integrated passive device disposed on and electrically bonded to the redistribution layer structure, wherein a top surface of the adhesive material is higher than a top surface of the redistribution layer structure and is separated from the integrated passive device.
9. The package structure of claim 1, wherein the encapsulation layer extends onto a portion of the passivation layer.
10. The package structure of claim 9, wherein vias of the redistribution layer structure penetrate through the encapsulation layer and are electrically connected to the conductive pads of the die.
11. A package structure, comprising: a die, comprising a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a passivation layer disposed over the semiconductor substrate and around the conductive pads; an encapsulation layer, encapsulating a sidewall of the die; a redistribution layer structure, disposed on the encapsulation layer and defining an opening that exposes a portion of the passivation layer; and a sealing protection structure, disposed on the die and along a sidewall of the opening defined by the redistribution layer structure, wherein the sealing protection structure has an enclosed shape from a top view wherein the encapsulation layer extends to contact portions of the conductive pads.
12. The package structure of claim 11, wherein the sealing protection structure comprises epoxy, silicone or epoxy-silicone hybrid resin.
13. The package structure of claim 11, further comprising an integrated passive device disposed on and electrically bonded to the redistribution layer structure, wherein a top surface of the adhesive material is higher than a top surface of the redistribution layer structure and is separated from the integrated passive device.
14. The package structure of claim 13, further comprising a filling layer disposed to fill a space between the integrated passive device and the redistribution layer structure, wherein the filling layer laterally surrounds a connector of the integrated passive device and a conductive pillar of the redistribution layer structure.
15. The package structure of claim 11, wherein the encapsulation layer extends onto and is in contact with a portion of the passivation layer.
16. The package structure of claim 11, wherein the sealing protection structure has a stepped sidewall close to the redistribution layer structure and an inclined sidewall away from the redistribution layer structure, and the stepped sidewall is opposite to the inclined sidewall.
17. A package structure, comprising: a die, comprising a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a passivation layer disposed over the semiconductor substrate and around the conductive pads; an encapsulation layer, laterally encapsulating the die, extending onto and in contact with a portion of the passivation layer and portions of the conductive pads; a redistribution layer structure, disposed on the die and the encapsulation layer, and comprising at least one redistribution layer embedded in at least one polymer layer, wherein the polymer layer contacts a portion of the passivation layer; and an adhesive material, disposed on the die and covering an interface between the polymer layer and the passivation layer, wherein the adhesive material has an enclosed shape from a top view, and wherein the encapsulation layer extends to contact portions of the conductive pads.
18. The package structure of claim 17, wherein a top surface of the adhesive material is in direct with the interface between the polymer layer and the passivation layer.
19. The package structure of claim 17, wherein a top surface of the adhesive material is higher than a top surface of the redistribution layer structure.
20. The package structure of claim 17, wherein the adhesive material has at least one void or bubble therein.
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August 31, 2021
March 25, 2025
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