Transmission assembly and foldable electronic device

This application is a National Stage of International Application No. PCT/CN2022/091797 filed on May 9, 2022, which claims priority to Chinese Patent Application No. 202110790991.8 filed on Jul. 13, 2021, both of which are incorporated herein by references in their entireties.

Embodiments of this application relate to the technical field of terminals, and in particular, to a transmission assembly and a foldable electronic device.

As communication technologies develop rapidly, increasingly high signal transmission performance inside communication devices is required. For example, current communication devices are developing in a multi-antenna trend. For a foldable communication device, generally, an antenna can be arranged on only one side. If the antenna is required to be arranged on another side, a transmission assembly for signal transmission needs to extend through a rotating shaft assembly to be connected to circuit boards on two sides. In this case, bending resistance and loss resistance of the transmission assembly are required to be extremely high.

An electronic device, for example, a foldable screen mobile phone is used. In the prior art, a transmission assembly is usually arranged on the foldable screen mobile phone. One end of the transmission assembly is connected to a circuit board on one side of the foldable screen mobile phone, and another end of the transmission assembly extends through a rotating shaft assembly and is connected to a circuit board on another side of the foldable screen mobile phone. The transmission assembly located in an area of the rotating shaft assembly (that is, a bend of the transmission assembly) is configured as a grid shape, to reduce stress concentration points during folding, thereby increasing flexibility of the transmission assembly. In this way, the transmission assembly can be easily bent.

However, through the above solution, the bending resistance of the transmission assembly is still poor, resulting in poor reliability of the transmission assembly when the transmission assembly is used in a foldable screen device and a failure to satisfy performance requirements for a transmission assembly required in the foldable screen device.

Embodiments of this application provide a transmission assembly and a foldable electronic device. By virtue of the embodiments of this application, bending resistance of a transmission assembly can be improved, so that reliability of the transmission assembly when the transmission assembly is used in a foldable screen device is improved, thereby satisfying performance requirements for a transmission assembly required in the foldable screen device.

According to a first aspect, this embodiment of this application provides a transmission assembly. The transmission assembly is configured for use in a foldable electronic device, and the transmission assembly includes a first transmission assembly, where the first transmission assembly is configured for use in a bending area of a foldable electronic device. The first transmission assembly includes at least two first conductive layers and a first transmission layer located between the two first conductive layers. Each of the first conductive layers includes at least a first conductive fabric. The first transmission layer includes at least one first signal line. A dielectric layer is further arranged between the first conductive layer and the first transmission layer, and the dielectric layer includes at least a first substrate layer.

In the transmission assembly provided in this embodiment of this application, by arranging the first conductive fabric, the first conductive fabric has good tensile performance during bending of the first transmission assembly, which can improve bending resistance of the first transmission assembly, thereby enhancing reliability of the transmission assembly when the transmission assembly is used in a foldable screen device, and meeting performance requirements for transmission assemblies required in foldable screen devices.

In a possible implementation, the first conductive layer further includes a first conductive adhesive layer located between the first conductive fabric and the dielectric layer. The first conductive adhesive layer is configured to bond the first conductive fabric to the dielectric layer.

In a possible implementation, the first conductive fabric and the first conductive adhesive layer are integrally formed. The integral formation of the first conductive fabric and the first conductive adhesive layer can ensure the reliability of the first conductive layer.

In a possible implementation, the first conductive fabric includes a first base layer and a conductive material arranged on the first base layer. A tensile strength of the first base layer is greater than 360 Mpa. In this way, the first base layer with the tensile strength greater than 360 Mpa can ensure the tensile performance of the first conductive fabric, and the conductive material arranged on the first base layer can ensure the conductivity of the first conductive fabric.

In a possible implementation, the first base layer is made of a polyester fiber. The polyester fiber is a synthetic fiber obtained by spinning polyester obtained by polycondensation of organic dibasic acid and dibasic alcohol, which has excellent wrinkle resistance and shape retention, and high strength and elastic restorability, and is durable.

In a possible implementation, the conductive material is any one or more of copper, gold, and nickel.

In a possible implementation, a thickness of the first conductive layer is in a range of 0.01 mm to 0.1 mm.

In a possible implementation, the first transmission layer further includes at least one first ground wire. At least one first ground wire is arranged on each of two sides of each of the first signal lines.

In a possible implementation, a distance between the first signal line and the first ground wire is greater than a distance between the first signal line and the first conductive layer.

In a possible implementation, the dielectric layer further includes an insulating layer located between the first conductive layer and the first substrate layer.

In a possible implementation, the insulating layer includes a first insulating adhesive layer. The first insulating adhesive layer is located between the first conductive layer and the first substrate layer. By arranging the first insulating adhesive layer between the first conductive layer and the first substrate layer, a thickness of the first substrate layer can be appropriately reduced, and the first insulating adhesive layer has better tensile performance compared with the first substrate layer, thereby enhancing bending resistance of the first transmission assembly.

In a possible implementation, the insulating layer includes an insulating fabric and a second insulating adhesive layer, and the second insulating adhesive layer is located between the insulating fabric and the first substrate layer. The insulating fabric has good tensile performance, which can further optimize the bending resistance of the first transmission assembly.

In a possible implementation, the insulating fabric is made of a polyester fiber.

In a possible implementation, the insulating layer includes a foamed layer and a third insulating adhesive layer, and the third insulating adhesive layer is located between the foamed layer and the first substrate layer.

In a possible implementation, the foamed layer is a closed-cell foam, a semi-closed-cell foam, or a foamed material. The closed-cell foam, the semi-closed-cell foam, or the foamed material has excellent resilience and retention.

In a possible implementation, the foamed material is a composite material formed of polytetrafluoroethylene, polyurethane, or a copolymer of polytetrafluoroethylene and fluorinated ethylene propylene. Polytetrafluoroethylene has excellent chemical stability, corrosion resistance, sealing performance, high lubrication and non-stickiness, electrical insulation, and good aging resistance. Polyurethane is a thermoplastic linear structure with good stability, chemical resistance, resilience and mechanical properties, and has less compression deformation. The copolymer of polytetrafluoroethylene and fluorinated ethylene propylene has good processability of thermoplastics.

In a possible implementation, a thickness of the insulating layer is in a range of 0.04 mm to 0.1 mm.

In a possible implementation, a thickness of the first substrate layer is in a range of 0.012 mm to 0.025 mm.

In a possible implementation, a plurality of notches are provided on the first signal line, and the plurality of notches are arranged at intervals in a bending direction perpendicular to the first transmission assembly.

In a possible implementation, the transmission assembly further includes a second transmission assembly. The second transmission assembly is connected to the first transmission assembly, and is configured for use in a non-bending area of the foldable electronic device. The second transmission assembly includes at least two first ground layers and a second transmission layer located between the two first ground layers. The second transmission layer includes a second signal line. A second substrate layer is further arranged between each of the first ground layers and the second transmission layer. The first ground layer is connected to the first conductive layer, the second transmission layer is connected to the first transmission layer, and the second substrate layer is connected to the first substrate layer.

When the second transmission assembly in the transmission assembly is configured for use in the non-bending area in the foldable electronic device, structural strength and stability of the transmission assembly corresponding to the non-bending area can be ensured. When the first transmission assembly in the transmission assembly is configured for use in the bending area of the foldable electronic device, the conductive fabric is arranged in the first transmission assembly as the ground layer, which can ensure the bending resistance and reliability of the transmission assembly corresponding to the bending area.

In a possible implementation, the second transmission layer and the first transmission layer are integrally arranged, and the second substrate layer and the first substrate layer are integrally arranged. In this way, reliability of signal transmission between the first transmission assembly and the second transmission assembly can be ensured.

In a possible implementation, the first conductive layer is connected to a side of the first ground layer facing away from the second substrate layer. The first conductive layer of the first transmission assembly is connected to the first ground layer of the second transmission assembly, which can ensure the performance of signal transmission between the first transmission assembly and the second transmission assembly.

2 In a possible implementation, a connection area between the first conductive layer and the first ground layer is greater than or equal to 20 mm. In this way, the reliability of signal transmission between the first transmission assembly and the second transmission assembly can be further ensured.

In a possible implementation, a thickness of the dielectric layer is set such that a first distributed capacitance is formed between the first conductive layer and the first signal layer, and the first distributed capacitance causes an impedance of the first transmission assembly to match an impedance of the second transmission assembly.

A distributed capacitance is formed between the first conductive layer and the first signal layer. Increasing the thickness of the dielectric layer can increase the distributed capacitance, and the impedance of the first transmission assembly is related to the distributed capacitance. Increasing the distributed capacitance can reduce the impedance of the first transmission assembly. In this way, when the thickness of the dielectric layer reaches a preset value, the first distributed capacitance is formed between the first conductive layer and the first signal layer, and the first distributed capacitance can cause the impedance of the first transmission assembly to match the impedance of the second transmission assembly.

In a possible implementation, when the impedance of the second transmission assembly is 50Ω, the thickness of each dielectric layer is set to 0.107 mm, a thickness of the first signal layer is 12 μm, and a dielectric constant c of the dielectric layer is 2.9, and when a transmission frequency is 2000 MHz, the first distributed capacitance is formed between the first conductive layer and the first signal layer, and the first distributed capacitance causes the impedance of the first transmission assembly to be 50Ω.

In a possible implementation, a weaving density of the first conductive fabric of the first conductive layer is set such that a second distributed capacitance is formed between the first conductive layer and the first signal layer, and the second distributed capacitance causes an impedance of the first transmission assembly to match an impedance of the second transmission assembly.

A distributed capacitance is formed between the first conductive layer and the first signal layer. Increasing the weaving density of the first conductive fabric of the first conductive layer can increase the distributed capacitance, and the impedance of the first transmission assembly is related to the distributed capacitance. Increasing the distributed capacitance can reduce the impedance of the first transmission assembly. In this way, when the weaving density of the first conductive fabric of the first conductive layer reaches a preset value, the second distributed capacitance is formed between the first conductive layer and the first signal layer, and the second distributed capacitance can cause the impedance of the first transmission assembly to match the impedance of the second transmission assembly.

In a possible implementation, a dielectric constant of the dielectric layer is set such that a third distributed capacitance is formed between the first conductive layer and the first signal layer, and the third distributed capacitance causes an impedance of the first transmission assembly to match an impedance of the second transmission assembly.

A distributed capacitance is formed between the first conductive layer and the first signal layer. Decreasing the dielectric constant of the dielectric layer can increase the distributed capacitance, and the impedance of the first transmission assembly is related to the distributed capacitance. Increasing the distributed capacitance can reduce the impedance of the first transmission assembly. In this way, when the dielectric constant of the dielectric layer reaches a preset value, the third distributed capacitance is formed between the first conductive layer and the first signal layer, and the third distributed capacitance can cause the impedance of the first transmission assembly to match the impedance of the second transmission assembly.

In a possible implementation, when the impedance of the second transmission assembly is 50Ω, the dielectric constant of the dielectric layer is set to 2, a thickness of each dielectric layer is set to 0.039 mm, and a thickness of the first signal layer is 12 μm, and when a transmission frequency is 2000 MHz, the third distributed capacitance is formed between the first ground layer and the first signal layer, and the third distributed capacitance causes the impedance of the first transmission assembly to be 50Ω.

According to a second aspect, this embodiment of this application further provides a transmission assembly. The transmission assembly is configured for use in a foldable electronic device, and the transmission assembly includes a first transmission assembly, where the first transmission assembly is configured for use in a bending area of a foldable electronic device. The first transmission assembly includes at least a second conductive layer, a third transmission layer, and a third substrate layer located between the second conductive layer and the third transmission layer. The third transmission layer includes third signal lines arranged at intervals and second ground wires located on two sides of each of the third signal lines, and the second ground wire extends through the third substrate layer and is connected to the second conductive layer. The second conductive layer includes a second conductive fabric.

In the transmission assembly provided in this embodiment of this application, by arranging the second conductive layer as the second conductive fabric, the second conductive fabric has good tensile performance during bending of the first transmission assembly, which can improve bending resistance of the first transmission assembly, thereby enhancing reliability of the transmission assembly when the transmission assembly is used in a foldable screen device, and meeting performance requirements for transmission assemblies required in foldable screen devices.

In a possible implementation, the transmission assembly further includes a second transmission assembly. The second transmission assembly is connected to the first transmission assembly, and is configured for use in a non-bending area of the foldable electronic device. The second transmission assembly includes at least a second ground layer, a fourth transmission layer, and a fourth substrate layer located between the second ground layer and the fourth transmission layer. The second ground layer is connected to the second conductive layer, the fourth transmission layer is connected to the third transmission layer, and the fourth substrate layer is connected to the third substrate layer.

When the second transmission assembly in the transmission assembly is configured for use in the non-bending area in the foldable electronic device, structural strength and stability of the transmission assembly corresponding to the non-bending area can be ensured. When the first transmission assembly in the transmission assembly is configured for use in the bending area of the foldable electronic device, the second conductive layer in the first transmission assembly is a conductive fabric, which can ensure the bending resistance and reliability of the transmission assembly corresponding to the bending area.

In a possible implementation, the fourth transmission layer and the third transmission layer are integrally arranged, and the fourth substrate layer and the third substrate layer are integrally arranged. In this way, reliability of signal transmission between the first transmission assembly and the second transmission assembly can be ensured.

In a possible implementation, the second transmission assembly further includes a third ground layer and a fifth substrate layer. The fourth transmission layer is located between the fourth substrate layer and the fifth substrate layer, and the fifth substrate layer is located between the fourth transmission layer and the third ground layer. In this way, the structural strength and stability of the second transmission assembly corresponding to the non-bending area can be further improved.

According to a third aspect, this embodiment of this application further provides a foldable electronic device. The foldable electronic device includes a first structural member and a second structural member. a bending area is formed between the first structural member and the second structural member. The first structural member includes at least a first circuit board, and the second structural member includes at least a second circuit board. The foldable electronic device further includes any one of the transmission assemblies described above. One end of the transmission assembly is connected to the first circuit board, and another end of the transmission assembly is connected to the second circuit board.

The foldable electronic device provided in this embodiment of this application includes at least a transmission assembly. In the transmission assembly, by arranging the first conductive fabric, the first conductive fabric has good tensile performance during bending of the first transmission assembly, which can improve bending resistance of the first transmission assembly, thereby enhancing reliability of the transmission assembly when the transmission assembly is used in a foldable screen device, and meeting performance requirements for transmission assemblies required in foldable screen devices.

In a possible implementation, the transmission assembly includes a first transmission assembly and a second transmission assembly connected to the first transmission assembly. The first transmission assembly is configured for use in a bending area of the foldable electronic device, and the second transmission assembly is configured for use in a non-bending area of the foldable electronic device. Since the first transmission assembly has bending resistance, when the first transmission assembly is configured for use in a corresponding area of a rotating shaft assembly that needs to be bent, the use reliability of the transmission assembly can be ensured.

100 10 11 —Transmission assembly;—First transmission assembly;—First conductive layer; 111 112 12 —First conductive fabric;—First conductive adhesive layer;—First transmission layer; 121 122 1211 —First signal line;—First ground wire;—Notch; 13 131 132 —Dielectric layer;—First substrate layer;—Insulating layer; 1321 1322 1323 —First insulating adhesive layer;—Insulating fabric;—Second insulating adhesive layer; 1324 1325 20 —Foamed layer;—Third insulating adhesive layer;—Second transmission assembly; 201 202 2021 —First ground layer;—Second transmission layer;—Second signal line; 2022 203 204 —Fourth ground wire;—Second substrate layer;—First bonding layer; 205 301 3011 —First cover layer;—Second conductive layer;—Second conductive fabric; 3012 302 3021 —Second conductive adhesive layer;—Third transmission layer;—Third signal line; 3022 303 401 —Second ground wire;—Third substrate layer;—Second ground layer; 402 4021 4022 —Fourth transmission layer;—Fourth signal line;—Third ground wire; 403 404 405 —Fourth substrate layer;—Third ground layer;—Fifth substrate layer; 50 60 200 —Second cover layer;—Second bonding layer;—Foldable screen mobile phone; 210 21 211 —Bending area;—First structural member;—First circuit board; 212 22 221 —First battery;—Second structural member;—Second circuit board; 222 23 231 —Second battery;—Rotating shaft assembly;—Rotating shaft; 232 233 24 —First connecting member;—Second connecting member;—Display; 25 26 —Rear cover; and—Flexible circuit board.

Terms used in implementations of this application are only used for explaining specific embodiments of this application, and are not intended to limit this application. The implementations of the embodiments of this application are described in detail below with reference to the accompanying drawings.

As flexible display technologies gradually become mature, a display mode of electronic devices changes significantly. For example, foldable electronic devices such as foldable mobile phones and foldable computers appear. Efficiency of information exchange can be doubled merely by simple folding of the foldable electronic devices. Future designs such as multiple folding and scrolling can completely change a way of information exchange. In addition, modes of displays of the foldable electronic devices can be flexibly changed and switched in different use scenarios, and the displays have a high screen-to-body ratio and definition. For example, a foldable mobile phone can be as small as a traditional mobile phone after being folded, which is portable, and can be as large as a tablet computer after being unfolded. Due to these characteristics, the foldable electronic devices become one of the most popular products.

An embodiment of this application provides a foldable electronic device. The foldable electronic device may include, but is not limited to, a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a handheld computer, a walkie-talkie, a netbook, a point of sales (point of sales, POS) machine, a personal digital assistant (personal digital assistant, PDA), a wearable device, a virtual reality device, a wireless USB flash disk, a Bluetooth audio/headset, or a mobile or stationary terminal having a transmission assembly, such as an on-board front-mounted device, a driving recorder, or a security device.

1 FIG. 3 FIG. 4 FIG. 200 200 21 22 210 21 22 23 210 23 21 22 21 22 23 Referring toto, for example, the foldable electronic device is a foldable screen mobile phone. The foldable screen mobile phonemay include a first structural memberand a second structural member. A bending areais formed between the first structural memberand the second structural member(refer to). For example, a rotating shaft assemblymay be arranged in the bending area. The rotating shaft assemblyis located between the first structural memberand the second structural member, and the first structural memberand the second structural memberare rotatably connected through the rotating shaft assembly.

4 FIG. 23 231 232 233 231 231 232 233 232 21 233 22 21 22 Specifically, as shown in, the rotating shaft assemblymay include a rotating shaftand a first connecting memberand a second connecting memberlocated on two sides of an axis of the rotating shaft. The rotating shaftis rotatably connected to the first connecting memberand the second connecting member, the first connecting memberis fixedly connected to the first structural member, and the second connecting memberis fixedly connected to the second structural member, thereby realizing folding and unfolding of the first structural memberand the second structural member.

2 FIG. 3 FIG. 1 FIG. 3 FIG. 200 24 24 21 23 22 21 22 21 22 200 21 22 21 22 21 22 200 In this embodiment of this application, as shown inor, the foldable screen mobile phonemay further include a display. The displaymay be a flexible display, and the flexible display may cover one sides of the first structural member, the rotating shaft assembly, and the second structural member. In this way, the flexible display can be folded or unfolded correspondingly with rotation of the first structural memberand the second structural member. For example, when the first structural memberand the second structural memberare rotated toward each other into a folded state (refer to), the flexible display of the foldable screen mobile phoneis located between the first structural memberand the second structural memberin a folded state. When the first structural memberand the second structural memberare rotated away from each other into an unfolded state (see) until the first structural memberand the second structural memberare located on a same horizontal plane, the flexible display of the foldable screen mobile phoneis also in an unfolded state.

1 FIG. 3 FIG. 200 23 200 21 22 It should be noted that, there may be two (refer toto) or more structural members in the foldable screen mobile phone, and when there are more than two structural members, adjacent structural members may rotate about rotating shaft assembliesparallel to each other, thereby forming a multi-layer structural member. Alternatively, the structural members may be unfolded to obtain a larger display area. In this embodiment of this application, the foldable screen mobile phonehas two structural members (that is, the first structural memberand the second structural member) by way of example for description.

200 25 25 21 23 22 24 21 23 22 24 25 1 FIG. 2 FIG. Further, the foldable screen mobile phonemay further include a rear cover. As shown inor, the rear coveris located on one sides of the first structural member, the rotating shaft assembly, and the second structural memberfacing away from the display. For example, the first structural member, the rotating shaft assembly, and the second structural memberare all located between the displayand the rear cover.

4 FIG. 6 FIG. 5 FIG. 200 212 222 211 221 21 212 211 212 22 222 221 222 Referring toto, the foldable screen mobile phonemay further include batteries (such as a first batteryand a second battery) and circuit boards (such as a first circuit boardand a second circuit board). Specifically, as shown in, the first structural memberhas the first batteryand two first circuit boardslocated on two sides of the first battery, and the second structural memberhas the second batteryand two second circuit boardslocated on two sides of the second battery.

200 200 It may be understood that the structures illustrated in this embodiment of this application do not constitute a specific limitation on the foldable screen mobile phone. In some other embodiments of this application, the foldable screen mobile phonemay include more or fewer components than those shown in the figure, or some components may be combined, or some components may be split, or components are arranged in different manners. The components shown in the figure may be implemented by hardware, software, or a combination of software and hardware.

200 200 200 In order to realize a communication function of the foldable screen mobile phone, an antenna (not shown) is usually arranged on the foldable screen mobile phone, so as to transmit and receive signals through the antenna. In this embodiment of this application, antennas may be formed on a metal frame of the foldable screen mobile phoneby forming two slits.

200 21 200 22 200 In the prior art, generally, an antenna can only be arranged on only one side of a structural member of a foldable screen mobile phone. For example, an antenna is arranged only on the first structural memberof the foldable screen mobile phone, or only on the second structural memberof the foldable screen mobile phone, which may lead to a very tense antenna environment in a multi-antenna application scenario.

4 FIG. 6 FIG. 4 FIG. 200 100 100 211 21 100 23 221 22 100 200 100 211 21 100 210 221 22 221 22 26 In order to improve the antenna environment to realize arrangement of antennas on the structural members on two sides of the foldable screen mobile phone, as shown inor, the foldable screen mobile phoneprovided in this embodiment of this application may further include a transmission assembly. One end of the transmission assemblyis connected to the first circuit boardin the first structural member, and another end of the transmission assemblyextends through the rotating shaft assemblyand is connected to the second circuit boardin the second structural member. For example, in, a transmission assemblyis arranged in the foldable screen mobile phone. One end of the transmission assemblyis connected to one of the first circuit boardsin the first structural member, and another end of the transmission assemblyextends through the bending areaand is connected to the second circuit boardin the second structural member. Two circuit boards located at the same side (for example, two second circuit boardsin the second structural member) may be connected through a flexible circuit board.

However, bending resistance of a current common transmission assembly is relatively poor, resulting in poor reliability of the transmission assembly when the transmission assembly is used in the foldable screen mobile phone and a failure to satisfy performance requirements for the transmission assembly required in the foldable screen mobile phone.

Based on this, an embodiment of this application provides a transmission assembly. The transmission assembly is configured for use in the foldable electronic device (for example, a foldable screen mobile phone). In the transmission assembly, by arranging a first conductive fabric, the first conductive fabric has good tensile performance during bending of the first transmission assembly, which can improve bending resistance of the first transmission assembly, thereby enhancing reliability of the transmission assembly when the transmission assembly is used in a foldable screen device, and improving use effects of users while meeting performance requirements for transmission assemblies required in foldable screen devices.

A specific structure of the transmission assembly in this embodiment of this application is described in detail below by using different embodiments as examples with reference to the specific accompanying drawings.

7 FIG. 8 FIG. 4 FIG. 8 FIG. 100 100 200 100 10 10 210 10 11 12 11 11 111 12 121 13 11 12 13 131 Referring toor, an embodiment of this application provides a transmission assembly. The transmission assemblyis configured for use in a foldable electronic device (for example, a foldable screen mobile phone). The transmission assemblymay include a first transmission assembly. The first transmission assemblyis configured for use in a bending areaof the foldable electronic device (refer to). As shown in, the first transmission assemblymay include at least two first conductive layersand a first transmission layerlocated between the two first conductive layers. Each of the first conductive layersmay include at least a first conductive fabric. The first transmission layermay include at least one first signal line. A dielectric layeris further arranged between the first conductive layerand the first transmission layer. The dielectric layermay include at least a first substrate layer.

11 FIG. 12 FIG. 11 FIG. 12 FIG. 12 122 122 121 12 121 122 122 121 12 121 122 122 121 122 12 121 122 12 In this embodiment of this application, referring toand, the first transmission layermay further include at least one first ground wire. At least one first ground wireis arranged on each of two sides of each of the first signal lines. Specifically, in, the first transmission layerincludes a first signal lineand two first ground wires, and the first ground wireslocated on two sides of the first signal linecan play a role in shielding external interference signals. In, the first transmission layerincludes two first signal linesand three first ground wires. The first ground wirelocated between two adjacent first signal lines(that is, the first ground wirelocated in the middle of the first transmission layer) can play a role of isolation to avoid mutual interference between two adjacent first signal lines. The two first ground wireslocated at two outermost sides of the first transmission layercan play a role in shielding external interference signals.

12 121 122 122 121 122 121 Alternatively, in some other embodiments, the first transmission layermay include two first signal linesand a first ground wire. The first ground wireis located between the two first signal lines, and the first ground wirecan play a role of isolation to avoid mutual interference between the two first signal lines.

122 121 121 121 In addition, it may be understood that in a possible implementation, the first ground wiremay not be arranged between two adjacent first signal lines, so that a distance between two adjacent first signal linesis increased, and it can be ensured that an isolation degree between two adjacent first signal linesis greater than 20 dB.

121 122 121 11 121 122 121 121 122 It should be noted that, a distance between the first signal lineand the first ground wiremay be greater than a distance between the first signal lineand the first conductive layer. In this way, it can be ensured that the first signal lineis still a control impedance of a stripline structure, and the first ground wireson left and right sides only play the role of shielding interference, without affecting the impedance of the first signal line. If the distance between the first signal lineand the first ground wireis excessively small, a coplanar waveguide may be changed.

131 In this embodiment of this application, a material of the first substrate layermay be a low-loss and low-dielectric material such as liquid crystal polymer (Liquid Crystal Polymer, LCP), fluorine, polyimide (Polyimide, PI), or modified polyimide (MPI), which is neither limited in this embodiment of this application nor limited to the above examples.

8 FIG. 11 112 112 111 13 112 111 13 In this embodiment of this application, referring to, the first conductive layermay further include a first conductive adhesive layer. The first conductive adhesive layeris located between the first conductive fabricand the dielectric layer, and the first conductive adhesive layeris configured to bond the first conductive fabricto the dielectric layer.

111 112 111 112 11 In an optional implementation, the first conductive fabricand the first conductive adhesive layermay be integrally formed. The integral formation of the first conductive fabricand the first conductive adhesive layercan ensure the reliability of the first conductive layer.

111 111 111 In some embodiments, the first conductive fabricmay include a first base layer and a conductive material arranged on the first base layer. The tensile strength of the first base layer is greater than 360 Mpa, that is, the tensile strength of the first base layer is greater than tensile performance of copper. In this way, the first base layer with the tensile strength greater than 360 Mpa can ensure the tensile performance of the first conductive fabric, and the conductive material arranged on the first base layer can ensure the conductivity of the first conductive fabric.

For example, the first base layer may be made of a polyester fiber. The polyester fiber is a synthetic fiber obtained by spinning polyester obtained by polycondensation of organic dibasic acid and dibasic alcohol, which has excellent wrinkle resistance and shape retention, and high strength and elastic restorability, and is durable.

13 FIG. 14 FIG. 13 FIG. 14 FIG. In this embodiment of this application, the conductive material may be any one or more of copper, gold, and nickel. The conductive material may be granular (as shown inand) or branched (as shown inand).

111 In a practical application scenario, the polyester fiber may be plated with nickel, then plated with copper with high conductivity and nickel with anti-oxidation and anti-corrosion, and finally plated with gold. The first conductive fabricformed in this way provides good conductivity and electromagnetic shielding effects due to the combination of copper, nickel, and gold. In addition, according to the requirements of shielding design, a linear size of the gap in the conductive fabric is less than 1/10 wavelength, and a size of a cavity is less than ⅕ wavelength. A mesh number of the conventional conductive fabric is generally in a range of 100 mesh to 400 mesh, and an aperture size is in a range of 0.150 mm to 0.0374 mm. In this way, a better shielding effect can be obtained in the range of 100 K-3 GHz.

111 112 112 111 11 In addition, for the interference above 3 GHz, a metal/conductive polymer composite layer may be constructed on a surface of the first conductive fabricor inside the first conductive adhesive layer, for example, dendritic crystals are used inside the colloid of the first conductive adhesive layerto replace conductive particles, or metal wires and particles with a wave-absorbing function are woven in the first conductive fabric. The first conductive layerobtained in this way (that is, an anti-electromagnetic radiation woven fabric material) can realize two attenuation mechanisms of reflection and absorption, so as to achieve an effect of mutual enhancement and solve the problem of high-frequency shielding.

11 11 11 In this embodiment of this application, a thickness of the first conductive layermay be in a range of 0.01 mm to 0.1 mm. In an optional implementation, a thickness of the first conductive layermay be in a range of 0.03 mm to 0.05 mm. For example, the thickness of the first conductive layermay be 0.035 mm, 0.04 mm, or 0.045 mm. It should be noted herein that the numerical value and the numerical range involved in this application are approximate values, and an error within a certain range may exist due to impact of the manufacturing process. The error may be considered negligible by a person skilled in the art.

2 11 11 In an optional implementation, in an area of 4*4 (or 2*2) mm, a lapping impedance of the first conductive layerdoes not exceed 200 milliohms, and the reliability does not exceed 200 milliohms after degradation. In a range of 500 MHz to 6 GHz, the shielding effectiveness of the first conductive layeris greater than 70 dBm.

8 FIG. 13 132 132 11 131 132 Referring to, the dielectric layermay further include an insulating layer. The insulating layeris located between the first conductive layerand the first substrate layer. The specific arrangement of the insulating layerincludes but is not limited to the following possible implementations.

8 FIG. 132 1321 1321 11 131 1321 11 131 131 1321 131 10 A possible implementation is as follows. As shown in, the insulating layerincludes a first insulating adhesive layer. The first insulating adhesive layeris located between the first conductive layerand the first substrate layer. By arranging the first insulating adhesive layerbetween the first conductive layerand the first substrate layer, a thickness of the first substrate layercan be appropriately reduced, and the first insulating adhesive layerhas better tensile performance compared with the first substrate layer, thereby enhancing bending resistance of the first transmission assembly.

9 FIG. 132 1322 1323 1323 1322 131 1322 10 Another possible implementation is as follows. As shown in, the insulating layerincludes an insulating fabricand a second insulating adhesive layer. The second insulating adhesive layeris located between the insulating fabricand the first substrate layer. The insulating fabrichas good tensile performance, which can further optimize the bending resistance of the first transmission assembly.

1322 In an optional implementation, the insulating fabricmay be made of a polyester fiber.

10 FIG. 132 1324 1325 1325 131 Still another possible implementation is as follows. As shown in, the insulating layermay include a foamed layerand a third insulating adhesive layer. The third insulating adhesive layeris located between the foamed layer and the first substrate layer.

1324 It should be noted that, the foamed layermay be a closed-cell foam, a semi-closed-cell foam, or a foamed material. The closed-cell foam, the semi-closed-cell foam, or the foamed material has excellent resilience and retention. For example, the foamed material may be a composite material formed of polytetrafluoroethylene (Polytetrafluoroethylene, PTFE), polyurethane (PU), or a copolymer of polytetrafluoroethylene and fluorinated ethylene propylene (Fluorinated ethylene propylene, FEP). Polytetrafluoroethylene has excellent chemical stability, corrosion resistance, sealing performance, high lubrication and non-stickiness, electrical insulation, and good aging resistance. Polyurethane is a thermoplastic linear structure with good stability, chemical resistance, resilience and mechanical properties, and has less compression deformation. The copolymer of polytetrafluoroethylene and fluorinated ethylene propylene has good processability of thermoplastics.

132 132 The thickness of the insulating layermay be in a range of 0.04 mm to 0.1 mm. For example, the thickness of the insulating layermay be 0.05 mm, 0.06 mm, or 0.07 mm. It should be noted herein that the numerical value and the numerical range involved in this application are approximate values, and an error within a certain range may exist due to impact of the manufacturing process. The error may be considered negligible by a person skilled in the art.

131 131 In this embodiment of this application, the thickness of the first substrate layermay be in a range of 0.012 mm to 0.025 mm. For example, the thickness of the first substrate layermay be 0.015 mm, 0.018 mm, or 0.021 mm. It should be noted herein that the numerical value and the numerical range involved in this application are approximate values, and an error within a certain range may exist due to impact of the manufacturing process. The error may be considered negligible by a person skilled in the art.

15 FIG. 16 FIG. 1211 121 1211 10 In addition, in a possible implementation, as shown inand, a plurality of notchesmay be arranged on the first signal line, and the plurality of notchesare arranged at intervals in a bending direction perpendicular to the first transmission assembly.

17 FIG. 18 FIG. 4 FIG. 100 20 20 10 20 210 200 10 23 10 23 100 Referring toand, the transmission assemblymay further include a second transmission assembly. The second transmission assemblyis connected to the first transmission assembly, and the second transmission assemblyis configured for use in a non-bending area of the foldable electronic device (that is, an area outside the bending areaof the foldable screen phonein). It should be noted that, at least part of the first transmission assemblycovers the rotating shaft assembly. Since the first transmission assemblyhas bending resistance, when the first transmission assembly is configured for use in a corresponding area of the rotating shaft assemblythat needs to be bent, the use reliability of the transmission assemblycan be ensured.

20 201 202 201 202 2021 203 201 202 201 11 202 12 203 131 Specifically, the second transmission assemblymay include at least two first ground layersand a second transmission layerlocated between the two first ground layers. The second transmission layermay include a second signal line. A second substrate layeris further arranged between the first ground layerand the second transmission layer. The first ground layeris connected to the first conductive layer, the second transmission layeris connected to the first transmission layer, and the second substrate layeris connected to the first substrate layer.

20 100 100 10 100 10 100 210 When the second transmission assemblyin the transmission assemblyis configured for use in the non-bending area in the foldable electronic device, structural strength and stability of the transmission assemblycorresponding to the non-bending area can be ensured. When the first transmission assemblyin the transmission assemblyis configured for use in the bending area of the foldable electronic device, the conductive fabric is arranged in the first transmission assemblyas the ground layer, which can ensure the bending resistance and reliability of the transmission assemblycorresponding to the bending area.

202 12 203 131 10 20 In a possible implementation, the second transmission layerand the first transmission layermay be integrally arranged, and the second substrate layerand the first substrate layermay be integrally arranged. In this way, reliability of signal transmission between the first transmission assemblyand the second transmission assemblycan be ensured.

20 204 204 202 203 204 17 FIG. In addition, in an optional implementation, the second transmission assemblymay further include a first bonding layer(refer to). The first bonding layeris located between the second transmission layerand the second substrate layer, and the first bonding layermay be a low-loss adhesive or the like. This is not limited in this embodiment of this application.

17 FIG. 20 205 205 201 203 205 Still referring to, the second transmission assemblymay further include a first cover layer. The first cover layeris located on a side of the first ground layeraway from the second substrate layer. The first cover layermay be a cover film made of ink, or the like. This is not limited in this embodiment of this application.

11 201 203 11 10 201 20 10 20 205 201 20 11 11 201 18 FIG. It is easy to understand that the first conductive layermay be connected to the side of the first ground layerfacing away from the second substrate layer. The first conductive layerof the first transmission assemblyis connected to the first ground layerof the second transmission assembly, which can ensure the performance of signal transmission between the first transmission assemblyand the second transmission assembly. Specifically, referring to, a part of the first cover layerattached to the first ground layerin the second transmission assemblymay be removed (for example, by using a process such as etching), and an end of the first conductive layermay be arranged at the position, so as to realize the electrical connection between the first conductive layerand the first ground layer.

11 201 11 201 11 201 10 20 2 2 2 2 In a possible implementation, a connection area between the first conductive layerand the first ground layeris greater than or equal to 20 mm. For example, the connection area between the first conductive layerand the first ground layermay be 20 mm, 25 mm, or 30 mm. Increasing the connection area between the first conductive layerand the first ground layercan further ensure the reliability of the signal transmission between the first transmission assemblyand the second transmission assembly, and can avoid the problem of stray radiation.

19 FIG. 19 FIG. 202 2022 2022 2021 12 2021 2022 2022 2021 In this embodiment of this application, referring to, the second transmission layermay further include at least one fourth ground wire. The at least one fourth ground wireis arranged on each of two sides of each of the second signal lines. Specifically, in, the first transmission layerincludes a second signal lineand two fourth ground wires, and the fourth ground wireslocated on two sides of the second signal linecan play a role in shielding external interference signals.

202 2021 2022 2022 2021 2022 202 2021 2022 202 Alternatively, the second transmission layermay include two second signal linesand three fourth ground wires. The fourth ground wirelocated between two adjacent second signal lines(that is, the fourth ground wirelocated in the middle of the second transmission layer) can play a role of isolation to avoid mutual interference between two adjacent second signal lines. The two fourth ground wireslocated at two outermost sides of the second transmission layercan play a role in shielding external interference signals.

202 2021 2022 2022 2021 2022 2021 Alternatively, in some other embodiments, the second transmission layermay include two second signal linesand a fourth ground wire. The fourth ground wireis located between the two second signal lines, and the fourth ground wirecan play a role of isolation to avoid mutual interference between the two second signal lines.

2022 2021 2021 2021 In addition, it may be understood that in a possible implementation, the fourth ground wiremay not be arranged between two adjacent second signal lines, so that a distance between two adjacent second signal linesis increased, and it can be ensured that an isolation degree between two adjacent second signal linesis greater than 20 dB.

2021 2022 2021 11 2021 2022 2021 2021 2022 It should be noted that, a distance between the second signal lineand the fourth ground wiremay be greater than a distance between the second signal lineand the first conductive layer. In this way, it can be ensured that the second signal lineis still a control impedance of a stripline structure, and the fourth ground wireson left and right sides only play the role of shielding interference, without affecting the impedance of the second signal line. If the distance between the second signal lineand the fourth ground wireis excessively small, a coplanar waveguide may be changed.

20 FIG. 21 FIG. 22 FIG. 23 FIG. 21 FIG. 23 FIG. 22 FIG. 20 FIG. 10 12 12 123 124 131 200 10 10 12 13 12 11 13 12 200 10 10 10 It should be noted that, as shown in, the first transmission assemblymay only include the first transmission layer(the first transmission layerincludes the signal lineon a same layer and the ground wireon a same layer spaced apart from each other) and the first substrate layer, so that the radiation performance diagram of the antenna in the foldable screen mobile phonewith the first transmission assemblyis shown in. As shown in, the first transmission assemblyincludes the first transmission layerand dielectric layerslocated on two sides of the first transmission layer. A first conductive layeris further arranged on a side of the two dielectric layersfacing away from the first transmission layer, so that the radiation performance diagram of the antenna in the foldable screen mobile phonewith the first transmission assemblyis shown in. By comparingwith, it may be learned that the interference protection effect of the first transmission assemblyinis obviously better than the interference protection effect of the first transmission assemblyin.

10 In addition, in this embodiment of this application, the manner of adjusting the impedance of the first transmission assemblyincludes, but is not limited to, the following three possible implementations.

13 11 10 20 A possible implementation is as follows. A thickness of the dielectric layermay be set such that a first distributed capacitance is formed between the first conductive layerand the first signal layer, and the first distributed capacitance causes an impedance of the first transmission assemblyto match an impedance of the second transmission assembly.

11 13 10 10 13 11 10 20 It may be understood that a distributed capacitance is formed between the first conductive layerand the first signal layer. Increasing the thickness of the dielectric layercan increase the distributed capacitance, and the impedance of the first transmission assemblyis related to the distributed capacitance. Increasing the distributed capacitance can reduce the impedance of the first transmission assembly. In this way, when the thickness of the dielectric layerreaches a preset value, the first distributed capacitance is formed between the first conductive layerand the first signal layer, and the first distributed capacitance can cause the impedance of the first transmission assemblyto match the impedance of the second transmission assembly.

20 13 13 11 10 For example, when the impedance of the second transmission assemblyis 50Ω (ohms), the thickness of each dielectric layeris set to 0.107 mm, a thickness of the first signal layer is 12 μm, and a dielectric constant c of the dielectric layeris 2.9, and when a transmission frequency is 2000 MHz, the first distributed capacitance is formed between the first conductive layerand the first signal layer, and the first distributed capacitance can cause the impedance of the first transmission assemblyto be 50Ω.

111 11 11 10 20 Another possible implementation is as follows. A weaving density of the first conductive fabricof the first conductive layeris set such that a second distributed capacitance is formed between the first conductive layerand the first signal layer, and the second distributed capacitance causes an impedance of the first transmission assemblyto match an impedance of the second transmission assembly.

11 111 11 10 10 111 11 11 10 20 A distributed capacitance is formed between the first conductive layerand the first signal layer. Increasing the weaving density of the first conductive fabricof the first conductive layercan increase the distributed capacitance, and the impedance of the first transmission assemblyis related to the distributed capacitance. Increasing the distributed capacitance can reduce the impedance of the first transmission assembly. In this way, when the weaving density of the first conductive fabricof the first conductive layerreaches a preset value, the second distributed capacitance is formed between the first conductive layerand the first signal layer, and the second distributed capacitance can cause the impedance of the first transmission assemblyto match the impedance of the second transmission assembly.

13 11 10 20 Still another possible implementation is as follows. The dielectric constant of the dielectric layeris set such that a third distributed capacitance is formed between the first conductive layerand the first signal layer, and the third distributed capacitance causes an impedance of the first transmission assemblyto match an impedance of the second transmission assembly.

11 13 10 10 13 11 10 20 A distributed capacitance is formed between the first conductive layerand the first signal layer. Decreasing the dielectric constant of the dielectric layercan increase the distributed capacitance, and the impedance of the first transmission assemblyis related to the distributed capacitance. Increasing the distributed capacitance can reduce the impedance of the first transmission assembly. In this way, when the dielectric constant of the dielectric layerreaches a preset value, the third distributed capacitance is formed between the first conductive layerand the first signal layer, and the third distributed capacitance can cause the impedance of the first transmission assemblyto match the impedance of the second transmission assembly.

20 13 13 201 10 For example, when the impedance of the second transmission assemblyis 50Ω, the dielectric constant of the dielectric layeris set to 2, a thickness of each dielectric layeris set to 0.039 mm, and a thickness of the first signal layer is 12 μm, and when a transmission frequency is 2000 MHz, the third distributed capacitance is formed between the first ground layerand the first signal layer, and the third distributed capacitance causes the impedance of the first transmission assemblyto be 50Ω.

10 20 100 10 20 100 It should be noted that, if the impedance of the first transmission assemblydoes not match the impedance of the second transmission assembly, transmission performance of the transmission assemblymay be poor. Therefore, in this embodiment of this application, the impedance of the first transmission assemblyis caused to match the impedance of the second transmission assembly, so that the signal transmission performance of the transmission assemblycan be ensured.

24 FIG. 25 FIG. 100 100 200 100 10 10 210 10 301 302 303 301 302 302 3021 3022 3021 3022 303 301 301 3011 Referring to, an embodiment of this application further provides a transmission assembly. The transmission assemblyis configured for use in a foldable electronic device (for example, a foldable screen mobile phone). Specifically, as shown in, the transmission assemblyincludes a first transmission assembly. The first transmission assemblyis configured for use in a bending areaof the foldable electronic device. The first transmission assemblyincludes at least a second conductive layer, a third transmission layer, and a third substrate layerlocated between the second conductive layerand the third transmission layer. The third transmission layerincludes a third signal lineand a second ground wirelocated on two sides of the third signal line, and the second ground wireextends through the third substrate layerand is connected to the second conductive layer. The second conductive layerincludes a second conductive fabric.

25 FIG. 301 3012 3012 3011 303 3012 3011 303 Still referring to, the second conductive layermay further include a second conductive adhesive layer. The second conductive adhesive layeris located between the second conductive fabricand the third substrate layer, and the second conductive adhesive layeris configured to bond the second conductive fabricto the third substrate layer.

3011 3012 3011 3012 301 In an optional implementation, the second conductive fabricand the second conductive adhesive layermay be integrally formed. The integral formation of the second conductive fabricand the second conductive adhesive layercan ensure the reliability of the second conductive layer.

3011 3011 3011 In some embodiments, the second conductive fabricmay include a second base layer and a conductive material arranged on the second base layer. The tensile strength of the second base layer is greater than 700 Mpa. In this way, the second base layer with the tensile strength greater than 700 Mpa can ensure the tensile performance of the second conductive fabric, and the conductive material arranged on the second base layer can ensure the conductivity of the second conductive fabric.

For example, the second base layer may be made of a polyester fiber. The polyester fiber is a synthetic fiber obtained by spinning polyester obtained by polycondensation of organic dibasic acid and dibasic alcohol, which has excellent wrinkle resistance and shape retention, and high strength and elastic restorability, and is durable.

301 301 In this embodiment of this application, a thickness of the second conductive layermay be in a range of 0.03 mm to 0.05 mm. For example, the thickness of the second conductive layermay be 0.035 mm, 0.04 mm, or 0.045 mm. It should be noted herein that the numerical value and the numerical range involved in this application are approximate values, and an error within a certain range may exist due to impact of the manufacturing process. The error may be considered negligible by a person skilled in the art.

301 10 10 100 100 By arranging the second conductive layeras the second conductive fabric, the second conductive fabric has good tensile performance during bending of the first transmission assembly, which can improve bending resistance of the first transmission assembly, thereby enhancing reliability of the transmission assemblywhen the transmission assembly is used in a foldable screen device, and meeting performance requirements for transmission assembliesrequired in foldable screen devices.

100 20 20 10 20 20 401 402 403 401 402 401 301 402 302 403 303 26 FIG. 27 FIG. In a possible implementation, the transmission assemblyfurther includes a second transmission assembly. The second transmission assemblyis connected to the first transmission assembly, and the second transmission assemblyis configured for use in a non-bending area of the foldable electronic device. Referring toor, the second transmission assemblyincludes at least a second ground layer, a fourth transmission layer, and a fourth substrate layerlocated between the second ground layerand the fourth transmission layer. The second ground layeris connected to the second conductive layer, the fourth transmission layeris connected to the third transmission layer, and the fourth substrate layeris connected to the third substrate layer.

20 100 100 10 100 210 301 10 100 When the second transmission assemblyin the transmission assemblyis configured for use in the non-bending area in the foldable electronic device, structural strength and stability of the transmission assemblycorresponding to the non-bending area can be ensured. When the first transmission assemblyin the transmission assemblyis configured for use in the bending areaof the foldable electronic device, the second conductive layerin the first transmission assemblyis a conductive fabric, which can ensure the bending resistance and reliability of the transmission assemblycorresponding to the bending area.

402 302 403 303 10 20 In a possible implementation, the fourth transmission layerand the third transmission layerare integrally arranged, and the fourth substrate layerand the third substrate layerare integrally arranged. In this way, reliability of signal transmission between the first transmission assemblyand the second transmission assemblycan be ensured.

20 404 405 402 403 405 405 402 404 20 In a possible implementation, the second transmission assemblyfurther includes a third ground layerand a fifth substrate layer. The fourth transmission layeris located between the fourth substrate layerand the fifth substrate layer, and the fifth substrate layeris located between the fourth transmission layerand the third ground layer. In this way, the structural strength and the stability of the second transmission assemblycorresponding to the non-bending area can be further improved.

20 50 50 401 403 404 405 50 26 FIG. 27 FIG. In addition, in an optional implementation, the second transmission assemblymay further include a second cover layer(refer toor). The second cover layeris located on a side of the second ground layeraway from the fourth substrate layerand a side of the third ground layeraway from the fifth substrate layer. The second cover layermay be a cover film made of ink, or the like. This is not limited in this embodiment of this application.

20 60 60 402 405 60 26 FIG. 27 FIG. The second transmission assemblymay further include a second bonding layer(refer toor). The second bonding layeris located between the fourth transmission layerand the fifth substrate layer, and the second bonding layermay be a low-loss adhesive or the like. This is not limited in this embodiment of this application.

402 4021 4022 4021 It is easy to understand that the fourth transmission layerincludes fourth signal linesarranged at intervals and third ground wireslocated on two sides of each of the fourth signal lines.

In the descriptions of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and defined, the terms “mount”, “connected”, and “connection” should be understood in a broad sense. For example, the connection may be a fixed connection, an indirect connection through an intermediary, internal communication inside two elements, or an interaction relationship between two elements. A person of ordinary skill in the art can understand specific meanings of the foregoing terms in the embodiments of this application according to a specific situation.

The apparatus or element indicated or implied in the embodiments of this application is required to have a specific orientation, be constructed and operate in the specific orientation, and therefore should not be construed as a limitation on the embodiments of this application. In the description of the embodiments of this application, unless otherwise specifically limited, “a plurality of” means two or more.

The terms such as “first”, “second”, “third”, and “fourth” (if any) in the specification and claims of the embodiments of this application and in the accompanying drawings are used for distinguishing between similar objects and not necessarily used for describing any particular order or sequence. It is to be understood that data used in this way is exchangeable in a proper case, so that the embodiments of this application described herein can be implemented in an order different from the order shown or described herein. Moreover, the terms “may include”, “have”, and any of their variants are intended to cover non-exclusive inclusions. For example, a process, a method, a system, a product, or a device that includes a list of steps or units is not necessarily limited to those expressly listed steps or units, but may include other steps or units not expressly listed or inherent to such a process, method, product, or device.

Finally, it should be noted that: the foregoing embodiments are merely intended for describing other than limiting the technical solutions of the embodiments of this application. Although the embodiments of this application are described in detail with reference to the foregoing embodiments, a person of ordinary skill in the art should understand that modifications may be made to the technical solutions described in the foregoing embodiments, or equivalent replacements may be made to some or all technical features in the technical solutions, as long as such modifications or replacements do not cause the essence of corresponding technical solutions to depart from the scope of the technical solutions of the embodiments of this application.