Gas Atomized Fluid Clean of Electroplating Chuck in Maintenance Chamber

This application is a continuation of U.S. patent application Ser. No. 18/656,091, filed May 6, 2024, the entire disclosure of which is incorporated herein.

Certain electroplating residues are difficult to remove from electroplating hardware and may degrade the useful life of electroplating hardware. The most common plating bath(s) chemistry which leaves a residue/contamination on chuck elastomer seals or other surfaces of chuck surfaces such as for polyether ether ketone (PEEK) retainers is Tin (Sn) or Tin-Silver (Sn/Ag). For example, Sn baths may leave residues or films on electroplating equipment. One consequence of residue (or film) is plate up onto the chuck surfaces. It is believed the residue creates a conductive film which can act as a seed layer to allow metal to plate on the chuck surfaces in addition to the wafer/workpiece. Also, if the chuck is exposed to other plating baths (i.e. copper (Cu)), the Sn bath residue can be etched off into the Cu bath causing contamination. Additionally, electroplating chemical residue can have negative impact on the electroplating process.

While methods and systems have been developed for cleaning electroplating residue, such as using a cloth or cleaning agent on an end effector of a maintenance chamber, electroplating residues may still remain, especially when the electroplating hardware has complicated geometry or components. For example, electroplating chucks may include seals, electrical contacts, or other components that are difficult to clean with conventional methods.

Accordingly, devices, systems, and methods of cleaning electroplating hardware, such as electroplating chucks, are needed.

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This summary is not intended to identify key features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

Disclosed herein is a maintenance chamber configured to reduce contamination on an electroplating chuck, the maintenance chamber including a positioning system configured to rotate, axially move, or both rotate and axially move the electroplating chuck, and a gas atomizing nozzle, configured to spray an atomized fluid onto the electroplating chuck, wherein the atomized fluid is configured to reduce and/or remove contamination on the electroplating chuck.

In some embodiments, the fluid comprises deionized (DI) water, a cleaning chemistry, or a combination thereof. In some embodiments, the fluid is atomized with a gas selected from dry nitrogen, compressed air, or carbon dioxide.

In some embodiments, the positioning system is configured to rotate the positioning system at a speed of about 1 RPM to 700 RPM. In some embodiments, the atomized fluid is sprayed at a volume flow rate of about 1 mL/min to about 1500 mL/min.

In some embodiments, the maintenance chamber further includes an end effector configured to carry the nozzle. In some embodiments, the nozzle is a first nozzle, and wherein the maintenance chamber further comprises a second nozzle. In some embodiments, the second nozzle is located on the end effector.

In some embodiments, the maintenance chamber includes a first wall and a second wall opposite the first wall, where the second nozzle is located on the second wall of the maintenance chamber.

In some embodiments, the nozzle is a first nozzle, and wherein the maintenance chamber further comprises a plurality of nozzles. In some embodiments, each nozzle of the plurality of nozzles is configured to target a predetermined location of the electroplating chuck.

In some embodiments, the predetermined location is selected from a seal of the chuck, a backside of the chuck, a body of the chuck, an electrical contact of the chuck, or a side of the chuck.

In some embodiments, the maintenance chamber further comprises a lid configured to prevent splash of the atomized fluid. In some embodiments, at least one nozzle of the plurality of nozzles is located on the lid. In some embodiments, the maintenance chamber is fully enclosed.

Also disclosed herein is a method for reducing contamination of an electroplating chuck inside a maintenance chamber, including placing the electroplating chuck inside the maintenance chamber, spraying the electroplating chuck with an atomized fluid from one or more nozzles, and dislodging or eroding contaminants on the electroplating chuck by mechanical interactions between atomized liquid droplets and the contaminants.

In some embodiments, the nozzle is configured to spray in a narrow spray pattern, a wide-angle spray pattern, a fan spring pattern, a ring spray pattern, or a combination thereof. In some embodiments, the nozzle is angled so that a direction of spray from the nozzle intersects with a plane of the chuck.

In some embodiments, the method further includes determining if the electroplating chuck is clean with one or more optical sensors, and, if it is determined that the electroplating chuck is not clean, directing the one or more nozzles to spray the atomized fluid toward the electroplating chuck.

In some embodiments, the method further includes repositioning the electroplating chuck inside the maintenance chamber with a positioning system. In some embodiments, the one or more nozzles are configured to dry one or more portions of the electroplating chuck after atomized fluid cleaning. In some embodiments, a separate nozzle (or tube) of the one or more nozzles is configured to deliver a high velocity stream of gas. The high velocity stream of gas may be used to dry the electroplating chuck.

Illustrated and described herein are devices, systems, and methods for reducing contamination of an electroplating chuck inside a maintenance chamber. In some embodiments, the electroplating chuck may include multiple components, such as a body, an elastomer liquid seal (or “seal”), and electrical contacts. In some embodiments, the maintenance chamber includes one or more nozzles configured to apply fluid, gas, or gas atomized fluid to one or more components (“predetermined locations”) of the electroplating chuck. In some embodiments, the maintenance chamber further includes a positioning system, to position the electroplating chuck inside the maintenance chamber. Gas atomized fluid spray cleaning is advantageous to extend useful life of electroplating hardware due to efficacious cleaning efficiency without chemistry. Absence of chemistry may also reduce cost of equipment and cost of ownership. It also reduces risk of cleaning chemistries remaining on a chuck components and contaminating plating baths or etching subsequent workpiece seed layers. However, embodiments with a chemical fluid in the gas atomized fluid spray are feasible and appropriate if chemistry assists in cleaning efficacy.

Turning now to the figures,is an example maintenance chamber, in accordance with the present technology. In some embodiments, the maintenance chamberincludes a space (or chamber), a positioning system, a bottom, a first wall Wand a second wall W. In some embodiments, the maintenance chamberfurther includes an end effector. In some embodiments, the end effectorholds one or more cleaning devices, such as nozzles, as described herein.

The maintenance chamberis configured to hold an electroplating chuck, as shown and described in detail in. In some embodiments, the electroplating chuckincludes a base, and a holderconfigured to retain a wafer. In some embodiments, the electroplating chuckhas a first side Sand a second side Sopposite the first side S. The electroplating chuckalso has a backside BS. In some embodiments, the maintenance chamberis configured to open the wafer chuck into an upper half and a lower half. This may be used to place and remove a wafer into the chuck. By opening the electroplating chuck (as shown in), the maintenance chamber may better access portions of the electroplating chuck to clean portions of the electroplating chuck.

In some embodiments, the positioning systemis a platform configured to hold the electroplating chuck. The positioning systemmay spin and/or move axially to position the electroplating chuckin proximity with the end effector. In some embodiments, the end effectorcan be moved to different radial position.

is an example electroplating chuck, in accordance with the present technology. In some embodiments, the electroplating chuckincludes a wafer backplateand a vacuum plateconfigured to hold a wafer, a seal, a side S, and a backside BS. One skilled in the art should recognize that the first side Sand the second side Sofrepresent orientations of the electroplating chuck, but as the electroplating chuckis substantially cylindrical, both the first side Sand the second side Smay be two locations on a single, continuous side S of the electroplating chuck. In some embodiments, the locations of the first side Sand the second side Smay be 180° apart.

In some embodiments, a wafer (such as wafer W in) is retained by a wafer backplateand further held in place with the seal. The chuck may retain the wafer by forming a vacuum seal between the wafer, the vacuum plate, the seal, and the wafer backplate. In some embodiments, the sealis an elastomer liquid seal. In some embodiments, contamination may build up on the seal, the backside BS, the holder, and/or the side S of the electroplating chuck.

is a cross section along lineC of a first side Sof, in accordance with the present technology. While only the first side Sis shown, it should be understood that the first side Sand the second side Smay have similar or identical components. As is shown in, in some embodiments, the electroplating chucka seal, a first side Sla backside BS, and one or more electrical contacts (or “contacts”). In some embodiments, the chuckfurther includes a first set of magnetsa second set of magnets. In some embodiments, the first set of magnetsand the second set of magnetsare configured to interact to hold the electroplating chucktogether. In some embodiments, the electroplating chuckis configured to hold a wafer W.

In some embodiments, the contactsand the sealare configured to be in contact with the wafer W.

are example maintenance chambers, in accordance with the present technology. In some embodiments, the maintenance chamberincludes an end effector, one or more optical sensors, a positioning systemconfigured to rotate, axially move, or both rotate and axially move an electroplating chuck.

In some embodiments, the positioning systemis a platform configured to hold the electroplating chuck. The positioning systemmay spin and/or move axially to position the electroplating chuckin proximity with the end effectorand/or nozzle. In some embodiments, the positioning systemis configured to rotate the electroplating chuck as one or more nozzles (such as nozzlein, first nozzleA, second nozzleB in, and/or plurality of nozzlesA,B,C in) sprays atomized fluid CF. In some embodiments, the positioning systemis configured to rotate the electroplating chuckat a speed of about 1 RPM to 700 RPM.

In some embodiments, the one or more nozzles ((such as nozzlein, first nozzleA, second nozzleB in, and/or plurality of nozzlesA,B,C in) are configured to dry one or more portions of the electroplating chuck after atomized fluid cleaning. In some embodiments, a separate nozzle (or tube) of the one or more nozzles is configured to deliver a high velocity stream of gas. The high velocity stream of gas may be used to dry the electroplating chuck. Advantageously, drying the wafer after spraying the atomized cleaning fluid and especially wafer contacts prevents wetting a seed layer on the next wafer, and potentially etching the seed layer.

In some embodiments, the end effectoris configured to move to different radial positions. For example, the end effectormay reposition the one or more nozzles (such as nozzlein, first nozzleA, second nozzleB in, and/or plurality of nozzlesA,B,C in) as the nozzle is rotated, to ensure that all surfaces of the electroplating chuck are cleaned. In some embodiments, the nozzle cleaning coverage is a path 2 mm wide so multiple rotations with the nozzle moved with the end effectormay be needed to clean the whole surface.

In some embodiments, the one or more optical sensorsare selected from one or more cameras, one or more light-emitting diode (LED) sensors, lasers including laser intensity detectors, or a combination thereof. In some embodiments, the one or more optical sensorsare configured to determine if the electroplating chuckhas been cleaned. In some embodiments, if it is determined that the electroplating chuck is not clean, one or more nozzles (such as nozzlein, first nozzleA, second nozzleB in, and/or plurality of nozzlesA,B,C in) to spray atomized fluid CF toward the electroplating chuck. In some embodiments, the fluid includes deionized (DI) water. In some embodiments, the fluid includes a cleaning chemistry. As used herein, a cleaning chemistry is a cleaning composition such as sulfuric acid, carbonic acid, sulfamic acid, and the like. In some embodiments, the fluid is atomized with a gas selected from dry nitrogen, compressed air, or carbon dioxide. In some embodiments, the atomized fluid CF is sprayed at a volume flow rate of about 1 mL/min to about 1500 mL/min. In some embodiments, a wall (shown as a triangular shaped wall above Wand Win) is a movable wall that is lowered to allow placement of the electroplating chuck. In some embodiments, the wall is raised during cleaning to contain mist/splash/etc.)

In some embodiments, the maintenance chamberfurther includes a chamber, a bottom, a first wall W, and a second wall Wopposite the first wall W.

In operation, the maintenance chamberis configured to hold the electroplating chuck. The electroplating chuckmay include at least a first side S, a second side Sopposite the first side S, a base, a backside BS, and a seal. It should be understood that electroplating chuckmay be electroplating chuckas shown and described in. One skilled in the art should understand components of electroplating chuckmay be omitted for clarity. In some embodiments, the maintenance chambercan have an exhaust of up toCFM to help contain any spray from leaving the chamber area.

is an example maintenance chamber having a nozzle. In some embodiments, the nozzleis located on the end effector. In some embodiments, the nozzleis configured to spray a fluid, gas, or gas atomized fluid (collectively, compressed fluid CF) onto the electroplating chuck. In some embodiments, the nozzleis configured to move about the end effector(as shown by the arrow in) so as to spray multiple predetermined locations of electroplating chuck. In some embodiments, the positioning systemis configured to spin the electroplating chuckas the nozzlesprays the electroplating chuck. While an arrow is shown, it should be understood that in some embodiments, nozzleis stationary.

In some embodiments, the maintenance chamberfurther includes a first nozzleA and a second nozzleB, as shown in. In some embodiments, both the first nozzleA and the second nozzleB are located on the end effector. In some embodiments, the first nozzleA is configured to spray the sealof the electroplating chuck, while the second nozzleB is configured to spray a backside BS of the electroplating chuck. It should be understood that the first nozzleA and the second nozzleB may be positioned to contact the same predetermined location or different predetermined locations of the electroplating chuck. In some embodiments, the second nozzleB is located on the second wall Wof the maintenance chamber from the end effector(as shown by nozzleC in). Predetermined locations of the electroplating chuckinclude, but are not limited to the first side S, the second side S, the backside, a holder (such as holder), the seal, one or more contacts (such as contactsA,B) or a combination thereof of the electroplating chuck.

In some embodiments, the maintenance chambermay include a plurality of nozzlesA,B,C, as shown in. In some embodiments, each nozzle of the plurality of nozzlesA,B,C) is directed towards a different predetermined location of the electroplating chuck. In some embodiments, a nozzleC of the plurality of nozzlesA,B,C is located on the second wall Wof the maintenance chamberfrom the end effector.

is an example maintenance chamberwith a lid, in accordance with the present technology. In some embodiments, the maintenance chamberincludes a chamber, a bottom, a first wall Wa second wall Wopposite the first wall W, and a positioning system. In some embodiments, the maintenance chamberfurther includes a lid. In some embodiments, the lidincludes one or more nozzlesA,B, one or more optical sensors, and a handle.

In some embodiments, the one or more nozzlesA,B are a first nozzleA and a second nozzleB. In some embodiments, the first nozzleA is directed towards a first side Sof the electroplating chuckand the second nozzleB is directed towards a second side Sof the electroplating chuck.

In some embodiments, the positioning systemis a platform configured to hold the electroplating chuck. The positioning systemmay spin and/or move axially to position the electroplating chuckin proximity with the one or more nozzlesA,B. In some embodiments, the positioning systemis configured to rotate the electroplating chuck as one or more nozzlesA,B spray atomized fluid CF. In some embodiments, the positioning systemis configured to rotate the electroplating chuckat a speed of about 1 RPM to 700 RPM.

In some embodiments, the lidis configured to rest on top of the maintenance chamber. In some embodiments, the lidand the maintenance chamberform a seal, so that the maintenance chamberis fully enclosed by the lid. In some embodiments, “fully enclosed” means the maintenance chamberand the lidform an airtight seal. In operation, the lidis configured to prevent splash of the atomized fluid.

are example nozzles, in accordance with the present technology. In some embodiments, the one or more nozzlemay be configured to spray in a narrow spray pattern (), a wide-angle spray pattern (), a fan spray pattern (), a ring spray pattern (), or a combination thereof.

shows a nozzlespraying atomized fluid CF in a narrow spray pattern. In some embodiments, the narrow spray pattern includes angle A and distance B. In some embodiments, angle A is maintained throughout distance B. Beyond B, the spray may become turbulent and project out. In some embodiments, nozzleincludes a tip. As shown in, the tipmay be rounded.

shows a nozzlespraying atomized fluid CF in a wide-angle spray pattern. In some embodiments, the tipmay be round and larger than tipof. In some embodiments, the atomized fluid CF extends outwards from tip.

shows a nozzlespraying atomized fluid CF in a fan spray pattern (of flat spray pattern). In some embodiments, the tipmay be shaped like a slit, as shown in. In some embodiments, A and B are widths at distances from the tip. The width B is larger than width A of the spray of atomized fluid CF.

show a nozzleconfigured to spray a ring spray pattern and spraying a ring spray pattern, respectively. In some embodiments, the nozzleincludes a tipand a plug.illustrates a front plan view of the nozzle. As shown in, the spray of atomized fluid CF extends outwards from the tip, around the plug.

is an example methodof reducing contamination of an electroplating chuck inside a maintenance chamber, in accordance with the present technology. In some embodiments, methodmay be performed with a maintenance chamber (such as maintenance chamber,,). In some embodiments, the maintenance chamber includes a positioning system (such as positioning system,,) one or more optical sensors (such as optical sensors,), and one or more nozzles (such as nozzle, first nozzleA, second nozzleB, plurality of nozzlesA,B,C, first nozzleA, and/or second nozzleB). In some embodiments, the maintenance chamber further includes a chamber (such as chamber,,) a first wall (such as first wall W), and a second wall (W). In some embodiments, the maintenance chamber may further include an end effector (such as end effector,) and/or a lid (such as lid).

In some embodiments, the maintenance chamber holds an electroplating chuck (such as electroplating chuck,,). In some embodiments, the electroplating chuck includes a seal (such as seal,,), a holder (such as holder), a backside (such as backside BS), a first side (S), a second side (S), a base (such as base,,), and/or one or more electrical contacts (such as contactsA,B).

In block, the electroplating chuck (or “chuck”) is placed into the maintenance chamber. In some embodiments, the electroplating chuck is placed inside the chamber and onto the positioning system.

Optionally, in block, the chuck is positioned with the positioning system. In some embodiments, positioning the chuck includes rotating or moving the chuck axially. In some embodiments, the positioning system is configured to spin (or rotate) the chuck, before, during, or after spraying the chuck. In some embodiments, the positioning system rotates the chuck at a speed of about 1 RPM to about 700 RPM.

In block, the chuck is sprayed with atomized fluid, fluid, or gas from one or more nozzles. In some embodiments, the fluid is DI water. In some embodiments, the fluid is a cleaning chemistry such as sulfuric acid, carbonic acid, sulfamic acid, and the like. In some embodiments, the atomized fluid is atomized with nitrogen, carbon dioxide, or compressed air. In some embodiments, the atomized fluid is sprayed at a volume flow rate of about 1 mL/min to about 1500 mL/min. In some embodiments, blocksandare performed simultaneously.

is another example methodof reducing contamination of an electroplating chuck inside a maintenance chamber. In some embodiments, methodmay be performed with a maintenance chamber (such as maintenance chamber,,). In some embodiments, the maintenance chamber includes one or more optical sensors (such as optical sensors,), and one or more nozzles (such as nozzle, first nozzleA, second nozzleB, plurality of nozzlesA,B,C, first nozzleA, and/or second nozzleB). In some embodiments, the maintenance chamber further includes a chamber (such as chamber,,) a first wall (such as first wall W), and a second wall (W). In some embodiments, the maintenance chamber may further include an end effector (such as end effector,) and/or a lid (such as lid).