A semiconductor laser device (2) is placed on a first heating-cooling device (1). A probe holder (4) is attached on a second heating-cooling device (3). A measurement probe (8) is fixed to a distal end of the probe holder (4). A fine movement table (9) moves the second heating-cooling device (3) and the probe holder (4) so that a distal end of the measurement probe (8) contacts the semiconductor laser device (2). An inspection apparatus (10) inputs an inspection signal to the semiconductor laser device (2) through the measurement probe (8).
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor laser inspection apparatus comprising: a metal plate on which a semiconductor laser device is placed; a heating-cooling device; a probe holder attached on the heating-cooling device; a measurement probe fixed to a distal end of the probe holder; a fine movement table moving the heating-cooling device and the probe holder so that a distal end of the measurement probe contacts the semiconductor laser device; an inspection apparatus inputting an inspection signal to the semiconductor laser device through the measurement probe; and a spring having one end connected to an upper surface of the metal plate and the other end connected to a lower surface of the probe holder, wherein the spring thermally couples the metal plate and the probe holder without the measurement probe interposed therebetween.
2. The semiconductor laser inspection apparatus according to claim 1, wherein supports are attached to four corners of a lower surface of the metal plate, and a hollow space is provided below the metal plate.
3. The semiconductor laser inspection apparatus according to claim 1, wherein the spring has a thermal conductivity higher than 200 [W/m·K].
4. A semiconductor laser inspection method comprising: placing a temperature setting laser device for which a relation between wavelength and temperature is known in advance on the metal plate of the semiconductor laser inspection apparatus according to claim 1, measuring a wavelength of light output from the temperature setting laser device while temperature of the heating-cooling device is changed, and fixing temperature of the heating-cooling device when the measured wavelength becomes a wavelength corresponding to a desired temperature; and after the temperature setting laser device is removed from the metal plate, placing the semiconductor laser device on the metal plate while temperature of the heating-cooling device is fixed, and performing inspection of the semiconductor laser device with the distal end of the measurement probe brought into contact with the semiconductor laser device.
5. The semiconductor laser inspection apparatus according to claim 1, wherein the spring is connected to the lower surface of the probe holder by way of a spring fixation member positioned between the spring and the lower surface of the probe holder.
6. The semiconductor laser inspection apparatus according to claim 5, wherein the spring fixation member is not fixed to the lower surface of the probe holder.
7. The semiconductor laser inspection apparatus according to claim 1, wherein the semiconductor laser device is placed on the upper surface of the metal plate.
8. A semiconductor laser inspection apparatus comprising: a heating-cooling device on which a semiconductor laser device is placed; a probe holder; a measurement probe fixed to a distal end of the probe holder; a fine movement table moving the probe holder so that a distal end of the measurement probe contacts the semiconductor laser device; an inspection apparatus inputting an inspection signal to the semiconductor laser device through the measurement probe; and a spring having one end connected to an upper surface of the heating-cooling device and the other end connected to a lower surface of the probe holder, wherein the spring thermally couples the heating-cooling device and the probe holder without the measurement probe interposed therebetween.
9. A semiconductor laser inspection method comprising: placing a temperature setting laser device for which a relation between wavelength and temperature is known in advance on the heating-cooling device of the semiconductor laser inspection apparatus according to claim 8, measuring a wavelength of light output from the temperature setting laser device while temperature of the heating-cooling device is changed, and fixing temperature of the heating-cooling device when the measured wavelength becomes a wavelength corresponding to a desired temperature; and after the temperature setting laser device is removed from the heating-cooling device, placing the semiconductor laser device on the heating-cooling device while temperature of the heating-cooling device is fixed, and performing inspection of the semiconductor laser device with the distal end of the measurement probe brought into contact with the semiconductor laser device.
10. The semiconductor laser inspection apparatus according to claim 8, wherein the spring has a thermal conductivity higher than 200 [W/m·K].
11. The semiconductor laser inspection apparatus according to claim 8, wherein the spring is connected to the lower surface of the probe holder by way of a spring bracket positioned between the spring and the lower surface of the probe holder.
12. The semiconductor laser inspection apparatus according to claim 11, wherein the spring bracket is not fixed to the lower surface of the probe holder.
13. The semiconductor laser inspection apparatus according to claim 8, wherein the semiconductor laser device is placed on the upper surface of the heating-cooling device.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 5, 2023
April 29, 2025
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