Surgical Devices Including Sealed Electronic Components

This disclosure generally relates to surgical devices, and more particularly, to seal assemblies for electronic components of reusable surgical devices.

Powered surgical devices include electronic components, such as printed circuit boards, switches, sensors, etc. to enhance the control of functions of the surgical devices. For example, force sensors (e.g., load reading sensors) have been used to enhance control of functions in a surgical device, such as a surgical stapling instrument. By using a force sensor, the clamping, stapling, and cutting forces of the surgical device can be monitored and used to facilitate these various functions. The force sensor can be used to detect pre-set loads and cause the surgical device to react in response thereto. For example, during clamping of thick tissue, the load will rise to a pre-determined limit where the surgical device can slow clamping to maintain the clamping force as the tissue relaxes. This allows for clamping of thick tissue without damaging the tissue (e.g., serosa tears). One such example is the firing of a circular stapler type surgical device to create an anastomosis for a powered EEA device (e.g., End-to-End Anastomosis device). The intelligence of such a surgical device is at a higher product cost compared to currently available disposable units and thus would benefit if such intelligent devices are reusable.

Reusable surgical devices must be cleaned (e.g., disinfected) using high pH solutions and sterilized prior to subsequent uses. The most common method of sterilization is the use of autoclaving. Autoclaving utilizes high pressure superheated steam (e.g., 37 PSI @ 137° C. for 18 minutes). Such an environment is known to damage electronic components. For example, surgical devices may suffer from moisture ingress during cleaning and/or sterilizing procedures which, in turn, may corrode and/or degrade the electronic components.

It would be beneficial if the durability of the electronic components of reusable surgical devices is enhanced to withstand cleaning and sterilization procedures (e.g., the electronic components are protected from high temperatures, steam, and/or moisture), thereby improving the reliability of the electronic components and/or extending the effective cycle life of the surgical device.

Electronic assemblies of this disclosure are sealed to withstand environmental stresses associated with high pH cleaning and sterilization (e.g., autowashing and/or autoclaving), minimizing or eliminating the ingress of fluids during such processes and/or increasing the moisture resistance of the electronic assemblies thereby rendering the electronic assemblies more durable for re-use. Seal assemblies of this disclosure provide a low cost, robust, and easy to manufacture method of protecting electronic components and electronic connections between electronic components in wet or harsh environments.

In aspects, seal assemblies of the disclosure include an encapsulate and a housing. The encapsulate is used to cover and protect electronic components (e.g., a force sensor, a flex cable, etc.) and electronic connections (e.g., solder connections) between the electronic components. The encapsulate prevents contact of the electronic components and the electronic connections to wet or harsh environments in which the electronic components may corrode or degrade, or various traces can become short circuited due to the conduction of water, bodily fluids, saline, etc. The encapsulate must also withstand the harsh environments associated with cleaning and sterilization as the encapsulate may break down by repeated or prolonged contact with the harsh environments. Accordingly, the housing of the seal assemblies cover a majority of the encapsulate that would be exposed to the harsh environments thereby reducing the exposed surface area of the encapsulate to the harsh environments.

In one aspect of this disclosure, an electronic assembly includes a first electronic component, a second electronic component, and a seal assembly. The first electronic component includes a substrate and a first electrical connecting portion secured to the substrate, and the second electronic component includes a second electrical connecting portion connected to the first electrical connecting portion forming an electronic connection between the first and second electronic components. The seal assembly includes a housing and an encapsulate. The housing defines a cavity and has one or more open sides. The housing is positioned over the electronic connection and is mated to the substrate resulting in a single open side. The encapsulate is disposed within the cavity of the housing and covers the electronic connection. The encapsulate seals closed the single open side of the housing.

The first electronic component may be a sensor and/or the second electronic component may be a flexible electrical cable. The electronic connection between the first and second electronic components may be a solder connection.

In some aspects, the one or more open sides of the housing of the seal assembly includes an open bottom and an open end. The housing is positioned over the electronic connection with the open bottom positioned against the substrate of the first electronic component thereby closing the open bottom.

In some aspects, the housing is force mated to the substrate to form a seal between the housing and the substrate. The housing may include a rib disposed within the cavity that forms an interference fit between the housing and the first electrical connecting portion of the first electronic component. The seal assembly may further include a gasket forming a mated seal of the housing to the substrate. The housing may further include a living hinge.

The encapsulate may be formed using a curable liquid resin. In some aspects, the encapsulate is only exposed outside of the housing at an interface of the encapsulate with the single open side of the housing. The second electronic component may extend out of the seal assembly through the encapsulate closing the single open side of the housing.

In another aspect of this disclosure, a method of sealing an electronic connection between a first electronic component and a second electronic component includes: positioning a housing of a seal assembly over an electronic connection formed between a first electrical connecting portion of a first electronic component and a second electrical connecting portion of a second electronic component, the housing defining a cavity therein and having one or more open sides, wherein positioning the housing over the electronic connection results in the housing having a single open side; and filling the single open side of the housing with an encapsulate of the seal assembly to encapsulate the electronic connection and seal close the single open side of the housing.

The method may further include soldering the first and second electrical connecting portions together to form a solder connection.

In some aspects, the one or more open sides of the housing of the seal assembly includes an open bottom, and positioning the housing over the electronic connection includes positioning the open bottom of the housing against the substrate of the first electronic component to close the open bottom. In certain aspects, the one or more open sides of the housing of the seal assembly includes an open end, and positioning the housing over the electronic connection includes facing the open end of the housing towards the electronic connection and sliding the housing onto the substrate and over the electronic connection.

The method may further include force mating the housing to the substrate to form a seal between the housing and the substrate.

The method may further include curing the encapsulate after filling the housing with the encapsulate. In some aspects, the second electronic component extends out of the seal assembly through the single open side of the housing, and filling the single open side of the housing with the encapsulate includes pouring the encapsulate around a portion of the second electronic component extending through the single open side of the housing.

In yet another aspect of this disclosure, a surgical device includes a handle assembly, an adapter assembly extending from the handle assembly, an end effector releasably secured to the adapter assembly, and an electronic assembly disposed within the adapter assembly. The electronic assembly is configured to enable communication between the handle assembly and the end effector. The electronic assembly includes a first electronic component, a second electronic component, and a seal assembly. The first electronic component includes a substrate and a first electrical connecting portion secured to the substrate, and the second electronic component includes a second electrical connecting portion connected to the first electrical connecting portion forming an electronic connection between the first and second electronic components. The seal assembly includes a housing and an encapsulate. The housing defines a cavity and has one or more open sides. The housing is positioned over the electronic connection and is mated to the substrate resulting in a single open side. The encapsulate is disposed within the cavity of the housing and covers the electronic connection. The encapsulate seals closed the single open side of the housing.

The details of one or more aspects of this disclosure are set forth in the accompanying drawings and the description below. Other aspects, as well as features, objects, and advantages of the aspects described in this disclosure will be apparent from the description and drawings, and from the claims.

The electronic assemblies of this disclosure of, e.g., surgical devices, include electronic components and/or electronic connections between electronic components that are protected from harsh environments, such as autowashing and/or autoclaving. The electronic components and/or electronic connections are covered by a seal assembly to create a protective barrier for the electronic components and/or electronic connections, and to prevent contact of these electronic components and/or electronic connections to wet or harsh environments.

While seal assemblies of this disclosure are described with respect to sealing a force sensor and a flex cable, as well as the electronic connection between the force sensor and the flex cable, it should be understood that the seal assemblies of this disclosure are applicable for use with any electronic component(s) and/or electronic connection between electronic components in any portion of a reusable surgical or medical instrument requiring protection from wet or harsh environments.

Aspects of this disclosure are now described in detail with reference to the drawings in which like reference numerals designate identical or corresponding elements in each of the several views. Throughout this description, the term “proximal” refers to a portion of a device, or component thereof, that is closer to a hand of a user, and the term “distal” refers to a portion of the device, or component thereof, that is farther from the hand of the user. Directional reference terms, such as “upper” “lower” and the like, are used to ease description of aspects of the disclosure and are not intended to have any limiting effect on the ultimate orientation of a structure or any part thereof. Additionally, it should be understood that various components of this disclosure, such as those numbered in theseries or plainly numbered, correspond to components of the disclosure similarly numbered in the,,series or prime numbered, such that redundant explanation of similar or identical components need not be repeated herein.

Turning now to, a surgical device, in accordance with an aspect of this disclosure, is in the form of a powered handheld electromechanical instrument. The surgical deviceincludes a powered handle assembly, a tool assembly or end effector, and an adapter assemblyinterconnecting the powered handle assemblyand the end effector. The powered handle assemblyis configured for selective connection with the adapter assemblyand, in turn, the adapter assemblyis configured for selective connection with the end effector.

The surgical devicewill further be described to the extent necessary to disclose aspects of the disclosure. Additionally, while described and shown as including the powered handle assembly, the end effector, and the adapter assembly, it should be understood that a variety of surgical devices, such as those having different handle assemblies, end effectors, and/or adapter assemblies, may be utilized with aspects of the disclosure. For a detailed description of the structure and function of exemplary surgical devices, reference may be made to U.S. Pat. Nos. 10,327,779 and 10,426,468, the entire contents of each of which being incorporated herein by reference.

With continued reference to, the powered handle assemblyincludes a handle housinghousing a power-pack (not shown) configured to power and control various operations of the surgical device, and a plurality of actuators(e.g., finger-actuated control buttons, knobs, toggles, slides, interfaces, and the like) for activating various functions of the surgical device. The end effectorincludes a loading unithaving a plurality of staples (not shown) disposed therein and an anvil assemblyincluding an anvil headand an anvil rod. The adapter assemblyincludes a proximal portionconfigured for operable connection to the handle assemblyand a distal portionconfigured for operable connection to the end effector.

Referring now to, the adapter assemblyincludes an outer sleeveand a distal connector housingsecured to a distal end of the outer sleeve. The distal connector housingis configured to releasably secure an end effector, e.g., the end effector(), to the adapter assembly. The adapter assemblyincludes an electronic or wiring assembly(shown in phantom) disposed therein. The electronic assemblyis configured to enable communication between the handle assembly() and the end effector() and to relay power from the handle assemblyto the end effector. For example, this communication allows for calibration and communication of data and control signals between the end effectorand the adapter assembly, as well as between the adapter assemblyand the handle assembly, thereby transferring data pertaining to the end effectorto the handle assemblyand signals from the handle assemblyto the end effector. The electronic assemblyincludes a force sensorthat detects stimuli (e.g., strain), converts the stimuli into electrical signals, and sends that data to the handle assemblyto affect a function of the end effector. It should be understood that while described and shown as a force sensor and, more specifically, as a strain gauge, other types of sensors may additionally or alternatively be utilized in the anvil assembly.

The electronic assemblygenerally includes at least one flex cable, as well as a first electrical connector, a second electrical connector, and the force sensorcoupled to the flex cable. The flex cableextends the length of the adapter assemblyand includes layer(s) of dielectric material isolating a series of internal traces which terminate at one or more electrical contact regions for electronic connection with the first and second electrical connectors,and the force sensor. The flex cableincludes a first or proximal end portioncoupled to the first electrical connectorfor electrical connection with the handle assembly(), a second or distal end portioncoupled to the second electrical connectorfor electrical connection with the end effector(), and a third or intermediate end portionelectrically coupled to the force sensor. The dielectric layer(s) of the flex cableare formed from a high performance polymer that retains its mechanical, thermal, and chemical properties when subjected to harsh environments (e.g., high temperature and/or high pressure), such as liquid crystal polymers which provide high performance in stable thin-walled applications, and the traces are formed from an electrically conductive material, such as copper.

In aspects, the flex cablesupports electronic components thereon (e.g., surface mount technology and/or through-hole technology, including, for example, integrated circuits (e.g., microchips, microcontrollers, microprocessors), resistors, amplifiers, inductors, capacitors, sensing elements (e.g., optical sensors, pressure sensors, capacitive sensors), buttons, switches, circuit boards, electrical connectors, cables, and/or wires, among other elements or circuitry within the purview of those skilled in the art). It should be understood that the flex cablemay be one of a plurality of cables (e.g., flex cables, adapter cables, ribbon cable, etc.) electrically coupled together to form a wiring harness or a flexible electrical cable, as is within the purview of those skilled in the art.

As shown in, the adapter assemblyfurther includes a trocar assemblythat extends through a central aperture(see e.g.,) of the force sensorand a central aperture() of a trocar connection housing. The trocar connection housingreleasably secures the trocar assemblyrelative to the outer sleeve() of the adapter assembly. The force sensoris disposed between the trocar connection housingand the distal connector housingof the adapter assembly, and is configured to measure forces along a load path. Specifically, the force sensormeasures forces of the end effector(e.g., as shown in, the pressure applied by the anvil headin the direction of arrow “A” against the distal portionof the adapter assembly, the pressure applied by tissue acting on the anvil headin a direction opposite of arrow “A” as the anvil headis closed onto tissue, etc.).

As shown in, the trocar connection housingincludes a distal surfacewhich interfaces with and loads a proximal surfaceof a body or substrateof the force sensorat proximal load contact areas “Cp”. As shown in, a proximal surfaceof the distal connector housinginterfaces with and loads a distal surfaceof the substrateof the force sensorat distal load contact areas “Cd” (e.g., disposed in each of the corners of the distal surface). Thus, for example, as the anvil assembly() is approximated towards the loading unit() of the end effector() during clamping and/or stapling of tissue, the anvil headapplies uniform pressure in the direction of arrow “A” () against the distal endof the distal connector housingwhich, in turn, is transmitted to the distal load contact areas “Cd” of the force sensor.

As shown in, the substrateof the force sensorhas a central aperturedefined through the proximal and distal surfaces,and extending along a central longitudinal axis “X” of the substrate. The substrateis divided into first and second lateral halves.by a plane passing through the central longitudinal axis “X”. The proximal surface() and the distal surface() of the substrateare load bearing surfaces having proximal and distal load contact areas “Cp.” “Cd.” respectively, as described above, that allow the substrateto compress when loaded by the surgical device(). The substrateis formed from a rigid material having high strength and high temperature endurance, such as a metal (e.g., stainless steel).

As seen in, the proximal surfaceof the substrateis a stepped surface including a central wall, lateral walls, and intermediate wallsinterconnecting the central and lateral walls,. The central wallis substantially planar and extends along a plane lying substantially perpendicular to the central longitudinal axis “X” of the substrate, and the lateral wallsare also planar and extend along a plane lying substantially perpendicular to the central longitudinal axis “X” of the substratein longitudinally spaced and distal relation relative to the central wall. The intermediate wallsare substantially planar and extend along a plane lying substantially parallel to the central longitudinal axis “X” of the substrate. It should be understood that the proximal surfacemay have other configurations, such as, for example, angled lateral walls. As seen in, the distal surfaceof the substrateis substantially planar and extends along a plane lying substantially perpendicular to the central longitudinal axis “X” () of the substrateand substantially parallel to the central and lateral walls,() of the proximal surface

Turning now to, the force sensor, the flex cable, and a seal assemblyof the electronic assemblyare shown. The force sensorincludes the substrate, sensing elements, a pin block assembly, and a chip assembly. The substrateincludes a cavitydefined in the first lateral halfthat is open at both the proximal and distal surfaces,of the substrate. The distal surfacefurther includes a groove() recessed therein that extends around the opening into the cavityfor engagement with a housingof the chip assembly.

In aspects, the substrateincludes relief holesdefined in a top surfacethereof to facilitate bending and/or to reduce stiffness of the substrate. It should be understood that the relief holes, as well as other relief features, such as relief cuts, may be formed in the substratein a variety of shapes and sizes, as well as in different positions about the substratewhen more elongation (e.g., flex) is desired.

The sensing elements, for example, strain gauges, are disposed within the cavityof the substrateand bonded (e.g., glued) to the substratealong with associated components thereof (not shown), e.g., media layers, films, protective coatings, circuitry including electronic components, such as resistors, conductive wires and/or traces, and electronic and/or solder connectors, etc. The sensing elementsare connected together with a series of wires (not shown) to form a resistance bridge, e.g., a Wheatstone bridge, that can read a linear strain response of the substratewhen compressed, as is within the purview of those skilled in the art. Alternatively, the sensing elementsmay be directly coated or etched onto the substrateby, for example, vapor deposition. In some aspects, the substrateincludes a thin insulative layer (e.g., vapor deposited glass) and a thin conductive layer (e.g., nichrome) laser etched to include the sensing elementsand the Wheatstone bridge.

The pin block assemblyis fixedly secured to the substrate. The pin block assemblyincludes a block bodyand a plurality of pins(referred to herein generally as pins) extending through the block bodyin spaced relation relative to each other. The block bodyis formed from an insulative material, such as glass or plastic, and the pinsare formed from a conductive material, such as metal. The proximal surfaceof the substrateincludes a grooverecessed therein that extends around the opening into the cavityfor engagement with the block bodyof the pin block assembly. Each of the pinsincludes a proximal portionand a distal portionextending proximally and distally, respectively, from the block body. The proximal portionsof the pinsare exposed at the proximal surfaceof the substratefor electronic connection with the flex cable, and the distal portionsof the pinsare disposed within the cavityof the substratefor electronic connection with the sensing elements(e.g., by wires (not shown)) and the chip assembly.

While the block bodyis shown positioned atop the proximal surfaceof the substrate, it should be understood that other arrangements are envisioned, such as a portion or the entirety of the block bodybeing positioned within the cavityof the substrateso long as the proximal portionof the pinsare accessible (e.g., extend proximally outwardly beyond the proximal surfaceof the substrate) for connection with the flex cable.

With continued reference to, the chip assemblyincludes a circuit boardand a connectorfor electrical connection with the distal portionsof the pinsof the pin block assembly. The connectoris disposed within the cavityof the substrateand the circuit boardextends distally out of the cavitybeyond the distal surfaceof the substrate. The circuit boardis configured for reading and/or storing data pertaining to the force sensorand sending the data to the handle assembly() via the flex cable.

The circuit boardincludes a microprocessorand a memory. The microprocessoris configured to receive and/or measure electrical signals from the sensing elementsand record them in the memorywhich, in turn, is configured to store the data received from the microprocessor. The memoryis configured to communicate the data to the handle assembly() via electrical contact with the pin block assemblyand the flex cablewhich, in turn, is electrically coupled to the handle assemblyby the first electrical connector(). The data may be processed by a processor of the power-pack (not shown) of the handle assembly() or in some remote processor or the like. The data may include, for example, stress measurements along the anvil assembly() which are converted via an algorithm into corresponding tissue stress measurements. It should be understood that the data may correspond with other desired monitored properties of the end effector() which, in turn, correspond with other desired monitored tissue properties and/or behaviors depending upon the type of sensing elementsand/or sensor utilized in the anvil assembly.

The chip assemblyfurther includes a coversized and shaped to house the circuit boardtherein. The coverincludes an elongated bodyhaving an open proximal endand a closed distal endthereby defining a pockettherein. A flangeextends around an entire outer perimeter of the open proximal endfor engagement with the distal surfaceof the substrateand, more specifically, for positioning within the groovedefined in the distal surface. The coveris positioned over the circuit boardand secured to the distal surfaceof the substrate, e.g., by welding, adhesives, coatings, and/or mechanical connections to seal the cavityon the distal surfaceof the substrate. The covermay be fabricated from a rigid material that is non-toxic, chemically inert, and capable of withstanding high temperatures and harsh detergents, such as, for example, a metal (e.g., stainless steel) or a polymer (e.g., polyphenylsulfone, such as those sold under the trademark RADEL® by Solvay Specialty Polymers USA, L.L.C.).

Alternatively, in some aspects, the circuit board, or components thereof, may be integrated into the flex cable. In such aspects, the chip assemblymay be otherwise omitted such that the cavityof the substrateis only open at the proximal surfaceof the substrate.

The flex cableis secured to the pin block assembly. The third portionof the flex cableis sized and shaped for positioning over the block bodyof the pin block assemblywithin the perimeter defined by the lateral wallon which the pin block assemblyis positioned. The third portionof the flex cableincludes a plurality of conductive holes(referred to herein generally as conductive holes) defined therethrough that are sized, shaped, and positioned to mate with the pinsof the pin block assembly. The third portionof the flex cableis positioned over block bodysuch that the proximal portionsof the pinsof the pin block assemblyengage and extend through the conductive holesof the flex cable. The flex cableis soldered to the pinsat a plurality of solder connections(, and referred to herein generally as solder connections) forming an electrical connection between the force sensorand the flex cable.

With continued reference to, the seal assemblycovers and seals the solder connectionsas well as the cavityof the substrateto protect the flex cable, the pin block assembly, the sensing elements, the chip assembly, and the electronic connections between these electronic components so that the electronic components and electronic connections can operate in a wet environment e.g., after cleaning and sterilization cycles. The seal assemblyincludes an encapsulateand a housing. The housingdefines a chamber or cavitytherein that is sized and shaped to receive the third portionof the flex cableand the pin block assemblytherein, and is positionable against the substrateto mate the housingto the force sensor. The encapsulatefills the housingto cover the third portionof the flex cable, the pin block assembly, and the solder connectionstherebetween, as well as the interface between the pin block assemblyand the cavityof the substrateto further protect the electronic components and the electronic connections within the cavity(e.g., the sensing elements, the distal portionsof the pinsof the pin block assembly, the circuit board, etc.).

The encapsulatemay be, for example, epoxies, silicones, urethanes, acrylics, among other materials that may form a strong bond and move with the thermal and mechanical movement of the flex cableand/or the force sensor, and withstand cleaning and sterilization cycles. The encapsulatemay be, for example, resins or adhesives, such as those sold under the trademark LOCTITE® of Henkel IP & Holding GMBH (e.g., LOCTITE® 3301™), sealants, such as a room-temperature vulcanization (RTV) silicone, or conformal coating or potting materials, such as those sold under the trademarks HUMISEAL® of Columbia Chase Corporation or DOLPHON® of John C. Dolph Company. The encapsulatemay be a multi-component system (e.g., a two-part system) in which parts are kept isolated from one another and then combined to form the encapsulate, such as epoxy adhesives sold under the trademark SCOTCH-WELD® of 3M Company. The encapsulatemay be a material that cures upon application of a stimuli, such as heat, moisture, or exposure to light (e.g., ultraviolet light), such as acrylic light cure resins, which may be used with a translucent or transparent housing.

As shown in, the housingincludes a first end wallthat defines a closed first endof the housing, and first and second side walls,extending from the first end wallin opposed spaced relation relative to each other. The first and second side walls,define closed first and second sides,of the housing. The housingalso includes top wallextending over and interconnecting the first end wall, the first side wall, and the second side wall. The top walldefines a closed topof the housing. The first end wall, the first and second side walls,, and the top wallare continuous surfaces to minimize exposure of electronic components positioned within the cavityof the housingto wet or harsh environments, however, it is envisioned that, in some aspects, openings, such as port or vent holes, or channels for the passage of electronic components (e.g., wires or cables), may be formed in one or more of the walls.

The housingalso includes an open second endand an open bottom. A second end surfaceof the first side wall, the second side wall, and the top walldefine the open second end, and a bottom surfaceof the first end wall, the first side wall, and the second side walldefine the open bottom. The open second endand the open bottomare open to the cavityto allow the housingto be placed over the solder connections(). The bottom surfaceis positionable against the substrate() of the force sensorand the open second endprovides a passageway for the flex cable() out of the housingand the encapsulate() into the cavity. The cavityis defined by a continuous inner surfaceof the first end wall, the first and second side walls,, and the top wall

A lower portionof the housing, extending from the bottom surfacetowards the top wall, includes a plurality of ribs(referred to herein generally as ribs) extending from the inner surfaceinto the cavity. The ribsare substantially u-shaped and extend from the first end walland the first and second side walls,. The ribsare sized and positioned so that the portion of the cavitydefined within each of the ribscorresponds with the shape of the block body() of the pin block assembly. In aspects, the ribsform a slight interference fit with the block bodywhen the housingis assembled thereover. In other aspects, other connections or fits are used between the block bodyand the housing, such as snap fit, slip fit, and the like. While two ribsare shown disposed in spaced relation relative to each other in the lower portionof the housing, it should be understood that one ribor more than two ribsmay be utilized that correspond in position, shape, and/or size with the electronic component to be encapsulated within the housing.

An upper portionof the housing, disposed above the lower portion, is sized and shaped to accommodate the third portion() of the flex cabletherein. In aspects, the upper portionis sized and shaped so that the flex cable, the solder connections(), and/or any exposed portion of the pinsare spaced from the inner surfaceof the housing.

The housingis formed from a material that is non-toxic, chemically inert, and capable of withstanding high temperatures and harsh detergents, such as, for example, metals (e.g., stainless steel), polymers (e.g., polyether ether ketone or polyphenylsulfone, such as those sold under the trademark RADEL® by Solvay Specialty Polymers USA, L.L.C.), resins (e.g., polyphenylene oxide or polyphenylene ether, such as those sold under the trademark NORYL® by SHPP Global Technologies B.V.), rubbers (e.g., silicones), and the like. The housingmay be formed from a translucent or transparent material to allow for light (e.g., UV or LED) to pass through the walls of the housingto cure the encapsulate() within the housing. The housingmay be manufactured by, for example, molding (e.g., injection molding), machining, casting, stamping, and the like.

A method of assembling the flex cableand the seal assemblyonto the force sensoris shown in. With the sensing elements(), the pin block assembly, and the chip assemblysecured to the substrate, and the sensing elementsand the chip assemblyelectrically coupled to the pin block assembly, as described above, the conductive holesin the flex cableare aligned with the proximal portionsof the pinsof the pin block assembly, as seen in. As seen in, the third portionof the flex cableis then placed atop the block bodyof the pin block assemblysuch that the proximal portions() of the pinsextend through the conductive holes() of the flex cableand the flex cableis soldered to the pinsat solder connections.

The housingis then assembled onto the substrateof the force sensorand over the third portionof the flex cableand the pin block assembly. Initially, the bottom surfaceof the housingis aligned with the proximal surfaceof the substratesuch that the open second endof the housingfaces the flex cableand the pin block assembly. The housingis then slid in the direction of arrow B so that the ribswrap around the block body(e.g., forming a slight interference fit) to register the assembly of the housingonto the pin block assembly.