Cooling Plate Having Reconfigurable Ferrofluid-Based Channels

Computing systems can be subject to many factors that may impact performance. Many relevant factors can relate to mechanical aspects of the components that are utilized in computing systems. Some mechanical considerations can relate to dissipation of heat that may be generated from one or more chips, a set of dice (which may include one die or more than one dice or dies), or other heat-generating components in use. Other considerations can include size limitations. Even minor changes to accommodate and balance among such considerations may render cost savings and/or operational performance benefits that may be significant or non-negligible, especially when implemented across large scale production volumes typical with manufacture of components for computing systems.

Embodiments herein relate to computing component systems, such as may be provided with a cooling plate having a coolant chamber with flow paths that can be modified by guides that are constructed by ferrofluid materials. The ferrofluid materials can be acted upon by magnetic fields to adjust an arrangement of the ferrofluid materials in order to change a flow path layout of conduits, channels, or other guides for controlling fluid flow characteristics through the coolant chamber in use. Accordingly, coolant flow layouts may be adjusted by adjusting the magnetic field to change ferrofluid placement and/or arrangement within the chamber.

Adjusting ferrofluid location within the chamber can allow particular channels to be expanded, contracted, repositioned, reshaped, or otherwise adjusted to provide suitable flow characteristics within the chamber. For example, to provide tailored and/or enhanced cooling, the chamber in a first configuration may be adjusted to exhibit a flow profile that focuses flow over a hotspot in a first zone on a processor or other heat-generating component, and the chamber in a second configuration may be adjusted to exhibit a different flow profile that focuses flow over a second zone of the heat-generating component that may have a higher amount of heat generated during a different operating mode of the heat-generating component.

In the following description, various embodiments will be described. For purposes of explanation, specific configurations and details are set forth in order to provide a thorough understanding of the embodiments. However, it will also be apparent to one skilled in the art that the embodiments may be practiced without the specific details. Furthermore, well-known features may be omitted or simplified in order not to obscure the embodiment being described.

illustrates two instances of a systemin differing configurations. For example, a first configurationA is shown at left inand a second configurationB is shown at right in.

The systemcan include a cooling plate. The cooling platecan be configured for dissipating heat, for example. The cooling platecan include a body. The bodymay be formed of aluminum or other suitable material with appropriate characteristics for functions described herein. For example, the cooling platemay be constructed of material with suitable heat transfer characteristics, material that may be sufficiently robust for loadbearing, and/or material that may be suitable for machining to provide a suitable structure for purposes described herein.

The bodycan include at least one chamber. In, examples of the chamberare individually identified as a first chamberA and a second chamberB. Although two chambersare shown in, any suitable number of chamberscan be utilized. Any chambermay be a coolant chamber, for example.

The coolant chambercan define a coolant inletand a coolant outlet. Examples of the coolant inletand the coolant outletare denoted with respective suffixes in, such as a first coolant inletA, a second coolant inletB, a first coolant outletA, and a second coolant outletB. Any coolant inletmay be coupled with a suitable input for receiving water or other coolant, for example. The coolant inletmay be coupled with an inlet fitting. The inlet fittingmay provide a suitable interface for enabling flow from a coolant supply (such as a water supply) and into the coolant inlet. In the embodiment shown in, the inlet fittingis shown coupled with the first coolant inletA of the first chamberA, while the first coolant outletA is coupled with a hosethat provides fluid flow from the first chamberA into the second chamberB. In the depicted example, the hoseis shown providing fluid flow from the first coolant outletA of the first chamberA and carrying flow to the second coolant inletB of the second chamberB. Fluid can flow through the second chamberB in the depicted embodiment to the second coolant outletB, which is also shown coupled with an outlet fitting.

More generally, the inlet fittingand the outlet fittingmay be coupled to a single chamberin operation or at differing ends of a series of chambers, which may be connected by the hoseor any other suitable structure to permit flow of coolant through the system. For example, although the hoseis depicted as a flexible tube, the hosemay additionally or alternatively correspond to or be replaced with a channel or other conduit structure that may be machined, coupled, or otherwise incorporated into and/or with the cooling plate. Moreover, although the cooling plateis depicted as rectangular in shape in, any other suitable shape may be utilized.

The chambermay be supplied with an amount, quantity, or mass of ferrofluid. The ferrofluidmay be utilized to define one or more guides. The guidesmay guide coolant flow within the chamberin use. For example, the guidesmay direct coolant flow movement between the coolant inletand the coolant outletof a respective chamber.

The ferrofluidmay correspond to any suitable magnetic material suspended in a carrier substance fluid, such as a liquid. Water-based or oil-based solutions may be utilized. A water-based carrier substance for the ferrofluidmay be most suitable for situations in which a coolant utilized is not also water-based. Since water-based coolant (e.g., plain water or water with additives for biocide, anti-corrosion, or other purposes) may be prevalent to implement (e.g., due to simplicity and/or ready availability of materials), oil-based carrier substances (e.g., rather than water-based) may be implemented in many embodiments. In various embodiments, the ferrofluidmay include an oil or carrier substance that is hydrophobic. Including a hydrophobic carrier substance may facilitate a distinct separation between the ferrofluidand water (or other coolant) in the system. In some embodiments, a water-based ferrofluidmay be utilized with an oil-based coolant. More generally, materials may be selected so that a base substance of coolant and a carrier substance of a ferrofluid will be immiscible, which may allow the ferrofluidand the coolant to maintain distinct separation in use. A distinct separation may facilitate the ferrofluidacting as a guide for the coolant without mixing with the coolant, for example.

Examples of magnetic particles that may be included in the ferrofluidmay include ferromagnetic particles or ferrimagnetic particles. Some examples of substances that may be suitable for particles in the ferrofluidmay include pure forms, alloys, or compounds of iron, cobalt, nickel, and certain rare-earth metals. Overall, the “ferro” prefix in ferrofluidneed not necessarily necessitate that ferrous or iron particles be present in the ferrofluid but may refer to the ferrofluidexhibiting ferromagnetic and/or ferrimagnetic behavior and/or properties (e.g., regardless of whether or not ferrous or iron materials are included). The particles may be nanoparticles (e.g., which may remain suspended within the carrier substance), whereas particles of a micrometer scale (e.g., which may be suitable for use in a magnetorheological fluid) may settle over time.

In some examples, the carrier substance can further include oleic acid, tetramethylammonium hydroxide, citric acid, soy lecithin, or other suitable surfactant, which may contribute to preventing magnetic particles from adhering together into heavier clusters that could precipitate out of the ferrofluid solution.

Generally, the ferrofluidmay be responsive to magnetic fields to change arrangements of the ferrofluid. For example, in response to one magnetic field, the ferrofluidmay align magnetic particles of the ferrofluidto a first arrangement or configuration. Then, in response to a change of field, the ferrofluidmay align magnetic particles of the ferrofluidto a second arrangement or configuration.

The systemmay further include or be implemented relative to a setof one or more magnetic field emitters. Each magnetic field emittermay correspond to a structure suitable for or capable of emitting magnetic fields. The magnetic field emittermay be controllable to alter a magnetic fieldsupplied. Some examples may include an electromagnetic that can be controlled to alter a supplied magnetic field. In some embodiments, one or more permanent magnets (e.g., movable or static) may be utilized and/or supplemented with electromagnets. Any other form of electromagnet, permanent magnets, or other form of magnetic field emitters can be utilized.

Magnetic field emittersherein may correspond to magnets. Magnets may correspond to any structure capable of providing a magnetic field. The magnetic field emittersmay alter magnetic fieldswhich may extend into and/or through the chamber. For example, the magnetic field emittersmay be positioned relative to the bodyso as to be operable to alter placement and/or arrangement of the ferrofluidin the chamber.

In some embodiments, different magnetic fieldsfrom different magnetic field emittersin the setmay interact with one another (such as to provide constructive or destructive interference and/or other modulation of magnetic fields) to control arrangement of the ferrofluidalong particular locations, lines, and/or paths within the chamber. Although two magnetic field emittersremote from and at opposite sides of the cooling plateare shown in solid lines in, any number and/or positioning on and/or adjacent cooling platemay be utilized. Some examples of alternate locationsthat may include magnetic field emittersare depicted by dashed line ovals in(which may include on differing sides of a given chamber, laterally offset from a given chamber, vertical offset from a given chamber, and/or between multiple chambers), although any combination of suitable numbers and/or positioning of magnetic field emitterscan be included.

Altering the arrangement of the ferrofluidwithin the chambermay adjust a physical characteristic of at least one of the guideswithin the chamber. Examples of physical characteristics may be location, shape, and/or size. As one example, as depicted in, as the magnetic field emitterstransition from a first operational state to a second operational state (such as depicted by arrowand corresponding to shifting from the first configurationA shown at left into the second configurationB shown at right in), the guidesmay shift the location of a first channelA bounded by the guidesdefined by the ferrofluid. This may correspond to relocating a first channelA in the first chamberA within or among other channels formed by the ferrofluid. For example, the first channelA may move from a location (e.g., shown in the first configurationA) in which three other channels are one side and four other channels are on another side and may move to a different location (e.g., shown in the second configurationB) in which six other channels are on one side and one other channel is on another side. The other channels may provide respectively smaller flow paths than the first channelA, for example.

Other examples of changes in physical characteristics are shown with respect to a second channelB. The second channelB may be changed in shape in addition to being changed in location. For example, the guidesmay be straight (e.g., as shown for the second channelB in the first configurationA) or curved (e.g., as shown for the second channelB in the second configurationB) or may be adjusted to exhibit any other suitable geometry (which may include, but is not limited to, at least partially straight, at least partially non-straight, diverging, or converging). In some embodiments, utilizing curved guidescan provide a nozzle effect to accelerate speed of coolant flowing through a restriction of the nozzle relative to parts of the chamberat which restriction of the nozzle is not present.

The size of the second channelB is also shown as being altered with the shape and location, although any one of shape, location, or size may be altered independently. A change in size may correspond to a maximum dimension, a minimum dimension, or other comparable reference dimension that may be compared between different configurations. For example, a largest dimension (e.g., along opposite ends) is shown smaller for the second channelB in the first configurationA than in the second configurationB, and the smallest dimension (e.g., in a middle portion) is shown larger for the second channelB in the first configurationA than in the second configurationB.

In some examples, a magnetic fieldfrom the magnetic field emittermay be sufficient to maintain ferrofluidwithin the chambernotwithstanding flow of coolant through the chamber. The chambermay include one or more barrierswhich may be positioned to contain ferrofluidwithin the chamberindependent of a presence of a magnetic field(such as if the magnetic field emittersare shut off or cease providing a predictable magnetic fieldin use). The barriersmay correspond to membranes or other structures with apertures or orifices that are sized to be large enough to allow molecules of water or other coolant to pass through and small enough to prevent particles of the ferrofluidfrom passing through. More generally, the barriersmay be arranged to prevent passage of the ferrofluidthrough the coolant outletand/or the coolant inletof a given chamber.

In some aspects, sizing and/or positioning of channelsin the second chamberB may be modulated to account for heat absorbed in the first chamberA prior to reaching the second chamberB. For example, a wider second channelB may be utilized in the second chamberB than a first channelA utilized in the first chamberA.

Also shown inare an introduction portA and an escape portB. For example, the ferrofluidmay be introduced so as to be received within the chamberthrough the introduction portA. Air may escape through the escape portB in response to receiving the ferrofluidthrough the introduction portA. Once a suitable amount of ferrofluidhas been introduced into the chamber, the chambermay undergo sealing of the introduction portA and the escape portB. Sealing may be achieved by readily reversible techniques to allow subsequent introduction of ferrofluidand/or extraction of ferrofluidif desired. Alternatively, the portsmay be sealed by brazing, soldering, or other suitable sealing techniques.

In some embodiments, a ferrofluid supply systemmay be included. The ferrofluid supply systemmay include suitable components to alter (e.g., increase or decrease) an amount of ferrofluidpresent in the chamber. For simplicity, examples of components of the ferrofluid supply systemare shown relative to the second chamberB but may be implemented additionally or alternatively relative to the first chamberA and/or any arrangement of one or more chambers.

The ferrofluid supply systemis shown with a reservoir, pump, a conduit, and a valve, although fewer, more, or different combinations of any of these and/or other components may be utilized. The reservoirmay be sized and arranged to contain ferrofluidseparately from the chamber. Suitable structure may be included for transferring ferrofluidbetween the reservoirand the chamber. For example, the conduitmay provide a path between the reservoirand the chamber. The pumpmay drive ferrofluidfrom the reservoirinto the chamberto increase an amount of ferrofluidin the chamberand/or may drive ferrofluidfrom the chamberinto the reservoirto decrease an amount of ferrofluidin the chamber. Additionally or alternatively, the valvemay be suitably positioned to block, allow, or otherwise control flow of ferrofluidrelative the reservoirand/or the chamber. In some embodiments, one or more magnetic field emittersin the setmay be operable to drive ferrofluidrelative to the chamberand/or reservoirin lieu of and/or as a supplement to the pumpand/or the valve.

The valveis shown at an end of the conduitand along a boundary of the chamber(e.g., in a location that may be suitable for blocking inadvertent passage of ferrofluidacross a boundary of the chamber), although any suitable location for controlling flow relative the reservoirand/or the chambermay be utilized. In some embodiments, the conduitor other structure of the ferrofluid supply systemmay be coupled with an inlet or outlet previously used for initially charging the chamberwith ferrofluid(such as the introduction portA and/or the escape portB).

Differing levels or amounts of ferrofluidmay be useful for addressing different conditions. Ferrofluidmay be provided in suitable quantity to occupy between 25% and 75% (or other amount or range) relative to a total volume of the chamber, for example. Generally, including the ferrofluid supply systemmay facilitate changing how much ferrofluid(e.g., by total quantity or volumetric ratio) is present in the chamberto accommodate different situations. Reducing an amount of ferrofluidin the reservoirmay increase an amount of ferrofluidin the chamberor vice versa. As an illustrative example shown in, changing between the first configurationA to the second configurationB (as depicted by arrow) may include some ferrofluidthat was in the reservoirin the first configurationA being moved into the chamberin the second configurationB, such as to form a blockof ferrofluidin the chamber. Blockalso further illustrates by way of example that ferrofluidmay be arranged to occupy any area of any desired shape in use.

illustrates a perspective view of the systemimplemented with respect relative to other components, such as within a computing system. For example the systemmay include components suitable for including servers, routers, network switches, or other network computing devices.

The systeminis shown with a chassis. The chassismay be formed of sheet-metal or any other suitable structure. In some examples, the chassismay be slidable in and/or out of a rack, such as a server rack.

The chassiscan include a board. The boardmay correspond to a motherboard and/or other suitable board for receiving and/or interfacing with other elements of the system. The boardmay define at least one socket zone, for example.shows a first socket zoneA and second socket zoneB, although any number of one, two, or more socket zonesmay be utilized. As an illustrative example, the systemmay be or may correspond to a two-socket server, although features of systemmay be implemented in three-socket, four-socket, or n-socket varieties of servers or other computing devices.

Each socket zonemay correspond to a region in which a heat-generating componentmay be situated and/or installed in use. For example, although each socket zoneis shown with two heat-generating components, any suitable combination of one, two, or other numbers may be utilized. The heat-generating componentsmay correspond to integrated circuits (including chips or dice), or other heat-generating components. Non-limiting examples include a processor, an input/output (I/O) chip, a baseboard management controller, a chip, a die, a card (e.g., which may include a printed circuit board various that bears other components), a voltage regulator, a hot swap control, an inductor, a resistor, or a capacitor). Other non-limiting examples may include a Field Programmable Gate Array (FPGA), a Complex Programmable Logic Device (CPLD), and a System-on-a-Chip (SoC). Each heat-generating componentmay include one or more subcomponents that generate heat. In some examples, the heat-generating componentsmay include a first processor and a second processor, although the heat-generating componentsmay be of similar or different types of components relative to each other.

A heat dissipation systemmay be included relative to the heat-generating components. The heat dissipation systemmay include one or more instances of the cooling platedescribed with respect to. Although two instances of the heat dissipation systemare shown in(e.g. with one installed in the rightward portion ofand one shown in an upwardly exploded position to show components thereunder at left in), any number of subcomponents and/or collections of components of the heat dissipating systemmay be implemented in use.

Other components may be included in the system, such as fans. Elements of the fansor other elements of the heat dissipation systemmay be controlled independently and/or collectively within the system.

illustrates a series of thermal images representing examples of heat distributions that may occur on or more of the heat-generating components. The images may correspond to different modes,,,, andof operation of the heat-generating component, for example. The images may correspond to heat maps, e.g., which may utilize different intensities of visual indicia to represent different levels of heat in operation. For example, the scale at right inpresents a scale differentiated by density of stippling, where higher density of stippling may correspond to higher temperature.

Heat may be distributed unevenly within and/or between each of the modes-. For example, heat may be distributed in higher concentrations at and/or around hotspots-that may be present in each of the modes-. A hotspotmay emerge in a different location with respect to a heat-generating componentbased on a type of process being performed by the heat-generating componentin a given mode-. For example, different types of processes may involve subcomponents located in different regions of the heat-generating componentand may thereby generate greater amounts of heat in different regions of the heat-generating componentduring different modes-. As an illustrative example, modemay correspond to a processor executing a large language model or other artificial intelligence (AI) program that primarily makes use of a lower portion of the heat-generating component, whereas modemay be a different processor executing a database application that primarily makes use of an upper portion of the same or a different heat-generating component. Accordingly, the hotspotsandmay correspond to physical locations on the heat-generating componentthat may be generating the most heat and/or may have the highest temperatures.

To address, mitigate, and/or prevent a hotspot, coolant flow may be focused relative to the hotspot. For example, with respect to features identified in, the systemcan magnetically manipulate the ferrofluidto adjust a physical characteristic (e.g., location, size, shape, and/or other physical characteristic) of one or more guidesto alter a coolant flow profile. To avoid obscuring other features in, dashed lines are utilized to show some generalized examples of different forms of layouts that may be implemented relative to hotspots-. The dashed lines may represent channel boundaries-, which may correspond to guidesand/or ferrofluidreferenced in, for example. The depicted channel boundaries-may correspond to a set of one or more largest channels implemented in a given instance, and other smaller channels (e.g., similar to in) may be implemented supplementally even though omitted from view infor clarity or may be omitted altogether depending on flow profiles desired. In some examples, portions or all of spaces outside channel boundaries-of the largest channel implemented may be partially or completely occupied by ferrofluidin use.

Generally, channel boundaries-may be respectively implemented in suitable locations, sizes, and/or shapes to impact coolant flow over and/or near the hotspots-to enhance cooling provided at and/or near the hotspot. Althoughfor simplicity primarily shows channel boundaries-arranged to define channels that pass over hotspots-, channels additionally or alternatively may be arranged over other areas or zones. For example, channels may be arranged to control flow so that relatively higher flow (and thus greater cooling) is provided along hotspots-(or other areas that produce a relatively higher thermal load) and so that relatively lower flow (and thus lesser cooling) passes along different areas that produce a relatively lower thermal load, e.g., such that high cooling is prioritized to zones with high thermal load and commensurate lower cooling is supplied to areas with lower demand for cooling.

Thus, the images inmay correspond to an illustrative example that includes a processor, chip, or other heat-generating component that may have a plurality of zones that include at least a first zone (e.g., at and/or around hotspot) and a second zone (e.g., at and/or around hotspot) that exhibit different heat-producing characteristics during different modes of operation (e.g., modesand) of the chip processor, chip, or other heat-generating component. Ferrofluid may be arranged in different arrangements, such as those depicted by channel boundariesand. For example, the ferrofluid in the first arrangement may be arranged to form a first set of walls (e.g., channel boundaries) defining a first set of coolant flow paths through the coolant chamber that facilitate a greater amount of coolant flow along the first zone (e.g., at and/or around a location of hotspot) than along the second zone (e.g., at and/or around a location that may later have hotspot). Continuing this example, the ferrofluid in the second arrangement may be arranged to form a different, second set of walls (e.g., channel boundaries) defining a different, second set of coolant flow paths through the coolant chamber that facilitate a greater amount of coolant flow along the second zone (e.g., at and/or around a location of hotspot) than along the first zone (e.g., at and/or around a location that may have previously included hotspot). Leveraging this capability of the ferrofluid, one or more magnetic field emitters(e.g.,) may be operable to alter placement of the ferrofluid within the coolant chamber to shift between the first arrangement and the second arrangement so as to arrange the ferrofluid in the first arrangement (e.g., along channel boundaries) to facilitate the greater amount of coolant flow along the first zone (e.g., at or along the hotspot) when the processor, chip, or other heat-generating component is in the first mode (e.g., mode) having the higher heat load in the first zone and so as to arrange the ferrofluid in the second arrangement (e.g., along channel boundaries) to facilitate the greater amount of coolant flow along the second zone (e.g., at or along the hotspot) when the processor, chip, or other heat-generating component is in the second mode (e.g., mode) having the higher heat load in the second zone.

Any suitable form factor may be utilized. Channel boundariesandshow examples of straight edges. Where channel boundariesshow an example of forming a single large channel across the hotspot, the channel boundariesshow an example of forming a central channel and multiple peripheral channels. Channel boundaries,, andshow examples with curved or otherwise non-straight edges. In some embodiments, curved edges (such as channel boundariesand/or) may be curved toward one another or otherwise suitably arranged to form a nozzle shape, e.g., which may include a narrowing restriction that operates to accelerate fluid flow passing through the restriction. In this manner, the channels may be utilized to increase speed of flow at a target location. Flaring out from the restriction may be included on both sides (such as with channel boundaries) or on a single side (such as with channel boundaries). Channel boundariesshow an example in which flow is modulated to flow across multiple hot spots. Multiple hotspots may occur in arrangements that include a Field Programmable Gate Arrays (FPGA), a Complex Programmable Logic Device (CPLD), a System-on-a-Chip (SoC), and/or in other arrangements with multiple types and/or zones of heat-generating components, for example. Overall, any simple or complex flow geometry may be implemented with the ferrofluid, including geometries to facilitate and/or direct flow in left and/or rightward directions, in forward and/or backward directions, in up and/or down directions, in diagonal directions, in spiral directions, around and/or along an island and/or edge formed of ferrofluid, and/or in other flow arrangements.

illustrates a series of fixed anchorsthat can receive ferrofluidaccording to certain aspects of the present disclosure. The fixed anchorsmay be implemented in a coolant chamber, which may be an example of the coolant chamber. The fixed anchorsmay be separated by gaps that can be filled or vacated by the ferrofluidto adjust arrangement of coolant flow path boundaries(which may correspond to guides, e.g.,). The fixed anchorsare depicted as cylindrical protrusions but may correspond to projections of square, rectangular, elongate, or any other suitable form factor. The fixed anchorsmay extend and/or span a full or partial height of the coolant chamber(e.g., in a direction into or out of the page of the view of). The fixed anchorscan be fixed in a predetermined plan within the coolant chamber(e.g., a grid-like plan, a repeating plan, or a plan that includes portions that are non-symmetric and/or non-repeating relative to other portions). The fixed anchorsmay receive ferrofluidsuch that the fixed anchorsand the ferrofluidtogether define coolant flow path boundarieswithin the coolant chamber. For example, the ferrofluidmay be arranged to extend laterally between any pair of respective sequentially adjacent fixed anchorsand/or vertically (e.g., above and/or below, such as in a direction into or out of the page of the view of) and/or horizontally (e.g., laterally, such as in a direction in a plane of the page of the view of) relative to any individual fixe anchor.

A magnetic field may be applied to the coolant chamber(e.g., via one or more magnetic field emitters) such that the ferrofluidrelocates among differing arrangements. Relocating the ferrofluidfrom the first configurationto the second configuration(such as illustrated by arrow) may create different coolant flow paths and may increase or alter an amount of cooling supplied in a location of the coolant chamber. For example, the ferrofluidmay adhere to the fixed anchorsin a first configurationto form six even coolant flow paths and may adhere to the fixed anchorsin a second configurationsuch that the ferrofluidand fixed anchorsform two uneven current flow paths. As a result, a relatively higher amount of coolant flow may be provided along the expanded upper channel (such as depicted by arrow) while a relatively smaller amount of coolant flow may be provided along the lower channel (such as depicted by arrows). Flow through the lower channel may be accelerated by the nozzle shape imparted (such as depicted by arrows), for example. Flow may be modulated within the coolant chamberby altering a channel size to affect an amount of flow and/or by adjusting a shape to affect a speed of flow.

In some examples, the fixed anchorsmay have certain electrostatic properties that enable the ferrofluid to adhere to the fixed anchors. For example, an electrical attraction between the fixed anchorsand the ferrofluid may enable the creation of more predictably shaped coolant flow path boundariesand may thereby provide additional control of a size, location, and/or shape associated with each coolant flow path. More generally, the fixed anchorsmay be configured to provide at least a mild attraction to the ferrofluid(such as by including material with magnetic properties or otherwise including a coating to attract material in the ferrofluid), which may cause the ferrofluidto be predisposed to adhere to, couple with, or otherwise remain in a predictable arrangement relative the fixed anchorsabsent magnetic fields in suitable strength and/or arrangement to overcome the effect of the fixed anchor and re-arrange the ferrofluid.

In some embodiments, ferrofluidinitially situated among one set of fixed anchorsmay be relocated to be aggregated among other fixed anchors. For example, in, the ferrofluidin the uppermost row in the second configurationis depicted thicker than in the first configuration, which may correspond to aggregating the ferrofluidfrom the second and third row during the transition. In some embodiments, ferrofluidmay be moved to block or unblock a channel. As an example in, the left end of the channelis shown blocked by ferrofluidin the second configurationand unblocked by the ferrofluid in the first configuration. The channelmay be closed by moving from the first configurationto the second configurationand/or may be opened by moving to the first configurationfrom the second configuration. Although blocking, unblocking, closing, and opening are discussed with respect to the coolant chamberwith fixed anchorsin, such manipulations may be performed in the chamberofor other chamber in which fixed anchorsare not present.

is a flow chart depicting a processthat may be performed relative to a coolant chamber (such as a coolant chamber discussed herein). Some or all of the process(or any other processes described herein, or variations, and/or combinations thereof) may be performed under the control of one or more computer systems configured with executable instructions and may be implemented as code (e.g., executable instructions, one or more computer programs, or one or more applications) executing collectively on one or more processors, by hardware or combinations thereof. The code may be stored on a computer-readable storage medium, for example, in the form of a computer program comprising a plurality of instructions executable by one or more processors. The computer-readable storage medium may be non-transitory.

At operation, the processcan include receiving, in a coolant chamber of a cooling plate, a magnetic field. This may correspond to applying a magnetic field to a coolant chamber of a cooling plate. The magnetic field may be from a magnetic field emitter, for example.

At operation, the processcan include altering a coolant flow path in the coolant chamber by adjusting an arrangement of ferrofluid within the coolant chamber in response to (e.g., using) the magnetic field. This may involve the chamber, ferrofluid, and/or other components discussed herein. Altering the coolant flow path may include changing a shape of the coolant flow path, a location of the coolant flow path, and/or a size of the coolant flow path (such as discussed with respect to the second channelB in). Additionally or alternatively, altering the coolant flow path may include closing or blocking the coolant flow path (such as discussed with respect to channelin). Additionally or alternatively, altering the coolant flow path may include opening or unblocking the coolant flow path (such as discussed with respect to channelin).

In some embodiments, the operationincludes adjusting the ferrofluid within the coolant chamber into a first arrangement of ferrofluid in the coolant chamber in response to the magnetic field (which may be a first magnetic field) to define a first flow path layout within the coolant chamber. The first ConfigurationA inmay be an example. The processmay further include receiving, in the coolant chamber of the cooling plate, a second magnetic field and adjusting the ferrofluid within the coolant chamber into a second arrangement of ferrofluid in the coolant chamber in response to the second magnetic field to define a second flow path layout within the coolant chamber. The second configurationB inmay be an example.

In some examples, the adjusting of the ferrofluid at operationmay be performed at any suitable time. For example, the ferrofluid may be adjusted before the heat-generating component begins an operation and/or during operation of the heat-generating component.

In some embodiments, prior to the receiving of the magnetic field, the processmay include installing the ferrofluid. For example, this may be accomplished by a subprocess that includes receiving an amount of ferrofluid through an introduction port into the coolant chamber (such as via the introduction portA in). The subprocess may further include permitting air to escape from the coolant chamber through an air escape port in response to the receiving of the amount of ferrofluid through the introduction port (such as via the escape portB in). The subprocess may further include undergoing sealing of the introduction port and the air escape port.

In some embodiments, the processfurther includes receiving coolant flow through an inlet (such as the coolant inletin), through a flow pattern defined by ferrofluid (such as ferrofluidin chamberin), and through an outlet (such as through the coolant outletin). The coolant may be flowed through a barrier between the inlet and the flow pattern defined by the ferrofluid (e.g., through a barrierat left of the chamberin) and/or through a barrier between the flow pattern defined by the ferrofluid and the outlet (e.g., through a barrierat right of the chamberin). The barrier may correspond to a membrane configured to prevent passage of ferrofluid through the inlet and/or the outlet, for example.