Electrical detection method

The present disclosure relates to a detection method, and more particularly, to an electrical detection method suitable for electronic devices.

In order to ensure the continued miniaturization and multi-function of electronic products and communication equipment, semiconductor packaging needs to develop towards miniaturization in order to facilitate the connection of multiple pins. To this end, the industry has developed many advanced process packaging technologies. With the advancement of technological development and in response to changes in electronic products, the industry has developed various types of test probe cards for testing electronic devices such as semiconductor chips or package modules.

Traditional probe card manufacturing methods have limited probe sizes and high manufacturing costs, so many bottlenecks need to be overcome in the process of manufacturing probes. At present, the size of the semiconductor chip tends to be miniaturized and the semiconductor chip has more and more output contacts. In addition, the test probe structure is composed of tiny probes wired one after another. Therefore, it is necessary to continuously improve and overcome the manufacturing technology of the probe structure to cope with the miniaturization of semiconductor chips, and to overcome the problems that the traditional probe structure is prone to fatigue during operation and the probe size is limited, in order to comply with the trend of modern technological products.

is a schematic cross-sectional view illustrating a conventional electrical detection method. As shown in, a substrate structureis first provided, in which a substrate bodyis provided with a plurality of electrical contact padsof micro pad (commonly known as μ-pad) specifications, wherein a conductive bumpis formed on each of the electrical contact padsto form a contact, and then a plurality of probesof a detection deviceare connected to a plurality of the conductive bumpsto perform electrical detection operations.

However, in the conventional electrical detection method, the probeonly contacts a single contact, resulting in insufficient contact force between the probeand the contact, thereby resulting in the inability to perform electrical testing.

Furthermore, when a single contactfails, the entire substrate structure, or even the entire semiconductor package or electronic product, often needs to be scrapped. This results in a large amount of material waste, making it difficult to reduce the cost of semiconductor packages or electronic products.

Therefore, how to overcome the various problems of the prior art has become an urgent issue to be solved.

In view of the various deficiencies of the prior art, the present disclosure provides an electrical detection method, which comprises: providing a wiring structure including a base material body and a plurality of contact portions bonded to the base material body, wherein each of the contact portions includes an electrical detection pad exposed from a surface of the base material body, an electrical auxiliary pad exposed from the surface of the base material body, and a conductor that electrically connects the electrical detection pad and the electrical auxiliary pad; and connecting probes of a detection device to the contact portions, so that each of the probes exerts a force on the electrical detection pad and the electrical auxiliary pad of each of the contact portions at the same time.

In the aforementioned electrical detection method, the base material body is provided with a plurality of electrical contact pads on the surface of the base material body. For example, a conductive bump is formed on each of the electrical contact pads.

In the aforementioned electrical detection method, the conductor is a conductive trace exposed from the surface of the base material body.

In the aforementioned electrical detection method, the conductor is a conductive trace embedded in the base material body.

In the aforementioned electrical detection method, at least two of the plurality of contact portions are electrically connected to each other via a wiring layer bonded to the base material body.

In the aforementioned electrical detection method, each of the contact portions includes a plurality of the electrical auxiliary pads, and the conductor is electrically connected to the electrical detection pad and the plurality of electrical auxiliary pads.

In the aforementioned electrical detection method, conductive bumps are formed on the electrical detection pad and the electrical auxiliary pad, and the probes contact the conductive bumps.

In the aforementioned electrical detection method, each of the probes has a width of at least 55 microns.

In the aforementioned electrical detection method, a distance between two adjacent probes of the detection device is at least 80 microns.

As can be seen from the above, in the electrical detection method of the present disclosure, the contact portion mainly includes an electrical detection pad and an electrical auxiliary pad, so that the detection device needs to widen the width of the probe to apply a force on the electrical detection pad and the electrical auxiliary pad at the same time. Therefore, compared with the prior art, the probe in the electrical detection method of the present disclosure needs to exert a force on the electrical detection pad and the electrical auxiliary pad, so that the contact force between the probe and the contact portion can be enhanced to facilitate the electrical testing.

Furthermore, via the design of the electrical auxiliary pad, when the electrical detection pad fails, the probe of the detection device can still electrically conduct the contact portion. Therefore, there is no need to scrap the entire wiring structure to avoid wasting a large amount of material. Therefore, compared with the prior art, the electrical detection method of the present disclosure can effectively reduce the cost of semiconductor packages or electronic products.

The following describes the implementation of the present disclosure with examples. Those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification.

It should be understood that, the structures, ratios, sizes, and the like in the accompanying figures are used for illustrative purposes to facilitate the perusal and comprehension of the contents disclosed in the present specification by one skilled in the art, rather than to limit the conditions for practicing the present disclosure. Any modification of the structures, alteration of the ratio relationships, or adjustment of the sizes without affecting the possible effects and achievable proposes should still be deemed as falling within the scope defined by the technical contents disclosed in the present specification. Meanwhile, terms such as “on,” “upper,” “one,” “a” and the like are merely for clear explanation rather than limiting the practicable scope of the present disclosure, and thus, alterations or adjustments of the relative relationships thereof without essentially altering the technical contents should still be considered in the practicable scope of the present disclosure.

is a schematic top view of a wiring structureused in an electrical detection method according to a first embodiment of the present disclosure. As shown in, the wiring structurecomprises a base material bodyand a plurality of contact portionsbonded to the base material body, wherein each of the contact portionsincludes an electrical detection padexposed from the surface of the base material body, an electrical auxiliary padexposed from the surface of the base material body, and a conductorelectrically connecting the electrical detection padand the electrical auxiliary pad.

The base material bodyis made of insulating material, like dielectric materials such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc., or solder resist materials such as solder mask (e.g., green solder mask), graphite (e.g., ink), etc. Alternatively, the base material bodycan also be made of semiconductor material, such as silicon or glass, but the present disclosure is not limited to as such.

In one embodiment, a plurality of electrical contact padscan be disposed on the surface of the base material body, such as copper micro pads (micro pads, commonly known as μ-pads) specifications, and a wiring layercan be formed inside the base material body, as shown in. For example, a redistribution layer (RDL) process can be used to manufacture the wiring layerand the electrical contact pads.

Each of the contact portions(including the electrical detection pad, the electrical auxiliary padand the conductor) is made of copper and is disposed on the surface of the base material body, and any two of the contact portionscan be electrically connected to each other via the wiring layeror other electronic elements.

In one embodiment, each of the contact portionsis manufactured using the RDL process. For example, the contact portionsand the electrical contact padsare fabricated in the same RDL process.

Furthermore, the conductoris a conductive trace exposed from the surface of the base material bodyand is electrically connected to the wiring layer. Alternatively, in a wiring structureshown inand, a conductorcan also be a conductive trace embedded in the base material body, and the conductorcan be produced together with the wiring layerusing the RDL process, wherein the base material bodyincludes a plurality of insulating layersto facilitate the production of the conductorand the wiring layer.

In addition, the electrical detection pad, the electrical auxiliary padand the electrical contact padcan be externally connected to other elements via conductive bumpssuch as metal bumps or solder bumps, as shown in. For example, an under-bump metallization (UBM) layercan be formed on the electrical detection pad, the electrical auxiliary padand the electrical contact pad, as shown in, so as to facilitate the bonding of the conductive bumps

As shown inor, when performing electrical detection operations, a plurality of probesof a detection devicecan be connected to two sets of contact portionsthat are electrically connected to each other, so that a single probeis aligned with two conductive bumpson a single contact portion(including an electrical detection padand an electrical auxiliary pad), that is, a single probecontacts the two conductive bumpsat the same time to apply a force on the electrical detection padand the electrical auxiliary padto perform a random inspection-type electrical detection operation.

In one embodiment, a width R of each of the probesof the detection deviceis at least 55 microns (μm), and a distance D between two adjacent probesis at least 80 microns.

Therefore, the electrical detection method of the present disclosure mainly relies on the design of the electrical auxiliary pad, so that one contact portionincludes two pads (the electrical detection padand the electrical auxiliary pad). Therefore, it helps to apply a force on the electrical detection padand the electrical auxiliary pad, so that the contact force between the probeand the contact portionis enhanced, thereby facilitating the electrical testing.

Furthermore, via the design of the electrical auxiliary pad, when the electrical detection padfails, the probeof the detection devicecan still electrically conduct the contact portion, so there is no need to scrap the entire wiring structure,, thereby avoiding a large waste of material.

In addition, as shown in, if all the contact portionsof a wiring structureare connected in pairs, then the detection devicecan simultaneously connect more probesto all contact portionsto perform a comprehensive electrical detection operation.

is a schematic cross-sectional view illustrating an electrical detection method according to a second embodiment of the present disclosure. The difference between the second embodiment and the first embodiment lies in the combination of contact portionsof a wiring structure. The other designs are generally the same, so the similarities will not be described again below.

As shown in, the contact portionincludes an electrical detection padexposed from the surface of the base material body, a plurality of electrical auxiliary pads,exposed from the surface of the base material body, and a conductorconnecting the electrical detection padand each of the electrical auxiliary pads,.

Therefore, when performing electrical detection operations, a plurality of probesof the detection devicecan be connected to two sets of contact portionsthat are electrically connected to each other, so that a single probeis aligned with three conductive bumpson a single contact portion(including an electrical detection padand two electrical auxiliary pads,), that is, a single probecontacts the three conductive bumpsat the same time to apply a force on the electrical detection padand the plurality of electrical auxiliary pads,to perform random inspection-type electrical detection operations. As shown in, it should be understood that if all the contact portionsof a wiring structureare connected in pairs, then the detection devicecan simultaneously connect more probesto all contact portionsto perform a comprehensive electrical detection operation.

toare schematic cross-sectional views illustrating an electrical detection method of the present disclosure applied to a manufacturing process of an electronic package.

As shown in, a carrieris provided, and at least one electronic structureand a plurality of conductive pillarsare arranged on the carrier. Next, a cladding layeris formed on a carrier structure, so that the cladding layercovers the electronic structureand the conductive pillars.

The carrieris, for example, a board made of semiconductor material (such as silicon or glass), on which a release layerand a metal layermade of such as titanium/copper are sequentially formed by, for example, coating, so as to form the carrier structureon the metal layer.

The carrier structureincludes at least one dielectric layerand a circuit layerbonded to the dielectric layer.

In one embodiment, the dielectric layeris made of a material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or other dielectric materials, and the circuit layerand the dielectric layercan be formed using an RDL process.

The electronic structureincludes an electronic bodyhaving a semiconductor substrate and a circuit portionbonded to the electronic body, and the electronic bodyis formed with a plurality of conductive vias therein, wherein a plurality of conductive bumps,electrically connected to the conductive vias and/or the circuit portioncan be formed according to requirements.

In one embodiment, the circuit portionof the electronic structureis disposed on the circuit layerof the carrier structurevia the plurality of conductive bumps.

The conductive pillarsare disposed on the carrier structureand are electrically connected to the circuit layer.

In one embodiment, the conductive pillarsare made of a metal material such as copper or a solder material. For example, the conductive pillarsare formed by electroplating on the circuit layervia exposure and development.

The cladding layeris made of an insulating material, such as polyimide (PI), dry film, encapsulation colloid such as epoxy resin, or molding compound. For example, the cladding layermay be formed on the carrier structureby liquid compound, injection, lamination, or compression molding.

In one embodiment, the outer surface of the cladding layercan be flush with end surfaces of the conductive pillarsand end surfaces of the conductive bumpsby a leveling process, so that the end surfaces of the conductive pillarsand the end surfaces of the conductive bumpsare exposed from the outer surface of the cladding layer. For example, the leveling process removes part of the material of the conductive pillars, part of the material of the conductive bumpsand part of the material of the cladding layervia grinding.

As shown in, a wiring structureis formed on the cladding layer, so that the wiring structureis electrically connected to the plurality of conductive pillarsand the plurality of conductive bumps.

In one embodiment, the wiring structureadopts the design shown in, wherein the outermost insulating layercan be used as a solder resist layer, and the outermost wiring layeris exposed from the solder resist layer to serve as an electrical detection pad, an electrical auxiliary padand an electrical contact pad, such as micro pad (commonly known as μ-pad) specifications.

Furthermore, the material for forming the wiring layeris copper, and the material for forming the insulating layeris a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc., or a solder resist material such as solder mask (e.g., green solder mask), graphite (e.g., ink), etc.

As shown in, the electrical detection operation is carried out to connect the probesof the detection deviceto two sets of contact portionsthat are electrically connected to each other, so that a single probeexerts a force on a single contact portionincluding the electrical detection padand the electrical auxiliary padat the same time to perform random inspection-type electrical detection operations.