Methods and apparatus for detecting carrier tape height level and thickness using fiber optic sensors

This disclosure generally relates to field of carrier tape manufacturing, and more particularly relates to methods and apparatus for detecting out of place components prior to sealing carrier tapes.

Carrier tape forming machines package electronic components such as integrated circuits, resistors, capacitors, transistors, by packing in a cavity. Upper cover tapes close over the components on a carrier tape and then the carrier tape is stored in a reel. The reel protects the electronics from contamination during transportation and storage. Unfortunately, during the manufacturing process out of position (OOP) components on a carrier tape may damage components or result in unusable reels and the like. For example, the components may be off-center or not aligned correctly which may result in stopping the carrier tape forming process altogether. What is needed are techniques that detect OOP components efficiently on carrier tape as the carrier tape is formed with components.

In terms of a general overview, this disclosure is generally directed to apparatus and methods for detecting out of position (OOP) or out of pocket components to be stored in a carrier tape using a carrier tape forming machine.

The following detailed description refers to the accompanying drawings. The same reference numbers may be used in different drawings to identify the same or similar elements. In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular structures, architectures, interfaces, techniques, etc. in order to provide a thorough understanding of the various aspects of various embodiments. However, it will be apparent to those skilled in the art having the benefit of the present disclosure that the various aspects of the various embodiments may be practiced in other examples that depart from these specific details. In certain instances, descriptions of well-known devices, circuits, and methods are omitted so as not to obscure the description of the various embodiments with unnecessary detail. For the purposes of the present document, the phrases “A or B” and “A/B” mean (A), (B), or (A and B).

Embodiments are directed to an apparatus for detection of out of position (OOP) components in a carrier tape forming machine. In one or more embodiments, the apparatus includes cross track sensors coupled to the bus interface circuitry, the cross track sensors configured to detect OOP components prior to overlaying the components on the carrier tape with cover tape; optical sensors to detect the OOP components on the carrier tape after overlaying with cover tape and prior to sealing, the optical sensors configured to detect reflections from OOP components seated on the carrier tape; an amplifier coupled to the optical sensors, the amplifier coupled to amplify signals generated by the optical sensors and set a range for determining whether the components are OOP; one or more relays coupled to the cross track sensors and the optical sensors, the relays configured to receive indications of detected OOP components in the carrier tape forming machine prior to sealing or prior to receipt by the cover plate; and a controller coupled to the one or more relays to stop the carrier tape forming machine as a function of signals received by the relays.

Another embodiment is directed to a method for a carrier tape forming machine including detecting out of position (OOP) components on a carrier tape in two locations within the carrier forming machine including a first detecting prior to overlaying components with a cover tape, and a second detecting prior to sealing the cover tape to the carrier tape; performing the first detecting using cross track sensors prior to overlaying components with cover tape; performing the second detecting with fiber optic sensors by detecting reflections from OOP components to determine whether one or more components seated on the carrier tape after overlaying with cover tape and prior to sealing the cover tape; amplifying the fiber optic sensor signal with an amplifier coupled to the fiber optic sensors to set a range for determining whether the components are OOP; and stopping the carrier tape forming machine as a function of the detecting OOP components via received signals from one or more relays coupled to the cross track sensors and the fiber optic sensors, the relays configured to receive signal indicative of detected OOP components on the carrier tape forming machine prior to sealing and prior to receipt by the cover plate.

Referring now to, a carrier tape forming machineis illustrated showing two cross track sensorsa carrier tape, and componentsdisposed with in pockets on the carrier tape. As shown, one cross track sensor detects whether components are below a sensor area as an “under reject”, and another cross track sensor detects whether components are over a sensor area as an “over reject”. As shown, a close up of the pocketand cross track sensorenables sensing covering the 1.5 mm distanceof the pocket.

illustrates a pick and place machinedropping a unitonto a carrier tapefollowed by the unitbecoming seated into pocketafter moving along within carrier tape forming machine.

illustrates different offset possibilities that could justify resetting or stopping a carrier tape forming machine. As shown, a pocketis illustrated with unitin different offset positions that may be identified, from a top view, a bottom offset, a top offset, a right side offsetand a left side offsetare illustrated as well as side views from the right,, and side views from the front. The offsets along an x axis as the unit is moving under pick and place machinemay be caused by issues controlled by a stepper motor. Issues causing a y axis offset may be caused by issues controlled by a servo motor. Thus two different motors must be synchronized to enable the carrier tape forming machine to accurately place units with pocket. In other words, two machines enable pick and place machines to drop component units into pockets as a carrier tape moves along an x axis.

Referring now to, an embodiment is directed to adding additional sensors to carrier tape forming machine. As shown, cross track sensorsreview carrier tapeto detect offset issues regarding components in pocketsprior to the carrier tapeentering cover plate areawhere cover tape is placed over the carrier tape to seal components within pocket.

In an embodiment, after cover tape is placed fiber optic sensorsview the carrier tape to detect out of position (OOP) components prior to the carrier tape entering into seal headwhere the cover tape is heat sealed onto the carrier tape.

Referring to, a side viewillustrates fiber sensorsable to detect OOP componentmisplaced on carrier tape. As shown, fiber sensorsdetect the offset componenton carrier tapeon the right side of pocket.

Referring toviewsillustrate different perspective views of machinewhere fiber optic sensorsare aimed component. As shown, fiberis aimed at pocketon carrier tape. As shown, fiber optic sensorsreceives reflectionfrom pocketable to view component.

Referring now to, a schematic viewillustrates embodiments for including fiber optic sensors within carrier tape forming machine. As shown, in one embodiment, cross track sensorsare coupled via bus circuitryto sensors within cover platewherein a cover plate sensorsupports a cover tape installation over the carrier tape. Bus circuitryis further coupled to relaysandwhich are coupled to fiber optic sensorsand amplifier. In one embodiment, relayreceives OOP detection indications from cross track sensors, and relayreceives OOP detection indications from fiber optic sensors. Fiber optic sensorsare further coupled to amplifierto control the size of reflectionshown in. Amplifierenables different sizes of beams to accommodate different size componentsas well as different sized carrier tapes.

further illustrates a parallel input output controller (PIOC)that receives signals from relaysand. PIOCmay be a controller or other logic controller as will be appreciated by those of skill in the art. More specifically, in one embodiment, relaysandmay both detect OOP components, in which case, PIOCmay be configured to stop carrier tape forming machine. In another embodiment, eitherormay detect OOP components and be configured to stop carrier tape forming machine. In another embodiment, ifdetects an OOP component butdoes not detect an OOP component, a component may have settled into pocketand not require stopping carrier tape forming machine.

In some embodiments, controllermay apply logic such that an AND function determines whether to turn off carrier tape forming machine. In other embodiments, an OR function, such that either relay determining an OOP component will turn off carrier forming machine. In another embodiment, if cross track sensors are known to fail or be inaccurate, relaymay be set to a “don't care” such that only relayis coupled to determine whether to pause or stop carrier tape forming machine.

As shown in, amplifierenables different size tapes and different components to be used in carrier tape forming machine. More specifically, as shown in Table A below, fiber optic sensorsmay be configured with different carrier tape sizes. Thus, the same machine may accommodate different sized tapes and still detect OOP components if amplifieris adjusted as shown in Table A.

Referring now to, a flow diagramillustrates a method in accordance with one or more embodiments. More particularly, blockprovides for detecting out of position (OOP) components on a carrier tape in two locations within the carrier forming machine including a first detecting prior to overlaying components with a cover tape, and a second detecting prior to sealing the cover tape to the carrier tape. For example, as shown in, two locations detect OOP components, cross tack sensor locationand fiber optic sensor location.

Blockprovides for performing the first detecting using cross track sensors prior to overlaying components with cover tape. For example as shown in, cross track sensorsare configured to detect OOP components by detecting over and under rejections of placement of componentson carrier tapewithin carrier tape forming machine.

Blockprovides for performing the second detecting with fiber optic sensors by detecting reflections from OOP components to determine whether one or more components seated on the carrier tape after overlaying with cover tape and prior to sealing the cover tape. For example, as shown in, fiber optic sensorsdetect whether componentis correctly seated within pocketon carrier tape.

Blockprovides for amplifying the fiber optic sensor signal with an amplifier coupled to the fiber optic sensors to set a range for determining whether the components are OOP. For example,illustrates amplifiercapable of setting a range for determining whether componentsare OOP on a carrier tape.

Blockprovides for interrupting the carrier tape forming machine as a function of the detecting OOP components via received signals from one or more relays coupled to the cross track sensors and the fiber optic sensors, the relays configured to receive signal indicative of detected OOP components on the carrier tape forming machine prior to sealing and prior to receipt by the cover plate. For example, as shown in, relays are coupled to cross track sensorsand fiber optic sensorsto receive signals of detected OOP components. Depending on the logic function or other method for determining conditions for interrupting the carrier tape forming machine, a controller may be configured to interrupt the carrier tape forming machine as a function of the detection signal received by relaysand.

Referring now to, a system diagram illustrates a carrier tape forming machine diagram. As shown, systemincludes cross track sensors, cover tape sensors, fiber optic sensors, amplifier, relays, memory, processorand controllerall coupled to bus circuitry.

In accordance with embodiments, memoryis coupled to processing circuitry, which is configured to detect out of position (OOP) components on carrier tape in two locations within the carrier forming machine by performing a first detection prior to overlaying components with a cover tape, and a second detection prior to sealing the cover tape to the carrier tape. For example, as described above, sensors are provided before cover tape is installed in cover plate, by performing the first detection using cross track sensors prior to overlaying components with cover tape. Further, processor is configured to perform the second detection using fiber optic sensorsby detecting reflections from OOP components to determine whether one or more components seated on the carrier tape after overlaying with cover tape and prior to sealing the cover tape.

Amplifieris configured to amplify the fiber optic sensor signal with an amplifier coupled to the fiber optic sensors to set a range for determining whether the components are OOP. Relaysand controllerare also coupled to bus circuitry. In one embodiment, processorenables the controllerto interrupt the carrier tape forming machine as a function of the detection of OOP components via received signals from one or more relayscoupled to the cross track sensorsand the fiber optic sensors, the relaysconfigured to receive signal indicative of detected OOP components on the carrier tape forming machine prior to sealing and prior to receipt by the cover tape.

As one of skill in the art will appreciate, processormay include modules to enable programming of controllerto perform actions based on the detections provided by relays. Additionally, processormay include modules to enable amplifierto increase or decrease amplification of fiber optic sensorsas a function of the type of components to be packed in a carrier tape or based on the size of the carrier tape.

For example, wherein the components are large scale integration (LSI) type components including integrated circuits (ICs), computer components, server components and computer components sized to fit into a carrier tape pocket.

A system of one or more computers can be configured to perform particular operations or actions by virtue of having software, firmware, hardware, or a combination of them installed on the system that in operation causes or cause the system to perform the actions. One or more computer programs can be configured to perform particular operations or actions by virtue of including instructions that, when executed by data processing apparatus, cause the apparatus to perform the actions. One general aspect includes cross track sensors coupled to the bus interface circuitry. The cross track sensors also includes optical sensors to detect the oop components on the carrier tape after overlaying with cover tape and prior to sealing, the optical sensors configured to detect reflections from oop components seated on the carrier tape. The sensors also includes an amplifier coupled to the optical sensors, the amplifier coupled to amplify signals generated by the optical sensors and set a range for determining whether the components are oop. The sensors also includes one or more relays coupled to the cross track sensors and the optical sensors, the relays configured to receive indications of detected oop components in the carrier tape forming machine prior to sealing or prior to receipt by the cover plate. The sensors also includes a controller coupled to the one or more relays to stop the carrier tape forming machine as a function of signals received by the relays. Other embodiments of this aspect include corresponding computer systems, apparatus, and computer programs recorded on one or more computer storage devices, each configured to perform the actions of the methods.

Implementations may include one or more of the following features. The apparatus may include bus interface circuitry coupled to the optical sensors and the amplifier, the bus interface circuitry connectable within the carrier tape forming machine to the controller. The optical sensors are a pair of fiber optic sensors. The sealing includes applying heat to seal a cover tape onto carrier tape to cover components. Out of position (oop) components are outside a pocket in the carrier tape or components are offset in an x direction or in a y direction on the carrier tape. The cross track sensors may include at least two photoelectric sensors. The optical sensors receive the range for oop from the amplifier as a function of a size of the carrier tape. Size of the carrier tape is 44 mm with an oop limit of 400 on each side of the carrier tape for 44 mm tape. Size of the carrier tape is 24 mm, with an oop limit of between 600 and 650 for a left side and 300 for a right side. The components are large scale integration (lsi) type components including integrated circuits (ics), computer components, server components and computer components sized to fit into a carrier tape pocket. Implementations of the described techniques may include hardware, a method or process, or computer software on a computer-accessible medium.

One general aspect includes a method for a carrier tape forming machine. The method also includes detecting out of position (oop) components on a carrier tape in two locations within the carrier forming machine including a first detecting prior to overlaying components with a cover tape, and a second detecting prior to sealing the cover tape to the carrier tape; performing the first detecting using cross track sensors prior to overlaying components with cover tape; performing the second detecting with fiber optic sensors by detecting reflections from oop components to determine whether one or more components seated on the carrier tape after overlaying with cover tape and prior to sealing the cover tape; amplifying the fiber optic sensor signal with an amplifier coupled to the fiber optic sensors to set a range for determining whether the components are oop; and interrupting the carrier tape forming machine as a function of the detecting oop components via received signals from one or more relays coupled to the cross track sensors and the fiber optic sensors, the relays configured to receive signal indicative of detected oop components on the carrier tape forming machine prior to sealing and prior to receipt by the cover plate. Other embodiments of this aspect include corresponding computer systems, apparatus, and computer programs recorded on one or more computer storage devices, each configured to perform the actions of the methods.

Implementations may include one or more of the following features. The method where the sealing includes applying heat to seal a cover tape onto carrier tape to cover components. Out of position (oop) components are outside a pocket in the carrier tape or components are offset in an x direction or in a y direction on the carrier tape. The cross track sensors may include at least two photoelectric sensors. The optical sensors receive the range for oop from the amplifier as a function of a size of the carrier tape. Size of the carrier tape is 44 mm with an oop limit of 400 on each side of the carrier tape for 44 mm tape. Size of the carrier tape is 24 mm, with an oop limit of between 600 and 650 for a left side and 300 for a right side. The components are large scale integration (lsi) type components including integrated circuits (ics), computer components, server components and computer components sized to fit into a carrier tape pocket. Implementations of the described techniques may include hardware, a method or process, or computer software on a computer-accessible medium.

One general aspect includes a system for a carrier tape forming machine. The system also includes a memory. The system also includes processing circuitry coupled to the memory, the processing circuitry configured to: detect out of position (oop) components on a carrier tape in two locations within the carrier forming machine by performing a first detection prior to overlaying components with a cover tape, and a second detection prior to sealing the cover tape to the carrier tape. The system also includes perform the first detection using cross track sensors prior to overlaying components with cover tape; perform the second detection with fiber optic sensors by detecting reflections from oop components to determine whether one or more components seated on the carrier tape after overlaying with cover tape and prior to sealing the cover tape; amplify the fiber optic sensor signal with an amplifier coupled to the fiber optic sensors to set a range for determining whether the components are oop; and interrupt the carrier tape forming machine as a function of the detection of oop components via received signals from one or more relays coupled to the cross track sensors and the fiber optic sensors, the relays configured to receive signal indicative of detected oop components on the carrier tape forming machine prior to sealing and prior to receipt by the cover tape. Other embodiments of this aspect include corresponding computer systems, apparatus, and computer programs recorded on one or more computer storage devices, each configured to perform the actions of the methods.

Implementations may include one or more of the following features. The system where the amplifier enables the carrier tape forming machine to detect oop components and form carrier tapes with a plurality of large scale integration (lsi) type components independent of requiring a conversion. The lsi type components include integrated circuits (ics), computer components, server components and computer components sized to fit into a carrier tape pocket. Implementations of the described techniques may include hardware, a method or process, or computer software on a computer-accessible medium.

In the above disclosure, reference has been made to the accompanying drawings, which form a part hereof, which illustrate specific implementations in which the present disclosure may be practiced. It is understood that other implementations may be utilized, and structural changes may be made without departing from the scope of the present disclosure. References in the specification to “one embodiment,” “an embodiment,” “an example embodiment,” “an example embodiment,” “example implementation,” etc., indicate that the embodiment or implementation described may include a particular feature, structure, or characteristic, but every embodiment or implementation may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment or implementation. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment or implementation, one skilled in the art will recognize such feature, structure, or characteristic in connection with other embodiments or implementations whether or not explicitly described. For example, various features, aspects, and actions described above with respect to an autonomous parking maneuver are applicable to various other autonomous maneuvers and must be interpreted accordingly.

Implementations of the systems, apparatuses, devices, and methods disclosed herein may comprise or utilize one or more devices that include hardware, such as, for example, one or more processors and system memory, as discussed herein. An implementation of the devices, systems, and methods disclosed herein may communicate over a computer network. A “network” is defined as one or more data links that enable the transport of electronic data between computer systems and/or modules and/or other electronic devices. When information is transferred or provided over a network or another communications connection (either hardwired, wireless, or any combination of hardwired or wireless) to a computer, the computer properly views the connection as a transmission medium. Transmission media can include a network and/or data links, which can be used to carry desired program code means in the form of computer-executable instructions or data structures and which can be accessed by a general purpose or special purpose computer. Combinations of the above should also be included within the scope of non-transitory computer-readable media.

Computer-executable instructions comprise, for example, instructions and data which, when executed at a processor, cause the processor to perform a certain function or group of functions. The computer-executable instructions may be, for example, binaries, intermediate format instructions such as assembly language, or even source code. Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the described features or acts described above. Rather, the described features and acts are disclosed as example forms of implementing the claims.

A memory device can include any one memory element or a combination of volatile memory elements (e.g., random access memory (RAM, such as DRAM, SRAM, SDRAM, etc.)) and non-volatile memory elements (e.g., ROM, hard drive, tape, CDROM, etc.). Moreover, the memory device may incorporate electronic, magnetic, optical, and/or other types of storage media. In the context of this document, a “non-transitory computer-readable medium” can be, for example but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: a portable computer diskette (magnetic), a random-access memory (RAM) (electronic), a read-only memory (ROM) (electronic), an erasable programmable read-only memory (EPROM, EEPROM, or Flash memory) (electronic), and a portable compact disc read-only memory (CD ROM) (optical). Note that the computer-readable medium could even be paper or another suitable medium upon which the program is printed, since the program can be electronically captured, for instance, via optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner if necessary, and then stored in a computer memory.

Those skilled in the art will appreciate that the present disclosure may be practiced in network computing environments with many types of computer system configurations, including in-dash vehicle computers, personal computers, desktop computers, laptop computers, message processors, nomadic devices, multi-processor systems, microprocessor-based or programmable consumer electronics, network PCs, minicomputers, mainframe computers, mobile telephones, PDAs, tablets, pagers, routers, switches, various storage devices, and the like. The disclosure may also be practiced in distributed system environments where local and remote computer systems, which are linked (either by hardwired data links, wireless data links, or by any combination of hardwired and wireless data links) through a network, both perform tasks. In a distributed system environment, program modules may be located in both the local and remote memory storage devices.

Further, where appropriate, the functions described herein can be performed in one or more of hardware, software, firmware, digital components, or analog components. For example, one or more application specific integrated circuits (ASICs) can be programmed to carry out one or more of the systems and procedures described herein. Certain terms are used throughout the description, and claims refer to particular system components. As one skilled in the art will appreciate, components may be referred to by different names. This document does not intend to distinguish between components that differ in name, but not function.

At least some embodiments of the present disclosure have been directed to computer program products comprising such logic (e.g., in the form of software) stored on any computer-usable medium. Such software, when executed in one or more data processing devices, causes a device to operate as described herein.

While various embodiments of the present disclosure have been described above, it should be understood that they have been presented by way of example only, and not limitation. It will be apparent to persons skilled in the relevant art that various changes in form and detail can be made therein without departing from the spirit and scope of the present disclosure. Thus, the breadth and scope of the present disclosure should not be limited by any of the above-described example embodiments but should be defined only in accordance with the following claims and their equivalents. The foregoing description has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the present disclosure to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. Further, it should be noted that any or all of the aforementioned alternate implementations may be used in any combination desired to form additional hybrid implementations of the present disclosure. For example, any of the functionality described with respect to a particular device or component may be performed by another device or component. Further, while specific device characteristics have been described, embodiments of the disclosure may relate to numerous other device characteristics. Further, although embodiments have been described in language specific to structural features and/or methodological acts, it is to be understood that the disclosure is not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as illustrative forms of implementing the embodiments. Conditional language, such as, among others, “can,” “could,” “might,” or “may,” unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments could include, while other embodiments may not include, certain features, elements, and/or steps. Thus, such conditional language is not generally intended to imply that features, elements, and/or steps are in any way required for one or more embodiments.

For the purposes of the present document, the following terms and definitions are applicable to the examples and embodiments discussed herein.

The term “circuitry” as used herein refers to, is part of, or includes hardware components such as an electronic circuit, a logic circuit, a processor (shared, dedicated, or group) and/or memory (shared, dedicated, or group), an Application Specific Integrated Circuit (ASIC), a field-programmable device (FPD) (e.g., a field-programmable gate array (FPGA), a programmable logic device (PLD), a complex PLD (CPLD), a high-capacity PLD (HCPLD), a structured ASIC, or a programmable SoC), digital signal processors (DSPs), etc., that are configured to provide the described functionality. In some embodiments, the circuitry may execute one or more software or firmware programs to provide at least some of the described functionality. The term “circuitry” may also refer to a combination of one or more hardware elements (or a combination of circuits used in an electrical or electronic system) with the program code used to carry out the functionality of that program code. In these embodiments, the combination of hardware elements and program code may be referred to as a particular type of circuitry. The term “processor circuitry” as used herein refers to, is part of, or includes circuitry capable of sequentially and automatically carrying out a sequence of arithmetic or logical operations, or recording, storing, and/or transferring digital data. Processing circuitry may include one or more processing cores to execute instructions and one or more memory structures to store program and data information. The term “processor circuitry” may refer to one or more application processors, one or more baseband processors, a physical central processing unit (CPU), a single-core processor, a dual-core processor, a triple-core processor, a quad-core processor, and/or any other device capable of executing or otherwise operating computer-executable instructions, such as program code, software modules, and/or functional processes. Processing circuitry may include more hardware accelerators, which may be microprocessors, programmable processing devices, or the like. The one or more hardware accelerators may include, for example, computer vision (CV) and/or deep learning (DL) accelerators. The terms “application circuitry” and/or “baseband circuitry” may be considered synonymous to, and may be referred to as, “processor circuitry.”

The term “interface circuitry” as used herein refers to, is part of, or includes circuitry that enables the exchange of information between two or more components or devices. The term “interface circuitry” may refer to one or more hardware interfaces, for example, buses, I/O interfaces, peripheral component interfaces, network interface cards, and/or the like.

The term “computer system” as used herein refers to any type interconnected electronic devices, computer devices, or components thereof. Additionally, the term “computer system” and/or “system” may refer to various components of a computer that are communicatively coupled with one another. Furthermore, the term “computer system” and/or “system” may refer to multiple computer devices and/or multiple computing systems that are communicatively coupled with one another and configured to share computing and/or networking resources.

The term “appliance,” “computer appliance,” or the like, as used herein refers to a computer device or computer system with program code (e.g., software or firmware) that is specifically designed to provide a specific computing resource. A “virtual appliance” is a virtual machine image to be implemented by a hypervisor-equipped device that virtualizes or emulates a computer appliance or otherwise is dedicated to provide a specific computing resource.

The term “resource” as used herein refers to a physical or virtual device, a physical or virtual component within a computing environment, and/or a physical or virtual component within a particular device, such as computer devices, mechanical devices, memory space, processor/CPU time, processor/CPU usage, processor and accelerator loads, hardware time or usage, electrical power, input/output operations, ports or network sockets, channel/link allocation, throughput, memory usage, storage, network, database and applications, workload units, and/or the like. A “hardware resource” may refer to compute, storage, and/or network resources provided by physical hardware element(s). A “virtualized resource” may refer to compute, storage, and/or network resources provided by virtualization infrastructure to an application, device, system, etc. The term “network resource” or “communication resource” may refer to resources that are accessible by computer devices/systems via a communications network. The term “system resources” may refer to any kind of shared entities to provide services, and may include computing and/or network resources. System resources may be considered as a set of coherent functions, network data objects or services, accessible through a server where such system resources reside on a single host or multiple hosts and are clearly identifiable.

The terms “instantiate,” “instantiation,” and the like as used herein refers to the creation of an instance. An “instance” also refers to a concrete occurrence of an object, which may occur, for example, during execution of program code.

The terms “coupled,” “communicatively coupled,” along with derivatives thereof are used herein. The term “coupled” may mean two or more elements are in direct physical or electrical contact with one another, may mean that two or more elements indirectly contact each other but still cooperate or interact with each other, and/or may mean that one or more other elements are coupled or connected between the elements that are said to be coupled with each other. The term “directly coupled” may mean that two or more elements are in direct contact with one another. The term “communicatively coupled” may mean that two or more elements may be in contact with one another by a means of communication including through a wire or other interconnect connection, through a wireless communication channel or link, and/or the like.