Resonator Device

This application claims the priority benefit of Taiwan application serial no. 113116598, filed on May 3, 2024. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

The disclosure relates to an electronic element, and more particularly, to a resonator device.

A resonator is an electronic element that utilizes piezoelectric properties of a material and a natural resonance frequency of the material. Quartz is a common material used for the resonator. A quartz element has stable piezoelectric properties and may provide functions such as accurate and wide reference frequencies, clock control, timing function, and noise filtering. In addition, the quartz element may also be used as a sensor for vibration, pressure, etc. and an important optical element.

A working environment where resonator-related products are located is often close to systems such as wireless networks (Wifi) and Bluetooth. A temperature generated by the systems will be transmitted into a vibration area through metal traces of the product, causing thermal stress. As a result, an operating frequency of the product is affected. Especially with product trends of high frequency, high stability, and miniaturization nowadays, an issue of thermal stress cannot be ignored.

Therefore, how to avoid thermal stress concentration and reduce an impact of thermal stress transmitted to the vibration area on vibration characteristics of a chip is one of important issues of research and development in the art.

The disclosure provides a resonator device with good vibration characteristics.

A resonator device in the disclosure includes a crystal chip, two metal electrodes, and two groove portions. The crystal chip has a first surface and a second surface opposite to each other and includes a first area, a second area, and a third area. The second area surrounds the first area. The third area surrounds the second area. The second area is located between the first area and the third area. The two metal electrodes are respectively disposed on the first surface and the second surface. Each of the metal electrodes includes a first electrode portion, a connecting portion, and a second electrode portion. The first electrode portion is disposed in the first area. The connecting portion is disposed in the second area. The second electrode portion is disposed in the third area. The connecting portion connects the first electrode portion and the second electrode portion, and the second electrode portion extends to an edge of the crystal chip. The two groove portions are respectively disposed on the first surface and the second surface, and are disposed in the second area. A depth of each of the groove portions is equal to a thickness of each of the metal electrodes.

In an embodiment of the disclosure, the second area is directly adjacent to and completely surrounds the first area. The third area is directly adjacent to and completely surrounds the second area. The first area, the second area, and the third area do not overlap each other.

In an embodiment of the disclosure, the first electrode portion completely covers the first area.

In an embodiment of the disclosure, the first electrode portion is rectangular.

In an embodiment of the disclosure, the first electrode portion has four corner portions, and the corner portions are right angles or rounded corner.

In an embodiment of the disclosure, an area of the connecting portion accounting for an area of the second area is greater than or equal to 1% and less than 100%.

In an embodiment of the disclosure, an area of the connecting portion accounting for an area of the second area is greater than or equal to 5% and less than or equal to 50%.

In an embodiment of the disclosure, an area of the second electrode portion accounting for an area of the third area is greater than or equal to 25%.

In an embodiment of the disclosure, an edge of the third area is aligned with edges of the first surface and the second surface.

In an embodiment of the disclosure, each of the groove portions includes a first section, a second section, a third section, and a fourth section connected to each other in sequence. The first section and the third section extend along a first direction. The second section and the fourth section extend along a second direction perpendicular to the first direction. The first section, the second section, the third section, and the fourth section form multiple bends. The connecting portion is located between the first section and the fourth section to separate the first section and the fourth section.

In an embodiment of the disclosure, the resonator device further includes an opening portion disposed on the first surface and disposed in the third area. A depth of the opening portion is equal to the thickness of each of the metal electrodes.

In an embodiment of the disclosure, the crystal chip has multiple corners, and the opening portion corresponds to at least one of the corners.

In an embodiment of the disclosure, the crystal chip has multiple sides, and the opening portion extends to at least one of the sides.

In an embodiment of the disclosure, the crystal chip has multiple sides, and the second electrode portion extends to at least one of the sides.

In an embodiment of the disclosure, the resonator device further includes at least one conductive adhesive corresponding to the second surface.

Based on the above, in the resonator device according to the disclosure, the upper and lower surfaces of the crystal chip are provided with the metal electrodes surrounding the main vibration area along the edge of the crystal chip, which may avoid thermal stress concentration, reduce the impact of the thermal stress transmitted to the vibration area on the vibration characteristics of the crystal chip, and achieve the purpose of increasing the thermal conductivity to optimize the temperature uniformity and regulating the secondary wave frequency to achieve the chip design with the wide temperature range.

In order for the aforementioned features and advantages of the disclosure to be more comprehensible, embodiments accompanied with drawings are described in detail below.

is a schematic perspective view of a resonator device according to an embodiment of the disclosure.is a schematic perspective view of the resonator device infrom another viewing angle., for example, shows the resonator device inflipped 180 degrees to show a structure therebehind. Referring to, a resonator devicein this embodiment includes a crystal chip, two metal electrodes, two groove portions, an opening portion, and at least one conductive adhesive. The crystal chiphas a first surfaceand a second surfaceopposite to each other. The two metal electrodesare respectively disposed on the first surfaceand the second surface. The two groove portionsare respectively disposed on the first surfaceand the second surface. In this embodiment, a material of the crystal chipis a piezoelectric material, such as quartz crystal or other piezoelectric materials.

In an embodiment, the resonator devicemay further include a base and an upper cover. The crystal chipis disposed on the base through the conductive adhesive, and the upper cover is assembled to the base and covers the crystal chip. An area between the two metal electrodesis, for example, a vibration area. When a voltage difference is applied between the two metal electrodes, the vibration area will be deformed due to an inverse piezoelectric effect. Then, when the voltage difference is removed, the vibration area will vibrate, and due to a piezoelectric effect, a voltage changes between the two metal electrodeswith the vibration, so that the two metal electrodesoutput voltage signals. An operation and implementation of a resonator element may be sufficiently taught, suggested, and implemented by persons with ordinary knowledge in the art, so no further description is incorporated herein.

are schematic front views of the resonator device in.is a schematic cross-sectional view of the resonator device intaken along a line A-A.is a schematic cross-sectional view of the resonator device intaken along a line B-B.

Referring tofirst, in this embodiment, the crystal chipincludes a first area Z, a second area Z, and a third area Z. The second area Zsurrounds the first area Z. The third area Zsurrounds the second area Z. The second area Zis located between the first area Zand the third area Z. An edge of the third area Zis aligned with edges of the first surfaceand the second surface. Specifically, the second area Zis directly adjacent to and completely surrounds the first area Z, the third area Zis directly adjacent to and completely surrounds the second area Z, and the first area Z, the second area Z, and the third area Zdo not overlap each other. It should be noted that in, the metal electrodes on the crystal chip are omitted and shown with dots of different densities to facilitate display and identification of the first area, the second area, and the third area.

Referring to, in this embodiment, the metal electrodeincludes a first electrode portion, a connecting portion, and a second electrode portion. The first electrode portionis disposed in the first area Z. The connecting portionis disposed in the second area Z. The second electrode portionis disposed in the third area Z. The connecting portionconnects the first electrode portionand the second electrode portion.

In this embodiment, the first electrode portioncompletely covers the first area Z. The first electrode portionis, for example, rectangular, but the disclosure is not limited thereto. In this embodiment, the first electrode portionhas four corner portions, and the corner portions are right angles. However, in other embodiments, the corner portions may also be rounded corners, and the disclosure is not limited thereto.

In this embodiment, the two groove portionsare disposed in the second area Z. Referring to, a depth Hof the groove portionis equal to a thickness Wof each of the metal electrodes, so that the first surfaceand the second surfaceof the crystal chipare exposed. Referring to, specifically, the groove portionincludes a first section, a second section, a third section, and a fourth sectionconnected to each other in sequence. The first sectionand the third sectionextend along a first direction N. The second sectionand the fourth sectionextend along a second direction N. The first section, the second section, the third section, and the fourth sectionform multiple bends to surround the first electrode portion.

In this embodiment, the connecting portionis located between the first sectionand the fourth sectionto separate the first sectionand the fourth section. In other embodiments, a shape of the connecting portionmay be appropriately adjusted, and the disclosure is not limited thereto. In an embodiment, an area of the connecting portionaccounting for an area of the second area Zis greater than or equal to 1% and less than 100%, but the disclosure is not limited thereto. In another embodiment, the area of the connecting portionaccounting for the area of the second area Zis greater than or equal to 5% and less than or equal to 50%, but the disclosure is not limited thereto.

In this embodiment, the second electrode portionextends to an edge of the crystal chip. Specifically, the crystal chiphas a first side S, a second side S, a third side S, and a fourth side S. The first side Sand the third side Sextend along the first direction N. The second side Sand the fourth side Sextend along the second direction Nperpendicular to the first direction N. The second electrode portionextends to the first side S, the second side S, the third side S, and the fourth side S.

In this embodiment, the opening portionis disposed on the first surfaceand disposed in the third area Z. That is to say, the second electrode portiondoes not completely cover the third area Z. In fact, the third area Zis further provided with the opening portion. In an embodiment, an area of the second electrode portionaccounting for an area of the third area Zis greater than or equal to 25%, but the disclosure is not limited thereto.

Referring to, in this embodiment, a depth Hof the opening portionis equal to the thickness Wof each of the metal electrodes, so that the first surfaceof the crystal chipis exposed. In other words, the depth Hof the opening portionis equal to the depth Hof the groove portion, and the opening portionand the groove portionmay be regarded as hollow areas on the crystal chip. However, the disclosure is not limited thereto.

Referring to, in this embodiment, the opening portionextends to the first side Sand the fourth side S. For example, the crystal chiphas multiple corners R, R, R, and R. The opening portioncorresponds to at least one of the corners, for example, the corner R, but the disclosure is not limited thereto.

In this embodiment, the conductive adhesivecorresponds to the second surfaceand the fourth side S, and includes a first colloidand a second colloid. The first colloidcorresponds to the opening portion, but the disclosure is not limited thereto.

In addition, in this embodiment, the first area Zcorresponds to a center position of the crystal chip. The first electrode portionhas a first side edgeand a second side edgerespectively corresponding to the second side Sand the fourth side S. A first distance Xbetween the first side Sand the first side edgeis greater than a second distance Xbetween the second side Sand the second side edge. That is to say, the first electrode portionis disposed eccentrically and is slightly away from the fourth side Sprovided with the conductive adhesive, but the disclosure is not limited thereto.

Under the above configuration, upper and lower surfaces of the crystal chipare provided with a metal layer structure surrounding a main vibration area along the edge of the crystal chipto increase a thermal conduction area for thermal conduction, which may prevent thermal stress from being concentrated in a peripheral area of the crystal chipclose to the conductive adhesive, reduce an impact of the thermal stress transmitted to the vibration area on vibration characteristics of the crystal chip, and achieve a purpose of increasing thermal conductivity to optimize temperature uniformity and regulating a secondary wave frequency to achieve a chip design with a wide temperature range.

Other embodiments are provided below for description. It is noted that some of the reference numerals and descriptions of the above embodiment will apply to the following embodiments. The same reference numerals will represent the same or similar components and the descriptions of the same technical contents will be omitted. Reference may be made to the above embodiment for the omitted descriptions, which will not be repeated in the following embodiments.

are schematic perspective views of multiple resonator devices according to other embodiments of the disclosure. Referring tofirst, in this embodiment, a resonator deviceB is slightly different from the resonator devicein. A main difference lies in configurations of a metal electrodeB and an opening portionB.

In, the opening portionis a rectangle, but the disclosure is not limited thereto. In this embodiment, the opening portionB is disposed on the first surfaceand includes a first portionB and a second portionB connected to each other. The first portionB and the second portionB have an included angle facing the fourth side S. The included angle is less than 180 degrees to form a triangle, but the disclosure is not limited thereto. Other portions on the third area Z() except the opening portionB are covered by the metal electrodeB, but the disclosure is not limited thereto.

Referring to, in this embodiment, a resonator deviceC is slightly different from the resonator deviceB in. A main difference lies in configurations of a metal electrodeC and an opening portionC.

In this embodiment, the opening portionC is disposed on the first surfaceand includes a first portionC, a second portionC, and a third portionC connected to each other. The first portionC and the third portionC are parallel to the first direction N, and the second portionC is parallel to the second direction N, so as to form a C shape. However, the disclosure is not limited thereto. The other portions on the third area Z() except the opening portionC are covered by the metal electrodeC, but the disclosure is not limited thereto.

is a schematic perspective view of a resonator device according to an embodiment of the disclosure.is a schematic front view of the resonator device in. Referring to, in this embodiment, a resonator deviceD is slightly different from the resonator devicein. A main difference lies in configurations of a metal electrodeD and an opening portionD.

In this embodiment, the opening portionD includes a first portionD, a second portionD, and a third portionD connected to each other, which respectively correspond to and extend to the second side S, the third side S, and the fourth side S. Here, the opening portionD and the groove portionjointly form the hollow area to expose the crystal chip.

In other words, a second electrode portionD of the metal electrodeD extends to the first side S, the second side S, and the fourth side S, and does not extend to the third side S. That is to say, the second electrode portionD is C-shaped, but the disclosure is not limited thereto.

is a schematic perspective view of a resonator device according to an embodiment of the disclosure. Referring to, in this embodiment, a metal electrodeE includes a first electrodeE, a second electrode portionE, and a connecting portionE. The connecting portionE corresponds to the second colloid, and other portions on the second area Z() except the connecting portionE are groove portionsE. The opening portion is omitted in a resonator deviceE, and the second electrode portionE is annular. However, the disclosure is not limited thereto.

Based on the above, in the resonator device according to the disclosure, the upper and lower surfaces of the crystal chip are provided with the metal electrodes surrounding the main vibration area along the edge of the crystal chip to increase the thermal conduction area for the thermal conduction, which may prevent the thermal stress from being concentrated in the peripheral area of the crystal chip close to the conductive adhesive, reduce the impact of the thermal stress transmitted to the vibration area on the vibration characteristics of the crystal chip, and achieve the purpose of increasing the thermal conductivity to optimize the temperature uniformity and regulating the secondary wave frequency to achieve the chip design with the wide temperature range.

Although the disclosure has been described with reference to the above embodiments, they are not intended to limit the disclosure. It will be apparent to one of ordinary skill in the art that modifications to the described embodiments may be made without departing from the spirit and the scope of the disclosure. Accordingly, the scope of the disclosure will be defined by the attached claims and their equivalents and not by the above detailed description.