Wafer transfer method and wafer transfer apparatus

The present invention relates to a wafer transfer method that affixes a wafer affixed to a first adhesive tape to a second adhesive tape and that peels off the first adhesive tape from the wafer and a wafer transfer apparatus that transfers the wafer from the first adhesive tape to the second adhesive tape.

In a process of manufacturing device chips used in electronic apparatuses such as mobile telephones or personal computers, first, a plurality of planned dividing lines (streets) intersecting one another are set on the top surface of a wafer formed of a material such as a semiconductor. Then, a device such as an integrated circuit (IC) or large-scale integration (LSI) is formed in each of regions demarcated by the planned dividing lines. The individual device chips are formed when the wafer is thereafter divided along the planned dividing lines. The division of the wafer is, for example, performed by a cutting apparatus having an annular cutting blade. Before the wafer is loaded into the cutting apparatus, an adhesive tape having a diameter larger than that of the wafer is affixed to the undersurface of the wafer. This adhesive tape is referred to as a dicing tape. An inner circumferential portion of a ring frame having an opening portion of such a size as to be able to house the wafer is affixed to a peripheral portion of the adhesive tape. That is, the wafer, the adhesive tape, and the ring frame are integrated to form a frame unit, and the wafer forming a part of the frame unit and having the top surface side thereof exposed upward is loaded into the cutting apparatus and processed therein.

In the cutting apparatus, while a workpiece is cut, cutting water is supplied to the workpiece and the cutting blade in order to remove heat and cutting waste generated from the workpiece and the cutting blade by the cutting. However, when the cutting water that has captured the cutting waste comes into contact with the top surface of the workpiece and the cutting water is dried, the cutting waste is fixed to the devices formed on the top surface of the workpiece. Accordingly, there is a case where, in order not to contaminate the top surface side, the frame unit is formed by affixing the adhesive tape to the top surface side in place of the undersurface of the wafer, to expose the undersurface side upward (see Japanese Patent Laid-Open No. 2010-82644).

However, in this case, each chip formed by cutting the wafer has a device formation surface thereof oriented to the adhesive tape side. Therefore, when the chip is picked up from the adhesive tape and mounted on a predetermined mounting target, the circuit pattern of the device cannot be photographed by an imaging unit, and the alignment of the chip in consideration of the position of the circuit pattern cannot be performed. Accordingly, after the wafer is cut, performed is transfer work (reaffixing work) which affixes a new adhesive tape to the exposed undersurface side of the wafer and peels off the old adhesive tape from the wafer (see Japanese Patent Laid-Open No. 2017-162870). More specifically, first, a first adhesive tape of a first frame unit including the wafer, the first adhesive tape, and a first ring frame is cut along the periphery of the wafer. Then, in place of the first ring frame, a second ring frame is disposed on the periphery of the wafer, and a second adhesive tape is affixed to the surface of the wafer to which surface the first adhesive tape is not affixed and the second ring frame. Finally, the first adhesive tape remaining on the wafer is peeled off. The transfer of the wafer (reaffixing of the adhesive tape) is thereby completed.

However, in a case where the wafer transfer work is performed by this method, there is a fear that a cutting tool cutting the first adhesive tape may come into contact with the wafer and damage the wafer (chips). In addition, there is a fear that cutting waste may be generated by cutting the first adhesive tape, adhere to the wafer, and contaminate the wafer. The wafer has been subjected to various kinds of processing with enormous cost and time before this stage in which the transfer work is performed. Therefore, damaging or soiling the wafer (chips) in this stage immediately before the completion of the chips causes a tremendous loss. Hence, there is a desire to perform the wafer transfer work (reaffixing of the adhesive tape) without cutting the adhesive tape.

It is accordingly an object of the present invention to provide a wafer transfer method and a wafer transfer apparatus that can transfer a wafer safely by replacing an adhesive tape without cutting the adhesive tape.

In accordance with an aspect of the present invention, there is provided a wafer transfer method for forming a second work unit by transferring a wafer of a first work unit to a second adhesive tape that is affixed to a second ring frame in such a manner as to close a second opening portion disposed in a center of the second ring frame, the first work unit including a first ring frame having a first opening portion disposed in a center of the first ring frame, a first adhesive tape affixed to the first ring frame in such a manner as to close the first opening portion, and the wafer affixed to the first adhesive tape in the first opening portion of the first ring frame. The wafer transfer method includes a ring frame disposing step of facing the second ring frame to a surface of the first ring frame of the first work unit, the first ring frame surface not being affixed to the first adhesive tape, while superposing the second opening portion on the first opening portion, and superposing the second ring frame on the first ring frame without bringing the second ring frame into contact with the first ring frame, by sandwiching a claw body between the first ring frame and the second ring frame, an affixing step of affixing the second adhesive tape to a surface of the wafer, the wafer surface not being affixed to the first adhesive tape, in a state in which the first ring frame and the second ring frame are superposed on each other without being in contact with each other, and holding the wafer by the second ring frame via the second adhesive tape, and a peeling step of peeling off the first adhesive tape from the wafer and peeling off the first adhesive tape from the first ring frame in the state in which the first ring frame and the second ring frame are superposed on each other without being in contact with each other.

Preferably, in the affixing step, the second adhesive tape affixed to the second ring frame in advance is affixed to the wafer.

In addition, preferably, the wafer transfer method further includes a cleaning step of cleaning the wafer with liquid after the peeling step.

Further, preferably, in the peeling step, a peeling tape is affixed to the first adhesive tape, and the first adhesive tape is peeled off from the first ring frame and the wafer by the peeling tape by moving the peeling tape.

In addition, preferably, when the wafer is affixed to the second adhesive tape in the affixing step, the wafer is brought close to the second adhesive tape by adjusting relative positions of the wafer and the first ring frame in a penetrating direction of the first opening portion in advance while the first adhesive tape is deformed.

In accordance with another aspect of the present invention, there is provided a wafer transfer apparatus for forming a second work unit by transferring a wafer of a first work unit to a second adhesive tape that is affixed to a second ring frame in such a manner as to close a second opening portion disposed in a center of the second ring frame, the first work unit including a first ring frame having a first opening portion disposed in a center of the first ring frame, a first adhesive tape affixed to the first ring frame in such a manner as to close the first opening portion, and the wafer affixed to the first adhesive tape in the first opening portion of the first ring frame. The wafer transfer apparatus includes a first work unit supporting unit including a wafer supporting portion configured to support the wafer via the first adhesive tape and a ring frame supporting portion configured to support the first ring frame via the first adhesive tape, the first work unit supporting unit being configured to support the first work unit in a state in which a surface of the wafer, the wafer surface not being affixed to the first adhesive tape, is exposed upward, a second ring frame supporting unit including a first claw portion having a function of supporting the second ring frame in such a manner as to face the first ring frame supported by the ring frame supporting portion of the first work unit supporting unit and a function of being sandwiched between the first ring frame and the second ring frame, the second ring frame supporting unit being configured to be able to move the first claw portion between a region between the first ring frame and the second ring frame and an outside of the region, a tape affixing unit disposed above the second ring frame supporting unit, the tape affixing unit being configured to affix the second adhesive tape to a surface of the wafer supported by the wafer supporting portion of the first work unit supporting unit, the wafer surface not being affixed to the first adhesive tape, a holding unit having a second claw portion, the holding unit being configured to hold the second ring frame by the second claw portion by inserting the second claw portion between the first ring frame and the second ring frame and hold the wafer via the second adhesive tape, and a peeling unit configured to peel off the first adhesive tape from the wafer and peel off the first adhesive tape from the first ring frame in a state in which the holding unit holds the wafer.

Preferably, the wafer transfer apparatus further includes a tape supply unit configured to affix the second adhesive tape to the second ring frame in such a manner as to close the second opening portion in advance before the second ring frame supporting unit supports the second ring frame.

In addition, preferably, the wafer transfer apparatus further includes a cleaning unit configured to clean, with liquid, the wafer from which the first adhesive tape has been peeled off by the peeling unit.

More preferably, the peeling unit includes a peeling tape supply unit to which a peeling tape formed by a base material and an adhesive layer formed on one surface of the base material is drawably fitted in a state of being rolled in a roll shape, a plurality of rollers configured to guide the peeling tape drawn out from the peeling tape supply unit and form a traveling path of the peeling tape, a moving body having a pressing portion configured to affix the peeling tape to the first adhesive tape by pressing the peeling tape against the first adhesive tape, a driving unit configured to move the moving body, and a winding unit configured to wind and collect the peeling tape, and the peeling unit affixes the peeling tape to the first adhesive tape by pressing the peeling tape against the first adhesive tape by the pressing portion, moves the peeling tape by moving the moving body by the driving unit, peels off the first adhesive tape from the first ring frame and the wafer by the peeling tape, and is able to wind and collect, by the winding unit, the peeling tape to which the first adhesive tape is affixed.

In addition, preferably, the first work unit supporting unit further includes a raising and lowering unit configured to raise and lower the wafer supporting portion and the ring frame supporting portion relative to each other.

In the wafer transfer method and the wafer transfer apparatus according to one aspect of the present invention, first, the second ring frame is superposed on the first ring frame of the first work unit, and at this time, a claw body (claw portion) is sandwiched between the first ring frame and the second ring frame. Then, the claw body performs a function of a separator, so that the second ring frame is superposed on the first ring frame without being in contact with the first ring frame. Then, the second adhesive tape is affixed to the wafer, and the wafer is held by the second ring frame via the second adhesive tape. Finally, the first adhesive tape is peeled off from the wafer and the first ring frame. The second work unit which includes the wafer, the second adhesive tape, and the second ring frame is consequently formed. The transfer of the wafer is thereby completed. When the wafer is thus transferred, a process of cutting the first adhesive tape by a cutting tool is unnecessary. Therefore, the cutting tool does not come into contact with the wafer, nor does the adhesion of cutting waste attendant on the cutting of the first adhesive tape to the wafer occur.

In particular, a predetermined interval is formed between the second ring frame and the first ring frame by sandwiching the claw body (claw portion) between the second ring frame and the first ring frame. Therefore, a situation in which, when the second adhesive tape is affixed to the wafer, the second adhesive tape hangs down and sticks to the first adhesive tape is prevented.

Hence, one aspect of the present invention provides a wafer transfer method and a wafer transfer apparatus that can transfer a wafer safely by replacing an adhesive tape without cutting the adhesive tape.

The above and other objects, features and advantages of the present invention and the manner of realizing them will become more apparent, and the invention itself will best be understood from a study of the following description and appended claims with reference to the attached drawings showing a preferred embodiment of the invention.

An embodiment of the present invention will hereinafter be described in detail with reference to the accompanying drawings. In a wafer transfer method and a wafer transfer apparatus according to the present embodiment, a wafer affixed to a first adhesive tape is transferred to a second adhesive tape. That is, the first adhesive tape affixed to the wafer is replaced with the second adhesive tape. Then, the wafer that has been included in a first work unit is set in a state of being included in a second work unit.

The wafer to be transferred from the first adhesive tape to the second adhesive tape will first be described.is a perspective view illustrating a top surfaceside of the wafer, denoted by.includes a perspective view illustrating an undersurfaceside of the wafer. The waferis, for example, a substantially disk-shaped substrate or the like formed of a material such as silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), or another semiconductor. However, the waferis not limited to this. The top surfaceof the waferis demarcated by a plurality of planned dividing linesintersecting one another. A devicesuch as an IC or LSI is formed in each of regions demarcated by the planned dividing lineson the top surfaceof the wafer. When the waferis divided along the planned dividing lines, individual device chips having respective devicescan be manufactured. The waferis divided by a processing apparatus such as a cutting apparatus or a laser processing apparatus.

When the waferis to be loaded into the processing apparatus, a work unit is formed in advance by integrating the wafer, an adhesive tape referred to also as a dicing tape, and a ring frame formed of a material such as metal. At this time, when the adhesive tape is affixed to the undersurfaceside of the wafer, the top surfaceside is exposed. Therefore, processing waste or the like produced by processing adheres to the devices, and contaminates the devices. Thus, there is a case where a frame unit is formed by affixing the top surfaceside of the waferto the adhesive tape.is a perspective view schematically illustrating a first work unitformed by integrating a first ring frame, a first adhesive tape, and the wafer.

The first ring frameis formed of a metallic material such as aluminum or stainless steel. A first opening portionis provided in the center of the first ring frame. The first opening portionpenetrates from a top surfaceto an undersurfaceof the first ring frame, and has a diameter larger than the diameter of the wafer.

The first adhesive tapeis affixed to the first ring framein such a manner as to close the first opening portion. The first adhesive tapehas a diameter larger than the diameter of the first opening portionof the first ring frame. The first adhesive tape, for example, includes a base material layer formed by a resin film or the like and an adhesive layer formed on one surface of the base material layer. Incidentally, the adhesive layer is preferably formed by a UV curing resin. In this case, the adhesive force of the adhesive layer can be decreased by application of UV rays to the first adhesive tape. When the first adhesive tapeis affixed to the first ring framein such a manner as to close the first opening portion, the adhesive layer of the first adhesive tapeis exposed in the first opening portion. Then, the waferis affixed to the first adhesive tapefrom the top surfaceside in the first opening portion

The waferis transported to the processing apparatus in a state in which the waferis included in the first work unitillustrated in, and the waferis then processed and divided. Thereafter, the first work unitis unloaded from the processing apparatus. However, when the first adhesive tapeis affixed to the top surfaceside of the wafer, it is difficult to check circuit patterns constituting the devicesor the like. Accordingly, in the wafer transfer method and the wafer transfer apparatus according to the present embodiment, the waferis transferred by affixing a second adhesive tape to the undersurfaceside of the waferand peeling off the waferfrom the first adhesive tape. Then, a second work unit constituted by the wafer, the second adhesive tape, and a second ring frame is formed. However, the wafer transfer method and the wafer transfer apparatus according to the present embodiment are not limited to this. The first adhesive tapemay be affixed to the undersurfaceof the wafer, and the second adhesive tape may be affixed to the top surfaceof the wafer. In the following, description will be made by taking as an example a case where the first work unitis formed by affixing the first adhesive tapeto the top surfaceside of the waferand where the second work unit is formed by affixing the second adhesive tape to the undersurfaceand peeling off the first adhesive tapefrom the top surfaceside. However, in the following description, the top surfaceand the undersurfacemay be replaced with each other.

The transfer of the waferis performed by a wafer transfer apparatusillustrated in. The wafer transfer apparatuswill first be described in detail.is a perspective view schematically illustrating the wafer transfer apparatus. The first work unitincluding the waferis loaded into the wafer transfer apparatusin a state in which the first work unitis housed in a cassettethat can house a plurality of first work units. In addition, the second work unit formed by transferring the waferin the wafer transfer apparatusis housed into a cassettethat can house a plurality of second work units. As illustrated in, the wafer transfer apparatusincludes a basethat supports each constituent element. Arranged on the front side of the baseare a cassette tableon which the cassettehousing the first work unitis mounted and a cassette tableon which the cassettehousing the second work unit is mounted. The cassette tablesandcan be raised and lowered in an upward-downward direction (Z-axis direction) by a raising and lowering mechanism (not illustrated).

Both side walls of housing spaces of the cassettesandare respectively provided with a plurality of housing rails at height positions corresponding to each other. The ring frame of a work unit housed in the cassetteorhas one end mounted on the housing rail provided to one side wall, and has another end mounted on the corresponding housing rail provided to the other side wall.

In the wafer transfer apparatus, the cassettehousing a plurality of first work unitsis mounted on the cassette table, the first work unitsare unloaded from the cassetteone after another, and the waferincluded in each of the first work unitsis reaffixed to the second adhesive tape. Then, second work units formed are housed into the cassettemounted on the cassette tableone after another.

On a rear side (X-axis positive direction side) of the upper surface of the basewhich rear side is adjacent to the cassette table, provided is a temporary placement table which is formed by a pair of guide railsthat are brought into proximity to and separated from each other while maintaining a state of being parallel with an X-axis direction. In addition, at a position adjacent to the temporary placement table on the upper surface of the base, provided is a push-pull arm (unloading unit)which unloads, from the cassette, a first work unithoused in the cassettemounted on the cassette table

is a perspective view schematically illustrating the cassettemounted on the cassette table, the pair of guide rails, and the push-pull arm. The pair of guide railseach includes a horizontal supporting surface(along an XY plane) that supports the first ring frameof the first work unitfrom below and a butting surfacesubstantially perpendicular to the supporting surface(along an XZ plane). The butting surfacesof the respective guide railsface each other. The push-pull armis connected to a moving mechanism (not illustrated) that moves the push-pull armalong the X-axis direction. The push-pull armis movable along the X-axis direction by the moving mechanism. A surface of the push-pull armwhich surface faces the cassette(cassette table) is provided with a gripping unit that grips the first ring frameof the first work unit. The gripping unit grips the first ring framefrom above and from below.

As illustrated in, the wafer transfer apparatusincludes a first UV irradiating unitin a region within the baseand directly below the pair of guide rails. In, the first UV irradiating unitis indicated by a chain double-dashed line. The first UV irradiating unithas a function of irradiating the first work unitpulled out to the pair of guide railswith UV rays from below. The first UV irradiating unitincludes a UV light source.

When the first work unithoused in the cassetteis to be unloaded by the push-pull arm (unloading unit), the push-pull armis moved to the cassette, and the push-pull armis made to grip the first ring frame. Incidentally, at this time, the cassette tableis raised or lowered in advance such that the height of the first work unitto be unloaded and the height of the gripping unit of the push-pull armcorrespond to each other. Thereafter, when the push-pull armis moved in a direction of separating from the cassette, the first work unitis pulled out onto the supporting surfacesof the guide railsfrom the cassette. At this time, the first work unitis positioned at a predetermined position in the X-axis direction by adjusting the position of the push-pull arm. The gripping of the first ring frameby the push-pull armis thereafter released. Next, when the pair of guide railsare moved in a direction of approaching each other in an interlocked manner and the first ring frameis sandwiched between the respective butting surfacesof the pair of guide rails, the first work unitis positioned at a predetermined position in a Y-axis direction.

In addition, the first UV irradiating unitirradiates the first work unitpulled out onto the pair of guide railswith UV rays from below. In a case where the adhesive layer of the first adhesive tapeis formed by a UV curing resin, the adhesive force of the adhesive layer is decreased when the first adhesive tapeis irradiated with UV rays. Therefore, the first adhesive tapeis peeled off easily and cleanly when the first adhesive tapeis peeled off from the waferand the first ring frame, as will be described later.

The wafer transfer apparatusincludes a first work unit supporting unitat a position adjacent to the temporary placement unit formed by the pair of guide rails. The first work unit supporting unithas a function of supporting the first work unit. When the first work unitis supported by the first work unit supporting unit, the undersurfaceof the waferwhich undersurface is on a side opposite to the top surfaceaffixed to the first adhesive tapeis exposed upward.

The first work unit supporting unitincludes a wafer supporting portionthat supports the waferof the first work unitvia the first adhesive tapeand a ring frame supporting portionthat supports the first ring framevia the first adhesive tape. The wafer supporting portionhas a circular shape such that an upper surface thereof serving as a supporting surface has substantially the same diameter as that of the wafer. In addition, the ring frame supporting portionhas an annular upper surface serving as a supporting surface, and an inner circumferential edge of the ring frame supporting portionhas substantially the same diameter as that of the first opening portionof the first ring frame.

In addition, the first work unit supporting unitincludes a raising and lowering unit (not illustrated) that raises and lowers the wafer supporting portionand the ring frame supporting portionrelative to each other. The raising and lowering unit is not particularly limited to any kind. However, a ball screw type raising and lowering mechanism, a raising and lowering mechanism including an air cylinder, or the like can be applied to the raising and lowering unit. The wafer supporting portionand the ring frame supporting portionare each raisable and lowerable along a Z-axis direction independently. Further, the wafer supporting portionmay include a heating mechanism (heater) such as a heating wire, and may thereby be capable of heating the wafersupported by the wafer supporting portionto a predetermined temperature within a range of 30° C. to 80° C. When the wafersupported by the wafer supporting portionis heated in advance, the second adhesive tape is heated and softened at a time of affixing the second adhesive tape to the waferas described later. In this case, the second adhesive tape is easily deformed to follow the shape of the adhered surface (undersurface) of the wafer, so that the adhesive force of the second adhesive tape is strengthened.

The wafer transfer apparatusincludes a first work unit transporting unitthat transports the first work unitfrom the temporary placement unit formed by the pair of guide railsto the first work unit supporting unit. The first work unit transporting unittransports the first work unitpositioned at the predetermined positions in the X-axis direction and the Y-axis direction, by a predetermined operation. The first work unit transporting unitthereby transports the first work unitto a predetermined position on the first work unit supporting unit. The first work unit transporting unitincludes a railalong the X-axis direction, an arm unithaving a proximal end side slidably fitted to the rail, and a holding unitprovided via a raising and lowering mechanismto a lower side of a distal end of the arm unitextending along a horizontal direction. The holding unit, for example, has a function of holding under suction the first ring frameof the first work unitfrom above. In addition, the raising and lowering mechanismis formed by an air cylinder or the like, and has a function of raising and lowering the holding unit.

Returning to, the description of the wafer transfer apparatuswill be continued. The wafer transfer apparatusincludes a second ring frame supporting unitfor supporting a second ring frame above the first work unit supporting unit. The second ring frame supporting unitwill be described later in detail. The wafer transfer apparatushas a supply mechanism for supplying the second ring frame to the second ring frame supporting uniton the rear side (far side in the X-axis direction) of the first work unit supporting uniton the base.

The second ring frame supply mechanism will be described with reference to.is a perspective view schematically illustrating a ring frame housing unit, a ring frame transporting unit, a ring frame support table, and an adhesive tape supply unit.

The ring frame housing unithas a function of housing a plurality of second ring frames in a stacked manner. The ring frame housing unitis disposed within the base. The second ring frame used to form a second work unit is supplied from the ring frame housing unit.

is a perspective view schematically illustrating the ring frame housing unit.schematically illustrates a second ring framehoused in the ring frame housing unit.illustrates one second ring framehoused in the ring frame housing unit, for the convenience of description. It is needless to say that the number of second ring frameshoused in the ring frame housing unitis not limited to one. Here, the second ring frameis formed in a manner similar to that of the first ring frame. Specifically, the second ring frameis formed of a metallic material such as aluminum, and a second opening portionthat penetrates a top surfaceand an undersurfaceis formed in the center of the second ring frame. The second ring frameis, for example, housed in the ring frame housing unitin a state in which the top surfaceis oriented downward and the undersurfaceside to which the second adhesive tape is affixed as described later is oriented upward.

The ring frame housing unitincludes a support tableon which a plurality of stacked second ring framesare to be mounted and a plurality of positioning poststhat are erected from an outer circumferential portion of the support tableto surround the second ring framefrom the periphery thereof. The peripheral edge of the second ring framehas a notch portion, a linear portion, and an arcuate portion formed for various purposes. The positioning postsare arranged at positions corresponding to the shape of the peripheral edge of the second ring frame. The positioning postsregulate the position, orientation, and obverse and reverse of the second ring framehoused in the ring frame housing unit. Conversely, the second ring framecannot be mounted on the support tableunless in a predetermined position and a predetermined orientation. In addition, the second ring framecannot be mounted on the support tablein a state in which the top surfaceis oriented upward and the undersurfaceis oriented downward, because of obstruction by the positioning posts. Therefore, when the second ring framehoused in the ring frame housing unitis transported by a predetermined transporting operation, the second ring framecan be supplied to a predetermined place in a predetermined position and a predetermined orientation.

Description will next be made of the ring frame transporting unitthat transports the second ring framehoused in the ring frame housing unit. As illustrated in, the ring frame transporting unitincludes a railalong the Y-axis direction, a moving bodyslidably fitted to the rail, an arm unitextending from the moving bodyin the X-axis direction, and a holding unitprovided to a distal end of the arm unit. The arm unitcan be raised and lowered along the moving body. Specifically, the ring frame transporting unitincludes an unillustrated raising and lowering mechanism in the moving body, and thereby raises and lowers the arm unitalong the Z-axis direction. In addition, the holding unitcan hold the second ring frameunder suction from above. Specifically, the ring frame transporting unithas an unillustrated suction mechanism that is connected to the holding unit, and can therefore transport the second ring framewhile holding the second ring frameunder suction. One end of the railreaches the vicinity of the ring frame housing unit. Another end of the railreaches the vicinity of the ring frame support tableto be described next. The ring frame transporting unittransports the second ring framefrom the ring frame housing unitto the ring frame support table.

At the ring frame support table, the second adhesive tape is affixed to the undersurfaceside of the second ring framein such a manner as to close the second opening portion. The adhesive tape supply unitthat supplies the second adhesive tape to the second ring frameis disposed above the ring frame support table. The adhesive tape supply unitwill next be described. The adhesive tape supply unitincludes a feeding rollwound with a long length of a supply tape, a plurality of rollersthat form a traveling path of the supply tapefed from the feeding roll, and a winding rollthat winds the supply tape. The adhesive tape supply unitis supported by an unillustrated raising and lowering mechanism, and can thereby be raised and lowered above the ring frame support table.

The supply tape, for example, includes a base material layer formed of resin or the like and an adhesive layer formed on one surface of the base material layer. A second adhesive tape can be formed when the supply tapeis cut out into a predetermined shape. The adhesive tape supply unitincludes a cutting unitthat cuts out the supply tape. The cutting unitincludes a rotary shaft portionalong a Z-axis, an arm portionextending along the horizontal direction from a lower end of the rotary shaft portion, and a cutter (cutting tool)provided to a lower side of a distal end of the arm portion. The rotary shaft portionof the cutting unitis positioned directly above the center of the second opening portionof the second ring framesupported by the ring frame support table. In addition, the arm portionis longer than the diameter of the second opening portion. The cutting unithas an unillustrated rotational driving source such as a motor, which rotates the rotary shaft portion. The cutting unitmoves the cutteron an annular trajectory having the arm portionas a diameter, by actuating the rotational driving source.

When the second adhesive tape is to be supplied from the adhesive tape supply unitto the second ring frame, first, the adhesive tape supply unitis lowered toward the second ring framesupported by the ring frame support table. Then, the supply tapeis affixed to the exposed undersurfaceside of the second ring frame. Thereafter, the supply tapeis cut out into a circular shape by rotationally moving the cutterof the cutting unitaround the second opening portionwhile making the cuttercut into the supply tapeon the second ring frame.

A second adhesive tape(seeand the like) can thereby be supplied to the undersurfaceof the second ring frame. However, the supply tapemay be a support tape on which a plurality of second adhesive tapes formed in a predetermined shape in advance are arranged side by side, and the second adhesive tapemay be transferred from the supply tapeas the support tape to the second ring frame. In this case, the cutting unitis unnecessary, and therefore, cutting waste is not produced accompanying the cutting of the supply tape.

In addition, the adhesive tape supply unitdoes not have to be disposed above the ring frame support table, and the second adhesive tapedoes not have to be supplied to the second ring frameon the ring frame support table. For example, the adhesive tape supply unitmay supply the second adhesive tapeto the second ring frameand the waferon the second ring frame supporting unitto be described later.

The second ring frameis transported from the ring frame support tableto the second ring frame supporting unitdisposed above the first work unit supporting unit. The wafer transfer apparatusincludes a ring frame transporting unitthat transports the second ring framefrom the ring frame support tableto the second ring frame supporting unit. The ring frame transporting unitis configured in a manner similar to that of the ring frame transporting unitdescribed above. The ring frame transporting unitincludes a railalong the X-axis direction, a moving body (not illustrated) slidably fitted to the rail, an arm unit extending in the Y-axis direction from the moving body, and a holding unit provided to a distal end of the arm unit. This holding unit can be raised and lowered, and can hold the second ring frameunder suction from above. That is, the ring frame transporting unitcan transport the second ring framewhile holding the second ring frameunder suction.