Wavelength conversion module and projector

This application claims the priority benefit of China application serial no. 202011548218.2, filed on Dec. 24, 2020. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

The disclosure relates to an optical module and a projector, and particularly relates to a wavelength conversion module and a projector having the wavelength conversion module.

Most existing phosphor wheels use aluminum or aluminum alloy metal substrate as the heat dissipation substrate, and the appearance design of the heat dissipation substrate is mostly a flat circular or ring structure without any special structure on the surface. In order to increase the efficiency of heat dissipation, at present, the surface area may also be increased by forming bosses or grooves on the front surface, the back surface, or both the front and back surfaces of the heat dissipation substrate through stamping or processing forming, but the height/depth and the number of structures will also be reduce the strength of the substrate. The boss structures will generate turbulence or increase convection during the high-speed rotational process of the phosphor wheel, and accelerate the removal of heat around the phosphor wheel through the turbulence or convection, so as to reduce the temperature of the fluorescent layer of the phosphor wheel, thereby increasing the excitation efficiency of the phosphor wheel.

However, if the phosphor wheel uses high-temperature inorganic glue to sinter phosphor powder or diffuse reflective particles onto the heat dissipation substrate, the sintering temperature needs to be greater than 700° C., but the metal heat dissipation substrate is unable to withstand such temperature, thereby causing failed full bonding with the phosphor layer or the diffuse reflective layer after sintering. Therefore, in order to increase the sintering temperature of the phosphor wheel and reduce the limitation on the material used for the fluorescent layer and the reflective layer, a ceramic substrate with high thermal conductivity is also currently used as the heat dissipation substrate. Although the temperature resistance of the ceramic substrate may be greater than 600° C., it is difficult for the boss structure to be formed on the surface of the ceramic substrate, which causes the heat dissipation effect of using the ceramic substrate to be poor, thereby affecting the excitation efficiency of the phosphor wheel. In addition, the ceramic substrate is a brittle material, which is susceptible to issues such as cracking during the operational process due to hidden cracks generated during the forming and processing of the substrate, thereby affecting the reliability of the phosphor wheel.

The information disclosed in this Background section is only for enhancement of understanding of the background of the described technology and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art. Further, the information disclosed in the Background section does not mean that one or more problems to be resolved by one or more embodiments of the invention was acknowledged by a person of ordinary skill in the art.

The disclosure provides a wavelength conversion module, which has a better heat dissipation effect on a wavelength conversion layer.

The disclosure also provides a projector, which includes the wavelength conversion module and has better projection quality and product competitiveness.

The other objectives and advantages of the disclosure may be further understood from the technical features disclosed in the disclosure.

In order to achieve one, part of, or all of the above objectives or other objectives, an embodiment of the disclosure provides a wavelength conversion module, which includes a substrate, a wavelength conversion layer, and multiple adhesive bosses. The substrate has a first surface. The wavelength conversion layer is configured on the first surface of the substrate. The adhesive bosses are separately configured on the first surface of the substrate. The wavelength conversion layer surrounds the adhesive bosses, and each of the multiple adhesive bosses is configured separately from the wavelength conversion layer.

In order to achieve one, part of, or all of the above objectives or other objectives, an embodiment of the disclosure provides a projector, which includes an illumination module, a light valve, and a projection lens. The illumination module is configured to provide an illumination beam. The illumination module includes a light source and a wavelength conversion module. The light source is configured to provide an excitation beam. The wavelength conversion module is configured on a transmission path of the excitation beam and is configured to convert the excitation beam into a conversion beam. The illumination beam includes the conversion beam. The wavelength conversion module includes a substrate, a wavelength conversion layer, and multiple adhesive bosses. The substrate has a first surface. The wavelength conversion layer is configured on the first surface of the substrate. The adhesive bosses are separately configured on the first surface of the substrate. The wavelength conversion layer surrounds the adhesive bosses, and each of the multiple adhesive bosses is configured separately from the wavelength conversion layer. The light valve is configured on a transmission path of the illumination beam and is configured to convert the illumination beam into an image beam. The projection lens is configured on a transmission path of the image beam and is configured to project the image beam out of the projector.

Based on the above, the embodiments of the disclosure have at least one of the following advantages or effects. In the design of the wavelength conversion module of the disclosure, the adhesive bosses are separately configured on the substrate, and the adhesive bosses are configured separately from the wavelength conversion layer, so that the adhesive bosses are configured without contacting the inner side of the wavelength conversion layer. With the design of the adhesive bosses, the heat dissipation effect of the substrate may be increased when the wavelength conversion module rotates at a high speed to reduce the temperature of the wavelength conversion layer, thereby increasing the excitation efficiency of the wavelength conversion module. Furthermore, the adhesive bosses also have the functions of increasing the toughness and strength of the substrate while balancing weight. In addition, the projector adopting the wavelength conversion module of the disclosure may have better projection quality and product competitiveness.

Other objectives, features and advantages of the present invention will be further understood from the further technological features disclosed by the embodiments of the present invention wherein there are shown and described preferred embodiments of this invention, simply by way of illustration of modes best suited to carry out the invention.

In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as “top,” “bottom,” “front,” “back,” etc., is used with reference to the orientation of the Figure(s) being described. The components of the present invention can be positioned in a number of different orientations. As such, the directional terminology is used for purposes of illustration and is in no way limiting. On the other hand, the drawings are only schematic and the sizes of components may be exaggerated for clarity. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the present invention. Also, it is to be understood that the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless limited otherwise, the terms “connected,” “coupled,” and “mounted” and variations thereof herein are used broadly and encompass direct and indirect connections, couplings, and mountings. Similarly, the terms “facing,” “faces” and variations thereof herein are used broadly and encompass direct and indirect facing, and “adjacent to” and variations thereof herein are used broadly and encompass directly and indirectly “adjacent to”. Therefore, the description of “A” component facing “B” component herein may contain the situations that “A” component directly faces “B” component or one or more additional components are between “A” component and “B” component. Also, the description of “A” component “adjacent to” “B” component herein may contain the situations that “A” component is directly “adjacent to” “B” component or one or more additional components are between “A” component and “B” component. Accordingly, the drawings and descriptions will be regarded as illustrative in nature and not as restrictive.

is a schematic diagram of a projector according to an embodiment of the disclosure. Please refer to. In this embodiment, a projectorincludes an illumination module, a light valve, and a projection lens. The illumination moduleis configured to provide an illumination beam L. The illumination moduleincludes a light sourceand a wavelength conversion module. The light sourceis configured to provide an excitation beam L′. The wavelength conversion moduleis configured on a transmission path of the excitation beam L′ and is configured to convert the excitation beam L′ into a conversion beam. Here, the illumination beam Lincludes the excitation beam L′ and the conversion beam. To further illustrate, the excitation beam L′ and the conversion beam leave the illumination modulein time sequence to form the illumination beam L. The light valveis configured on a transmission path of the illumination beam Land is configured to convert the illumination beam Linto an image beam L. The projection lensis disposed on a transmission path of the image beam Land is configured to project the image beam Lout of the projector.

In detail, the light sourceused in this embodiment is, for example, a laser diode (LD), such as an LD bank. Specifically, any light source that meets the volume requirement in actual design may be implemented, and the disclosure is not limited thereto. The light valveis, for example, a reflective optical modulator such as a liquid crystal on silicon panel (LCoS panel) and a digital micro-mirror device (DMD). In an embodiment, the light valveis, for example, a transmissive optical modulator such as a transparent liquid crystal panel, an electro-optical modulator, a magneto-optical modulator, and an acousto-optical modulator, but this embodiment does not limit the form and type of the light valve. The detailed steps and implementation manner of the method of the light valvetransforming the illumination beam Linto the image beam Lmay be obtained from common knowledge in the art with sufficient teaching, suggestion, and implementation description, so there will be no reiteration.

In addition, the projection lensincludes, for example, a combination of one or more optical lenses with refractive power, such as various combinations of non-planar lenses such as biconcave lens elements, biconvex lens elements, concave-convex lens elements, convex-concave lens elements, plano-convex lens elements, and plano-concave lens elements. In an embodiment, the projection lensmay also include a flat optical lens to convert the image beam Lfrom the light valveinto a projection beam to be projected out of the projectorin a reflective or transmissive manner. Here, this embodiment does not limit the form and type of the projection lens.

is a perspective schematic diagram of a wavelength conversion module according to an embodiment of the disclosure.is a perspective schematic diagram of the wavelength conversion module offrom another viewing angle.is a schematic diagram of a cross section taken along a line I-I of. Please refer toandat the same time. In this embodiment, a wavelength conversion moduleincludes a substrate, a wavelength conversion layer, and multiple adhesive bosses. The substratehas a first surfaceand a second surfaceopposite to each other. The wavelength conversion layeris configured on the first surfaceof the substrate. The wavelength conversion layeris, for example, a phosphor powder layer, such as a phosphor powder layer that generates a yellow and green conversion light after excitation, but not limited thereto, and is configured to convert the wavelength of the excitation beam L′ ofand respectively generate conversion beams with different wavelengths. The adhesive bossesinclude multiple first adhesive bossesand multiple second adhesive bosses. The first adhesive bossesare separately configured on the first surface, and the second adhesive bossesare separately configured on the second surface. The wavelength conversion layersurrounds the adhesive bosses, and the adhesive bossesare configured without contacting the inner side of the wavelength conversion layer. That is, each adhesive bossis configured separately from the wavelength conversion layer, so that there is a distance between the adhesive bossand the wavelength conversion layer.

More specifically, the substrateof this embodiment has a wavelength conversion regionand an optical regionadjacently configured along the circumferential direction. The wavelength conversion layeris located in the wavelength conversion region. The optical regionis configured with a transparent plateor a reflective structure (not shown). That is, the wavelength conversion moduleof this embodiment may be a transmissive wavelength conversion module or a reflective wavelength conversion module. In this embodiment, the transmissive wavelength conversion module is taken as an example. The optical regionis provided with the transparent plate, so that the excitation beam L′ (please refer to) transmitted to the optical regionpenetrates the transparent plateto be then transmitted to other optical elements. In another embodiment not shown, the reflective wavelength conversion module may be used. In this case, the optical regionmay be provided with a reflective structure, so that the excitation beam L′ transmitted to the optical region(please refer to) is reflected by the reflective structure to be then transmitted to other optical elements. The disclosure does not limit whether the wavelength conversion moduleis transmissive or reflective. Here, the material of the substrateis, for example, aluminum, aluminum oxide, aluminum nitride, silicon carbide, ceramic, ceramic and metal composite material, plastic and ceramic composite material, or plastic and metal composite material.

Furthermore, the shape of the adhesive bossof this embodiment is, for example, a bar shape or a block shape. The shape of the adhesive bossof this embodiment is exemplified as a bar shape for illustration. Each adhesive bosshas a first endand a second endopposite to each other. The connecting line between the first endand an axis center Cand the connecting line between the second endand the axis center Cform an included angle A, which means that the adhesive bossesare not arranged along the radial direction of the substrate. Here, the material of the adhesive bossesis, for example, metal glue, acrylic glue, silica gel, epoxy glue, or inorganic glue. The adhesive bossesare formed on the substrateby means of dispensing, printing, spraying, exposure and development, etc. In this embodiment, an adhesive with better thermal conductivity is selected as the material of the adhesive bosses. The adhesive bossesmay not only spoil the flow, but also increase the effective heat dissipation area. Preferably, the adhesive may be metal glue. The thermal conductivity of each adhesive bossis greater than 10 W/m·K. In addition, the coated adhesive also needs to withstand up to 100° C. without degradation, and preferably, withstand up to 200° C. or more, which may avoid degradation caused by heat energy generated during the wavelength conversion process.

Next, please refer to. In this embodiment, there is a first height difference Hbetween each first adhesive bossand the first surfaceof the substrate. There is a second height difference Hbetween the wavelength conversion layerand the first surfaceof the substrate. There is a third height difference Hbetween each second adhesive bossand the second surfaceof the substrate. Preferably, the first height difference His equal to the third height difference H, and the first height difference His greater than the second height difference H. Here, the first height difference His, for example, greater than 0.3 mm and less than 0.8 mm.

In addition, please refer toandat the same time. The wavelength conversion moduleof this embodiment further includes a weight ringand a driving component. The driving componentis connected to the substrateto drive the substrateto rotate with an axis X of the driving componentas the axis center. The driving componentand the second adhesive bossesare configured on the second surface, and the second adhesive bossessurround the driving component. The weight ringis attached onto the substratealong the axis X. The weight ringis configured on the first surfaceof the substrate. The substrateis located between the weight ringand the driving component. The first adhesive bossesare located between the weight ringand the wavelength conversion layer, and the first adhesive bossessurround the weight ring. In addition, as shown in, the wavelength conversion modulefurther includes a filler, which is configured in a recessof the weight ringto balance and correct the wavelength conversion module

In short, the adhesive bossesare separately configured on the substrate, and the adhesive bossesare configured without contacting the inner side of the wavelength conversion layer. In this way, the design of the adhesive bossesmay increase the heat dissipation effect of the substratewhen the wavelength conversion modulerotates at a high speed to reduce the temperature of the wavelength conversion layer, thereby increasing the excitation efficiency of the wavelength conversion module. Preferably, the heat dissipation efficiency of the wavelength conversion modulemay be increased by 20% to 30%, the excitation efficiency of the wavelength conversion modulemay be increased by 5% to 10%, and the temperature may be reduced by 10° C. to 20° C. Furthermore, the adhesive bossesalso have the functions of increasing the toughness and strength of the substratewhile balancing weight. In addition, the projectoradopting the wavelength conversion moduleof this embodiment has better heat dissipation and wavelength conversion efficiency, so as to have better projection quality and product competitiveness.

It must be noted here that the following embodiments continue to use the reference numerals of the elements and part of the content of the foregoing embodiment. The same reference numerals are used to represent the same or similar elements, and the description of the same technical content is omitted. Reference may be made to the foregoing embodiment for the description of the omitted parts, which will not be reiterated in the following embodiments.

is a perspective schematic diagram of a wavelength conversion module according to another embodiment of the disclosure.is a perspective schematic diagram of the wavelength conversion module offrom another viewing angle.is a schematic diagram of a cross section taken along a line II-II of. Please refer to,,, andat the same time. A wavelength conversion moduleof this embodiment is similar to the wavelength conversion moduleofand. The difference between the two is: in this embodiment, adhesive bossesare only located on the first surfaceof the substrate, a weight ringis configured on the second surfaceof the substrate, and the filleris configured in the recessof the weight ringto balance and correct the wavelength conversion module

Furthermore, the wavelength conversion moduleof this embodiment further includes an eccentric cover slab, which is configured on the first surfaceof the substrate. A center of mass Cof the eccentric cover slabdeviates from the axis center C. The first adhesive bossessurround the eccentric cover slab. Here, the weight ringis located between the driving componentand the substrate. The adhesive bossesare located between the eccentric cover slaband the wavelength conversion layer. Afterwards, please refer to. In this embodiment, there is a first height difference Hbetween each adhesive bossand the first surfaceof the substrate. There is a second height difference Hbetween the wavelength conversion layerand the first surfaceof the substrate. Preferably, the first height difference His greater than the second height difference H. The first height difference His, for example, greater than 0.3 mm and less than 0.8 mm.

is a perspective schematic diagram of a wavelength conversion module according to another embodiment of the disclosure.is a perspective schematic diagram of the wavelength conversion module offrom another viewing angle.is a schematic diagram of a cross section taken along a line III-III of. A wavelength conversion moduleof this embodiment is similar to the wavelength conversion moduleofand. The difference between the two is: in this embodiment, adhesive bossesof this embodiment includes multiple first adhesive bossesand multiple second adhesive boss. The first adhesive bossesare configured on the first surface, and the second adhesive bossesare configured on the second surface. Afterwards, please refer to. In this embodiment, there is a first height difference Hbetween each first adhesive bossand the first surfaceof the substrate. There is a second height difference Hbetween the wavelength conversion layerand the first surfaceof the substrate. There is a third height difference Hbetween each second adhesive bossand the second surfaceof the substrate. Preferably, the first height difference His equal to the third height difference H, and the first height difference His greater than the second height difference H. The first height difference His, for example, greater than 0.3 mm and less than 0.8 mm.

is a perspective schematic diagram of a wavelength conversion module according to another embodiment of the disclosure.is a perspective schematic diagram of the wavelength conversion module offrom another viewing angle.is a schematic diagram of a cross section taken along a line IV-IV of. A wavelength conversion moduleof this embodiment is similar to the wavelength conversion moduleofand. The difference between the two is: in this embodiment, the wavelength conversion modulefurther includes a connecting glue layer, which is connected to adhesive bossesalong the circumferential direction. That is, the adhesive bossesare connected in series through the connecting glue layer, which may improve the adhesion between the connecting glue layerand the substrate. Here, the material of the connecting glue layeris, for example, metal glue, acrylic glue, silica gel, epoxy glue, or inorganic glue, but not limited thereto.

Then, please refer to. In this embodiment, there is a first height difference Hbetween each adhesive bossand the first surfaceof the substrate. There is a second height difference Hbetween the wavelength conversion layerand the first surfaceof the substrate. There is a third height difference Hbetween the connecting glue layerand the first surfaceof the substrate. Preferably, the first height difference His greater than the second height difference Hand the third height difference H. The first height difference His, for example, greater than 0.3 mm and less than 0.8 mm.

is a perspective schematic diagram of a wavelength conversion module according to another embodiment of the disclosure.is a perspective schematic diagram of the wavelength conversion module offrom another viewing angle.is a schematic diagram of a cross section taken along a line V-V of. A wavelength conversion moduleof this embodiment is similar to the wavelength conversion moduleofand. The difference between the two is: in this embodiment, adhesive bossesinclude multiple first adhesive bossesand multiple second adhesive bosses. The first adhesive bossesare configured on the first surface, and the second adhesive bossesare configured on the second surface. Furthermore, the wavelength conversion moduleof this embodiment further includes a connecting glue layer, which is configured on a part of the second surfacealong the circumferential direction of the substrate. The second adhesive bossesare connected to each other through the connecting glue layer. That is, the second adhesive bossesare connected in series through the connecting glue layer, which may improve the adhesion between the connecting glue layerand the substrate. Here, the material of the connecting glue layeris, for example, metal glue, acrylic glue, silica gel, epoxy glue, or inorganic glue, but not limited thereto. In an embodiment, the connecting glue layermay have different widths in the radial direction, and have a larger width at the position where the unbalance needs to be compensated, wherein the unbalance is caused when the center of gravity is shifted from the axis X, and the unbalance may be compensated by adjusting the position of center of gravity. For example, as shown in, the two ends close to the transparent platehave larger widths.

Please refer to. In this embodiment, there is a first height difference Hbetween each first adhesive bossand the first surfaceof the substrate. There is a second height difference Hbetween the wavelength conversion layerand the first surfaceof the substrate. There is a third height difference Hbetween the connecting glue layerand the first surfaceof the substrate. There is a fourth height difference Hbetween the connecting glue layerand the second surfaceof the substrate. The first height difference His greater than the second height difference H, the third height difference H, and the fourth height difference H. The first height difference His, for example, greater than 0.3 mm and less than 0.8 mm.

is a perspective schematic diagram of a wavelength conversion module according to another embodiment of the disclosure. A wavelength conversion moduleof this embodiment is similar to the wavelength conversion moduleof. The difference between the two is that: in this embodiment, a substratehas the first surfaceand the second surfaceopposite to each other and includes multiple spoiler parts. The spoiler partsprotrude inwardly from at least one of the first surfaceand the second surface. In this embodiment, the spoiler partsprotrude inwardly from the first surfaceand are staggered with the adhesive bosses. Here, the spoiler partsare formed by stamping or processing forming the substrate. The material of the spoiler partsis the same as the material of the substrate. The height difference between the spoiler partsand the first surfaceof the substrateis greater than the first height difference Hbetween the adhesive bossesand the first surfaceof the substrate(please refer to).

In summary, the embodiments of the disclosure have at least one of the following advantages or effects. In the design of the wavelength conversion module of the disclosure, the adhesive bosses are separately configured on the substrate, and the adhesive bosses are configured without contacting the inner side of the wavelength conversion layer. With the design of the adhesive bosses, the heat dissipation effect of the substrate may be increased when the wavelength conversion module rotates at a high speed to reduce the temperature of the wavelength conversion layer, thereby increasing the excitation efficiency of the wavelength conversion module. Furthermore, the adhesive bosses also have the functions of increasing the toughness and strength of the substrate while balancing weight. In addition, the projector adopting the wavelength conversion module of the disclosure may have better projection quality and product competitiveness.

The foregoing description of the preferred embodiments of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form or to exemplary embodiments disclosed. Accordingly, the foregoing description should be regarded as illustrative rather than restrictive. Obviously, many modifications and variations will be apparent to practitioners skilled in this art. The embodiments are chosen and described in order to best explain the principles of the invention and its best mode practical application, thereby to enable persons skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use or implementation contemplated. It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents in which all terms are meant in their broadest reasonable sense unless otherwise indicated. Therefore, the term “the invention”, “the present invention” or the like does not necessarily limit the claim scope to a specific embodiment, and the reference to particularly preferred exemplary embodiments of the invention does not imply a limitation on the invention, and no such limitation is to be inferred. The invention is limited only by the spirit and scope of the appended claims. Moreover, these claims may refer to use “first”, “second”, etc. following with noun or element. Such terms should be understood as a nomenclature and should not be construed as giving the limitation on the number of the elements modified by such nomenclature unless specific number has been given. The abstract of the disclosure is provided to comply with the rules requiring an abstract, which will allow a searcher to quickly ascertain the subject matter of the technical disclosure of any patent issued from this disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Any advantages and benefits described may not apply to all embodiments of the invention. It should be appreciated that variations may be made in the embodiments described by persons skilled in the art without departing from the scope of the present invention as defined by the following claims. Moreover, no element and component in the present disclosure is intended to be dedicated to the public regardless of whether the element or component is explicitly recited in the following claims.