The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for manufacturing a semiconductor device package structure, comprising: providing a carrier having a first surface and a second surface opposite to the first surface; forming an adhesive layer on the first surface of the carrier; and attaching a package unit to the adhesive layer, the package unit comprising: a first electronic component having an active surface facing away the adhesive layer; and a first molding compound encapsulating the first electronic component wherein the adhesive layer comprises a protruding portion laterally protruding beyond a lateral surface of the package unit, and wherein the adhesive layer includes a first curve surface and a second curve surface opposite to the first curve surface.
2. The method of claim 1, wherein a center of curvature of the first curve surface is different from a center of curvature of the second curve surface.
3. The method of claim 2, wherein the protruding portion of the adhesive layer is separated from the first electronic component.
4. The method of claim 3, wherein the protruding portion of the adhesive layer has a convex surface.
5. The method of claim 1, further comprising a conductive element encapsulated by the first molding compound, wherein the conductive element overlaps the first electronic component in a direction parallel to the active surface of the first electronic component.
6. The method of claim 5, wherein the package unit further comprises a second electronic component disposed above the first electronic component, wherein a first width of the first electronic component is different from a second width of the second electronic component in a cross-sectional view.
7. The method of claim 6, wherein the second electronic component has an active surface facing toward the conductive element.
8. The method of claim 7, wherein the package unit further comprises a solder material located between the active surface of the second electronic component and the conductive element.
9. The method of claim 8, wherein the package unit further comprising a second molding compound encapsulating the second electronic component.
10. The method of claim 9, wherein a thickness of the second molding compound is different from a thickness of the first molding compound.
11. The method of claim 9, wherein the second molding compound encapsulates the solder material.
12. The method of claim 11, wherein the second molding compound is separated from the first molding compound.
13. The method of claim 6, wherein the package unit further comprises an electrical conductive structure between the first electronic component and the second electronic component.
14. A method for manufacturing a semiconductor device package structure, comprising: providing a carrier having a first surface and a second surface opposite to the first surface; forming an adhesive layer on the first surface of the carrier, wherein the adhesive layer further comprises a protruding portion tapering away from the first surface of the carrier; and disposing a package unit over the adhesive layer, the package unit comprising: a conductive element; and a resin layer at least partially between the adhesive layer and the conductive element, wherein the resin layer includes a curve surface between the conductive element and the adhesive layer, and wherein the resin layer horizontally overlaps the conductive element in a cross-sectional view.
15. The method of claim 14, further comprising a first electronic component covered by the resin layer.
16. The method of claim 15, further comprising a second electronic component over the resin layer, wherein the second electronic component has an active surface facing toward the conductive element.
17. A method for manufacturing a semiconductor device package structure, comprising: providing a carrier having a first surface and a second surface opposite to the first surface; forming an adhesive layer on the first surface of the carrier; and attaching a package unit to the adhesive layer, the package unit comprising: a conductive element; a first electronic device having an active surface facing away the adhesive layer; and an encapsulant encapsulating the conductive element, wherein the adhesive layer comprises a protruding portion protruding upwardly and covering a lateral surface of the package unit, and wherein a first elevation of a top end of the conductive element is higher than a second elevation of a top end of the protruding portion of the adhesive layer with respect to the first surface of the carrier.
18. The method of claim 17, wherein the package unit further comprises a second electronic device disposed over the conductive element, wherein a thickness of the first electronic component is different from a thickness of the second electronic component in a cross-sectional view.
19. The method of claim 18, wherein the protruding portion of the adhesive layer is separated from a lateral surface of the encapsulant.
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June 20, 2023
May 13, 2025
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