Thermal Management Case System for Portable Electronic Device

A case system for a portable electronic device includes (I) a front assembly including (A) a first side, (B) a second side extending perpendicular with respect to the first side, (C) a third side extending parallel with respect to the first side, (D) a fourth side extending parallel with the respect to the second side, and (E) a base extending perpendicular to and having an interior extending between the first side, the second side, the third side, and the fourth side, wherein the base includes a first portion having a thermal conductivity of at least 30 W/m.K, and wherein the first portion of the base includes at least 30% of the interior of the base.

In implementations the first portion of the base includes an aluminum alloy. In implementations the first portion of the base has a thermal conductivity of at least 100 W/m.K. In implementations the first portion of the base includes a copper alloy. In implementations the first portion of the base includes at least 50% of the interior of the base. In implementations the first portion of the base includes at least 75% of the interior of the base. Implementations further include at least one air mover positioned adjacent the first side. Implementations further include at least one air mover positioned midway between the first side and the third side. In implementations the base includes an exterior with a plurality of corrugated fins extending between the first side and the third side. In implementations the base includes a plurality of exterior corrugated longitudinal fins. Implementations further include a plate covering a portion of the plurality of exterior corrugated longitudinal fins. In implementations the first portion of the base includes a brass alloy. In implementations the first portion of the base includes a carbon fiber material. In implementations the first portion of the base includes a steel alloy.

A case system for a portable electronic device includes (I) a front assembly including (A) a first side, (B) a second side extending perpendicular with respect to the first side, (C) a third side extending parallel with respect to the first side, (D) a fourth side extending parallel with the respect to the second side, and (E) a base extending perpendicular to and having an interior extending between the first side, the second side, the third side, and the fourth side, wherein the base includes a first portion having a thermal conductivity of at least 30 W/m.K. In implementations the first portion of the base includes at least 50% of the interior of the base. Implementations further include at least one air mover positioned adjacent the first side.

A case system for a portable electronic device includes (I) a front assembly including (A) a first side, (B) a second side extending perpendicular with respect to the first side, (C) a third side extending parallel with respect to the first side, (D) a fourth side extending parallel with the respect to the second side, and (E) a base extending perpendicular to and having an interior extending between the first side, the second side, the third side, and the fourth side, wherein the base includes a first metallic portion, and wherein the first portion of the base includes at least 30% of the interior of the base. In implementations the first portion of the base has a thermal conductivity of at least 100 W/m.K. In implementations the base includes an exterior with a plurality of corrugated fins extending between the first side and the third side.

In addition to the foregoing, other aspects are described in the claims, drawings, and text forming a part of the disclosure set forth herein. Various other aspects are set forth and described in the teachings such as text (e.g., claims and/or detailed description) and/or drawings of the present disclosure. The foregoing is a summary and thus may contain simplifications, generalizations, inclusions, or omissions of detail; consequently, those skilled in the art will appreciate that the summary is illustrative only and is NOT intended to be in any way limiting. Other aspects, features, and advantages of the devices and/or processes and/or other subject matter described herein will become apparent in the teachings set forth herein.

For a more complete understanding of implementations, reference now is made to the following descriptions taken in connection with the accompanying drawings. The use of the same symbols in different drawings typically indicates similar or identical items, unless context dictates otherwise.

With reference now to the figures, shown are one or more examples of Thermal Management Case System for Portable Electronic Device, articles of manufacture, compositions of matter for same that may provide context, for instance, in introducing one or more processes and/or devices described herein.

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative implementations described in the detailed description, drawings, and claims are not meant to be limiting. Other implementations may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented here.

Turning to, depicted therein is a front perspective view of thermal management case system for portable electronic device. Depicted implementation of thermal management case system for portable electronic deviceis shown to include side, side, side, side, and base. Depicted implementation of baseis shown to include interior planar surface of thermally conductive portionand aperture.

Of note, implementations of thermally conductive portions of various bases depicted herein can be characterized as being of materials with thermal conductivities significantly exceeding those of conventional case materials. For instance, thermal conductivities (expressed in “Watts/(meter×Kelvin)” or ‘W/m.K”) of conventional case materials include 0.3 W/m.K for polyamide (nylon), 0.21 W/m.K for acrylonitrile butadiene styrene (ABS), 0.21 W/m.K for polycarbonate, 0.4 W/m.K for polyethylene terephthalate, and 0.29 W/m.K for polyurethane. (From following source: EngineerExcel, Charlie Young et al. (2023 Dec. 7). Thermal conductivity of plastics. EngineerExcel. https://engineerexcel.com/thermal-conductivity-plastic/).

In contrast, implementations of thermally conductive portions of various bases depicted herein can include materials, mixtures, alloys with much higher thermal conductivities such as materials, mixtures, or alloys of 235 W/m.K for aluminum, 109 W/m.K for brass, 100 W/m.K for carbon fiber, 401 W/m.K for copper, 314 W/m.K for gold, 67 W/m.K for iron, 35 W/m.K for lead, 91 W/m.K for nickel, 428 W/m.K for silver, 14 W/m.K for stainless steel, 43 W/m.K for steel, etc. (From following source:. Material Properties. (2021 Mar. 17). https://material-properties.org/thermal-conductivity-of-materials/).

Turning to, depicted therein is a rear perspective view of thermal management case system for portable electronic device. Depicted implementation of baseis shown to include exterior planar surface of thermally conductive portion.

Turning to, depicted therein is a rear perspective of portable electronic device. Depicted implementation of portable electronic deviceis shown to include side, side, side, side, and back. Depicted implementation of backis shown to include image input.

Turning to, depicted therein is a front perspective of the portable electronic device of. Depicted implementation of portable electronic deviceis shown to include display

Turning to, depicted therein is a front perspective view of thermal a management case system for portable electronic device ofcoupled with portable electronic device of.

Turning to, depicted therein is a top-elevational cross-sectional view of the thermal management case system for portable electronic device ofcoupled with portable electronic device oftaken along the-cutline of.

Turning to, depicted therein is a rear perspective view of a thermal management case system for portable electronic device coupled with portable electronic device of. Depicted implementation of thermal management case system for portable electronic deviceis shown to include side, side, side, side, and base. Depicted implementation of baseis shown to include exterior corrugated fin surface of thermally conductive portion.

Turning to, depicted therein is a top-elevational cross-sectional view of the thermal management case system for portable electronic device ofcoupled with portable electronic device oftaken along the-cutline of. Depicted implementation of baseis shown to include interior planar surface of thermally conductive portion.

Turning to, depicted therein is a rear perspective view of a thermal management case system for portable electronic device coupled with portable electronic device of. Depicted implementation of thermal management case system for portable electronic deviceis shown to include side, side, side, side, and base. Depicted implementation of baseis shown to include exterior corrugated fin surface of thermally conductive portion, and standoff.

Turning to, depicted therein is a top-elevational cross-sectional view of the thermal management case system for portable electronic device ofcoupled with portable electronic device oftaken along the-cutline of. Depicted implementation of baseis shown to include interior planar surface of thermally conductive portion.

Turning to, depicted therein is a rear perspective view of a thermal management case system for portable electronic device coupled with portable electronic device of. Depicted implementation of thermal management case system for portable electronic deviceis shown to include side, side, side, side, and base. Depicted implementation of baseis shown to include exterior corrugated fin surface of thermally conductive portion, cover plate, and standoff. Depicted implementation of exterior corrugated fin surface of thermally conductive portionis shown to include air passage, air passage, and air passage

Turning to, depicted therein is a top-elevational cross-sectional view of the thermal management case system for portable electronic device ofcoupled with portable electronic device oftaken along the-cutline of. Depicted implementation of baseis shown to include interior planar surface of thermally conductive portion.

Turning to, depicted therein is an exploded rear perspective view of a thermal management case system for portable electronic device. Depicted implementation of thermal management case system for portable electronic deviceis shown to include side, side, side, side, and base. Depicted implementation of baseis shown to include exterior corrugated fin surface of thermally conductive portion, fan area, standoff, cover plate, axial fan air mover, screened cover, and exterior planar surface of thermally conductive portion. Implementations of axial fan air moverand the other air movers described herein can be powered by electrical power sources such as electrical batteries, USB or Apple lightning cabled sources, AC-to-DC power converters, etc.

Turning to, depicted therein is a partial exploded rear perspective view of the thermal management case system for portable electronic device of. Depicted implementation of exterior corrugated fin surface of thermally conductive portionis shown to include air passage, and air passage

Turning to, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of. Implementations of axial fan air moverare so positioned with gapped separation to allow for air passage between axial fan air moverand exterior planar surface of thermally conductive portion.

Turning to, depicted therein is an exploded rear perspective view of a thermal management case system for portable electronic device. Depicted implementation of thermal management case system for portable electronic deviceis shown to include side, side, side, side, and base. Depicted implementation of baseis shown to include exterior corrugated fin surface of thermally conductive portion, fan area, exterior corrugated fin surface of thermally conductive portion, standoff, cover plate, axial fan air mover, and exterior planar surface of thermally conductive portion.

Turning to, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of. Depicted implementation of exterior corrugated fin surface of thermally conductive portionis shown to include air passage, and air passage. Implementations of axial fan air moverare so positioned with gapped separation to allow for air passage between axial fan air moverand exterior planar surface of thermally conductive portion.

Turning to, depicted therein is a partial rear perspective view of a thermal management case system for portable electronic device. Depicted implementation of thermal management case system for portable electronic deviceis shown to include side, side, side, side, and base. Depicted implementation of baseis shown to include exterior corrugated fin surface of thermally conductive portion,, centrifugal fan air mover, and exterior planar surface of thermally conductive portion. Depicted implementation of centrifugal fan air moveris shown to include air inlet, side, side, and air outlet

Turning to, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of. Depicted implementation of baseis shown to include cover plate, and exterior corrugated fin surface of thermally conductive portionis shown to include air passage, and air passage

Turning to, depicted therein is a partial rear perspective view of a thermal management case system for portable electronic device. Depicted implementation of thermal management case system for portable electronic deviceis shown to include side, side, side, side, and base. Depicted implementation of baseis shown to include exterior corrugated fin surface of thermally conductive portion, standoff, air area, piezoelectric-based flapping fan air mover(such as related to, but not limited to, technological developments by Mide Technology Corporation, Woburn, MA), and exterior planar surface of thermally conductive portion. In implementations, it may be preferred to keep piezoelectric-based flapping fan air moveruncovered as shown inrather than covered as shown in.

Turning to, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of. Depicted implementation of exterior corrugated fin surface of thermally conductive portionis shown to include air passage, and air passage. Depicted implementation of air areais shown to include air passage, and air passage. Depicted implementation of baseis shown to include cover plate.

Turning to, depicted therein is a partial rear perspective view of a thermal management case system for portable electronic device. Depicted implementation of baseis shown to include centrifugal fan air mover.

Turning to, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of. Depicted implementation of baseis shown to include cover plate.

Turning to, depicted therein is an exploded rear perspective view of a thermal management case system for portable electronic device. Depicted implementation of thermal management case system for portable electronic deviceis shown to include side, side, side, side, and base

Depicted implementation of baseis shown to include exterior corrugated fin surface of thermally conductive portion, standoff, air mover area, piezoelectric-based vibrating-thin-membranes fan air mover assembly(such as related to, but not limited to, technological developments by Frore Systems Inc, San Jose, CA), cover plate, and exterior planar surface of thermally conductive portion. Depicted implementation of piezoelectric-based vibrating-thin-membranes fan air mover assemblyis shown to include air intake, and air outlet

Turning to, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of. Depicted implementation of exterior corrugated fin surface of thermally conductive portionis shown to include air passage, and air passage

Turning to, depicted therein is a front perspective view of a thermal management case system for portable electronic deviceof larger size than portable electronic device. Depicted implementation of thermal management case system for portable electronic deviceis shown to include side, side, side, side, and base. Depicted implementation of baseis shown to include interior planar surface of thermally conductive portion, and aperture.

Turning to, depicted therein is a rear perspective view of the thermal management case system for portable electronic device of. Depicted implementation of baseis shown to include exterior planar surface of thermally conductive portion. Implementations of thermal management case systems depicted incan be sized accordingly to equivalent sizing of thermal management case system for portable electronic devicerelative to sizing of thermal management case system for portable electronic device.

While particular aspects of the present subject matter described herein have been shown and described, it will be apparent to those skilled in the art that, based upon the teachings herein, changes and modifications may be made without departing from the subject matter described herein and its broader aspects and, therefore, the appended claims are to encompass within their scope all such changes and modifications as are within the true spirit and scope of the subject matter described herein. It will be understood by those within the art that, in general, terms used herein, and especially in the appended claims (e.g., bodies of the appended claims) are generally intended as “open” terms (e.g., the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “includes but is not limited to,” etc.). It will be further understood by those within the art that if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. For example, as an aid to understanding, the following appended claims may contain usage of the introductory phrases “at least one” and “one or more” to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim recitation to claims containing only one such recitation, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an” (e.g., “a” and/or “an” should typically be interpreted to mean “at least one” or “one or more”); the same holds true for the use of definite articles used to introduce claim recitations. In addition, even if a specific number of an introduced claim recitation is explicitly recited, those skilled in the art will recognize that such recitation should typically be interpreted to mean at least the recited number (e.g., the bare recitation of “two recitations,” without other modifiers, typically means at least two recitations, or two or more recitations). Furthermore, in those instances where a convention analogous to “at least one of A, B, and C, etc.” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., “a system having at least one of A, B, and C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). In those instances where a convention analogous to “at least one of A, B, or C, etc.” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., “a system having at least one of A, B, or C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). It will be further understood by those within the art that typically a disjunctive word and/or phrase presenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms unless context dictates otherwise. For example, the phrase “A or B” will be typically understood to include the possibilities of “A” or “B” or “A and B.”

With respect to the appended claims, those skilled in the art will appreciate that recited operations therein may generally be performed in any order. Also, although various operational flows are presented in a sequence(s), it should be understood that the various operations may be performed in other orders than those which are illustrated, or may be performed concurrently. Examples of such alternate orderings may include overlapping, interleaved, interrupted, reordered, incremental, preparatory, supplemental, simultaneous, reverse, or other variant orderings, unless context dictates otherwise. Furthermore, terms like “responsive to,” “related to,” or other past-tense adjectives are generally not intended to exclude such variants, unless context dictates otherwise.