Optical transceiver

This Patent Applications claims priority to U.S. Patent Application No. 63/449,082, filed on Mar. 1, 2023, and entitled “HYBRID OPTICAL MODULE.” The disclosure of the prior Application is considered part of and is incorporated by reference into this Patent Application.

The present disclosure relates generally to an optical transceiver, and to an optical transceiver with reduced power consumption.

An optical transceiver is a hardware device that can transmit and receive data. An optical transceiver includes transmitter components to convert electrical signals into light and receiver components to convert light into electrical signals.

In some implementations, an optical transceiver includes a printed circuit board (PCB) with an edge; one or more first components associated with a transmitter functionality of the optical transceiver, the one or more first components including a linear driver component and a processing component; one or more second components associated with a receiver functionality of the optical transceiver, the one or more second components including a linear transimpedance amplifier (TIA) component; electrical contacts arranged at the edge of the PCB; first electrical traces, connected between the one or more first components and the electrical contacts; and second electrical traces, connected between the one or more second components and the electrical contacts, wherein the one or more first components are closer to the electrical contacts than the one or more second components.

In some implementations, an optical transceiver includes a PCB with an edge, a first surface and a second surface, the first surface opposite the second surface; electrical contacts arranged on the first surface and the second surface at the edge of the PCB; a light emission component associated with a transmitter functionality of the optical transceiver; a linear driver component associated with the transmitter functionality of the optical transceiver; a processing component associated with the transmitter functionality of the optical transceiver, the processing component disposed on the first surface of the PCB; a light reception component associated with a receiver functionality of the optical transceiver, the light reception component disposed on the second surface of the PCB; a linear TIA component associated with the receiver functionality of the optical transceiver, the linear TIA disposed on the second surface of the PCB; first electrical traces routed on the first surface of the PCB and connecting the processing component and the electrical contacts; and second electrical traces routed on the second surface of the PCB and connecting the linear TIA component and the electrical contacts, wherein: the receiver functionality of the optical transceiver is not associated with the processing component.

In some implementations, an optical transceiver includes a PCB with an edge; a light emission component associated with a transmitter functionality of the optical transceiver; an integrated component associated with the transmitter functionality of the optical transceiver that includes a linear driver component and a processing component; a light reception component associated with a receiver functionality of the optical transceiver; a linear TIA component associated with the receiver functionality of the optical transceiver; and electrical contacts arranged at the edge of the PCB, wherein: the integrated component and the linear TIA component are disposed on a surface of the PCB in a side-by-side configuration along a width of the surface of the PCB, and the receiver functionality of the optical transceiver is not associated with the processing component.

The following detailed description of example implementations refers to the accompanying drawings. The same reference numbers in different drawings may identify the same or similar elements.

An optical transceiver can include processing component, such as a digital signal processor (DSP) or a clock data recovery circuit (CDR), to process electrical signals (e.g., electrical signals that are to be converted to optical signals as part of a transmitter functionality of the optical transceiver, and electrical signals converted from received optical signals as part of a receiver functionality of the optical transceiver). Further, a linear driver is needed to amplify processed electrical signals associated with the transmitter functionality of the optical transceiver, and a TIA is needed to amplify electrical signals associated with the electrical signals associated with the receiver functionality of the optical transceiver. In this way, the optical transceiver ensures consistent communications to and from the optical transceiver. However, utilizing all of these components (e.g., the processing component, the linear driver, and the linear TIA) results in significant power consumption by the optical transceiver.

Some implementations described herein include an optical transceiver that has a reduced power consumption (e.g., as compared to a typical optical transceiver described above). The optical transceiver includes a linear TIA component to enable a receiver functionality of the optical transceiver, but, notably, the optical transceiver does not include a processing component that is associated with the TIA component or with the receive functionality of the optical transceiver. That is, electrical signals associated with the receiver functionality of the optical transceiver are handled by the linear TIA component and not by a DSP or CDR. Accordingly, by not using a processing component associated with the receiver functionality of the optical transceiver, a power consumption of the optical transceiver is reduced. The power consumption of a processing component associated with the transmit functionality and disassociated from the receive functionality can be lower than the complexity of a processing component associated with both the transmit and receive functionality of the same optical transceiver. This is also true for the complexity of such processing components.

Additionally, in some implementations, the optical transceiver may include an integrated component that includes a processing component and a linear driver component to enable a transmitter functionality of the optical transceiver. That is, electrical signals associated with the transmitter functionality of the optical transceiver are handled by the integrated component (as compared to a separate processing component and a separate linear driver component). In this way, the processing component of the integrated component and the power consumption of the integrated component are only associated with the transmitter functionality of the optical transceiver, and therefore an overall power consumption of the optical transceiver is reduced.

Alternatively, in some implementations, the optical transceiver may include a separate processing component and a separate linear driver component to enable the transmitter functionality of the optical transceiver. That is, the electrical signals associated with the transmitter functionality of the optical transceiver are handled by the processing component and the linear driver component while the electrical signals associated with the receiver functionality are not associated with a processing component. In this way, the processing component and its power consumption are only associated with the transmitter functionality of the optical transceiver, and therefore an overall power consumption of the optical transceiver is reduced.

Further, in some implementations, the integrated component, or the processing component (e.g., when no integrated component is present), may be positioned on a PCB of the optical transceiver such as to be closer to electrical contacts of the PCB than the linear TIA component. Accordingly, first electrical traces between the electrical contacts and the integrated component (or the processing component) may be shorter than second electrical traces between the electrical contacts and the linear TIA component, where both the first electrical traces and the second electrical have termination points that connect to the electrical contacts at similar distances from an edge of the PCB. Due to the relative shortness of the first electrical traces, the first electrical traces are less susceptible to channel loss (e.g., electrical signals that propagate via the first electrical traces are less likely to experience attenuation, noise, crosstalk, distortion, and/or other issues) than the second electrical traces.

In this way, the optical transceiver maintains a consistency (e.g., a link bit error rate (BER) consistency) of electrical signals associated with the transmitter functionality of the optical transceiver. This, in turn, allows the optical transceiver to be used with another device, such as a switch with an application specific integrated circuit (ASIC) that is not configured to compensate for transmitter channel loss, where a consistency of transmitter electrical signals is desired (and a relative inconsistency of receiver electrical signals is acceptable).

Accordingly, in at least some cases, the optical transceiver described herein is preferred over a higher power-consuming optical transceiver.

1 1 FIGS.A-C 1 1 FIGS.A-C 1 FIG.A 1 FIG.B 1 FIG.C 100 100 102 102 102 102 104 102 are diagrams of an example implementationdescribed herein. As shown in, the example implementationmay include an optical transceiver. The optical transceivermay support a particular data rate, such as a data rate of at least 100 gigabits per second.shows a schematic view of the optical transceiver,shows a top-down view of a surface of the optical transceiver, andshows an exploded view of an optical assemblythat includes the optical transceiver.

1 1 FIGS.A-C 102 106 108 109 106 110 102 112 102 114 106 116 110 118 120 120 112 122 124 As shown in, the optical transceivermay include a PCB, which may have electrical contactsarranged at an edgeof the PCB; one or more first componentsassociated with a transmitter functionality of the optical transceiver; one or more second componentsassociated with a receiver functionality of the optical transceiver; a plurality of electrical traces(e.g., that are routed on and/or through one or more surfaces of the PCB); and a lens array component. The one or more first componentsmay include, for example, a light emission componentand an integrated componentthat includes a linear driver component and a processing component (e.g., the linear driver component and the processing component are formed together into a single component, the integrated component). The one or more second componentsmay include a light reception componentand a linear TIA component.

106 102 106 106 109 108 108 102 102 1 1 FIGS.A-B The PCBmay be configured to facilitate mounting and interconnecting components of the optical transceiver. The PCBmay comprise a non-conductive material, such as a fiber-reinforced plastic material (e.g., a fiberglass-reinforced epoxy resin (FR-4)). The PCBmay include the edge(e.g., shown as a left edge in), upon which the electrical contactsmay be arranged (e.g., for electrically connecting with one or more external components, such as of another device). The electrical contactsmay include one or more contacts or pads (e.g., plated with a metal, such as gold) that are arranged in a particular configuration to enable the optical transceiverto connect to another device and to facilitate transmission of electrical signals in and out of the optical transceiver.

118 110 102 102 102 118 120 110 118 120 118 120 120 118 118 120 108 106 118 120 120 118 120 102 The light emission component, of the one or more first components, may be configured to generate light (e.g., an optical signal) for the optical transceiver(e.g., light that is to be emitted by the optical transceiveras part of a transmitter functionality of the optical transceiver). The light emission componentmay be, for example, a light-emitting diode (LED), a laser diode (e.g., a vertical-cavity surface-emitting laser (VCSEL)), or another type of light emission component. The integrated component, of the one or more first components, may be configured to control the light emission component. For example, the linear driver component of the integrated componentmay be configured to drive the light emission component. As a specific example, the linear driver component of the integrated componentmay amplify electrical signals that are provided by the processing component of the integrated componentto the light emission component, such as to ensure that optimal light (e.g., in terms of power and signal quality) is generated by the light emission component. Further, the processing component of the integrated componentmay be configured to correct digital data encoded in the electrical signals (e.g., that are provided by another device via the electrical contactsof the PCB) and to provide the electrical signals to the light emission component(e.g., via the linear driver component of the integrated component). The processing component of the integrated componentmay include, for example, a DSP and/or a CDR, and may use one or more modulation techniques and/or error correction techniques to correct the digital data encoded in the electrical signals. Together, the light emission componentand the integrated componentenable the transmitter functionality of the optical transceiver.

122 112 122 124 122 124 108 106 102 The light reception component, of the one or more second components, may be configured to convert incoming light (e.g., an incoming optical signal) into an electrical signal (e.g., an electrical representation of the incoming light). The light reception componentmay include, for example, a photodiode, a photodetector, or another type of light reception component. The linear TIA componentmay amplify the electrical signal generated by the light reception component(e.g., by increasing a voltage of the electrical signal). The linear TIA componentmay provide the electrical signal (e.g., to another device via the electrical contactsof the PCB) as part of the receiver functionality of the optical transceiver.

112 102 120 124 102 124 102 102 Notably, the one or more second componentsassociated with the receiver functionality of the optical transceiverare disassociated from any processing component. For example, no processing component (e.g., not the integrated componentthat includes the processing component and not any other processing component, such as a DSP or a CDR) is associated with the linear TIA component. That is, electrical signals associated with the receiver functionality of the optical transceiverare handled by the linear TIA componentand not by a processing component. Accordingly, by not using a processing component associated with the receiver functionality of the optical transceiver, a power consumption of the optical transceiveris reduced.

116 102 116 118 102 122 102 116 102 The lens array componentmay be configured to control transmission and/or reception of light (e.g., optical signals) by the optical transceiver. The lens array componentmay include, for example, one or more lenses (e.g., that comprise glass, plastic, or another material) in a particular arrangement, and may be configured to facilitate aligning and directing of emitted light (e.g., an emitted optical signal) generated by the light emission component(e.g., in association with the transmitter functionality of the optical transceiver) and/or to facilitate aligning and/or coupling of incoming light (e.g., an incoming optical signal) into the light reception component(e.g., in association with the receiver functionality of the optical transceiver). The lens array componentmay also be configured to cover (e.g., to serve as a protective case) one or more other components of the optical transceiver, as further described herein.

1 1 FIGS.A-C 1 1 FIGS.A-C 118 120 122 124 106 116 106 118 120 122 124 118 120 122 124 116 As shown in, the light emission component, the integrated component, the light reception component, and the linear TIA componentmay be disposed on a surface (e.g., the same surface) of the PCB. In some implementations, the lens array componentmay also be disposed on the surface of the PCB, and may cover at least one of the light emission component, the integrated component, the light reception component, and the linear TIA component. For example, as shown in, the light emission component, the integrated component, the light reception component, and the linear TIA componentmay be covered by the lens array component.

1 1 FIGS.A-C 1 FIG.B 1 FIG.B 118 122 106 106 106 118 122 120 124 106 106 106 120 124 As further shown in, the light emission componentand the light reception componentmay be disposed on the surface of the PCBin a “side-by-side” configuration (e.g., along a width of the surface of the PCB). For example, as a visual aid to understanding the side-by-side configuration, as shown in, a reference line A (e.g., an imaginary line that is parallel to a “width” rectilinear axis of the PCB) may extend through the light emission componentand the light reception component. Additionally, or alternatively, the integrated componentand the linear TIA componentmay be disposed on the surface of the PCBin a side-by-side configuration (e.g., along a width of the surface of the PCB). For example, as a visual aid to understanding the side-by-side configuration, as shown in, a reference line B (e.g., an imaginary line that is parallel to the width rectilinear axis of the PCB) may extend through the integrated componentand the linear TIA component.

114 106 214 106 114 1 114 110 108 108 106 114 1 114 1 120 108 108 106 114 1 106 120 120 108 106 108 106 120 114 1 102 1 1 FIGS.A-B The plurality of electrical tracesmay interconnect components of the PCB, and each electrical tracemay run along one or more surfaces and/or within or between layers of the PCB. In some implementations, a first set of one or more electrical traces-, of the plurality of electrical traces, may connect (e.g., connect between) the one or more first componentsand the electrical contacts(e.g., a first portion of the electrical contacts) of the PCB. For example, the first set of one or more electrical traces-(e.g., as shown inby a representative example of the first set of one or more electrical traces-) may connect (e.g., directly connect, such as without running through any other component) the integrated componentand the electrical contacts(e.g., the first portion of the electrical contacts) of the PCB. Further, the first set of one or more electrical traces-may be routed on the surface of the PCB(e.g., on which the integrated componentis disposed) between the integrated componentand the electrical contactsof the PCB. In this way, electrical signals may be provided (e.g., by another device) from the electrical contactsof the PCBto the integrated componentvia the first set of one or more electrical traces-, such as to enable the transmitter functionality of the optical transceiver.

114 2 114 112 108 108 106 114 2 114 2 124 108 108 106 114 2 106 124 124 108 106 124 114 2 108 106 102 1 1 FIGS.A-B In some implementations, a second set of one or more electrical traces-, of the plurality of electrical traces, may connect between the one or more second componentsand the electrical contacts(e.g., a second portion of the electrical contacts) of the PCB. For example, the second set of one or more electrical traces-(e.g., as shown inby a representative example of the second set of one or more electrical traces-) may connect (e.g., directly connect, such as without running through any other component) the linear TIA componentand the electrical contacts(e.g., the second portion of the electrical contacts) of the PCB. Further, the second set of one or more electrical traces-may be routed on the surface of the PCB(e.g., on which the linear TIA componentis disposed) between the linear TIA componentand the electrical contactsof the PCB. In this way, the linear TIA componentmay provide an electrical signal (e.g., to another device) via the second set of one or more electrical traces-and the electrical contactsof the PCB, such as to enable the receiver functionality of the optical transceiver.

120 120 106 120 108 106 109 106 106 120 108 108 120 106 106 124 108 108 124 106 1 FIG.B In some implementations, the integrated component(e.g., because the integrated componentincludes a linear driver component and a processing component) may have a footprint (e.g., on the surface of the PCB) such that a side of the integrated componentis closer to the electrical contactsof the PCB(e.g., that are arranged at the edgeof the PCB). For example, as shown in, a distance C (e.g., along a “length” rectilinear axis of the PCB) from the integrated componentto the electrical contacts(e.g., a first particular electrical contactthat is closest to the integrated component) of the PCBmay be less than a distance D (e.g., along the length rectilinear axis of the PCB) from the linear TIA componentto the electrical contacts(e.g., a second particular electrical contactthat is closest to the linear TIA component) of the PCB.

110 108 112 110 110 120 110 108 108 112 112 124 112 108 Accordingly, in some implementations, the one or more first componentsmay be closer to the electrical contactsthan the one or more second components. That is, a particular first componentof the one or more first components(e.g., the integrated component) that is closest, of the one or more first components, to the electrical contactsmay be closer to the electrical contactsthan a particular second componentof the one or more second components(e.g., the linear TIA component) that is closest, of the one or more second components, to the electrical contacts.

114 1 108 114 1 109 106 114 2 108 114 2 109 106 114 1 114 2 114 1 108 114 1 109 106 114 2 108 114 2 109 106 114 1 114 2 1 FIG.B 1 FIG.B Moreover, an electrical trace, of the first set of one or more electrical traces-, with a termination point that connects to the electrical contactsand that is closest to (e.g., as compared to termination points of other electrical traces of the first set of one or more electrical traces-) the edgeof the PCBmay be shorter than an electrical trace, of the second set of one or more electrical traces-, with a termination point that connects to the electrical contactsand that is closest to (e.g., as compared to termination points of other electrical traces of the second set of one or more electrical traces-) the edgeof the PCB. For example, as shown in, the top electrical trace of the first set of one or more electrical traces-may be shorter than the top electrical trace of the second set of one or more electrical traces-. Additionally, or alternatively, an electrical trace, of the first set of one or more electrical traces-, with a termination point that connects to the electrical contactsand that is farthest from (e.g., as compared to termination points of other electrical traces of the first set of one or more electrical traces-) the edgeof the PCBmay be shorter than an electrical trace, of the second set of one or more electrical traces-, with a termination point that connects to the electrical contactsand that is farthest from (e.g., as compared to termination points of other electrical traces of the second set of one or more electrical traces-) the edgeof the PCB. For example, as shown in, the bottom electrical trace of the first set of one or more electrical traces-may be shorter than the bottom electrical trace of the second set of one or more electrical traces-.

114 1 114 1 114 1 114 2 In this way, due to the shortness of the first set of one or more electrical traces-, the first set of one or more electrical traces-may be less susceptible to channel loss (e.g., electrical signals that propagate via the first set of one or more electrical traces-may be less likely to experience attenuation, noise, crosstalk, distortion, and/or other issues) than the second set of one or more electrical traces-.

1 FIG.C 102 104 104 126 128 130 132 134 As shown in, the optical transceivermay be included in the optical assembly. The optical assemblymay further include a bottom housing component, a top housing component, a manual interaction component, a multiple fiber push-on/pull-off (MPO) housing, and MPO connectors.

102 126 128 126 128 108 106 102 130 130 102 102 108 106 102 The optical transceivermay be enclosed by the bottom housing componentand the top housing component. An opening (e.g., a window) may be formed by the bottom housing componentand the top housing componentto allow the electrical contactsof the PCBof the optical transceiverto connect to another device. The manual interaction componentmay be a handle, a lever, or another type of manual interaction componentto allow manual manipulation of the optical transceiver, which thereby allows the optical transceiverto connect to, or disconnect from, the other device (e.g., via the electrical contactsof the PCBof the optical transceiver).

134 116 132 134 102 132 102 The MPO connectorsmay connect to the lens array componentand the MPO housing. Accordingly, the MPO connectorsmay be configured to enable transmission of light (e.g., optical signals) to and from the optical transceiver, such as to enable an optical fiber that interfaces with the MPO housing toto communicate with the optical transceiver.

1 1 FIGS.A-C 1 1 FIGS.A-C As indicated above,are provided as an example. Other examples may differ from what is described with regard to.

2 2 FIGS.A-C 2 2 FIGS.A-C 1 1 FIGS.A-C 2 FIG.A 2 FIG.B 2 FIG.C 200 200 202 202 204 104 202 202 202 are diagrams of an example implementationdescribed herein. As shown in, the example implementationmay include an optical transceiver. The optical transceivermay support a particular data rate, such as a data rate of at least 100 gigabits per second. The optical transceiver may be included in an optical assembly(e.g., that is similar to the optical assemblydescribed herein in relation to).shows a schematic view of the optical transceiver,shows a top-down view of a first surface of the optical transceiver, andshows a top-down view of a second surface (e.g., an opposite surface of the first surface) of the optical transceiver.

2 2 FIGS.A-C 1 1 FIGS.A-C 202 206 208 206 209 206 210 202 212 202 214 206 216 As shown in, the optical transceivermay include a PCB, which may have electrical contactsarranged on a first surface and a second surface of the PCBat an edgeof the PCB; one or more first componentsassociated with a transmitter functionality of the optical transceiver; one or more second componentsassociated with a receiver functionality of the optical transceiver; a plurality of electrical traces(e.g., that are routed on and/or through one or more surfaces of the PCB); and a lens array component, which may be configured in a same or similar manner as corresponding components that are described herein in relation to.

210 218 220 222 120 218 118 220 222 120 212 224 226 122 124 1 1 FIGS.A-C 1 1 FIGS.A-C In some implementations, the one or more first componentsmay include, for example, a light emission component, and a linear driver componentand a processing component(e.g., instead of an integrated component). The light emission componentmay be configured in a same or similar manner as the light emission componentdescribed herein in relation to. The linear driver componentand the processing componentmay be configured in a same or similar manner as the linear driver component and the processing component of the integrated component, respectively, which are described herein in relation to, but may be separate, standalone components (e.g., may not be formed into a single component). The one or more second componentsmay include a light reception componentand a linear TIA component, which may be configured in a same or similar manner as the light reception componentand the linear TIA component, described herein.

212 202 222 226 202 226 202 202 Notably, the one or more second componentsassociated with the receiver functionality of the optical transceiverare disassociated from any processing component. For example, no processing component (e.g., not the processing componentand not any other processing component, such as a DSP or a CDR) is associated with the linear TIA component. That is, electrical signals associated with the receiver functionality of the optical transceiverare handled by the linear TIA componentand not by a processing component. Accordingly, by not using a processing component associated with the receiver functionality of the optical transceiver, a power consumption of the optical transceiveris reduced.

2 FIG.B 2 FIG.C 2 2 FIGS.B-C 222 206 222 202 228 202 218 220 224 226 206 218 220 224 226 202 230 202 228 230 228 230 208 206 228 208 206 As shown in, the processing componentmay be disposed on the first surface of the PCB. For example, the processing componentmay be disposed on the first surface of the optical transceiverin association with a first width region(e.g., that extends across the width of the optical transceiver). As shown in, the light emission component, the linear driver component, the light reception component, and the linear TIA componentmay be disposed on the second surface (e.g., the same surface) of the PCB. For example, the light emission component, the linear driver component, the light reception component, and the linear TIA componentmay be disposed on the second surface of the optical transceiverin association with a second width region(e.g., that extends across the width of the optical transceiver). As shown in, the first width regionand the second width regionmay not overlap, and the first width regionmay be between the second width regionand the electrical contactsof the PCB(e.g., the first width regionmay be closer to the electrical contactsof the PCB).

2 FIG.C 2 FIG.C 216 106 218 220 224 226 218 220 224 226 216 As further shown in, the lens array componentmay also be disposed on the second surface of the PCB, and may cover at least one of the light emission component, the linear driver component, the light reception component, and the linear TIA component. For example, as shown in, the light emission component, the linear driver component, the light reception component, and the linear TIA componentmay be covered by the lens array component.

2 FIG.C 218 224 206 206 206 218 224 220 226 206 206 206 220 226 As further shown in, the light emission componentand the light reception componentmay be disposed on the second surface of the PCBin a side-by-side configuration (e.g., along a width of the surface of the PCB). For example, as a visual aid to understanding the side-by-side configuration, a reference line E (e.g., an imaginary line that is parallel to a “width” rectilinear axis of the PCB) may extend through the light emission componentand the light reception component. Additionally, or alternatively, the linear driver componentand the linear TIA componentmay be disposed on the second surface of the PCBin a side-by-side configuration (e.g., along a width of the surface of the PCB). For example, as a visual aid to understanding the side-by-side configuration, a reference line F (e.g., an imaginary line that is parallel to the width rectilinear axis of the PCB) may extend through the linear driver componentand the linear TIA component.

214 106 214 106 214 1 214 210 208 208 206 214 1 214 1 222 208 208 206 214 1 206 222 222 208 206 208 206 222 214 1 202 2 FIG.B The plurality of electrical tracesmay interconnect components of the PCB, and each electrical tracemay run along one or more surfaces and/or within or between layers of the PCB. In some implementations, a first set of one or more electrical traces-, of the plurality of electrical traces, may connect (e.g., connect between) the one or more first componentsand the electrical contacts(e.g., a first portion of the electrical contacts) of the PCB. For example, the first set of one or more electrical traces-(e.g., as shown inby a representative example of the first set of one or more electrical traces-) may connect (e.g., directly connect, such as without running through any other component) the processing componentand the electrical contacts(e.g., the first portion of the electrical contacts) of the PCB. Further, the first set of one or more electrical traces-may be routed on the first surface of the PCB(e.g., on which the processing componentis disposed) between the processing componentand the electrical contactsof the PCB. In this way, electrical signals may be provided (e.g., by another device) from the electrical contactsof the PCBto the processing componentvia the first set of one or more electrical traces-, such as to enable the transmitter functionality of the optical transceiver.

214 2 214 212 208 208 206 214 2 214 2 214 226 208 208 206 214 2 206 226 226 208 206 226 214 2 208 206 202 2 FIG.C In some implementations, a second set of one or more electrical traces-, of the plurality of electrical traces, may connect (e.g., connect between) the one or more second componentsand the electrical contacts(e.g., a second portion of the electrical contacts) of the PCB. For example, the second set of one or more electrical traces-(e.g., as shown inby a representative example of the second set of one or more electrical traces-), of the plurality of electrical traces, may connect (e.g., directly connect, such as without running through any other component) the linear TIA componentand the electrical contacts(e.g., the second portion of the electrical contacts) of the PCB. Further, the second set of one or more electrical traces-may be routed on the second surface of the PCB(e.g., on which the linear TIA componentis disposed) between the linear TIA componentand the electrical contactsof the PCB. In this way, the linear TIA componentmay provide an electrical signal (e.g., to another device) via the second set of one or more electrical traces-and the electrical contactsof the PCB, such as to enable the receiver functionality of the optical transceiver.

222 222 202 228 208 206 209 206 206 222 208 208 222 206 106 226 208 208 226 206 2 2 FIGS.B-C In some implementations, the processing component(e.g., because the processing componentis disposed on the first surface of the optical transceiverin association with the first width region) may be closer to the electrical contactsof the PCB(e.g., that are arranged at the edgeof the PCB). For example, as shown in, a distance G (e.g., along a “length” rectilinear axis of the PCB) from the processing componentto the electrical contacts(e.g., a first particular electrical contactthat is closest to the the processing component) of the PCBmay be less than a distance H (e.g., along the length rectilinear axis of the PCB) from the linear TIA componentto the electrical contacts(e.g., a second particular electrical contactthat is closest to the linear TIA component) of the PCB.

210 208 212 210 210 222 210 208 208 212 212 226 212 208 Accordingly, in some implementations, the one or more first componentsmay be closer to the electrical contactsthan the one or more second components. That is, a particular first componentof the one or more first components(e.g., the processing component) that is closest, of the one or more first components, to the electrical contactsmay be closer to the electrical contactsthan a particular second componentof the one or more second components(e.g., the linear TIA component) that is closest, of the one or more second components, to the electrical contacts.

214 1 208 214 1 209 206 214 2 208 214 2 209 206 214 1 214 2 214 1 208 214 1 209 206 214 2 208 214 2 209 206 214 1 214 2 2 2 FIGS.B-C 2 2 FIGS.B-C Moreover, an electrical trace, of the first set of one or more electrical traces-, with a termination point that connects to the electrical contactsand that is closest to (e.g., as compared to termination points of other electrical traces of the first set of one or more electrical traces-) the edgeof the PCBmay be shorter than an electrical trace, of the second set of one or more electrical traces-, with a termination point that connects to the electrical contactsand that is closest to (e.g., as compared to termination points of other electrical traces of the second set of one or more electrical traces-) the edgeof the PCB. For example, as shown in, the top electrical trace of the first set of one or more electrical traces-may be shorter than the top electrical trace of the second set of one or more electrical traces-. Additionally, or alternatively, an electrical trace, of the first set of one or more electrical traces-, with a termination point that connects to the electrical contactsand that is farthest from (e.g., as compared to termination points of other electrical traces of the first set of one or more electrical traces-) the edgeof the PCBmay be shorter than an electrical trace, of the second set of one or more electrical traces-, with a termination point that connects to the electrical contactsand that is farthest from (e.g., as compared to termination points of other electrical traces of the second set of one or more electrical traces-) the edgeof the PCB. For example, as shown in, the bottom electrical trace of the first set of one or more electrical traces-may be shorter than the bottom electrical trace of the second set of one or more electrical traces-.

214 1 214 1 214 1 214 2 In this way, due to the shortness of the first set of one or more electrical traces-, the first set of one or more electrical traces-may be less susceptible to channel loss (e.g., electrical signals that propagate via the first set of one or more electrical traces-may be less likely to experience attenuation, noise, crosstalk, distortion, and/or other issues) than the second set of one or more electrical traces-.

228 230 208 206 214 2 222 230 208 228 222 106 228 Accordingly, because the first width regionmay be between the second width regionand the electrical contactsof the PCB, at least one electrical trace of the second set of one or more electrical traces-may bypass (e.g., may route around) the processing component. For example, the at least one electrical trace may route from the second width regionto the electrical contactsand may thereby route through the first width region, and may thereby bypass the processing component(e.g., because the processing component is disposed on the first surface of the PCBin association with the first width region).

2 2 FIGS.A-C 2 2 FIGS.A-C As indicated above,are provided as an example. Other examples may differ from what is described with regard to.

The foregoing disclosure provides illustration and description, but is not intended to be exhaustive or to limit the implementations to the precise forms disclosed. Modifications and variations may be made in light of the above disclosure or may be acquired from practice of the implementations. Furthermore, any of the implementations described herein may be combined unless the foregoing disclosure expressly provides a reason that one or more implementations may not be combined.

Even though particular combinations of features are recited in the claims and/or disclosed in the specification, these combinations are not intended to limit the disclosure of various implementations. In fact, many of these features may be combined in ways not specifically recited in the claims and/or disclosed in the specification. Although each dependent claim listed below may directly depend on only one claim, the disclosure of various implementations includes each dependent claim in combination with every other claim in the claim set. As used herein, a phrase referring to “at least one of” a list of items refers to any combination of those items, including single members. As an example, “at least one of: a, b, or c” is intended to cover a, b, c, a-b, a-c, b-c, and a-b-c, as well as any combination with multiple of the same item.

No element, act, or instruction used herein should be construed as critical or essential unless explicitly described as such. Also, as used herein, the articles “a” and “an” are intended to include one or more items, and may be used interchangeably with “one or more.” Further, as used herein, the article “the” is intended to include one or more items referenced in connection with the article “the” and may be used interchangeably with “the one or more.” Furthermore, as used herein, the term “set” is intended to include one or more items (e.g., related items, unrelated items, or a combination of related and unrelated items), and may be used interchangeably with “one or more.” Where only one item is intended, the phrase “only one” or similar language is used. Also, as used herein, the terms “has,” “have,” “having,” or the like are intended to be open-ended terms. Further, the phrase “based on” is intended to mean “based, at least in part, on” unless explicitly stated otherwise. Also, as used herein, the term “or” is intended to be inclusive when used in a series and may be used interchangeably with “and/or,” unless explicitly stated otherwise (e.g., if used in combination with “either” or “only one of”). Further, spatially relative terms, such as “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the apparatus, device, and/or element in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.