Micro LED Array and Micro LED Display Panel

The present disclosure claims the benefits of priority to PCT Application No. PCT/CN 2024/090034, filed on Apr. 26, 2024, which is incorporated herein by reference in its entirety.

The present disclosure generally relates to micro LED manufacturing technology, and more particularly, to a micro LED array and a micro LED display panel.

Inorganic micro pixel light emitting diodes, also referred to as micro light emitting diodes, micro LEDs, or u-LEDs, become more important since they are used in various applications including self-emissive micro-displays, visible light communications, and optogenetics. The micro LEDs have higher output performance than conventional LEDs because of better strain relaxation, improved light extraction efficiency, and uniform current spreading. Compared with conventional LEDs, the micro LEDs also exhibit several advantages, such as improved thermal effects, faster response rate, larger working temperature range, higher resolution, wider color gamut, higher contrast, lower power consumption, and operability at higher current density.

Generally, a micro LED display panel includes an array of micro LEDs. Each micro LED may generate heat when emitting light. However, high temperature may impact the performance of the micro LED display panel. Therefore, there is a challenge to improve a heat dissipation effect.

Embodiments of the present disclosure provide a micro LED array. The micro LED array includes a plurality of micro LED structures, each of the a micro LED structures including: a mesa structure; a bonding layer provided at a bottom of the mesa structure to bond the mesa structure with an integrated circuit (IC) backplane; and a first thermal conductive layer formed surrounding sidewalls of the mesa structure and the bonding layer, wherein a material of the first thermal conductive layer is electrically insulative material with high thermal conductivity.

Embodiments of the present disclosure also provide a micro LED display panel. The micro LED display panel includes: an integrated circuit (IC) backplane comprising a bottom pad array, the bottom pad array comprising a plurality of bottom pads; and an above-described micro LED array formed on the IC backplane. One micro LED structure of the plurality of micro LED structures is electrically connected with one bottom pad of the plurality of bottom pads.

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise represented. The implementations set forth in the following description of exemplary embodiments do not represent all implementations consistent with the invention. Instead, they are merely examples of apparatuses and methods consistent with aspects related to the invention as recited in the appended claims. Particular aspects of the present disclosure are described in greater detail below. The terms and definitions provided herein control, if in conflict with terms and/or definitions incorporated by reference.

Embodiments of the present disclosure provide a micro LED array having improved heat dissipation efficiency.

illustrates a structural cross-sectional diagram of an exemplary micro LED array, according to some embodiments of the present disclosure.shows two complete micro LED structures, and only one micro LED structureis described for illustrative purposes. Accordingly, it can be understood that micro LED arraymay include a plurality of micro LED structures. Referring tomicro LED structureincludes a mesa structureand a bonding layer. Bonding layeris provided at a bottom of mesa structureto bond mesa structurewith a bottom padon an integrated circuit (IC) backplane. IC backplaneis provided at a bottom of micro LED arrayfor providing control of micro LED array. A material of bonding layeris metal. For example, the material of bonding layermay include: AI, Au, Rh, Ag, Cr, Ti, Pt, Sn, Cu, etc. The material may also include metal alloys, for example, AuSn, TiW, NiSn, and the like. In some embodiments, bonding layercan further configured as a reflector to reflect light upwards. Therefore, the light emission efficiency of micro LED structurecan be further improved.

Micro LED structurefurther includes a first thermal conductive layerformed surrounding sidewalls of mesa structureand bonding layer. A material of first thermal conductive layeris an electrically insulative material with high thermal conductivity, so that first thermal conductive layercan radiate heat generated by mesa structure. In some embodiments, a thermal conductivity of the insulator material of first thermal conductive layeris greater than 300W/mK. For example, the material of first thermal conductive layermay be AlN, SiC, Boron, Nitride, diamond, diamond-like carbon, and the like.

In some embodiments, micro LED arrayfurther includes a second thermal conductive layerfilled between adjacent ones of micro LED structures. A material of second thermal conductive layeris a material with high thermal conductivity, so that second thermal conductive layercan further radiate the heat to the air. For example, a thermal conductivity of the material of second thermal conductive layeris greater than 300W/mK. In some embodiments, the material of second thermal conductive layeris electrically insulative, such as, AlN, SiC, Boron, Nitride, diamond, or diamond-like carbon. In some embodiments, the material of second thermal conductive layeris electrically conductive, such as, Ag, Cu, Al, Graphite, Graphene, or the like.

In some embodiments, as shown infirst thermal conductive layeris further provided on a portion of a top surface of mesa structureand defines an openingon the top surface of mesa structure. A first top conductive layeris further provided to fill opening. In some embodiments, first top conductive layeris a TCO (transparent conductive oxide) thin film, for example, an ITO (Indium Tin Oxide) film, an AZO (Antimony doped Zinc Oxide) film, an ATO (Antimony doped Tin Oxide) film, an FTO (Fluorine doped Tin Oxide) film, and the like.

In some embodiments, as shown inmicro LED arrayfurther includes a second top conductive layerprovided on a top of micro LED structure, and respective first top conductive layersof the plurality of micro LED structuresare interconnected to form a whole conductive layer. In some embodiments, second top conductive layeris a TCO (transparent conductive oxide) thin film, for example, an ITO (Indium Tin Oxide) film, an AZO (Antimony doped Zinc Oxide) film, an ATO (Antimony doped Tin Oxide) film, an FTO (Fluorine doped Tin Oxide) film, and the like. A material of first top conductive layerand a material of second top conductive layer can be the same or different.

illustrates a structural diagram of a top view of the micro LED arrayshown inwith a second top conductive layerremoved for illustrative purposes, according to some embodiments of the present disclosure. Referring toin this example, micro LED arrayincludes a 4×3 micro LED structures. It can be understood that a micro LED array can include different numbers of micro LED structures. As shown ineach mesa structure, which may generate heat when emitting light, is surrounded by first thermal conductive layer, and second thermal conductive layeris filled between adjacent ones of micro LED structures. With the high thermal conductivity of the first thermal conductive layerand second thermal conductive layer, the heat dissipation effect can be improved.

Referring back toin some embodiments, micro LED structurefurther includes a bottom conductive layerprovided between mesa structureand bonding layerto provide an ohmic conduct between mesa structureand bonding layer. In some embodiments, bottom conductive layerincludes an omni-directional reflector (ODR) structure with high reflectivity. In some embodiments, bottom conductive layeris a TCO (transparent conductive oxide) thin film, for example, an ITO (Indium Tin Oxide) film, an AZO (Antimony doped Zinc Oxide) film, an ATO (Antimony doped Tin Oxide) film, an FTO (Fluorine doped Tin Oxide) film, and the like.

In some embodiments, mesa structureincludes a P-N structure. For example, mesa structureincludes a first semiconductor layer, a second semiconductor layer, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The first semiconductor layer is provided on the light emitting layer, and the light emitting layer is provided on the second semiconductor layer. Bonding layeris provided facing a bottom surface of the second semiconductor layer. The light emitting layer can emit red light, green light, or blue light. In some embodiments, an area of a top surface of mesa structureis smaller than an area of bottom surface of mesa structure. In some embodiments, the first semiconductor layer is an N-type semiconductor layer, and the second semiconductor layer is a P-type semiconductor layer.

In some embodiments, IC backplaneincludes an array of bottom pads. Each bottom padcorresponds to one micro LED structure. In some embodiments, bottom padis a Cu-pad.

illustrates a structural cross-sectional diagram of another exemplary micro LED array, according to some embodiments of the present disclosure.shows two complete micro LED structures, and only one micro LED structureis described for illustrative purposes. Accordingly, it can be understood that micro LED arraymay include a plurality of micro LED structures. Referring to, similar to micro LED arrayshown inmicro LED structureincludes a mesa structureand a bonding layer. Bonding layeris provided at a bottom of mesa structureto bond mesa structurewith an integrated circuit (IC) backplane. Micro LED structurefurther includes a first thermal conductive layerformed surrounding sidewalls of mesa structureand bonding layer. In this example, first thermal conductive layeris further formed on a top surface of IC backplanebetween adjacent ones of micro LED structures. For example, first thermal conductive layerincludes a portionA provided on IC backplanebetween adjacent ones of micro LED structures. Accordingly, first thermal conductive layeris continuously formed in this example, and can further radiate heat from IC backplane.

As shown in, micro LED arrayfurther includes a second thermal conductive layerfilled between adjacent ones of micro LED structures. In some embodiments, micro LED arrayfurther includes an isolation structureprovided between adjacent ones of micro LED structuresto isolate light and reduce crosstalk between the adjacent ones of micro LED structures. In some embodiments, the material of second thermal conductive layeris electrically insulative. A material of isolation structurecan be electrically conductive or insulative. In some embodiments, when the material of second thermal conductive layeris electrically conductive., a material of isolation structureis electrically insulative.

Referring to, micro LED arrayfurther includes a second top conductive layerprovided on a top of micro LED structure. As a result, a first top conductive layer on a top surface of mesa structureand respective first top conductive layersof the plurality of micro LED structuresare interconnected to form a whole conductive layer. In this example, micro LED arrayfurther includes a plurality of top contactprovided on second top conductive layerand between adjacent ones of micro LED structures, and the plurality of top contacts are interconnected to improve electrical conductivity of second top conductive layer.

Description of other features of micro LED arraymay be found by referring to such features described above with reference towhich will not be repeated here.

illustrates a structural cross-sectional diagram of another exemplary micro LED array, according to some embodiments of the present disclosure.shows two complete micro LED structures, and only one micro LED structureis described for illustrative purposes. Accordingly, it can be understood that micro LED arraymay include a plurality of micro LED structures. Referring to, similar to micro LED arrayshown inand micro LED arrayshown in, micro LED structureincludes a mesa structureand a bonding layer. Bonding layeris provided facing a bottom of mesa structureto bond mesa structurewith an integrated circuit (IC) backplane. Micro LED structurefurther includes a first thermal conductive layerformed surrounding sidewalls of mesa structureand bonding layer. First thermal conductive layeris further formed on a top surface of IC backplanebetween adjacent ones of micro LED structures. In this example, micro LED structureincludes a top conductive layerprovided on a top surface of mesa structureand on first thermal conductive layer.

Referring to, in this example, micro LED arrayfurther includes a second thermal conductive layerfilled between adjacent ones of micro LED structuresand on part of top conductive layer.

Description of other features of micro LED arraymay be found by referring to such features described above with reference toand, which will not be repeated here.

illustrates a structural diagram showing a top view of a micro LED display panel, according to some embodiments of the present disclosure. Referring to, micro LED display panelincludes a micro LED array(for example, micro LED array, micro LED array, or micro LED array) and an IC (integrated circuit) backplane. Micro LED arrayis located on IC backplaneto form an image display area of micro LED display panel. The rest of the area on IC backplanenot covered by micro LED arrayis formed as a non-functional area. IC backplaneis formed at the back surface of micro LED arraywith a part extending outside of, i.e., not covered by, micro LED array. Micro LED arrayincludes a plurality of micro LEDs(for example, micro LED structure, micro LED structure, or micro LED structure) provided in micro LED array. IC backplaneis configured to control the plurality of micro LEDs. IC backplanemay include a bottom pad array (not shown) corresponding to micro LED array. The bottom pad array includes a plurality of bottom pads (for example, bottom padin), and one bottom pad corresponds to one micro LED. One micro LED of the plurality of micro LEDs is electrically connected with one bottom pad of the plurality of the bottom pad.

In some embodiments, a top conductive layer (for example, second top conductive layer, second top conductive layer, or second top conductive layer) of the micro LED is interconnected with each of the plurality of micro LEDs. That is, the top conductive layer is continuously formed on a top of micro LED array, and connected with every micro LED.

In some embodiments, IC backplanefurther includes a top connected pad. The top conductive layer is connected with top connected pad, and further may connect to an external circuit.

Each micro LED structure herein (e.g., micro LED structure, micro LED structure, or micro LED structure) has a very small volume. The micro LED structure can be applied in a micro LED display panel. The light emitting area of the micro LED display panel, e.g., micro LED display panel, is very small, such as 1 mm×1 mm, 3 mm×5 mm, etc. In some embodiments, the light emitting area is the area of micro LED arrayin micro LED display panel. The micro LED display panel includes one or more micro LED s that form a pixel array in which the micro LEDs of micro LED arrayare pixels, such as a 1600×1200, 680×480, or 1920×1080-pixel array. The diameter of each micro LED is in the range of about 200 nm to 2 μm. An IC backplane, e.g., IC backplane, is formed at the back surface of micro LED arrayand is electrically connected with micro LED array. IC backplaneacquires signals such as image data from outside via signal lines to control corresponding micro LEDsto emit light or not.

It is understood by those skilled in the art that the micro LED display panel is not limited by the structure described above, and may include greater or fewer components than those illustrated, or some components may be combined, or a different component may be utilized.

It should be noted that relational terms herein such as “first” and “second” are used only to differentiate an entity or operation from another entity or operation, and do not require or imply any actual relationship or sequence between these entities or operations. Moreover, the words “comprising,” “having,” “containing,” and “including,” and other similar forms are intended to be equivalent in meaning and be open ended in that an item or items following any one of these words is not meant to be an exhaustive listing of such item or items, or meant to be limited to only the listed item or items.

As used herein, unless specifically stated otherwise, the term “or” encompasses all possible combinations, except where infeasible. For example, if it is stated that a database may include A or B, then, unless specifically stated otherwise or infeasible, the database may include A, or B, or A and B. As a second example, if it is stated that a database may include A, B, or C, then, unless specifically stated otherwise or infeasible, the database may include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C.

In the foregoing specification, embodiments have been described with reference to numerous specific details that can vary from implementation to implementation. Certain adaptations and modifications of the described embodiments can be made. Other embodiments can be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims. It is also intended that the sequence of steps shown in figures are only for illustrative purposes and are not intended to be limited to any particular sequence of steps. As such, those skilled in the art can appreciate that these steps can be performed in a different order while implementing the same method.

In the drawings and specification, there have been disclosed exemplary embodiments. However, many variations and modifications can be made to these embodiments. Accordingly, although specific terms are employed, they are used in a generic and descriptive sense only and not for purposes of limitation.