Semiconductor module inspection device

The present disclosure relates to a semiconductor module inspection device.

In recent years, in order to cope with an increase in communication traffic, miniaturization, low power, and high speed of an optical communication transceiver have come to be required. The optical semiconductor module including the optical communication transceiver includes an optical modulator that converts an electrical signal into a transmission optical signal, a photodiode that converts a reception optical signal into an electrical signal, and an optical circuit chip that connects these components. In addition, an amplifier circuit for driving an optical modulator or a photodiode, a control circuit, and a digital signal processing circuit may also be included in the electronic/optical circuit.

In recent years, research and development on optical semiconductor modules including a ball grid array (BGA) and a land grid array (LGA) as a small and high-speed input/output interface for an electrical signal has been conducted. Such an optical semiconductor module is called Co-packaged Optics, and has been actively researched and developed in recent years. (For example, Non Patent Literature 1)

In shipment inspection of an optical semiconductor module including such a BGA, inspection using an IC socket is performed similarly to an integrated circuit (IC) or an IC module (IC package) including a general BGA not including an optical semiconductor such as a processor or an application specific integrated circuit (ASIC). The IC socket includes a contact pin, and various electrical characteristics can be inspected by bringing a terminal portion of the accommodated IC module into contact with the contact pin and allowing conduction. (Patent Literature 1)

When an IC module is inspected in a temperature environment, a non-contact type temperature control device (environmental tester) that jets jet air at about −100° C. to 300° C. to an IC socket is used to change the ambient temperature environment for each IC socket in general.

As a method of easily changing the temperature, a method of changing the upper surface temperature of the IC module by attaching a contact-type temperature control device such as a Peltier element or a fin to the upper portion of the IC socket is also used.

Since the jet air causes shaking of the optical fiber connected to the optical semiconductor module, there is a problem that an inspection result of the optical semiconductor module is affected. In addition, when the temperature control device is attached to the upper portion of the IC socket, there is a problem that a temperature distribution occurs in the optical semiconductor module.

The present disclosure has been made in view of such a problem, and an object of the present disclosure is to provide a semiconductor module inspection device that is easily temperature-controllable and particularly suitable for an optical semiconductor module.

In order to achieve such an object, a semiconductor module inspection device according to an embodiment of the present invention includes a PCB substrate, an IC socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate, a first temperature control device disposed in contact with an upper surface of the IC socket, and a second temperature control device disposed in contact with a second main surface of the PCB substrate.

As described above, according to one embodiment of the present invention, it is possible to provide a semiconductor module inspection device that can be easily temperature-controlled, particularly suitable for an optical semiconductor module.

A detailed description of embodiments of the present invention will be described below with reference to the drawings. The same or similar reference numerals denote the same or similar components, and repetitive explanation of them will not be made in some cases. The following description of the embodiments is exemplary, and some configurations may be changed, omitted, or added without departing from the gist.

Before describing an embodiment of the present invention, an example of a conventional IC module inspection device will be described with reference toto

is a schematic configuration diagram of a jet air jetting-type semiconductor module inspection device as an environmental tester. An IC module inspection devicewhich is an inspection device is a device that inspects a semiconductor module such as the IC module or an optical semiconductor module.illustrates the optical semiconductor moduleincluding an LGA to which an optical fiberis connected as a semiconductor module. The IC module inspection deviceincludes a printed circuit board (PCB)as a development board, an IC socketdisposed on the PCB, and a jet air devicethat jets jet airfrom above the IC sockettoward a test environment including a semiconductor module mounted on the IC socket. The IC socketis made of a metal material such as aluminum and a resin material for insulation. Further, the IC sockethas a contact pinfor connecting a terminal (for example, a fine flat electrode (land)) of the mounted semiconductor module to wiring (not illustrated) on the PCB. The wiring on the PCBis connected with a connectordisposed near an edge of the PCB. A cableis connected to the connector. The cableis connected to, for example, a control unit and a measurement unit (not illustrated) of the inspection device. The optical fiberis connected to a light receiving unit and a light emitting unit (not illustrated) of the inspection device. The IC module inspection deviceis a jet air jetting-type environmental tester, and can change the temperature including the ambient temperature by the jet air deviceas a non-contact type temperature control device. Under such a test environment, power is supplied to the semiconductor module via the cable, the wiring on the PCB, and the contact pin, and an electric signal such as a control signal and an output signal is input/output, and an optical signal is input/output via the optical fiber, whereby the module is inspected.

is a schematic configuration diagram of a semiconductor module inspection device including a contact type temperature control device. Similarly to the IC module inspection deviceof, the IC module inspection deviceofincludes the PCBand the IC sockethaving the contact pin. The IC module inspection devicefurther includes a Peltier elementas a temperature control device provided on the upper portion of the IC socket, and a heat dissipation finthat cools a Peltier element. The Peltier elementand the heat dissipation fincan change the temperature of the test environment including the semiconductor module mounted on the IC socket.

is a schematic configuration diagram of a semiconductor module inspection device including a thermostatic bath. Similarly to the IC module inspection deviceof, an IC module inspection deviceofincludes the IC socketdisposed on the PCB, and a thermostatic baththat controls and holds the temperature of the test environment including the semiconductor module mounted to the IC socket. The thermostatic bathincludes a cable extraction portfor extracting the cableconnected to the connectordisposed near the edge of the PCBand the optical fiberconnected to the optical semiconductor module. The semiconductor module is inspected in a state where the entire IC socketwith the semiconductor module mounted is put inside the thermostatic bath.

In the example of the semiconductor module inspection device of, the configuration in which the optical semiconductor moduleincluding the LGA is inspected is illustrated, but also in the case of inspecting the optical semiconductor module including the BGA, the IC socket can be used similarly to the optical semiconductor module including the LGA.

In the optical semiconductor module, an optical fiberis connected as an input/output unit of an optical signal. Therefore, in the jet air jetting-type environmental tester (IC module inspection device) of, there is a problem that the optical fiberswings, the polarization state of the optical signal passing through the optical fiberchanges, and the inspection result is affected.

In the case of using the contact type temperature control device (IC module inspection device) of, the influence of the shaking of the optical fiberby the jet air is eliminated, but only the temperature on the upper surface side of the optical semiconductor modulecan be changed, so that a difference in temperature is generated between the upper surface side and the bottom surface side (contact pinside) of the optical semiconductor module. This is not a problem in the case of a general IC module. However, since an optical circuit is generally more sensitive to being affected by temperature characteristics than an electronic circuit, there is a problem that it is necessary to adjust the temperature of not only the bottom surface of the optical semiconductor modulebut also the entire optical semiconductor module.

In the case of using the semiconductor module inspection device (IC module inspection device) including the thermostatic bath of, the entire IC socketis accommodated in the thermostatic bath, so that the optical fiberdoes not shake, and the temperature of the optical semiconductor modulecan be uniformly adjusted. However, since the thermostatic bathis generally expensive and large, it is difficult to parallelize the control unit, the measurement unit, the light receiving unit, and the light emitting unit of the inspection device. Furthermore, since the thermostatic bathis large, the optical fiberconnected to the optical semiconductor modulefor inspection becomes long, and there is a problem in terms of handling of the optical fiberand cost.

Next, a semiconductor module inspection device according to an embodiment of the present invention will be described with reference to,, and. The semiconductor module inspection device according to the embodiment of the present invention includes a PCB substrate, an IC socket that accommodates a semiconductor module disposed on a first main surface of the PCB substrate, a first temperature control device disposed in contact with an upper surface of the IC socket, and a second temperature control device disposed in contact with a second main surface of the PCB substrate.

is a diagram schematically illustrating a semiconductor module inspection device according to a first embodiment of the present invention. As illustrated in, an IC module inspection devicethat is a semiconductor module inspection device includes the PCB, the IC sockethaving the contact pindisposed on the PCB, and a heat dissipation finthat cools a Peltier elementand a Peltier elementas a contact type temperature control device provided on an upper portion of the IC socket. Similarly to the IC socketillustrated in, the IC socketis made of a metal material such as aluminum and a resin material for insulation. The semiconductor module mounted to the IC socketis the optical semiconductor moduleincluding the LGA, and the optical fiberis connected thereto.

The heat dissipation finincludes a plate-shaped base and a fin portion. The fin portion has a plurality of fins extending in a direction substantially orthogonal to the main surface of the base portion. The heat dissipation finis disposed on the upper portion of the Peltier elementsuch that one of the main surfaces of the base portion (the main surface opposite to the fin portion) is in contact with the main surface of the Peltier element(the main surface opposite to the main surface in contact with the IC socket). The heat dissipation finis made of an aluminum material or the like, and is bonded to the Peltier elementusing an adhesive having thermal conductivity, thermal conductive grease, or the like.

The IC module inspection deviceoffurther includes a heat dissipation finthat cools a Peltier elementand the Peltier elementas a contact type temperature control device also on a lower main surface (a main surface opposite to the main surface on which the IC socketis disposed) of the PCB. The Peltier elementand the heat dissipation finare a large Peltier element for controlling the temperature of the entire range of the PCBand a fin for cooling.

Similarly to the heat dissipation fin, the heat dissipation finincludes a plate-shaped base portion and a fin portion. The heat dissipation finis disposed on the lower portion of the Peltier elementsuch that one of the main surfaces of the base portion (the main surface opposite to the fin portion) is in contact with the main surface of the Peltier element(the main surface opposite to the main surface in contact with the IC socket). The heat dissipation finis made of an aluminum material or the like, and is bonded to the Peltier elementusing an adhesive having thermal conductivity, thermal conductive grease, or the like.

The IC module inspection deviceofis different from the IC module inspection deviceofin that the lower surface of the PCBincludes the Peltier elementand the heat dissipation finthat cools the Peltier element. In the IC module inspection deviceof the present embodiment, the Peltier elementand the heat dissipation fincan change the temperature on the upper surface side of the optical semiconductor modulemounted on the IC socket, and the Peltier elementand the heat dissipation fincan change the temperature on the lower surface side of the optical semiconductor module. Consequently, the temperature inside the optical semiconductor modulecan be adjusted without a difference between the upper side and the lower side, and the temperature characteristic of optical semiconductor modulecan accurately be inspected. In addition, since the jet air is not used, there is no influence on the inspection result due to the shake of the optical fiberby the jet air.

The contact type temperature control device may include a cooling fan(and) in addition to the Peltier element and the heat dissipation fin.

In a case where the semiconductor module is inspected under the condition of the dew point of the surrounding environment or less using the IC module inspection deviceof the first embodiment described above with reference to, dew condensation occurs.

are diagrams schematically illustrating a semiconductor module inspection device according to a second embodiment of the present invention capable of preventing dew condensation. The configuration of an IC module inspection deviceof the present embodiment is a configuration in which a chamber structure is added to the configuration of the IC module inspection deviceof.

As illustrated in, the IC module inspection devicethat is a semiconductor module inspection device according to the present embodiment includes the PCB, the IC sockethaving the contact pindisposed on the PCB, the heat dissipation finthat cools the Peltier elementand the Peltier elementprovided above the IC socket, the heat dissipation finthat cools the Peltier elementand the Peltier elementprovided below the PCB, and a chamber structure having a chamber upper portionand a chamber lower portion

The chamber upper portionincludes a plate-shaped base and a side wall disposed at an outer edge of the base, and has an overall shape of a concave shape having an opening on a lower side. Similar to the chamber upper portion, the chamber lower portionalso includes a plate-shaped base and a side wall disposed at an outer edge of the base, and has an overall shape of a concave shape having an opening on an upper side. The chamber upper portionand the chamber lower portionare configured such that a part of a side wall of the chamber upper portionand a part of a side wall of the chamber lower portionare fitted in contact with each other in a state where the optical semiconductor moduleis mounted on the IC socket. As a result, a test environment including the semiconductor module amounted on the IC socketis formed, for example, in the chamber internal space formed in a state where a part (for example, an end portion) of the side wall of the chamber upper portionand a part (for example, an end portion) of the side wall of the chamber lower portionare fitted to each other.

The base portion of the chamber upper portionhas an opening. The edge of the opening of the chamber upper portionand the edge of the base of the heat dissipation finare bonded and fixed such that the fin portion of the heat dissipation finprovided in the upper portion of the IC socketprotrudes to the chamber outer space and the position of the Peltier elementis in the chamber internal space. In short, the base portion of the heat dissipation fin, which is the heat dissipation surface of the temperature control device, is connected to the chamber upper portion. The base portion of the chamber lower portionalso has an opening similarly to the chamber upper portion. The edge of the opening and the edge of the base of the heat dissipation finare bonded and fixed such that the fin portion of the heat dissipation finprovided on the lower surface side of the PCBprotrudes into the chamber outer space and the position of the Peltier elementis in the chamber internal space. In short, the base portion of the heat dissipation fin, which is the heat dissipation surface of the temperature control device, is connected to the chamber lower portion. A part of the base portion of the heat dissipation finsandconfigures a part of the chamber structure together with the base portion of the chamber upper portionand the chamber lower portion, so that the heat of the Peltier elementsandis released to the space outside the chamber. As an adhesive for bonding and fixing the edge of the opening portion of the chamber upper portionand the edge of the base portion of the heat dissipation fin, the chamber itself may also serve as the heat dissipation surface of the temperature control device using an adhesive having high thermal conductivity, or only the heat dissipation finmay serve as the heat dissipation surface by using an adhesive having high thermal insulation.

Alternatively, with regard to the fixing between the edge of the opening of the chamber upper portionand the edge of the base portion of the heat dissipation fin, a structure may be employed in which a rail or the like is attached to the heat dissipation finand the chamber upper portionis slid with respect to the heat dissipation finwithout adhering and fixing the chamber upper portionand the heat dissipation fin. In this way, the chamber upper portionand the chamber lower portionare fitted not to be affected by mechanical tolerance, and the influence of the atmosphere flowing into the chamber can be eliminated by the gap between the chamber upper portionand the chamber lower portion

The chamber structure is provided with a cable extraction port for extracting the cableconnected to the connectorand the optical fiberconnected to the optical semiconductor modulefrom the chamber internal space.

illustrates a state in which the optical semiconductor moduleis mounted on the IC socketof the IC module inspection deviceof the present embodiment. The IC socketis divided into two parts of a lid part and a recessed part. A lid portion of the IC socketis bonded and fixed to the Peltier element, and a recessed portion of the IC socketis bonded and fixed to the Peltier element. The optical semiconductor moduleis mounted in the recessed portion of the IC sockethaving the contact pin, then the optical fiberconnected to the optical semiconductor moduleis guided to the chamber external space through the cable extraction port provided on the side of the recessed portion of the IC socketand the cable extraction port provided on the side wall of the chamber structure, and finally the lid portion of the IC socketintegrated with the chamber upper portionis installed in the optical semiconductor module.

As illustrated in, the IC module inspection deviceof the present embodiment includes at least one purge mechanism in at least one of the chamber upper portionand the chamber lower portion. The purge mechanism may be, for example, a purge hole. The purge mechanism is a mechanism for purging the chamber internal space being inspected with dried air. As a result, in the IC module inspection deviceof the present embodiment, it is possible to perform the inspection while preventing the dew condensation even at the dew point or less.

is a schematic configuration diagram of a semiconductor module inspection device according to an embodiment of the present invention. The semiconductor module inspection device according to the present embodiment is a modification embodiment of a semiconductor module inspection device according to a second embodiment.

As illustrated in, in an IC module inspection devicewhich is a semiconductor module inspection device, the lid portion of the IC socketis not bonded and fixed to the Peltier element, and the lid portion of the IC socketand the Peltier elementcan be separated from each other. On the other hand, the IC module inspection deviceincludes a positioning mechanism for aligning the lid portion of the IC socketand the Peltier element. The positioning mechanism includes a positioning pinand a pin receiverinto which the positioning pinis fitted. In the IC module inspection deviceof the present embodiment, the Peltier elementincludes the positioning pinon the main surface (the main surface in contact with the IC socketand the main surface opposite to the heat dissipation fin), and the lid portion of the IC socketincludes the pin receiver.

According to the IC module inspection deviceof the present embodiment, even when the lid portion of the IC socketincludes a torque management screw (not illustrated) or the like for controlling an appropriate load on the optical semiconductor module, the optical semiconductor modulecan be mounted on the IC socket, the lid portion of the IC socketcan be installed on the optical semiconductor module, torque management is performed by the torque management screw, and then the Peltier elementcan be separately attached to the upper portion of the lid portion of the IC socket.

According to the above-described various embodiments, it is possible to provide an optical semiconductor module inspection device capable of simply and uniformly adjusting the temperature of the optical semiconductor module.