Three-Dimensional Heat Transfer Device

This patent application is a continuation patent application of U.S. patent application Ser. No. 17/693,697, filed on Mar. 14, 2022, which claims priority under 35 U.S.C. § 119 (a) on Patent Application No(s). 202111538788.8 filed in China on Dec. 15, 2021, the entire contents of which are hereby incorporated by reference.

The disclosure provides a heat transfer device, more particularly to a three-dimensional heat transfer device.

In order to increase the heat dissipation efficiency to a heat source, a conventional heat dissipation device adopts a thermal conductive plate and heat pipes to transfer heat, and uses a heat dissipation assembly (e.g., a fan and fins) to dissipate heat to outside environment.

The thermal conductive plate is in contact with the heat source. The heat pipes connect the thermal conductive plate with the heat dissipation assembly, and capillary structures inside the heat pipes are thermally coupled to a capillary structure inside the thermal conductive plate. By this configuration, when the thermal conductive plate absorbs heat generated from the heat source, the heat vaporizes a working fluid inside the thermal conductive plate, and the vaporized working fluid flows from ends of the heat pipes located close to the thermal conductive plate to the other ends thereof located close to the heat dissipation assembly. Then, the vaporized working fluid is condensed by the heat dissipation assembly so as to become the liquid working fluid, and the liquid working fluid flows back to the thermal conductive plate with the help of the capillary structures in the heat pipes and the thermal conductive plate. However, it is difficult to improve the heat dissipation efficiency of the conventional thermal conductive plate provided with the heat pipes, and thus how to solve this issue is one of the crucial topics in this field.

The disclosure provides a three-dimensional heat transfer device which is capable of providing a sufficient heat dissipation efficiency.

One embodiment of the disclosure provides a three-dimensional heat transfer device. The three-dimensional heat transfer device includes a vapor chamber and a plurality of flatten heat pipes. The flatten heat pipes are disposed on the vapor chamber and arranged along an extension direction of a short side of the vapor chamber. Major axes of cross-sections of the flatten heat pipes are parallel to a long side of the vapor chamber.

According to the three-dimensional heat transfer device as discussed in the above embodiment, the flatten heat pipes are arranged along the extension direction of the short side of the vapor chamber, and the major axes of the cross-sections of the flatten heat pipes are parallel to the long side of the vapor chamber, such that when an airflow is towards the three-dimensional heat transfer device, a total windward area of the flatten heat pipes can be reduced as much as possible so as to reduce air resistance, thereby increasing the heat dissipation efficiency of the three-dimensional heat transfer device.

In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.

In addition, the terms used in the present disclosure, such as technical and scientific terms, have its own meanings and can be comprehended by those skilled in the art, unless the terms are additionally defined in the present disclosure. That is, the terms used in the following paragraphs should be read on the meaning commonly used in the related fields and will not be overly explained, unless the terms have a specific meaning in the present disclosure.

Refer to, whereis a perspective view of a three-dimensional heat transfer deviceaccording to a first embodiment of the disclosure, andis a partial exploded view of the three-dimensional heat transfer devicein.

In this embodiment, the three-dimensional heat transfer deviceincludes a vapor chamber, a plurality of flatten heat pipes, and a plurality of heat dissipation fins. The vapor chamberincludes a bottom plateand a cover. The coveris disposed on the bottom plate, and the bottom plateand the covertogether surround a fluid chamber S (as shown in). The coverhas a plurality of through holes. The flatten heat pipesare respectively disposed through the through holesand connected to the bottom plate. The heat dissipation finsare mounted on the flatten heat pipes.

In this embodiment, the bottom plateincludes a main portionand a recessed portion. The recessed portionis recessed from the main portion. Some of the flatten heat pipesare connected to the main portionof the bottom plate, and others of the flatten heat pipesare connected to the recessed portionof the bottom plate. In addition, the bottom platefurther includes a plurality of first supportsand a plurality of second supports. The first supportsare located in the fluid chamber S, and protrude from the recessed portionand support the cover. A diameter of each of the second supportsis larger than a diameter of each of the first supports. The second supportsare located in the fluid chamber S, and protrude from the main portionand support the cover. Therefore, the first supportsand the second supportscan increase the structural strength of the vapor chamber.

The recessed portionof the bottom plateis configured to be in thermal contact with a heat source, such as, a CPU or GPU, for absorbing heat generated therefrom. After heat is absorbed by the bottom plate, the heat will be conducted to the flatten heat pipes, and then the flatten heat pipesand the heat dissipation finsdisposed on the flatten heat pipescan dissipate the heat thereon to outside environment.

Note that the quantity of the heat dissipation finsare not restricted in the disclosure and may be modified to be one or may be omitted in some other embodiments.

Refer to, whereis a partial tip view of the three-dimensional heat transfer devicein.

The flatten heat pipesare arranged along an extension direction Eof a short sideof the vapor chamber. Each of the flatten heat pipeshas a cross-section in an oval or elliptical shape, where the cross-section has a major axis Xand a minor axis X, and a length Lof the major axis Xis larger than a length Lof the minor axis X. The major axes Xof the cross-sections of the flatten heat pipesare parallel to a long sideof the vapor chamber. In the extension direction Eof the short sideof the vapor chamber, a distance Lbetween two of the flatten heat pipeswhich are located adjacent to each other is larger than the length Lof the minor axis Xof the cross-section of the flatten heat pipe; that is, the distance Lbetween two of the flatten heat pipeswhich are located adjacent to each other is larger than a thickness of the flatten heat pipe.

Since the major axes Xof the flatten heat pipesare parallel to the long sideof the vapor chamber, when an airflow is towards the three-dimensional heat transfer devicealong a direction F substantially parallel to the long sideof the vapor chamber, a total windward area of the flatten heat pipescan be reduced as much as possible so as to reduce the air resistance, thereby increasing the heat dissipation efficiency of the three-dimensional heat transfer device. In addition, since the flatten heat pipesare arranged along the extension direction Eof the short sideof the vapor chamber, the quantity of the flatten heat pipesin the extension direction Ecan be reduced as much as possible, such that the total windward area can also be reduced so as to reduce the air resistance, thereby further increasing the heat dissipation efficiency of the three-dimensional heat transfer device.

In this embodiment, the flatten heat pipesare arranged in a 3×5 array; that is, the flatten heat pipesare arranged not only along the extension direction Eof the short sideof the vapor chamberbut also an extension direction Eof the long sideof the vapor chamber. In this embodiment, there are plural flatten heat pipesarranged along the extension direction Eof the long sideof the vapor chamberin each row of the array, but the present disclosure is not limited thereto; in some other embodiments, there may be only one heat pipe arranged along the extension direction of the long side of the vapor chamber in each row of the array; that is, the flatten heat pipes arranged along the extension direction of the long side of the vapor chamber in each row of the array may be modified to one flatten heat pipe.

Refer to, whereis a partial cross-sectional view of the three-dimensional heat transfer devicein, andis a partial and enlarged cross-sectional view of the three-dimensional heat transfer devicein.

In this embodiment, the three-dimensional heat transfer devicemay further include a first capillary structureand a second capillary structure. The first capillary structureis located in the fluid chamber S and stacked on the bottom plate. The flatten heat pipesare in thermal contact with the first capillary structureand connected to the bottom platevia the first capillary structure. The second capillary structureis located in the fluid chamber S and stacked on the cover.

In this embodiment, the first capillary structureand the second capillary structureare, for example, sintered powder, but the present disclosure is not limited thereto; in some other embodiments, the first capillary structure and the second capillary structure may be a material selected from a group consisting of metal net, sintered powder and sintered ceramics. For example, the first capillary structure and the second capillary structure may be a composite of sintered powder and micro structure, such as a groove.

Note that the first capillary structureand the second capillary structureof the three-dimensional heat transfer deviceare optional in the disclosure; in some other embodiments, the three-dimensional heat transfer device may omit the first capillary structure and/or the second capillary structure.

In this embodiment, each of the flatten heat pipehas an opening endand a notchlocated at the opening end. An inner space of each of the flatten heat pipesis in fluid communication with the fluid chamber S via the notch. Therefore, a working fluid inside the fluid chamber S of the vapor chambercan flow into the flatten heat pipesvia the notches, such that heat absorbed by the vapor chambercan be rapidly transferred to the flatten heat pipes.

In this embodiment, the flatten heat pipesare in contact with the first capillary structureor connected to the first capillary structurevia a sintering or another suitable process so as to increase the heat dissipation efficiency of the three-dimensional heat transfer device.

Refer to, whereis an exploded view of a three-dimensional heat transfer deviceA according to a second embodiment of the disclosure, andis a cross-sectional view of the three-dimensional heat transfer deviceA in.

In this embodiment, the three-dimensional heat transfer deviceA includes a vapor chamberA and a plurality of flatten heat pipesA. In addition, similar to the three-dimensional heat transfer deviceof the previous embodiment, the three-dimensional heat transfer deviceA of this embodiment may include the heat dissipation fins. The heat dissipation fins of the three-dimensional heat transfer deviceA are substantially the same as that of the three-dimensional heat transfer device, and thus the following paragraphs will not repeatedly introduce the heat dissipation fins, and the figures omit the heat dissipation fins.

The vapor chamberA includes a bottom plateA and a coverA. The coverA is disposed on the bottom plateA, and the bottom plateA and the coverA together surround a fluid chamber S. The coverA has a plurality of through holesA. The flatten heat pipesA are respectively disposed through the through holesA and connected to the bottom plateA.

In this embodiment, the bottom plateA includes a main portionA and a recessed portionA. The recessed portionA is recessed from the main portionA. Some of the flatten heat pipesA are connected to the main portionA of the bottom plateA, and others of the flatten heat pipesA are connected to the recessed portionA of the bottom plateA. In addition, the bottom plateA further includes a plurality of first supportsA and a plurality of second supportsA. The first supportsA are located in the fluid chamber S, and protrude from the recessed portionA and support the coverA. A diameter of each of the second supportsA is larger than a diameter of each of the first supportsA. The second supportsA are located in the fluid chamber S, and protrude from the main portionA and support the coverA. Therefore, the first supportsA and the second supportsA can increase the structural strength of the vapor chamberA.

The recessed portionA of the bottom plateA is configured to be in thermal contact with a heat source, such as, a CPU or GPU, for absorbing heat generated therefrom. After heat is absorbed by the bottom plateA, the heat will be conducted to the flatten heat pipesA, and then the flatten heat pipesA can dissipate the heat thereon to outside environment.

The three-dimensional heat transfer deviceA may further include a plurality of thermal conductive structuresA. The thermal conductive structuresA are, for example, made of metal. The thermal conductive structuresA are, for example, connected to at least some of the first supportsA. The thermal conductive structuresA are parallel to each other and protrude from the recessed portionA of the bottom plateA; that is, the thermal conductive structuresA are in thermal contact with the bottom plateA.

In this embodiment, the thermal conductive structuresA are, for example, rectangular plates with different lengths, but the present disclosure is not limited thereto; in some other embodiments, the thermal conductive structures may be plates with another shape as long as a desired vapor pressure drop can be provided in the fluid chamber S, and a high liquid pressure drop caused by the capillary action provide by the capillary structure of sintered powder can be reduced.

In this embodiment, the first supportsA, the second supportsA, and the thermal conductive structuresA may be integrally formed on the bottom plateA via stamping process, computer numerical control process or other processes, but the disclosure is not limited thereto; in some other embodiments, the supports and the thermal conductive structure may be coupled to the bottom plate via welding process, diffusion bonding process, thermal pressing process, soldering process, brazing process, or adhering processing.

The flatten heat pipesA are arranged along an extension direction Eof a short sideA of the vapor chamberA. Each of the flatten heat pipesA has a cross-section in an oval or elliptical shape, where the cross-section has a major axis and a minor axis, and a length of the major axis is larger than a length of the minor axis. The major axes of the cross-sections of the flatten heat pipesA are parallel to a long sideA of the vapor chamberA. In the extension direction Eof the short sideA of the vapor chamberA, a distance between two of the flatten heat pipesA which are located adjacent to each other is larger than the length of the minor axis of the flatten heat pipeA; that is, the distance between two of the flatten heat pipesA which are located adjacent to each other is larger than a thickness of the flatten heat pipeA.

The three-dimensional heat transfer deviceA may further include a first capillary structureA and a second capillary structureA. The first capillary structureA is located in the fluid chamber S and stacked on the bottom plateA and the thermal conductive structuresA. The flatten heat pipesA are in thermal contact with the first capillary structureA and connected to the bottom plateA via the first capillary structureA. The second capillary structureA is located in the fluid chamber S and stacked on the coverA.

In this embodiment, the first capillary structureA and the second capillary structureA are, for example, sintered powder, but the present disclosure is not limited thereto; in some other embodiments, the first capillary structure and the second capillary structure may be a material selected from a group consisting of metal net, sintered powder and sintered ceramics. For example, the first capillary structure and the second capillary structure may be a composite of sintered powder and micro structure, such as a groove.

Note that the first capillary structureA and the second capillary structureA of the three-dimensional heat transfer deviceA are optional in the disclosure; in some other embodiments, the three-dimensional heat transfer device may omit the first capillary structure and/or the second capillary structure.

In this embodiment, each of the flatten heat pipeA has an opening endA and a notchA located at the opening endA. An inner space of each of the flatten heat pipesA is in fluid communication with the fluid chamber S via the notchA. Therefore, a working fluid inside the fluid chamber S of the vapor chamberA can flow into the flatten heat pipesA via the notchesA, such that heat absorbed by the vapor chamberA can be rapidly transferred to the flatten heat pipesA.

In this embodiment, the flatten heat pipesA are in contact with the first capillary structureA or connected to the first capillary structureA via a sintering or another suitable process so as to increase the heat dissipation efficiency of the three-dimensional heat transfer deviceA.

In this embodiment, the distance between two of the flatten heat pipeswhich are located adjacent to each other is larger than the thickness of the flatten heat pipeA, but the disclosure is not limited thereto; in some other embodiments, the distance between two of the flatten heat pipes which are located adjacent to each other may be smaller than or equal to the thickness of the flatten heat pipe. In such a case, there may be more flatten heat pipes, and those flatten heat pipes can be arranged in high density so as to increase the heat dissipation efficiency of the three-dimensional heat transfer device.

According to the three-dimensional heat transfer devices as discussed in the above embodiments, the flatten heat pipes are arranged along the extension direction of the short side of the vapor chamber, and the major axes of the cross-sections of the flatten heat pipes are parallel to the long side of the vapor chamber, such that when an airflow is towards the three-dimensional heat transfer device, a total windward area of the flatten heat pipes can be reduced as much as possible so as to reduce air resistance, thereby increasing the heat dissipation efficiency of the three-dimensional heat transfer device.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present disclosure. It is intended that the specification and examples be considered as exemplary embodiments only, with a scope of the disclosure being indicated by the following claims and their equivalents.