Managing program operations in memory systems

This application claims priority to Chinese Patent Application No. 202410545481.8, filed on Apr. 29, 2024, which is hereby incorporated by reference in its entirety.

The present disclosure generally relates to memory systems, and more specifically, to management of program operations of memory systems.

Program voltage in semiconductor manufacturing typically refers to the voltage used to change the state of a memory cell in non-volatile memory technologies, like Flash memory. The program voltage can depend on the specific technology, process, and the design of the semiconductor device being manufactured.

The present disclosure describes management of program operations in memory systems.

In one aspect, the present disclosure describes a memory device. The memory device includes a memory cell array and a peripheral circuit coupled to the memory cell array. The peripheral circuit is configured to: obtain a first temperature; in response to determining that the first temperature is at or above a predetermined threshold, apply a first program voltage pulse with a first pulse width to a specified word line coupling memory cells of the memory cell array; obtain a second temperature; and in response to determining that the second temperature is below the predetermined threshold, apply a second program voltage pulse with a second pulse width to the specified word line, wherein the second pulse width is larger than the first pulse width.

In another aspect, the present disclosure describes a method performed by a peripheral circuit in a memory device. The method includes: obtaining, by the peripheral circuit, a first temperature; in response to determining that the first temperature is at or above a predetermined threshold, applying, by the peripheral circuit, a first program voltage pulse with a first pulse width to a specified word line coupling memory cells of the memory cell array; obtaining, by the peripheral circuit, a second temperature; and in response to determining that the second temperature is below the predetermined threshold, applying, by the peripheral circuit, a second program voltage pulse with a second pulse width to the specified word line, wherein the second pulse width is larger than the first pulse width.

In still another aspect, the present disclosure describes a system that includes a memory device and a controller coupled to the memory device. The memory device includes a memory cell array and a peripheral circuit coupled to the memory cell array. The peripheral circuit is configured to: obtain a first temperature; in response to determining that the first temperature is at or above a predetermined threshold, apply a first program voltage pulse with a first pulse width to a specified word line coupling memory cells of the memory cell array; obtain a second temperature; and in response to determining that the second temperature is below the predetermined threshold, apply a second program voltage pulse with a second pulse width to the specified word line, wherein the second pulse width is larger than the first pulse width.

The details of one or more implementations of the subject matter of this disclosure are set forth in the accompanying drawings and the description below. Other features, aspects, and advantages of the subject matter will become apparent from the description, the drawings, and the claims.

Like reference numbers and designations in the various drawings indicate like elements.

The disclosed subject matter can help address technical challenges associated with the miniaturization of complementary metal-oxide-semiconductor (CMOS) memory devices, particularly the diminution of string driver capabilities due to reduced die sizes. As CMOS die size decreases, string driver size is also required to shrink, thereby weakening string driver capability. Low string driver capability may not provide sufficient high program voltage, potentially resulting in program failure and programming inefficacies. To counteract this, it is proposed to reduce the program voltage, such as the maximum final program voltage in an Incremental Step Pulse Programming (ISPP) loop, thereby enhancing the device reliability and facilitating die size reduction. In some instances, the required or desired maximum program voltage at lower temperatures (e.g., −25 degrees Celsius) is higher than the one in higher temperatures (e.g., 85 degrees Celsius). In some instances, the maximum program voltage for memory cells situated in upper layers of a memory cell array is also higher than the one for memory cells situated in lower layers, due to the comparatively larger critical dimensions (CDs).

In view of these challenges, the present disclosure introduces techniques for adaptively changing a duration of a program voltage pulse applied to word lines coupling memory cells under conditions of low temperature. For example, the duration of program pulse applied to a word line can be increased as word line CD increases. By prolonging or the pulse duration or increasing pulse width for the selected word lines, it can help memory cells acquire the necessary energy for consistent programming at reduced voltage levels, thus compensating for the diminished capacitive driving capacity inherent in scaled-down string drivers.

Furthermore, the present disclosure describes preventative techniques against potential over-programming issues. Example techniques include using a lower initial program voltage at low temperatures to avert the imposition of surplus charge upon the cells. Moreover, the present disclosure sets forth a precocious execution of program verification steps when programming memory cells to a target programmed state at low temperatures (e.g., less than −25 degrees Celsius or from −25 to 0 degrees Celsius). By starting verification earlier, over-programming can be detected earlier, thereby preventing the excessive charge build-up within the memory cells, which could otherwise impair functionality and longevity of the memory device. By curtailing instances of over-programming, it can effectively minimize memory cell wear, thus prolonging the operational lifespan of the memory device.

shows a block diagram of an example system, in accordance with some aspects of the present disclosure. Systemcan be a mobile phone, desktop computer, laptop computer, tablet computer, vehicle computer, game console, printer, positioning device, wearable electronic device, smart sensor, Virtual Reality (VR) device, Augmented Reality (AR) device, or any other suitable electronic device having storage therein. As shown in, systemcan include a hostand a memory system. Memory systemincludes one or more memory devicesand a memory controller. Hostcan be, for example, a processor (e.g., a Central Processing Unit (CPU)) or a system on a chip (SoC) (e.g., an Application Processor (AP)) of an electronic device. Hostcan be configured to send data to memory deviceor receive data from memory device. To send data to memory deviceor receive data from memory device, hostcan send instructions to memory systemin addition to the data.

Memory devicecan be any memory device disclosed in the present disclosure. In some implementations, memory device, such as a NAND Flash memory device, can perform a program operation on one or more memory cells such as xLCs (i.e., memory cells configured to store a piece of N-bits data at one of 2levels, where N is an integer greater than 1) based on a data page having N bits of data for each xLC. In some examples, the xLC may store two bits per cell (MLC), three bits per cell (TLC), or four bits per cell (QLC), etc.

In some implementations, memory controlleris coupled to memory deviceand hostand is configured to control memory device, according to some implementations. Memory controllercan manage the data stored in memory deviceand communicate with host. In some implementations, memory controlleris designed for operating in a low duty-cycle environment like secure digital (SD) cards, compact Flash (CF) cards, universal serial bus (USB) Flash drives, or other media for use in electronic devices, such as personal computers, digital cameras, mobile phones, etc. In some implementations, memory controlleris designed for operating in a high duty-cycle environment SSDs or embedded multi-media-cards (eMMCs) used as data storage for mobile devices, such as smartphones, tablets, laptop computers, enterprise storage arrays, and the like.

Memory controllercan be configured to control the operation (e.g., read, erase, and program (or write) operations) of memory device. For example, based on instructions received from host, memory controllercan transmit various commands (e.g., program (or write) commands, read commands, erase commands, etc.) to memory deviceto control the operation of memory device. In some implementations, memory controllertransmits a program command to memory deviceto initiate a program operation to be performed by memory device. During an ongoing program operation, an interrupt (e.g., a read operation to another page) may occur, for example, from host. Memory controllermay be configured to transmit an interrupt command to memory deviceto suspend the program operation. In some implementations, upon completion of other operations triggered by the interrupt, memory controlleralso can be configured to transmit a resume command to memory deviceto resume and complete the suspended program operation.

Memory controllercan also be configured to manage various functions with respect to data stored or to be stored in memory devices, including but not limited to bad block management, garbage collection, logical to physical address translation, wear leveling, and the like. In some implementations, memory controlleris also configured to process Error Correction Codes (ECC) with respect to data read from memory deviceor written to the memory device. Memory controllercan also perform any other suitable functions, such as formatting memory device. The memory controllercan communicate with external devices (e.g., host) according to a particular communication protocol. For example, the memory controllercan communicate with the external device via at least one of various interface protocols, such as a USB protocol, an MMC protocol, a Peripheral Component Interconnect (PCI) protocol, a PCI express (PCI-E) protocol, an Advanced Technology Attachment (ATA) protocol, a serial ATA protocol, a parallel ATA protocol, a small computer system small interface (SCSI) protocol, an Enhanced Small Disk Interface (ESDI) protocol, an Integrated Drive Electronics (IDE) protocol, a Firewire protocol, and so forth.

Memory controllerand the one or more memory devicescan be integrated into various types of storage devices and can be included, for example, in the same package (e.g., a Universal Flash Storage (UFS) package or an eMMC package). That is, memory systemcan be implemented and packaged into different types of end electronic products.

In one example as shown in, memory controllerand the single memory devicecan be integrated into a memory card. Memory cardcan include a PC card (PCMCIA), a CF card, a Smart Media (SM) card, a memory stick, a multimedia card (MMC, RS-MMC, MMCmicro), an SD card (SD, miniSD, microSD, SDHC), a UFS, and the like. Memory cardcan also include a memory card connectorconfigured to couple memory cardto a host (e.g., hostin).

In another example as shown in, memory controllerand multiple memory devicescan be integrated into the SSD. SSDcan also include an SSD connectorconfigured to couple SSDto a host (e.g., hostin). In some implementations, the storage capacity and/or operating speed of SSDis greater than the respective storage capacity and/or operating speed of memory card.

shows a schematic circuit diagram of a memory deviceincluding peripheral circuits, according to some aspects of the present disclosure. Memory devicecan be an example of memory devicein. Memory devicecan include a memory cell arrayand peripheral circuitscoupled to memory cell array. Memory cell arraycan be a NAND Flash memory cell array in which memory cellsare provided in the form of an array of NAND memory stringseach extending vertically above a substrate (not shown). In some implementations, each NAND memory stringincludes a plurality of memory cellscoupled in series and stacked vertically. Each memory cellcan hold a continuous, analog value, such as an electrical voltage or charge, that depends on the number of electrons trapped within a region of memory cell. Each memory cellcan be either a floating gate type of memory cell including a floating-gate transistor or a charge trap type of memory cell including a charge-trap transistor.

In some implementations, each memory cellis a single level cell (SLC) that has two possible memory states (levels) and thus, can store one bit of data. For example, the first memory state “0” can correspond to a first range of threshold voltages, and the second memory state “1” can correspond to a second range of threshold voltages. In some implementations, each memory cellis an xLC that is capable of storing more than a single bit of data in more than four memory states (levels). For example, the xLC may store two bits per cell (MLC), three bits per cell (TLC), or four bits per cell (QLC)). Each xLC can be programmed to assume a range of possible nominal storage values (i.e., 2pieces of N-bits data, e.g., gray codes). In one example, the MLC can be programmed to assume one of three possible programming levels by writing one of three possible nominal storage values to the cell. A fourth nominal storage value can be used for the erased state.

As shown in, each NAND memory stringcan also include a source select gate (SSG) transistorat its source end and a drain select gate (DSG) transistorat its drain end. SSG transistorand DSG transistorcan be configured to activate select NAND memory strings(columns of the array) during read and program operations. In some implementations, the sources of NAND memory stringsin the same blockare coupled through a same source line (SL), e.g., a common SL. In other words, all NAND memory stringsin the same blockhave an array common source (ACS), according to some implementations. The drain of each NAND memory stringis coupled to a respective bit linefrom which data can be read or written via an output bus (not shown), according to some implementations. In some implementations, each NAND memory stringis configured to be selected or deselected by applying a select voltage or a deselect voltage to the gate of respective DSG transistorthrough one or more DSG linesand/or by applying a select voltage or a deselect voltage to the gate of respective SSG transistorthrough one or more SSG lines.

As shown in, NAND memory stringscan be organized into multiple blocks, each of which can have a common source line, e.g., coupled to the ACS. In some implementations, each blockis the basic data unit for erase operations, i.e., all memory cellson the same blockare erased at the same time. To erase memory cellsin a select block, source linescoupled to select blockas well as unselect blocksin the same plane as select blockcan be biased with an erase voltage (Vers), such as a high positive bias voltage (e.g., 20 V or more). Memory cellsof adjacent NAND memory stringscan be coupled through word linesthat select which row of memory cellsis affected by read and program operations.

As shown in, memory cell arraycan include an array of memory cellsin a plurality of rows and a plurality of columns in each block. One row of memory cellscorresponds to one or more pages, and one column of memory cells corresponds to one NAND memory string, according to some implementations. The plurality of rows of memory cellscan be respectively coupled to word lines, and the plurality of columns of memory cellscan be respectively coupled to bit lines. Peripheral circuitcan be coupled to memory cell arraythrough bit linesand word lines.

illustrates a side view of a cross-section of memory cell arrayincluding NAND memory string, according to some aspects of the present disclosure. As shown in, NAND memory stringcan extend vertically through a memory stackabove a substrate. Substratecan include silicon (e.g., single crystalline silicon), silicon germanium (SiGe), gallium arsenide (GaAs), germanium (Ge), silicon on insulator (SOI), germanium on insulator (GOI), or any other suitable materials.

Memory stackcan include interleaved gate conductive layersand gate-to-gate dielectric layers. The number of the pairs of gate conductive layersand gate-to-gate dielectric layersin memory stackcan determine the number of memory cellsin memory cell array. Gate conductive layercan include conductive materials including, but not limited to, tungsten (W), cobalt (Co), copper (Cu), aluminum (Al), polysilicon, doped silicon, silicides, or any combination thereof. In some implementations, each gate conductive layerincludes a metal layer, such as a tungsten layer. In some implementations, each gate conductive layerincludes a doped polysilicon layer. Each gate conductive layercan include control gates surrounding memory cells, the gates of DSG transistors, or the gates of SSG transistors, and can extend laterally as DSG lineat the top of memory stack, SSG lineat the bottom of memory stack, or word linebetween DSG lineand SSG line.

As shown in, NAND memory stringincludes a channel structureextending vertically through memory stack. In some implementations, channel structureincludes a channel hole filled with semiconductor material(s) (e.g., as a semiconductor channel) and dielectric material(s) (e.g., as a memory film). In some implementations, semiconductor channelincludes silicon, such as polysilicon. In some implementations, memory filmis a composite dielectric layer including a tunneling layer, a storage layer(also known as a “charge trap/storage layer”), and a blocking layer. Channel structurecan have a cylinder shape (e.g., a pillar shape). Semiconductor channel, tunneling layer, storage layer, blocking layerare arranged radially from the center toward the outer surface of the pillar in this order, according to some implementations. Tunneling layercan include silicon oxide, silicon oxynitride, or any combination thereof. Storage layercan include silicon nitride, silicon oxynitride, silicon, or any combination thereof. Blocking layercan include silicon oxide, silicon oxynitride, high dielectric constant (high-k) dielectrics, or any combination thereof. In one example, memory filmmay include a composite layer of silicon oxide/silicon oxynitride/silicon oxide (ONO).

As shown in, a well(e.g., a P-well and/or an N-well) is formed in substrate, and the source end of NAND memory stringis in contact with well, according to some implementations. For example, source linemay be coupled to wellto apply an erase voltage to well, i.e., the source of NAND memory string, during erase operations. In some implementations, NAND memory stringfurther includes a channel plugat the drain end of NAND memory string. It is understood that although not shown in, additional components of memory cell arraycan be formed including, but not limited to, gate line slits/source contacts, local contacts, interconnect layers, etc.

As shown in, memory stackincludes two sections or groups of cells within the stack, namely, upper deckand lower deck. In the context of 3D memory devices, memory cells are stacked vertically in multiple layers to increase storage density. A “deck” in this context is a subset of these layers. For example, if a memory string has 64 layers, it might be divided into an upper and a lower deck, each comprising 32 layers. The division into decks is not just physical but also functional. Each deck can be independently accessed and operated, which can improve performance, reduce power consumption, and increase the efficiency of memory operations. In the shown example, lower deckrefers to the layers closer to the substrate, and upper deckrefers to the layers further away from the substrate. By organizing the memory cells into decks, it can reduce interference between cells, which can improve data integrity and read/write speeds. Different decks can be used to implement wear-leveling strategies, distributing write and erase cycles across the memory chip to prolong its lifespan. This architecture also allows for scalability in memory design. For example, manufacturers can increase storage capacity by adding more layers (i.e., decks) without significantly increasing the chip's footprint.

In some cases, variations in the size of the channel structure along the vertical direction, e.g., the stacking direction of the memory cells, in the decks of a memory string in 3D memory devices can occur due to several factors inherent in the manufacturing process. For example, the variations in the size of the channel structure can occur due to one or more of the following factors: deposition inconsistencies, etching variabilities, lithography challenges, stress and strain during fabrication, chemical mechanical polishing (CMP) irregularities, thermal effects, diffusion and material interactions, or limitations of current technology.

In the shown example, channel structurewithin each deck of upper deckand lower deckexhibits a dimensional decrement proceeding from the topmost layer towards the bottommost layer. This gradation is manifested as a progressive reduction in the cross-sectional area of channel structure, whereby the uppermost layer of each deck possesses the largest channel size, and this channel size diminishes in each subsequent layer down to the lowermost layer of the deck.

Note that memory stringinis shown to include two decks for illustrative purposes. In some examples, memory stringcan have any suitable number of decks, where each deck can have any suitable number of layers, such as 4 decks each consisting of 8 layers, 8 decks each consisting of 8 layers or 12 layers, 16 decks each consisting of 8 layers, or 22 decks each consisting of 8 layers.

Referring back to, peripheral circuitscan be coupled to memory cell arraythrough bit lines, word lines, source lines, SSG lines, and DSG lines. Peripheral circuitscan include any suitable analog, digital, and mixed-signal circuits for facilitating the operations of memory cell arrayby applying and sensing voltage signals and/or current signals to and from each select memory cellthrough bit lines, word lines, source lines, SSG lines, and DSG lines. Peripheral circuitscan include various types of peripheral circuits formed using metal-oxide-semiconductor (MOS) technologies.

illustrates some exemplary peripheral circuits including a page buffer/sense amplifier, a column decoder/bit line driver, a row decoder/word line driver, a voltage generator, control logic, registers, an interface, and a data bus. It is understood that, in some examples, additional peripheral circuits not shown inmay be included as well.

Page buffer/sense amplifiercan be configured to read and program (write) data from and to memory cell arrayaccording to the control signals from control logic. In one example, page buffer/sense amplifiermay store data to be programmed into one page of memory cell array. In another example, page buffer/sense amplifiermay verify programmed select memory cellsin each program/verify loop (cycle) in a program operation to ensure that the data has been properly programmed into memory cellscoupled to select word lines. In still another example, page buffer/sense amplifiermay also sense the low power signals from bit linethat represents a data bit stored in memory celland amplify the small voltage swing to recognizable logic levels in a read operation. As described below in detail and consistent with the scope of the present disclosure, in program operations, page buffer/sense amplifiercan include a plurality of page buffer circuits respectively coupled to bit lines, and each including a set of storage units (e.g., latches) for temporarily storing a piece of N-bits data (e.g., in the form of gray codes) received from data busand providing the piece of N-bits data to a corresponding select memory cellthrough the corresponding bit linein a program operation using a multi-cache loading scheme.

Column decoder/bit line drivercan be configured to be controlled by control logicand select one or more NAND memory stringsby applying bit line voltages generated from voltage generator. Row decoder/word line drivercan be configured to be controlled by control logicand select/deselect blocksof memory cell arrayand select/deselect word linesof block. Row decoder/word line drivercan be further configured to drive word linesusing word line voltages generated from voltage generator. In some implementations, row decoder/word line drivercan also select/deselect and drive SSG linesand DSG linesas well. Voltage generatorcan be configured to be controlled by control logicand generate the word line voltages (e.g., read voltage, program voltage, channel pass voltage, local voltage, verify voltage, etc.), bit line voltages, and source line voltages to be supplied to memory cell array.

Control logiccan be coupled to each peripheral circuit described above and configured to control the operations of each peripheral circuit. Registerscan be coupled to control logicand include status registers, command registers, and address registers for storing status information, command operation codes (OP codes), and command addresses for controlling the operations of each peripheral circuit. Interfacecan be coupled to control logicand act as a control buffer to buffer and relay control commands received from a memory controller (e.g.,in) and/or a host (e.g.,in) to control logicand status information received from control logicto the memory controller and/or the host. Interfacecan also be coupled to column decoder/bit line drivervia data busand act as a data input/output (I/O) interface and a data buffer to buffer and relay the data to and from memory cell array.

illustrates exemplary threshold voltage distributions of memory cells in a program operation, according to some aspects of the present disclosure. As described above, each memory cellcan be configured to store a piece of N-bits data in one of 2levels, where N is an integer greater than 1 (e.g., N=2 for MLCs, N=3 for TLCs, N=4 for QLCs, etc.). Each level can correspond to one of 2threshold voltage (V) ranges of memory cells. Taking TLCs, where N=3, for example, as shown in, memory cellmay be programmed into one of the 8 levels, including one level of the erased state and 7 levels of the programmed states. Each level may correspond to a respective threshold voltage (V) range of memory cells. For example, the level corresponding to the lowest threshold voltage range (the left-most threshold voltage distribution in) may be considered as level 0, the level corresponding to the second-lowest threshold voltage range (the second left-most threshold voltage distribution in) may be considered as level 1, and so until level 7 corresponding to the highest threshold voltage range (the right-most threshold voltage distribution in).

Each level can correspond to one of the 2pieces of N-bits data that is to be stored in a selected memory cell. In some implementations, the 2pieces of N-bits data may be represented by (in the form of) a gray code. A gray code (a.k.a., reflected binary code (RBC) or reflected binary (RB)) is an ordering of the binary numeral system such that two successive values differ in only one bit (binary digit). For example, TABLE 1 below shows an example of a binary code representing a one-to-one mapping between 8 levels (LV 0 to LV 7) and 8 pieces of 3-bits data used in the example of. As shown in TABLE 1, each piece of 3-bits data may consist of three bits of binary values (b1, b2, and b3). In one example, level 1 may correspond to a piece of 3-bits data having a value of 000. In another example, level 7 may correspond to another piece of 3-bits data having a value of 101.

Also referring to, in a program operation, user data can be used to program a selected row of memory cellscoupled to select word line. In some implementations, user data is transmitted through data busto page buffer/sense amplifier, and page buffer/sense amplifieris configured to convert the user data into data to be programmed into a respective row of memory cellsbased on a preset gray code. Based on the preset gray code, which defines the mapping of each programmed level and a respective piece of N-bits data, control logicis configured to send control signals (e.g., enable signals) to page buffer/sense amplifierto allow page buffer/sense amplifierto generate data for sequential program operations, according to some implementations. During the ongoing program operation, the current data can be temporarily stored in page buffer/sense amplifier, and page buffer/sense amplifiercan be configured to provide to each memory cellcoupled to select word linethe corresponding data through the corresponding bit line.

To perform a program operation, in addition to page buffer/sense amplifierproviding to each select memory cellthe corresponding data, row decoder/word line drivercan be configured to apply program voltages and verify voltages to a select word linecoupled to a select row of memory cellsin one or more program/verify loops in order to raise the threshold voltage of each select memory cellto a desired level (into a desired range of threshold voltages) based on the corresponding data.

illustrate a waveform of word line voltages applied to a word line in a program operation, according to some implementations of the present disclosure. As shown in, the program operation includes one or more program/verify loops (cycles). As shown in, in each program/verify loop, row decoder/word line drivercan be configured to apply a program voltage (V) on a target word line (e.g., word line) and apply one or more verify voltages (V) to verify whether a target memory cell has been properly programmed. In some examples, when a memory cell is programmed using an incremental pulse scheme, such as an ISPP scheme, the program voltage applied to the target word line is increased through a sequence of steps until programming is completed. After each incremental pulse, a verify voltage can be applied to the target word line to check the memory cell's threshold voltage. If the memory cell's threshold voltage is still lower than an expected voltage level corresponding to a target programmed state, the program/verify loop continues until the memory cell's threshold voltage is equal to or higher than the expected voltage level.

In some implementations, verification of different programmed states of a memory cell can start at different pulses or program/verify loops. For example, verification of a memory cell programmed to a lowest programmed state can start from the first program pulse. Verification of a memory cell programmed to a higher programmed state can start after a few program pulses. For example, there are 7 programmed states from ‘P1’ to ‘P7’ of a TLC memory cell. Each one of 7 programmed states from ‘P1’ to ‘P7’ corresponds to a respective threshold voltage range of the memory cell. In such examples, the programmed state ‘P1’ can correspond to the lowest threshold voltage ranges among the 7 programmed states, and the programmed state ‘P2’ can correspond to the second lowest threshold voltage ranges, and so on. Verification of the programmed state ‘P1’ can start from the first pulse or program/verify loop. Verification of the programmed state ‘P2’ can start from the seventh pulse or program/verify loop.

illustrates an example processof managing program operations in a memory device, according to some implementations of the present disclosure. Processcan be performed by any suitable device as described herein, such as memory device, memory device, or memory device. The operations shown in processmay not be exhaustive and that other operations can be performed as well before, after, or in between any of the illustrated operations. Further, some of the operations may be performed simultaneously, or in a different order than shown in.

In process, a peripheral circuit (e.g., peripheral circuit) obtains a first temperature (). In some implementations, the peripheral circuit is coupled to a memory cell array (e.g., memory cell array) in a memory device (e.g., memory device).

In memory devices, the voltage required to program memory cells can be influenced by temperature. In some implementations, the first temperature is an environmental temperature surrounding the device. In some implementations, the first temperature is a device temperature.

In implementations where the peripheral circuit obtains the environmental temperature surrounding the memory device, the environmental temperature is the ambient temperature in the device's operating environment. The environmental temperature pertains to the ambient conditions surrounding the memory device and can fluctuate based on external factors. These variations in environmental temperature can alter the threshold voltage levels of memory cells, thus impacting the program voltage.

In some implementations, the environmental temperature is obtained by using one or more of a sensor (e.g., an external sensor or a sensing mechanism integrated with the memory device), remote sensing, or integrated system monitoring. In some examples, external sensors can be placed in the environment where the memory device operates. The external sensors can be thermistors, thermocouples, or semiconductor temperature sensors, such as those known for their precision and reliability. In some examples, remote sensing technologies, e.g., infrared sensors or thermal cameras, are used to obtain the environmental temperature, especially, e.g., in large data centers or controlled environments. In some examples, the environmental temperature can be obtained through integrated system monitoring tools that include environmental sensors for temperature, e.g., for systems like servers.