Substrate Polishing Apparatus and Substrate Processing Apparatus

This application claims the priority benefits of Japanese application no. 2024-090081, filed on Jun. 3, 2024. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

The disclosure relates to a substrate polishing apparatus and a substrate processing apparatus.

Conventionally, a substrate polishing apparatus for planarizing a surface of a substrate such as a silicon wafer, etc. by chemical mechanical polishing (CMP) has been known. The substrate polishing apparatus include a polishing table which rotates, a polishing head which holds a substrate and presses the substrate against the polishing table, and a swinging arm which swings the polishing head (for example, refer to Patent Literature 1 (Japanese Patent Application Laid-Open No. 2014-147990)).

Incidentally, a bearing device that pivotally supports the polishing head is provided inside the swinging arm. The bearing device needs to be cooled with cooling water because heat is generated by the rotation of the polishing head. Additionally, the cooling water also has the purpose of lubricating a sliding surface in an environment where lubricating oil is unable to be used. As the cooling water, clean pure water, which has little influence on the substrate, is preferable. In this case, pure water supply piping is introduced from the outside into the inside of the swinging arm and is to be connected to the bearing device. However, due to the swinging of the swinging arm, the pure water supply piping may become twisted, causing blockage of the flow path inside the piping, or force resulting from the twisting may be continuously applied, leading to damage of the piping itself.

The disclosure is to mitigate the influence of twisting on the pure water supply piping.

A substrate polishing apparatus according to an aspect of the disclosure includes: a polishing table which rotates; a polishing head which holds a substrate and presses the substrate against the polishing table; a swinging arm which swings the polishing head; a bearing device which is disposed in an inside of the swinging arm and pivotally supports the polishing head; and pure water supply piping which is introduced into the inside of the swinging arm and supplies pure water to the bearing device. The pure water supply piping includes a spiral part which is wound so as to go around a swinging axis line of the swinging arm.

In the above-described substrate polishing apparatus, an opening part is formed on an upper surface of the swinging arm on the swinging axis line, and the pure water supply piping may include a first straight line part extending upward from the spiral part and passing through the opening part, and a second straight line part extending from the upper end of the first straight line part in a direction intersecting with the swinging axis line and fixed to an outside of the swinging arm.

In the above-described substrate polishing apparatus, the first straight line part may be disposed along the swinging axis line.

In the above-described substrate polishing apparatus, the spiral part may be extendable and retractable in an up-down direction.

In the above-described substrate polishing apparatus, the pure water supply piping may be formed from perfluoroalkoxy alkane.

A substrate processing apparatus according to an aspect of the disclosure includes the above-described substrate polishing apparatus which polishes a substrate, and a substrate cleaning apparatus which cleans the substrate polished by the substrate polishing apparatus.

According to an aspect of the disclosure described above, the influence of twisting on the pure water supply piping can be mitigated.

Hereinafter, an embodiment of the disclosure will be described with reference to the drawings.

is a plan view showing an overall configuration of a substrate processing apparatusaccording to an embodiment.

A substrate processing apparatusshown inis a chemical mechanical polishing (CMP) apparatus that polishes a surface of a substrate W such as a silicon wafer to a flat surface. The substrate processing apparatusincludes a rectangular box-shaped housing. The housingis formed to be approximately rectangular in a plan view.

Note that, the substrate W, which is a processing target, includes various devices such as a semiconductor wafer, a glass substrate (for a liquid crystal display device or for a plasma display), a substrate for an optical disc, a substrate for a magneto-optical disc, a substrate for a magnetic disc, a printed wiring board, a substrate for a memory circuit, a substrate for a logic circuit, and a substrate for an image sensor (for example, a substrate for a CMOS sensor), etc. Also, the shape is not limited to a circular shape, and for example, may be a rectangular shape. Also, in the case of a circular shape, the size of the semiconductor wafer includes, for example, wafers with diameters of 100 mm, 150 mm, 200 mm, 300 mm, and 450 mm.

The housingincludes a substrate transport pathextending in a longitudinal direction in the center thereof. A load/unload partis disposed at one end part in the longitudinal direction of the substrate transport path. A polishing partis disposed on one side in a width direction of the substrate transport path(a direction orthogonal to the longitudinal direction in a plan view), and a cleaning partis disposed on the other side thereof. A transport partwhich transports the substrate W is provided in the substrate transport path. Further, the substrate processing apparatusincludes a control part(control panel) which integrally controls operations of the load/unload part, the polishing part, the cleaning part, and the transport part.

The load/unload partincludes a front load partwhich accommodates the substrate W. Multiple front load partsare provided on one side surface in the longitudinal direction of the housing. The multiple front load partsare arranged in the width direction of the housing. The front load part, for example, mounts an open cassette, a Standard Manufacturing Interface (SMIF) pod, or a Front Opening Unified Pod (FOUP). The SMIF and FOUP are sealed containers that house a cassette of the substrate W internally and are covered by a partition wall, and can maintain an environment independent of the external space.

Further, the load/unload partincludes two transport robotswhich load and unload the substrate W to and from the front load part, and a traveling mechanismwhich causes each of the transport robotsto travel along the arrangement of the front load parts. Each of the transport robotsis provided with two hands, one above and one below, and uses the hands differently for the substrate W before processing and the substrate W after processing. For example, in the case of returning the substrate W to the front load part, the upper hand is used, and in the case of taking out the substrate W before processing from the front load part, the lower hand is used.

The polishing partincludes multiple substrate polishing apparatuses(A,B,C, andD) which perform polishing (planarization) of the substrate W. The substrate polishing apparatusesare arranged in the longitudinal direction of the substrate transport path. The substrate polishing apparatusincludes a polishing tablewhich rotates a polishing padhaving a polishing surface, a polishing headfor holding the substrate W and polishing the substrate W while pressing the substrate W against the polishing padon the polishing table, a polishing liquid supply nozzlefor supplying a polishing liquid or a dressing liquid (for example, pure water) to the polishing pad, a dresserfor performing dressing of the polishing surface of the polishing pad, and an atomizerwhich sprays a mixed fluid of a liquid (for example, pure water) and a gas (for example, nitrogen gas) or a liquid (for example, pure water) in a mist form onto the polishing surface.

In the substrate polishing apparatus, while supplying a polishing liquid from the polishing liquid supply nozzleonto the polishing pad, the substrate W is pressed against the polishing padby the polishing head, and further, by causing relative movement between the polishing headand the polishing table, the substrate W is polished and the surface thereof is planarized. The dresserhas hard particles such as diamond particles or ceramic particles fixed to a tip of a rotating part that contacts the polishing pad, and by rotating and swinging the rotating part, uniformly dresses the entire polishing surface of the polishing padand forms a flat polishing surface. The atomizer, by washing away polishing debris, abrasive grains, and the like remaining on the polishing surface of the polishing padwith a high-pressure fluid, achieves purification of the polishing surface and conditioning of the polishing surface by the dresser, which is a mechanical contact, that is, regeneration of the polishing surface.

The cleaning partincludes multiple substrate cleaning apparatuses(A andB) which perform cleaning of the substrate W, and a substrate drying apparatuswhich dries the cleaned substrate W. The substrate cleaning apparatusesand the substrate drying apparatusare arranged in the longitudinal direction of the substrate transport path. A first transport chamberis provided between the substrate cleaning apparatusA and the substrate cleaning apparatusB. In the first transport chamber, a transport robotis provided, which transports the substrate W between the transport part, the substrate cleaning apparatusA, and the substrate cleaning apparatusB. Further, a second transport chamberis provided between the substrate cleaning apparatusB and the substrate drying apparatus. In the second transport chamber, a transport robotis provided, which transports the substrate W between the substrate cleaning apparatusB and the substrate drying apparatus.

The substrate cleaning apparatusA, for example, includes a module (hereinafter referred to as a roll-type cleaning module) including a roll-type substrate cleaning member (a surface of which is a polyvinyl alcohol (PVA) sponge or a urethane sponge), and performs primary cleaning of the substrate W. Further, the substrate cleaning apparatusB also includes a roll-type cleaning module, and performs secondary cleaning of the substrate W. It should be noted that the substrate cleaning apparatusA and the substrate cleaning apparatusB may be of the same type or different types of cleaning modules, and may be, for example, a cleaning module including a pencil-type substrate cleaning member, or a cleaning module including a two-fluid jet type two-fluid jet nozzle that ejects a gaseous medium and gas, or the like.

The substrate drying apparatus, for example, includes a drying module that performs Rotagoni drying (Iso-Propyl Alcohol (IPA) drying). After drying, a shutterprovided on the partition wall between the substrate drying apparatusand the load/unload partis opened, and the substrate W is taken out from the substrate drying apparatusby the transport robot.

It should be noted that “cleaning” includes not only normal cleaning using a liquid such as a chemical liquid or pure water (referred to as wet cleaning in the embodiment) but also cleaning that does not use a liquid during cleaning (referred to as dry cleaning). In other words, one of the substrate cleaning apparatusA and the substrate cleaning apparatusB may be a wet cleaning part, and the other may be a dry cleaning part. Further, in the case of performing wet cleaning before performing dry cleaning, the above-described substrate drying apparatusmay be disposed in order to dry the substrate W.

The transport partincludes a lifter, a first linear transporter, a second linear transporter, and a swing transporter. In the substrate transport path, a first transport position TP, a second transport position TP, a third transport position TP, a fourth transport position TP, a fifth transport position TP, a sixth transport position TP, and a seventh transport position TPare set in order from the load/unload partside.

The lifteris a mechanism that transports the substrate W up and down at the first transport position TP. The lifterreceives the substrate W from the transport robotof the load/unload partat the first transport position TP. Further, the lifterdelivers the substrate W received from the transport robotto the first linear transporter. On the partition wall between the first transport position TPand the load/unload part, a shutteris provided, and during transport of the substrate W, the shutteris opened, and the substrate W is delivered from the transport robotto the lifter.

The first linear transporteris a mechanism that transports the substrate W between the first transport position TP, the second transport position TP, the third transport position TP, and the fourth transport position TP. The first linear transporterincludes multiple transport hands(A,B,C, andD), and a linear guide mechanismthat moves each of the transport handsin a horizontal direction at multiple heights. The transport handA moves between the first transport position TPand the fourth transport position TPby the linear guide mechanism. The transport handA is a pass hand for receiving the substrate W from the lifterand delivering the substrate W to the second linear transporter.

The transport handB moves between the first transport position TPand the second transport position TPby the linear guide mechanism. The transport handB receives the substrate W from the lifterat the first transport position TP, and delivers the substrate W to the substrate polishing apparatusA at the second transport position TP. The transport handB is provided with a lifting drive part, and in the case of delivering the substrate W to the polishing headof the substrate polishing apparatusA, the lifting drive part rises, and after delivering the substrate W to the polishing head, the lifting drive part lowers. Note that the transport handC and the transport handD are also provided with a similar lifting drive part.

The transport handC moves between the first transport position TPand the third transport position TPby the linear guide mechanism. The transport handC receives the substrate W from the lifterat the first transport position TP, and delivers the substrate W to the substrate polishing apparatusB at the third transport position TP. Also, the transport handC also functions as an access hand that receives the substrate W from the polishing headof the substrate polishing apparatusA at the second transport position TP, and delivers the substrate W to the substrate polishing apparatusB at the third transport position TP.

The transport handD moves between the second transport position TPand the fourth transport position TPby the linear guide mechanism. The transport handD functions as an access hand that receives the substrate W from the polishing headof the substrate polishing apparatusA or the substrate polishing apparatusB at the second transport position TPor the third transport position TP, and delivers the substrate W to the swing transporterat the fourth transport position TP.

The swing transporterhas a hand movable between the fourth transport position TPand the fifth transport position TP, and delivers the substrate W from the first linear transporterto the second linear transporter. Also, the swing transporterdelivers the substrate W polished in the polishing partto the cleaning part. A temporary placement standfor the substrate W is provided on a side of the swing transporter. The swing transporterturns over the substrate W received at the fourth transport position TPor the fifth transport position TPand places the substrate W on the temporary placement stand. The substrate W placed on the temporary placement standis transported to the first transport chamberby the transport robotof the cleaning part.

The second linear transporteris a mechanism that transports the substrate W between the fifth transport position TP, the sixth transport position TP, and the seventh transport position TP. The second linear transporterincludes multiple transport hands(A,B, andC), and a linear guide mechanismthat moves each of the transport handsin the horizontal direction at multiple heights. The transport handA moves between the fifth transport position TPand the sixth transport position TPby the linear guide mechanism. The transport handA functions as an access hand that receives the substrate W from the swing transporterand delivers the substrate W to the substrate polishing apparatusC.

The transport handB moves between the sixth transport position TPand the seventh transport position TP. The transport handB functions as an access hand that receives the substrate W from the substrate polishing apparatusC and delivering the substrate W to the substrate polishing apparatusD. The transport handC moves between the seventh transport position TPand the fifth transport position TP. The transport handC functions as an access hand for receiving the substrate W from the polishing headof the substrate polishing apparatusC or the substrate polishing apparatusD at the sixth transport position TPor the seventh transport position TP, and delivering the substrate W to the swing transporterat the fifth transport position TP. Although the description is omitted, the operation of the transport handat the time of delivering the substrate W is similar to the operation of the first linear transporterdescribed above.

is a perspective view of the substrate polishing apparatusaccording to an embodiment.

The substrate polishing apparatus, as shown in, includes the polishing tablewhich rotates around a central axis line O, the polishing headwhich holds the substrate W and presses the substrate W against the polishing table, and a swinging armwhich swings the polishing headaround a swinging axis line O. The swinging axis line Oof the swinging armextends parallel to the central axis line Oof the polishing table.

The polishing headis configured to be able to hold the substrate W on a lower surface thereof by vacuum suction. The swinging armis configured to be swingable around an arm shaft. An opening partis formed on an upper surface of the swinging armon the swinging axis line O. From the opening part, pure water supply pipingdescribed later, various piping (air piping, etc.) other than the pure water supply piping, and various electrical wiring are introduced into the inside of the swinging arm.

is a configuration diagram of the substrate polishing apparatusaccording to an embodiment.

The swinging armincludes an arm bodyA connected to the upper end of the arm shaft, and an arm coverB covering the arm bodyA. Inside the swinging arm, a rotating devicewhich rotates the polishing head, a bearing devicewhich rotatably supports the polishing head, and a lifting devicewhich lifts and lowers the polishing headare provided.

On the lower surface of the polishing head, a retaining ring, which is movable up and down to adjust a polishing amount of the substrate W, is provided. A polishing head shaftis connected to an upper surface of the polishing head. The polishing head shaftis coupled to a rotating cylindervia a key (not shown) extending in an up-down direction. The rotating devicerotates the rotating cylindervia a polishing head motor, a timing pulley, and a timing belt. As the rotating cylinderrotates, the polishing headconnected to the polishing head shaftrotates.

The bearing deviceincludes a bearingwhich supports the polishing head shaft, and a rotary jointattached to the upper end of the polishing head shaft. The bearingis supported by the lifting deviceso as to be movable up and down. The pure water supply piping, which will be described later, is connected to the rotary jointvia a piping connectorand connection piping. The pure water supply pipingsupplies pure water as quench water (cooling water) to the rotary joint. Note that air piping (not shown), etc., which generate a negative pressure on a lower surface of the polishing headvia the polishing head shaft, are connected to the rotary joint.

The lifting deviceincludes a lifting motor, a ball screw device, and a bridge. The lifting motoris fixed to the arm bodyA via a support stand. The ball screw deviceincludes a screw shaft coupled to the lifting motor, and a nut with which the screw shaft is screwed. The nut is coupled to the bridge. In response to rotation of the lifting motor, the bridgemoves up and down via the ball screw device, whereby the polishing head shaftand the polishing headmove up and down. Note that the height of the polishing headcan be measured by a height sensor facing the bridge.

is a plan view of the swinging armaccording to an embodiment.is a perspective view of the pure water supply pipingaccording to an embodiment.

The swinging armswings as shown in. Specifically, the swinging armswings at an angle θduring polishing of the substrate W. Also, the swinging armswings at an angle θin the case of delivering the substrate W. That is, the swinging armswings at an angle θ, which is a sum of the angle θand the angle θ. Specifically, the angle θis set within a range of 110° to 150°, preferably within a range of 120° to 140°, and more preferably within a range of 125° to 135°.

The pure water supply pipinghas a shape that mitigates the influence due to the swinging of the swinging arm. Specifically, the pure water supply piping, as shown in, includes a spiral part, a first straight line part, and a second straight line part. The pure water supply pipingis formed from, for example, perfluoroalkoxy alkane (PFA) which is exemplary in heat resistance, water repellency, chemical resistance, and flexibility. Note that the pure water supply pipingmay be formed from a fluororesin other than PFA, or other materials having chemical resistance, heat resistance, and ease of processing, if the pure water supply pipingincludes predetermined flexibility.

At the lower end of the spiral part, a fixed partconnectable with the piping connector(see) inside the swinging armis attached. The spiral partis wound so as to go around the swinging axis line Oof the swinging arm. This allows the pure water supply pipingto flexibly follow twisting around the swinging axis line O. Also, the spiral partis extendable and retractable in the up-down direction. Therefore, the pure water supply pipingcan flexibly accommodate not only the swinging of the swinging armbut also minute vibrations during polishing of the substrate W and individual differences in the mounting position of the piping. Note that the diameter of the spiral partmay be within a range that can be accommodated in the space of the installation location. Also, the pitch of the spiral partmay be uniform or may be non-uniform.

The first straight line partis disposed along the swinging axis line O. The first straight line part, as shown in, extends upward from the spiral partand is provided so as to pass through the opening partof the arm coverB. The second straight line partextends from the upper end of the first straight line partin a direction intersecting with the swinging axis line O(in the embodiment, a perpendicular direction). At an end part of the second straight line part, a fixed partis provided. The fixed partis, for example, fixed to a connection connector (not shown) provided in a housing enclosing the substrate polishing apparatus, and is connected to a pure water supply apparatus (not shown) via the connection connector.

According to the substrate polishing apparatusof the above configuration, since the pure water supply pipingincludes the spiral partwound so as to go around the swinging axis line Oof the swinging arm, as shown in, even in the case where the swinging armswings, twisting of the piping due to the swinging can be absorbed. For this reason, blockage of the flow path in the pure water supply pipingdue to twisting is prevented, and furthermore, since excessive force is no longer continuously applied to the pure water supply piping, damage to the piping itself can also be prevented.

As described above, the substrate polishing apparatusaccording to the embodiment includes: the polishing tablewhich rotates; the polishing headwhich holds the substrate W and presses the substrate W against the polishing table; the swinging armwhich swings the polishing head; the bearing devicewhich is disposed in an inside of the swinging armand pivotally supports the polishing head; and the pure water supply pipingwhich is introduced into the inside of the swinging armand supplies pure water to the bearing device. The pure water supply pipingincludes the spiral partwound so as to go around the swinging axis line Oof the swinging arm. According to the configuration, the influence of twisting on the pure water supply pipingcan be mitigated.

Further, in the embodiment, the opening partis formed on the upper surface of the swinging armon the swinging axis line O, and the pure water supply pipingincludes the first straight line partextending upward from the spiral partand passing through the opening part, and a second straight line partextending from the upper end of the first straight line partin the direction intersecting with the swinging axis line Oand fixed to the outside of the swinging arm. According to the configuration, from a limited space in an upper part of the swinging arm, the pure water supply pipingcan be introduced into the inside of the swinging arm, and pure water can be stably supplied to the bearing device. Note that, in the embodiment, pure water is supplied to the rotary joint, but in order to cool the bearing, pure water may also be supplied to the bearing.