A liquid immersion cooling system includes a tank defining a tank interior configured to receive electronic components (e.g., servers) and a thermally conductive dielectric liquid to cool the electronic components. The liquid immersion cooling system also includes a power shelf external to the tank interior, where the power shelf includes a converter configured to receive an alternating current (AC) power supply and convert the AC power supply to a direct current (DC) power supply. The liquid immersion cooling system also includes a DC bus configured to route the DC power supply from the power shelf, into the tank interior, and to the electronic components.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A liquid immersion cooling system, comprising: a tank defining a tank interior configured to receive a plurality of electronic components and a thermally conductive dielectric liquid to cool the plurality of electronic components; a power shelf external to the tank interior, wherein the power shelf comprises a converter configured to receive an alternating current (AC) power supply and convert the AC power supply to a direct current (DC) power supply; and a DC bus configured to route the DC power supply from the power shelf, into the tank interior, and to the plurality of electronic components, wherein the DC bus comprises a flexible portion configured to extend through an opening in a lid of the tank.
2. The liquid immersion cooling system of claim 1, comprising a plurality of blind mate connectors configured to couple the DC bus and the plurality of electronic components.
3. The liquid immersion cooling system of claim 2, wherein the plurality of electronic components comprises a plurality of respective DC jacks, and the plurality of blind mate connectors is configured to contact the plurality of respective DC jacks.
4. The liquid immersion cooling system of claim 1, comprising a gasket configured to seal the opening about the flexible portion of the DC bus.
5. The liquid immersion cooling system of claim 1, wherein the flexible portion or an additional portion of the DC bus is disposed in the tank interior and forms an oblique angle with the lid.
6. The liquid immersion cooling system of claim 1, comprising a controller configured to control at least one first aspect of a decoupling of an additional DC bus from the plurality of electronic components and at least one second aspect of a coupling of the DC bus to the plurality of electronic components.
7. A liquid immersion cooling system, comprising: a tank defining a tank interior configured to receive a thermally conductive dielectric liquid; a plurality of electronic components disposed in the tank interior; a power shelf external to the tank interior, wherein the power shelf comprises a converter configured to receive an alternating current (AC) power supply and convert the AC power supply to a direct current (DC) power supply; a DC bus coupled to the converter, wherein a portion of the DC bus extending into the tank interior forms an oblique angle with a lid of the tank; and a plurality of connectors coupling the DC bus and the plurality of electronic components.
8. The liquid immersion cooling system of claim 7, wherein the plurality of connectors comprises a plurality of blind mate connectors.
9. The liquid immersion cooling system of claim 7, wherein the plurality of electronic components comprises a plurality of respective DC jacks, and the plurality of connectors are configured to contact the plurality of respective DC jacks.
10. The liquid immersion cooling system of claim 7, wherein the DC bus comprises a flexible portion configured to extend through an opening in a lid of the tank.
11. The liquid immersion cooling system of claim 10, comprising a gasket configured to seal the opening about the flexible portion of the DC bus.
12. The liquid immersion cooling system of claim 7, comprising a controller configured to control at least one first aspect of a decoupling of an additional DC bus from the plurality of electronic components and at least one second aspect of a coupling of the DC bus to the plurality of electronic components.
13. A method of operating a liquid immersion cooling system, the method comprising: cooling, via a thermally conductive dielectric liquid, a plurality of electronic components disposed in a tank interior of a tank; receiving, at a power shelf disposed external to the tank interior, an alternating current (AC) power supply; converting, via a converter of the power shelf, the AC power supply to a direct current (DC) power supply; routing, via a DC bus coupled to the converter and extending into the tank interior, the DC power supply toward the plurality of electronic components; controlling, via a controller, at least one first aspect of a decoupling of an additional DC bus from the plurality of the electronic components; and controlling, via the controller, at least one second aspect of a coupling of the DC bus to the plurality of electronic components.
14. The method of claim 13, comprising routing the DC power supply through the DC bus and to the plurality of electronic components via a plurality of blind mate connectors between the DC bus and the plurality of electronic components.
15. The method of claim 13, comprising routing the DC power supply to the plurality of electronic components via a plurality of DC jacks corresponding to the plurality of electronic components.
16. The method of claim 13, comprising routing the DC power supply via a flexible portion of the DC bus that extends through a gasket sealed opening in a lid of the tank.
17. The method of claim 13, comprising: receiving, at the controller, sensor feedback from a power sensor or power sensor assembly; controlling, via the controller, the at least one first aspect based on the sensor feedback; and controlling, via the controller, the at least one second aspect based on the sensor feedback.
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June 13, 2023
June 17, 2025
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