The disclosure provides a method of manufacturing a semiconductor device including bonding a second device wafer to a first device wafer, such that a first bonding interface including a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface is formed between the first device wafer and the second device wafer, wherein the second device wafer is electrically coupled to the first device wafer, and a function of the first device wafer and the second device wafer are the same kind of device wafer. A semiconductor device is also provided.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of manufacturing a semiconductor device, comprising: bonding a second device wafer to a first device wafer, such that a first bonding interface including a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface is formed between the first device wafer and the second device wafer, wherein the second device wafer is electrically coupled to the first device wafer, and the first device wafer and the second device wafer are the same kind of device wafer, the first bonding interface is formed by a hybrid-bonding process, and the hybrid-bonding process refers to the formation of the two different types of bonds using a single bonding process, bonding the first device wafer to a dummy wafer, wherein a third bonding interface including a dielectric-to-dielectric bonding interface is formed between the dummy wafer and the first device wafer before the first bonding interface is formed.
2. The method as claimed in claim 1, wherein the first device wafer directly contacts the second device wafer.
3. The method as claimed in claim 1, wherein the first device wafer comprises a first dielectric layer and a first connector embedded in the first dielectric layer, the second device wafer comprises a second dielectric layer and a second connector embedded in the second dielectric layer, the first dielectric layer directly contacts the second dielectric layer, and the first connector directly contacts the second connector.
4. The method as claimed in claim 3, wherein the second device wafer comprises a plurality of second dielectric layers and a plurality of second connectors embedded in the plurality of second dielectric layers, and the first bonding interface is formed between the first dielectric layer, the first connector, a closest second dielectric layer and a closest second connector.
5. The method as claimed in claim 1, wherein the dummy wafer directly contacts the first device wafer.
6. The method as claimed in claim 1, wherein the third bonding interface is formed by a fusion-bonding process.
7. The method as claimed in claim 1, wherein the dummy wafer comprises a dielectric material layer, the first device wafer comprises a first dielectric layer, and the dielectric material layer directly contacts the first dielectric layer.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 23, 2023
April 15, 2025
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