A seamless three-dimensional cover (1) for an electronic device (2), the seamless three-dimensional cover (1) comprising of at least one glass base layer (3) and at least one glass rim layer (4). At least one layer of color inducing film (5) is arranged between at least one of the base layer (3) and the rim layer (4), or between two adjacent rim layers (4). The base layer (3), the rim layer(s) (4), and the layer of color inducing film (5) are fused together to form the seamless three-dimensional cover (1). This facilitates a strong and durable three-dimensional cover, which cover is translucent as well as at least partially colored. Furthermore, the cover does not affect the function of components such as millimeter-wave antennas.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of manufacturing a seamless three-dimensional cover for an electronic device, the method comprising steps of: providing a first flat sheet of transparent glass; depositing a first layer of color inducing film on the first flat sheet of transparent glass, wherein the first layer of color inducing film bonds to the first flat sheet of transparent glass during the depositing, and the first layer of color inducing film encircles a point of the first flat sheet of transparent glass and does not cover the point of the first flat sheet of transparent glass; providing a second flat sheet of transparent glass on top of the first layer of color inducing film, wherein the second flat sheet of transparent glass encircles the point of the first flat sheet of transparent glass and does not cover the point of the first flat sheet of transparent glass; fusing the first flat sheet of transparent glass, the first layer of color inducing film and the second flat sheet of transparent glass to form a seamless three-dimensional material, wherein after the fusing the first layer of color inducing film is fused to the first flat sheet of transparent glass and the second flat sheet of transparent glass; and machining the seamless three-dimensional material to form the seamless three-dimensional cover.
2. The method according to claim 1, further comprising: providing at least one third flat sheet of transparent glass on top of the first flat sheet of transparent glass or the second flat sheet of transparent glass.
3. The method according to claim 2, further comprising: providing at least a second layer of color inducing film between the at least one third flat sheet of transparent glass and the first flat sheet of transparent glass or the second flat sheet of transparent glass.
4. A method of manufacturing a seamless three-dimensional cover for an electronic device, the method comprising steps of: providing a first flat sheet of transparent glass, wherein the first flat sheet of transparent glass comprises chemically strengthened glass; depositing a first layer of color inducing film on the first flat sheet of transparent glass, wherein the first layer of color inducing film bonds to the first flat sheet of transparent glass during the depositing, and the first layer of color inducing film encircles a point of the first flat sheet of transparent glass and does not cover the point of the first flat sheet of transparent glass; providing a second flat sheet of transparent glass on top of the first layer of color inducing film, wherein the second flat sheet of transparent glass encircles the point of the first flat sheet of transparent glass and does not cover the point of the first flat sheet of transparent glass; fusing the first flat sheet of transparent glass, the first layer of color inducing film and the second flat sheet of transparent glass to form a seamless three-dimensional material, wherein after the fusing the first layer of color inducing film is fused to the first flat sheet of transparent glass and the second flat sheet of transparent glass; and machining the seamless three-dimensional material to form the seamless three-dimensional cover.
5. The method according to claim 4, wherein after the fusing of the first flat sheet of transparent glass, the first layer of color inducing film, and the second flat sheet of transparent glass, the second flat sheet of transparent glass extends along a peripheral edge of the first flat sheet of transparent glass in a direction perpendicular to a main surface of the first flat sheet of transparent glass.
6. The method according to claim 4, wherein the first layer of color inducing film comprises an inorganic thin film material.
7. The method according to claim 6, wherein the inorganic thin film material has a thickness that is between 10-50 nm.
8. The method according to claim 4, wherein the first layer of color inducing film comprises a metal oxide.
9. The method according to claim 4, wherein the first layer of color inducing film comprises a metal oxide containing material.
10. The method according to claim 4, wherein the first layer of color inducing film comprises Co3O4 or 60 SiO2-25 Co3O4-10 Na2O-5 Al2O.
11. The method according to claim 4, wherein the first layer of color inducing film comprises a cobalt oxide material.
12. A method of manufacturing a seamless three-dimensional cover for an electronic device, the method comprising steps of: providing a first flat sheet of transparent glass; depositing a first layer of color inducing film on the first flat sheet of transparent glass, wherein the first layer of color inducing film bonds to the first flat sheet of transparent glass during the depositing, and the first layer of color inducing film encircles a point of the first flat sheet of transparent glass and does not cover the point of the first flat sheet of transparent glass; providing a second flat sheet of transparent glass on top of the first layer of color inducing film, wherein the second flat sheet of transparent glass encircles the point of the first flat sheet of transparent glass and does not cover the point of the first flat sheet of transparent glass; providing a second layer of color inducing film over the second flat sheet of transparent glass; providing a third flat sheet of transparent glass on top of the second layer of color inducing film; fusing the first flat sheet of transparent glass, the first layer of color inducing film, the second flat sheet of transparent glass, the second layer of color inducing film, and the third flat sheet of transparent glass, to form a seamless three-dimensional material, wherein after the fusing the first layer of color inducing film is fused to the first flat sheet of transparent glass and the second flat sheet of transparent glass; and machining the seamless three-dimensional material to form the seamless three-dimensional cover.
13. The method according to claim 12, wherein after the fusing of the first flat sheet of transparent glass, the first layer of color inducing film, the second flat sheet of transparent glass, the second layer of color inducing film, and the third flat sheet of transparent glass, the second flat sheet of transparent glass and the third flat sheet of transparent glass extend along a peripheral edge of the first flat sheet of transparent glass in a direction perpendicular to a main surface of the first flat sheet of transparent glass.
14. The method according to claim 12, wherein the first layer of color inducing film comprises an inorganic thin film material.
15. The method according to claim 14, wherein the inorganic thin film material has a thickness that is between 10-50 nm.
16. The method according to claim 14, wherein the first layer of color inducing film comprises a metal oxide.
17. The method according to claim 14, wherein the first layer of color inducing film comprises a metal oxide containing material.
18. The method according to claim 14, wherein the first layer of color inducing film comprises Co3O4 or 60 SiO2-25 Co3O4-10 Na2O-5 Al2O.
19. The method according to claim 14, wherein the first layer of color inducing film comprises a cobalt oxide material.
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December 3, 2019
May 20, 2025
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