Three-Dimensional Vapor Chamber Cooling Device

The disclosure relates to a three-dimensional vapor chamber, particularly to a three-dimensional vapor chamber cooling device having a planarly extended structure and a close arrangement.

A three-dimensional vapor chamber (3D vapor chamber) is a phase change heat transfer device. Its structure is a combination of a vapor chamber and a heat pipe. Its internal chambers are communicated, so that the internal gas and liquid substances that exchange each other can directly move freely inside the two chambers to achieve a better cooling effect. However, such a three-dimensional vapor chamber requires a large amount of space to have vertical heat pipes and cooling fins on the vapor chamber, which limits the applications of the three-dimensional vapor chambers to the use space, and is especially difficult to apply to flat spaces.

In view of this, the inventors have devoted themselves to the above-mentioned prior art, researched intensively and cooperated with the application of science to try to solve the above-mentioned problems. Finally, the invention which is reasonable and effective to overcome the above drawbacks is provided.

The disclosure provides a three-dimensional vapor chamber cooling device having a heat pipe extended parallelly to the lateral direction of the bottom plate and arranged closely.

The disclosure provides a three-dimensional vapor chamber cooling device including a body, a heat pipe, a fin assembly and a working fluid. The body includes a bottom plate and an upright plate. The upright plate is upright arranged on the bottom plate. A first chamber is encompassed in the bottom plate. A second chamber is encompassed in the upright plate. The first chamber communicates with the second chamber. The heat pipe is extended from a side of the upright plate and communicates with the second chamber. The fin assembly is disposed on the heat pipe. The working fluid is filled in the bottom plate in a liquid state. The working fluid can flow to the upright plate and the heat pipe when vaporizing.

In an embodiment of the disclosure, the heat pipe is parallel to the bottom plate.

In an embodiment of the disclosure, a first wick structure is attached on an inner wall of the bottom plate. A second wick structure is attached on an inner wall of the upright plate, and the first wick structure is connected to the second wick structure. A third wick structure is attached on an inner wall of the heat pipe, and the second wick structure is connected to the third wick structure.

In an embodiment of the disclosure, the second chamber is extended with a buffer space.

The first chamber communicates with the buffer space.

In an embodiment of the disclosure, the upright plate is disposed on a side of an edge of the bottom plate.

In an embodiment of the disclosure, a side of the bottom plate is extended with another heat pipe, and the another heat pipe communicates with the first chamber. The another heat pipe is disposed with another fin assembly.

In an embodiment of the disclosure, the body includes another upright plate, the upright plate and the another upright plate are upright disposed on the bottom plate and oppositely disposed on two sides of the bottom plate, and the heat pipe is connected between the upright plate and the another upright plate.

The upright plate of the three-dimensional vapor chamber cooling device of the disclosure is laterally extended with the heat pipe to make the heat pipe able to be arranged parallelly to the bottom plate so as to prevent the overall height of the three-dimensional vapor chamber cooling device from being overhigh.

In the description of the present disclosure, it should be understood that the terms “front side”, “rear side”, “left side”, “right side”, “front end”, “rear end”, “distal end”, “longitudinal”, “transverse”, “vertical”, “top”, “bottom”, etc., which are used to indicate the orientations or positional relationships, are based on the orientations or positional relationships shown in the drawings. They are only for the convenience of describing the present disclosure and simplifying the description, and do not express or imply that the indicated devices or elements must be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the disclosure.

As used herein and not otherwise encompassed, the terms “substantially” and “approximately” are used to depict and describe small changes. When used in connection with an event or situation, the terms may include the precise moment at which the event or situation occurs, as well as the event or situation occurring to a close approximation. For example, when combined with a numerical value, the terms may include a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.

Please refer to. The disclosure provides a three-dimensional vapor chamber cooling device, which includes a body, at least one heat pipe, at least one fin assemblyand a working fluid (not shown).

In the embodiment, the bodyincludes a bottom plateand an upright plate. The upright plateis upright arranged on the top surface of the bottom plate. In detail, the upright plateis disposed on a side of an edge of the bottom plate. The bottom plateappears to be hollow and a first chamberis encompassed therein. The upright plateappears to be hollow and a second chamberis encompassed therein. The first chambercommunicates with the second chamber. A first wick structureis attached on the inner wall of the bottom plate. A second wick structureis attached on the inner wall of the upright plate. The first wick structureis connected to the second wick structure.

In the embodiment, part of the upright platemay be optionally disposed to appear to be of a stage shape to form a buffer spacetherein. The buffer spaceis extended from the second chamber. The first chambermay be optionally disposed to communicate with the buffer space.

In the simplest embodiment, disposing only one heat pipemay accomplish the functions of the disclosure, and the heat pipeis extended from a side of the upright plateand communicates with the second chamber. In the embodiment, the heat pipeis parallel to the bottom plateto be extended outside the boundary of the bottom plate, but the disclosure is not limited to this. A third wick structureis attached on the inner wall of the heat pipe. The second wick structureis connected to the third wick structure. The fin assemblyis disposed on the outer wall of the heat pipe. In the embodiment, multiple heat pipeswith the same structure and function are disposed on the same face of the upright plate, but the disclosure does not limit the amount of the heat pipe.

The working fluid is filled in the bottom platein a liquid state. The working fluid can flow to the upright plateand the heat pipewhen vaporizing. When using the three-dimensional vapor chamber cooling device of the embodiment, the bottom side of the bottom plateis used for contacting a heat source (not shown). Generally speaking, the heat source is disposed on a circuit board (not shown), and the bottom plateof the three-dimensional vapor chamber cooling device is superposed on the circuit board. After the bottom plateabsorbs heat from the heat source, the working fluid is vaporized in the first chamberby being heated, the vaporized working fluid can flow into the second chamberand the heat pipe. The buffer spacemay be used to regulate the gas working fluid to prevent the gas working fluid which suddenly increases from being unable to enter the heat pipein time to cause poor cooling when the heating power of the heat source suddenly rises. The gas working fluid in the heat pipeis condensed into a liquid state by dissipating heat through the fin assembly. The liquid working fluid in the heat pipewill flow back to the first chamberthrough the second wick structureand the first wick structureafter being absorbed by the third wick structure.

The upright plateof the three-dimensional vapor chamber cooling device of the disclosure is laterally extended with the heat pipeto make the heat pipeable to be arranged parallelly to the circuit board so as to prevent the overall height of the three-dimensional vapor chamber cooling device from being overhigh. According to different arrangement requirements, the three-dimensional vapor chamber cooling device of the disclosure may have various possible arrangement variations as follows.

Please refer to, which shows the second embodiment of the disclosure. The three-dimensional vapor chamber cooling device of the embodiment includes a body, multiple heat pipes, multiple fin assembliesand a working fluid. The bodyhas a bottom plateas the abovementioned first embodiment. However, the upright platein this embodiment is upright disposed at the middle portion of the body, each of two sides of the upright plateis disposed with a heat pipe, and all the heat pipesof two sides of the upright platecommunicate with the second chamber. In the embodiment, each heat pipeis extended parallelly to the bottom plate, and at least part of each heat pipeis stacked on the bottom plate. A third wick structureis attached on the inner wall of each heat pipe. The second wick structurein the upright plateis connected to each third wick structure. The fin assembliesare separately disposed on two sides of the upright plate. Each heat pipeis separately connected to the corresponding fin assembly, so that the spaces on two sides of the upright platemay be effectively utilized to dispose the heat pipeand the fin assembly.

In the embodiment, part of the upright platemay be optionally disposed with a buffer spaceas the first embodiment, and part of the heat pipemay also directly communicate with the buffer space.

Please refer to, which shows the third embodiment of the disclosure. The three-dimensional vapor chamber cooling device of the embodiment includes a body, multiple heat pipes, a fin assemblyand a working fluid. The bodyhas a bottom plateas the abovementioned first embodiment and an upright plate. The structure of each heat pipeis the same as the above embodiment and the heat pipeis disposed on one side of the upright plate. In the embodiment, each heat pipeis extended parallelly to the bottom plate, and at least part of each heat pipeis stacked on the bottom plate. Each heat pipeis separately connected to the fin assemblyso as to make the heat pipe, the fin assemblyand the bottom plateclosely arranged. In the embodiment, part of the upright platemay be optionally disposed to appear to be of a stage shape to form a buffer spacetherein. The buffer spaceis extended from the second chamber. The buffer spaceand the heat pipesare separately disposed on two sides of the upright plateto effectively utilize the spaces on the two sides of the upright plate

Please refer to, which shows the fourth embodiment of the disclosure. The three-dimensional vapor chamber cooling device of the embodiment includes a body, multiple heat pipes,, multiple fin assemblies,and a working fluid. The bodyhas a bottom plateas the abovementioned first embodiment. However, the bodyof the embodiment has a pair of upright plates. The pair of upright platesis oppositely disposed on two sides of the bottom plate. The heat pipes,are separately extended parallelly to the bottom platefrom the two sides of each upright plate. In detail, some of the heat pipesare connected between the pair of upright platesto be stacked on the bottom plate. The other heat pipesare separately extended from each upright plateto the outside of the bottom plate. The fin assemblies,are separately disposed on two sides of each upright plate. In other words, some fin assembliesare disposed between the two upright plates, and the other fin assembliesare separately disposed on two opposite sides outside the bottom plate. Also, each heat pipe,is connected to the corresponding fin assembly,. The embodiment makes the heat pipes,and the fin assemblies,obtain maximum extension in the direction parallel to the bottom plate.

Please refer to, which shows the fifth embodiment of the disclosure. The structure of the three-dimensional vapor chamber cooling device of the embodiment is substantially the same as the first embodiment, but the top surface of the bottom platemay be additionally disposed with a heat pipeand a fin assemblyto directly dissipate heat of the bottom plateaccording to the cooling requirement.

While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.