An integrated circuit (IC) package may be fabricated having an interposer, one or more microfluidic channels through the interposer, a first IC chip attached to a first side of the interposer, and a second IC chip attached to a second side of the interposer, where the first side of the interposer includes first bond pads coupled to first bond pads of the first IC chip, and the second side of the interposer includes second bond pads coupled to first bond pads of the second IC chip. In an embodiment of the present description, a liquid cooled three-dimensional IC (3DIC) package may be formed with the IC package, where at least two IC devices may be stacked with a liquid cooled interposer. In a further embodiment, the liquid cooled 3DIC package may be electrically attached to an electronic board. Other embodiments are disclosed and claimed.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An apparatus, comprising: an interposer; one or more microfluidic channels through the interposer; a first integrated circuit (IC) chip attached to a first side of the interposer; and a second IC chip attached to a second side of the interposer, wherein the first side of the interposer comprises first bond pads coupled to bond pads of the first IC chip, and the second side of the interposer comprises second bond pads coupled to bond pads of the second IC chip, and wherein the interposer comprises a top portion attached to a bottom portion, wherein a first side of the top portion comprises bond pads coupled to bond pads on a first side of the bottom portion.
2. The apparatus of claim 1, wherein the interposer comprises one or more metal vias between the first IC chip and the second IC chip.
3. The apparatus of claim 1, wherein the bonds pads on the first side of the top portion are hybrid bonded to the bond pads on the first side of the bottom portion.
4. The apparatus of claim 1, wherein the top portion and the bottom portion of the interposer each comprise respective portions of the one or more microfluidic channels.
5. The apparatus of claim 1, further comprising: at least one heat dissipation structure that protrudes into one of the one or more microfluidic channels.
6. The apparatus of claim 1, wherein the one or more microfluidic channels comprise a first microfluidic channel and a second microfluidic channel, and wherein a first cross sectional area of the first microfluidic channel perpendicular to a first flow direction at a first internal portion of the first microfluidic channel is different from a second cross sectional area of the second microfluidic channel perpendicular to a second flow direction at a second internal portion of the second microfluidic channel.
7. The apparatus of claim 1, wherein a first cross sectional area of the one or more microfluidic channels perpendicular to a first flow direction at an inlet of the interposer is less than a second cross sectional area of the one or more microfluidic channels perpendicular to a second flow direction at an outlet of the interposer that is in fluid communication with the inlet of the interposer.
8. The apparatus of claim 1, further comprising: an IC package comprising the interposer, the first IC chip, and the second IC chip; and an enclosure attached to the IC package, the enclosure comprising at least one inlet and at least one outlet.
9. The apparatus of claim 8, further comprising: a board coupled to the IC package; and a power supply to provide power to the first IC chip and/or the second IC chip.
10. The apparatus of claim 8, further comprising: a pump coupled to the at least one inlet and the at least one outlet of the enclosure; and/or a temperature monitor on the first IC chip and circuitry coupled to the temperature monitor to control a flow rate of fluid through the one or more microfluidic channels.
11. An apparatus, comprising: one or more microfluidic channels extending through an interposer, the interposer comprising a first portion attached to a second portion, wherein a first side of the first portion comprises bond pads coupled to bond pads of a first side of the second portion; a first integrated circuit (IC) chip comprising bond pads attached to bond pads at a second side of the first portion opposite the first side of the first portion; and a second IC chip comprising bond pads attached to a second side of the second portion opposite the first side of the first portion.
12. The apparatus of claim 11, wherein the interposer comprises one or more metal vias between the first IC chip and the second IC chip.
13. The apparatus of claim 11, wherein the bonds pads of the first side of the first portion are hybrid bonded to the bond pads of the first side of the second portion.
14. The apparatus of claim 11, wherein the first portion and the second portion of the interposer each comprise respective portions of the one or more microfluidic channels.
15. The apparatus of claim 11, further comprising: at least one heat dissipation structure that protrudes into one of the one or more microfluidic channels.
16. The apparatus of claim 11, wherein the one or more microfluidic channels comprise a first microfluidic channel and a second microfluidic channel, and wherein a first cross sectional area of the first microfluidic channel perpendicular to a first flow direction at a first internal portion of the first microfluidic channel is different from a second cross sectional area of the second microfluidic channel perpendicular to a second flow direction at a second internal portion of the second microfluidic channel.
17. The apparatus of claim 11, wherein a first cross sectional area of the one or more microfluidic channels perpendicular to a first flow direction at an inlet of the interposer is less than a second cross sectional area of the one or more microfluidic channels perpendicular to a second flow direction at an outlet of the interposer that is in fluid communication with the inlet of the interposer.
18. The apparatus of claim 11, further comprising: an IC package comprising the interposer, the first IC chip, and the second IC chip; and an enclosure attached to the IC package, the enclosure comprising at least one inlet and at least one outlet.
19. The apparatus of claim 18, further comprising: a board coupled to the IC package; and a power supply to provide power to the first IC chip and/or the second IC chip.
20. The apparatus of claim 18, further comprising: a pump coupled to the at least one inlet and the at least one outlet of the enclosure; and/or a temperature monitor on the first IC chip and circuitry coupled to the temperature monitor to control a flow rate of fluid through the one or more microfluidic channels.
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June 14, 2021
May 13, 2025
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