A semiconductor device structure is provided. The semiconductor device structure includes multiple semiconductor nanostructures, and the semiconductor nanostructures include a first semiconductor material. The semiconductor device structure also includes multiple epitaxial structures extending from edges of the semiconductor nanostructures. The epitaxial structures include a second semiconductor material that is different than the first semiconductor material. The semiconductor device structure further includes a gate stack wrapped around the semiconductor nanostructures.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor device structure, comprising: a plurality of semiconductor nanostructures, wherein the semiconductor nanostructures comprise a first semiconductor material; a plurality of epitaxial structures extending from edges of the semiconductor nanostructures, wherein the epitaxial structures comprise a second semiconductor material that is different than the first semiconductor material; a gate stack wrapped around the semiconductor nanostructures; and a conductive contact wrapped around terminals of the epitaxial structures, wherein the conductive contact has a portion extending towards the gate stack and extending past the terminals of the epitaxial structures, and the portion of the conductive contact has a distal end laterally between one of the terminals and one of the edges of the semiconductor nanostructures.
2. The semiconductor device structure as claimed in claim 1, wherein: the conductive contact has a second portion extending towards the gate stack and extending past the terminals of the epitaxial structures, the conductive contact has a third portion physically connecting the first portion and the second portion, and the first portion, the second portion, and the third portion are made of a same material.
3. The semiconductor device structure as claimed in claim 1, further comprising metal-semiconductor compound layers, wherein each of the metal-semiconductor compound layers is between the conductive contact and a respective epitaxial structure of the epitaxial structures.
4. The semiconductor device structure as claimed in claim 1, further comprising a plurality of inner spacers in direct contact with the edges of the semiconductor nanostructures, wherein each of the inner spacers is between the gate stack and the conductive contact.
5. The semiconductor device structure as claimed in claim 4, wherein each of the inner spacers has an inner edge and an outer edge, the inner edge is between the outer edge and the gate stack, and the outer edge is laterally between one of the terminals of the epitaxial structures and one of the edges of the semiconductor nanostructures.
6. The semiconductor device structure as claimed in claim 5, wherein each of the semiconductor nanostructures extends past the inner edges of the inner spacers.
7. The semiconductor device structure as claimed in claim 1, wherein each of the epitaxial structures has an inner portion and an outer portion, the inner portion is between the outer portion and the gate stack, and the outer portion is thicker than the inner portion.
8. The semiconductor device structure as claimed in claim 1, further comprising: a frontside conductive structure wrapped around terminals of the epitaxial structures; and a backside conductive structure positioned below the frontside conductive structure and electrically connected to the frontside conductive structure.
9. The semiconductor device structure as claimed in claim 1, wherein each of the epitaxial structures is thicker than each of the semiconductor nanostructures.
10. The semiconductor device structure as claimed in claim 1, wherein each of the epitaxial structures has an innermost end and an outermost end, the innermost end is between the outermost end and the edges of the semiconductor nanostructures.
11. A semiconductor device structure, comprising: a plurality of semiconductor nanostructures; a plurality of epitaxial structures extending from edges of the semiconductor nanostructures, wherein each of the epitaxial structures is thicker than each of the semiconductor nanostructures; and a conductive contact wrapped around terminals of the epitaxial structures.
12. The semiconductor device structure as claimed in claim 11, wherein compositions of the semiconductor nanostructures and the epitaxial structures are different.
13. The semiconductor device structure as claimed in claim 11, wherein an entirety of the conductive contact is made of a same material.
14. The semiconductor device structure as claimed in claim 11, further comprising: a plurality of metal-semiconductor compound layers, wherein the metal-semiconductor compound layers are wrapped around the terminals of the epitaxial structures.
15. The semiconductor device structure as claimed in claim 11, further comprising: a metal gate stack wrapped around the semiconductor nanostructures, wherein the conductive contact extends across a bottom of the metal gate stack.
16. A semiconductor device structure, comprising: a plurality of semiconductor nanostructures; a plurality of epitaxial structures extending from edges of the semiconductor nanostructures; and a conductive contact wrapped around each terminal of the epitaxial structures, wherein an entirety of the conductive contact is made of a same material.
17. The semiconductor device structure as claimed in claim 16, further comprising: a plurality of metal-semiconductor compound layers, wherein the metal-semiconductor compound layers are wrapped around portions of the epitaxial structures.
18. The semiconductor device structure as claimed in claim 16, wherein the semiconductor nanostructures comprise a first semiconductor material, and the epitaxial structures comprise a second semiconductor material that is different than the first semiconductor material.
19. The semiconductor device structure as claimed in claim 16, wherein one of the epitaxial structures extends across opposite surfaces of one of the semiconductor nanostructures.
20. The semiconductor device structure as claimed in claim 16, wherein one terminal of the epitaxial structures has a rounded profile.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 29, 2023
April 8, 2025
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