Bonded Abrasive with Low Wetting Bond Material

This application is a continuation application of and claims priority under 35 U.S.C. §to U.S. patent application Ser. No. 18/501,651, entitled “BONDED ABRASIVE WITH LOW WETTING BOND MATERIAL,” by Qing WANG et al., filed Nov. 3, 2023, which claims priority to Chinese Patent Application No. 202211376873.3, filed Nov. 4, 2022, by Qing WANG et al., entitled “BONDED ABRASIVE FOR GEAR POWER HONING,” all of which are assigned to the current assignees hereof and incorporated herein by reference in their entireties for all purposes.

The present invention relates in general to abrasive articles, and in particular, to bonded abrasive articles having a low wetting bond material and a unique microstructure.

Abrasive articles used in machining applications typically include bonded abrasive articles and coated abrasive articles. A bonded abrasive article generally has a bond matrix containing abrasive particles. Bonded abrasive articles can be mounted onto a suitable machining apparatus and used in various applications, such as shaping, grinding, polishing, and cutting. The industry continues to demand improved abrasive tools.

In one embodiment, the subject application provides an abrasive article, comprising:

In another embodiment, the subject application provides an abrasive article, comprising:

In yet another embodiment, the subject application provides a method of making an abrasive article, comprising,

In still another embodiment, the subject application provides a method of using an abrasive article to abrade a workpiece, the method comprising, cutting, beveling, sharpening, gear power honing, worm gear grinding, CMR, stock removal, grinding, weld blending, or precision finishing.

The following is generally directed to bonded abrasive articles suitable for use in material removal operations. The bonded abrasive articles can be used in various applications, including, for example, surface grinding, precision grinding operations (e.g., gear grinding operations), and the like.

Reference herein to bonded abrasive articles includes reference to a three-dimensional volume of an abrasive material having abrasive particles contained within a volume of a bond material. Bonded abrasive articles can be distinct from coated abrasive articles that may utilize a single layer of abrasive particles contained in a layer of bond or adhesive material. Moreover, the bonded abrasive articles of embodiments herein may include some porosity within the three-dimensional volume of a bond material.

includes a flowchart for forming an abrasive article in accordance with an embodiment. As illustrated, the process for forming the abrasive article can begin at stepby forming a mixture that includes a bond precursor material. The mixture can be a slurry, including a plurality of components homogeneously mixed in therein.

A bond precursor material may be a material that becomes the bond material of the final-formed abrasive article. In accordance with an embodiment, the bond precursor material can include a powder material configured to form the bond material of the final-formed abrasive article. In one embodiment, the bond precursor material can include an inorganic material, such as, but not limited to, metals, metal alloys, ceramics, vitreous materials or frit materials, or any combination thereof. The bond precursor material may include inorganic material in an amorphous phase, polycrystalline phase, monocrystalline phase, or any combination thereof.

The bond material precursor may have a particular composition that may facilitate improved performance or manufacturing of the abrasive article.

In an embodiment, the bond material precursor can include a content of AlOof at least 18 wt % or at least 20 wt % or at least 22 wt %. In an embodiment, the bond material precursor can include a content of AlOof not greater than 36 wt % for a total content of the bond material or not greater than 33 wt % or not greater than 30 wt % or not greater than 27 wt %. It will be appreciated that the AlOcontent may be between any of the minimum and maximum values noted above.

In an embodiment, the bond material precursor can include a content of SiOof at least 38 wt % or at least 40 wt % or at least 42 wt % or at least 45 wt %. In an embodiment, the bond material precursor can include a content of SiOof not greater than 55 wt % for a total content of the bond material. It will be appreciated that the SiOcontent may be between any of the minimum and maximum values noted above.

In an embodiment, the bond material precursor can include a content of BOof at least 10 wt %. In an embodiment, the bond material precursor can include a content of BOnot greater than 18 wt % or not greater than 15 wt % for a total content of the bond material. It will be appreciated that the BOcontent may be between any of the minimum and maximum values noted above.

In an embodiment, the bond material precursor can include a content of BaO of not greater than 0.6 wt % or not greater than 0.4 wt % or not greater than 0.2 wt % or not greater than 0.1 wt % or not greater than 0.05 wt % or not greater than 0.03 wt % for a total content of the bond material.

In an embodiment, the bond material precursor can include a content of CaO of at least 0.3 wt %. In an embodiment, the bond material precursor can include a content of CaO of not greater than 2 wt % or not greater than 1.5 wt % or not greater than 1 wt % or not greater than 0.5 wt % for a total content of the bond material. It will be appreciated that the CaO content may be between any of the minimum and maximum values noted above.

In an embodiment, the bond material precursor can include a content of CoO of not greater than 0.7 wt % for a total content of the bond material.

In an embodiment, the bond material precursor can include a content of CrOof not greater than 0.01 wt % for a total content of the bond material.

In an embodiment, the bond material precursor can include a content of FeOof not greater than 0.8 wt % or not greater than 0.7 wt % for a total content of the bond material.

In an embodiment, the bond material precursor can include a content of CuO of not greater than 0.01 wt % for a total content of the bond material.

In an embodiment, the bond material precursor can include a content of HfOof not greater than 0.02 wt % for a total content of the bond material.

In an embodiment, the bond material precursor can include a content of KO of at least 0.5 wt %. In an embodiment, the bond material precursor can include a content of KO of not greater than 2 wt % or not greater than 1 wt % for a total content of the bond material. It will be appreciated that the KO content may be between any of the minimum and maximum values noted above.

In an embodiment, the bond material precursor can include a content of LaOof at least 1.3 wt %. In an embodiment, the bond material precursor can include a content of LaOof not greater than 2.0 wt % or not greater than 1.5 wt % for a total content of the bond material. It will be appreciated that the LaOcontent may be between any of the minimum and maximum values noted above.

In an embodiment, the bond material precursor can include a content of LiO of at least 0.2 wt % or at least 0.5 wt % or at least 0.7 wt % or at least 0.9 wt %. In an embodiment, the bond material precursor can include a content of LiO of not greater than 3 wt % or not greater than 2.5 wt % or not greater than 2.0 wt % or not greater than 1.5 wt % or not greater than 1.1 wt % for a total content of the bond material. It will be appreciated that the LiO content may be between any of the minimum and maximum values noted above.

In an embodiment, the bond material precursor can include a content of MgO of at least 0.5 wt % or at least 0.7 wt %. In an embodiment, the bond material precursor can include a content of MgO of not greater than 1.5 wt % or 1.0 wt % for a total content of the bond material. It will be appreciated that the MgO content may be between any of the minimum and maximum values noted above.

In an embodiment, the bond material precursor can include a content of MnOof not greater than 0.05 wt %. In an embodiment, the bond material precursor can include a content of MnOof not greater than 0.02 wt % for a total content of the bond material. It will be appreciated that the MnOcontent may be between any of the minimum and maximum values noted above.

In an embodiment, the bond material precursor can include a content of NaO of at least 4 wt %. In an embodiment, the bond material precursor can include a content of NaO of not greater than 12 wt % or not greater than 9 wt % or not greater than 6 wt % for a total content of the bond material. It will be appreciated that the NaO content may be between any of the minimum and maximum values noted above.

In an embodiment, the bond material precursor can include a content of NiO of not greater than 0.01 wt % for a total content of the bond material.

In an embodiment, the bond material precursor can include a content of SrO of not greater than 0.02 wt % for a total content of the bond material.

In an embodiment, the bond material precursor can include a content of TiOof at least 0.2 wt % and not greater than 0.8 wt % for a total content of the bond material.

In an embodiment, the bond material precursor can include a content of VOof not greater than 0.02 wt % for a total content of the bond material.

In an embodiment, the bond material precursor can include a content of YOof at least 0.4 wt % and not greater than 1.0 wt % for a total content of the bond material.

In an embodiment, the bond material precursor can include a content of ZnO of not greater than 0.2 wt % for a total content of the bond material.

In an embodiment, the bond material precursor can include a content of ZrOof not greater than 0.01 wt % for a total content of the bond material.

In accordance with one embodiment, the bond precursor material may be added in a particular content. For example, the mixture may include at least 1 vol % of the bond precursor material for a total volume of the mixture, such as at least 2 vol % or at least 3 vol % or at least 4 vol % or at least 5 vol % or at least 6 vol % or at least 7 vol % or at least 8 vol % or at least 9 vol % or at least 10 vol % or at least 12 vol % or at least 14 vol % or at least 16 vol % or at least 18 vol % or at least 20 vol % or at least 22 vol % or at least 24 vol % or at least 26 vol % or at least 28 vol % or at least 30 vol % or at least 32 vol % or at least 34 vol % or at least 36 vol % or at least 38 vol % or at least 40 vol %. In another embodiment, the mixture may include at least 1 wt % of the bond precursor material for a total weight of the mixture, such as at least 2 wt % or at least 3 wt % or at least 4 wt % or at least 5 wt % or at least 6 wt % or at least 7 wt % or at least 8 wt % or at least 9 wt % or at least 10 wt % or at least 12 wt % or at least 14 wt % or at least 16 wt % or at least 18 wt % or at least 20 wt % or at least 22 wt % or at least 24 wt % or at least 26 wt % or at least 28 wt % or at least 30 wt % or at least 32 wt % or at least 34 wt % or at least 36 wt % or at least 38 wt % or at least 40 wt %. Still, in one non-limiting embodiment, the mixture may include not greater than 40 vol % of the bond precursor material for a total volume of the mixture, such as not greater than 38 vol % or not greater than 35 vol % or not greater than 32 vol % or not greater than 30 vol % or not greater than 28 vol % or not greater than 25 vol % or not greater than 22 vol % or not greater than 20 vol % or not greater than 18 vol % or not greater than 15 vol %. In another non-limiting embodiment, the mixture may include not greater than 40 wt % of the bond precursor material for a total weight of the mixture, such as not greater than 38 wt % or not greater than 35 wt % or not greater than 32 wt % or not greater than 30 wt % or not greater than 28 wt % or not greater than 25 wt % or not greater than 22 wt % or not greater than 20 wt % or not greater than 18 wt % or not greater than 15 wt %. The mixture may include a content of the bond precursor material in an amount within a range, including any of the minimum and maximum percentages noted above.

The mixture may further include abrasive particles configured to form the abrasive component of the final-formed abrasive article. The abrasive particles may be added to the mixture at various times, including, for example, after the addition of the bond precursor material to the mixture. Still, it will be appreciated, in other embodiments, the abrasive particles may be added in combination with one or more of the other components in the mixture, including, for example, but not limited to the gelling agent, the bond precursor material, or one or more additives. The abrasive particles may include a material such as from the group consisting of oxides, borides, nitrides, carbides, oxynitrides, oxycarbides, amorphous, monocrystalline, polycrystalline, superabrasive, diamond, or any combination thereof. In an embodiment, at least one material is from the group of alumina, silica, zirconia, or any combination thereof. In one particular embodiment, the abrasive particles can include alumina, and may consist essentially of alumina. In an embodiment, the abrasive particles comprise at least one of fused alumina, unseeded alumina, seeded sol-gel alumina, alumina with one or more magnetoplumbite-containing phases. In an embodiment, the abrasive particles can include doped alumina. In an embodiment, the abrasive particles can include La or MgO, or a combination thereof.

In an embodiment, the abrasive particles can include at least one of unshaped particles (e.g., crushed), shaped particles, agglomerated particles, unagglomerated particles.

The mixture may include a certain content of abrasive particles to facilitate improved manufacturing and/or improved performance of the abrasive article. For example, in one embodiment, the mixture may include at least 20 vol % of the abrasive particles for a total volume of the mixture, such as at least 25 vol % or at least 30 vol % or at least 35 vol % or at least 40 vol % or at least 45 vol % or at least 50 vol % or at least 55 vol % or at least 60 vol % or at least 65 vol % or at least 70 vol % or at least 75 vol % or at least 80 vol %. In one embodiment, the mixture may include at least 20 wt % of the abrasive particles for a total weight of the mixture, such as at least 25 wt % or at least 30 wt % or at least 35 wt % or at least 40 wt % or at least 45 wt % or at least 50 wt % or at least 55 wt % or at least 60 wt % or at least 65 wt % or at least 70 wt % or at least 75 wt % or at least 80 wt %. In another non-limiting embodiment, the mixture may include not greater than 80 vol % of the abrasive particles for a total volume of the mixture, such as not greater than 75 vol % or not greater than 70 vol % or not greater than 65 vol % or not greater than 60 vol % or not greater than 55 vol % or not greater than 50 vol % or not greater than 45 vol % or not greater than 40 vol % or not greater than 35 vol % or not greater than 30 vol %, such as not greater than 25 vol %. In another non-limiting embodiment, the mixture may include not greater than 80 wt % of the abrasive particles for a total weight of the mixture, such as not greater than 75 wt % or not greater than 70 wt % or not greater than 65 wt % or not greater than 60 wt % or not greater than 55 wt % or not greater than 50 wt % or not greater than 45 wt % or not greater than 40 wt % or not greater than 35 wt % or not greater than 30 wt %, such as not greater than 25 wt %. The mixture may include a content of the abrasive particles in an amount within a range, including any of the minimum and maximum percentages noted above.

In an embodiment, the abrasive particles can have a polycrystalline phase having crystalline domains, the crystalline domains having an average domain size of not greater than 8 microns or not greater than 7 microns or not greater than 6 microns or not greater than 5 microns or not greater than 4 microns or not greater than 3 microns or not greater than 2 microns or not greater than 1 micron or not greater than 0.5 microns or not greater than 0.3 microns according to the uncorrected intercept method. In an embodiment, the abrasive particles can have a polycrystalline phase having crystalline domains having an average domain size of at least 0.1 microns or at least 0.2 microns or at least 0.3 microns or at least 0.4 microns or at least 0.5 microns or at least 0.75 microns or at least 1 micron or at least 1.5 microns or at least 2 microns or at least 2.5 microns or at least 3 microns or at least 3.5 microns or at least 4 microns or at least 4.5 microns or at least 5 microns. It will be appreciated that the average crystalline domain size may be between any of the minimum and maximum values noted above.

The mixture can include a particular ratio of abrasive particles to bond content (APv/ABv) that may facilitate improved performance and/or manufacturing of the abrasive article. In an embodiment, APv/ABv can be at least 1 or at least 1.1 or at least 1.2 or at least 1.3 or at least 1.4 or at least 1.5 or at least 1.6 or at least 1.7 or at least 1.8 or at least 1.9 or at least 2.0 or at least 2.1 or at least 2.2 or at least 2.3 or at least 2.4 or at least 2.5 or at least 2.6. In an embodiment, APv/ABv can be not greater than 10 or not greater than 9 or not greater than 8 or not greater than 7 or not greater than 6 or not greater than 5 or not greater than 4.5 or not greater than 4.0 or not greater than 3.9 or not greater than 3.8 or not greater than 3.7 or not greater than 3.6 or not greater than 3.5 or not greater than 3.4 or not greater than 3.3 or not greater than 3.2 or not greater than 3.1 or not greater than 3.0. It will be appreciated that APv/ABv can be between any of the minimum and maximum values noted above.

In an embodiment, the abrasive particles can have a multimodal particle size distribution. An exemplary particle size distribution can be found in. The multimodal particle size distribution can have a fine mode and a coarse mode, and a midway point equal to the mean of the particle sizes corresponding to the fine mode and the coarse mode.

In an embodiment, the coarse mode can correspond to a particular particle size that may facilitate improved performance and/or manufacturing of the abrasive article. In an embodiment, the coarse mode can be at least 5 microns or at least 10 microns or at least 15 microns or at least 20 microns or at least 25 microns or at least 30 microns or at least 35 microns or at least 40 microns or at least 45 microns or at least 50 microns or at least 55 microns or at least 60 microns or at least 65 microns or at least 70 microns or at least 75 microns or at least 80 microns. In an embodiment the coarse mode can be not greater than 1000 microns or not greater than 800 microns or not greater than 600 microns or not greater than 500 microns or not greater than 400 microns or not greater than 300 microns or not greater than 200 microns or not greater than 190 microns or not greater than 185 microns or not greater than 180 microns or not greater than 175 microns or not greater than 170 microns or not greater than 165 microns or not greater than 160 microns or not greater than 155 microns or not greater than 150 microns or not greater than 145 microns or not greater than 140 microns or not greater than 135 microns or not greater than 130 microns or not greater than 125 microns or not greater than 120 microns or not greater than 115 microns or not greater than 110 microns or not greater than 105 microns or not greater than 100 microns or not greater than 95 microns or not greater than 90 microns or not greater than 85 microns or not greater than 80 microns or not greater than 75 microns or not greater than 70 microns. It will be appreciated that the coarse mode can be between any of the minimum and maximum values noted above.

In an embodiment, the fine mode can correspond to a particular particle size that may facilitate improved performance and/or manufacturing of the abrasive article. In an embodiment, the fine mode can be at least 1 micron or at least 2 microns or at least 3 microns or at least 4 microns or at least 5 microns or at least 6 microns or at least 7 microns or at least 8 microns or at least 9 microns or at least 10 microns or at least 11 microns or at least 12 microns or at least 13 microns or at least 14 microns or at least 15 microns or at least 16 microns or at least 17 microns or at least 18 microns or at least 19 microns or at least 20 microns or at least 21 microns or at least 22 microns or at least 23 microns or at least 24 microns or at least 25 microns or at least 26 microns or at least 27 microns or at least 28 microns. In an embodiment, the fine mode can be not greater than 80 microns or not greater than 78 microns or not greater than 76 microns or not greater than 74 microns or not greater than 72 microns or not greater than 70 microns or not greater than 68 microns or not greater than 66 microns or not greater than 64 microns or not greater than 62 not greater than 60 microns or not greater than 58 microns or not greater than 56 microns or not greater than 54 microns or not greater than 52 microns or not greater than 50 microns or not greater than 48 microns or not greater than 46 microns or not greater than 44 microns or not greater than 42 microns or not greater than 40 microns or not greater than 38 microns or not greater than 36 microns or not greater than 34 microns or not greater than 32 microns or not greater than 30 microns. It will be appreciated that the fine mode can be between any of the minimum and maximum values noted above.

In an embodiment, the difference between the fine and coarse modes can correspond to a particular particle size that may facilitate improved performance and/or manufacturing of the abrasive article. In an embodiment, the difference between the fine and coarse modes can be at least 5 microns or at least 10 microns or at least 15 microns or at least 20 microns or at least 25 microns or at least 30 microns or at least 35 microns or at least 40 microns or at least 45 microns or at least 50 microns or at least 55 microns or at least 60 microns or at least 65 microns or at least 70 microns or at least 75 microns or at least 80 microns. In an embodiment the difference between the fine and coarse modes can be not greater than 1000 microns or not greater than 800 microns or not greater than 600 microns or not greater than 500 microns or not greater than 400 microns or not greater than 300 microns or not greater than 200 microns or not greater than 190 microns or not greater than 185 microns or not greater than 180 microns or not greater than 175 microns or not greater than 170 microns or not greater than 165 microns or not greater than 160 microns or not greater than 155 microns or not greater than 150 microns or not greater than 145 microns or not greater than 140 microns or not greater than 135 microns or not greater than 130 microns or not greater than 125 microns or not greater than 120 microns or not greater than 115 microns or not greater than 110 microns or not greater than 105 microns or not greater than 100 microns or not greater than 95 microns or not greater than 90 microns or not greater than 85 microns or not greater than 80 microns or not greater than 75 microns or not greater than 70 microns. It will be appreciated that the difference between the fine and coarse modes can be between any of the minimum and maximum values noted above.

In an embodiment, the multimodal particle size distribution can include vol % ratio, [Vc/Vf] wherein Ve represents the vol % of the coarse abrasive particles having a particle size above the mean of the fine mode and the coarse mode and Vf represents the vol % of abrasive particles having a particle size below the mean of the fine mode and the coarse mode. In an embodiment, [Vc/Vf] can be at least 0.5 or at least 0.6 or at least 0.7 or at least 0.8 or at least 0.9 or at least 1 or at least 1.1 or at least 1.2 or at least 1.3 or at least 1.4 or at least 1.5 or at least 2 or at least 3 or at least 4 or at least 5 or at least 6 or at least 7 or at least 8. In an embodiment [Vc/Vf] can be not greater than 100 or not greater than 75 or not greater than 50 or not greater than 40 or not greater than 30 or not greater than 20 or not greater than 15 or not greater than 12 or not greater than 10 or not greater than 9 or not greater than 8 or not greater than 7 or not greater than 6 or not greater than 5. It will be appreciated that the [Vc/Vf] may be between any of the minimum and maximum values noted above.

After mixing, the mixture may be molded and pressed to form a green abrasive body. In an embodiment, the mixture can be pressed with a particular amount of force that may facilitate improved performance and/or manufacturing of the abrasive article. In an embodiment, the pressing force can be at least 300 Ton or at least 310 Ton or at least 320 Ton or at least 330 Ton or at least 340 Ton or at least 350 Ton or at least 360 Ton or at least 370 Ton or at least 380 Ton or at least 390 Ton or at least 400 Ton or at least 410 Ton or at least 420 Ton or at least 430 Ton or at least 440 Ton or at least 450 Ton or at least 460 Ton or at least 470 Ton or at least 480 Ton or at least 490 Ton or at least 500 Ton. In an embodiment, the pressing force can be of not greater than 1000 Ton or not greater than 950 Ton or not greater than 900 Ton or not greater than 850 Ton or not greater than 800 Ton or not greater than 750 Ton or not greater than 700 Ton or not greater than 650 Ton or not greater than 600 Ton or not greater than 550 Ton or not greater than 500 Ton or not greater than 450 Ton or not greater than 400 Ton or not greater than 350 Ton. It will be appreciated that the pressing force may be between any of the minimum and maximum values noted above.

In an embodiment, the mixture can be pressed with a particular pressure that may facilitate improved performance and/or manufacturing of the abrasive article. In an embodiment, the pressing pressure can be at least 90 MPa or at least 95 MPa or at least 100 MPa or at least 105 MPa or at least 110 MPa. In an embodiment, the pressing pressure can be no greater than 200 MPa or no greater than 195 MPa or no greater than 190 MPa or no greater than 185 MPa or no greater than 180 MPa.

After pressing, the green body may be dried under controlled humidity. Drying may be done at a particular humidity that may facilitate improved performance and/or manufacturing of the abrasive article. In an embodiment, drying can be done with at least 30% humidity or at least 32% humidity or at least 34% humidity or at least 36% humidity or at least 38% humidity or at least 40% humidity or at least 42% humidity or at least 44% humidity or at least 46% humidity or at least 48% humidity or at least 50% humidity or at least 52% humidity or at least 54% humidity or at least 56% humidity or at least 58% humidity or at least 60% humidity. In an embodiment, drying can be done with no greater than 60% humidity or no greater than 58% humidity or no greater than 56% humidity or no greater than 54% humidity or no greater than 52% humidity or no greater than 50% humidity or no greater than 48% humidity or no greater than 46% humidity or no greater than 44% humidity or no greater than 42% humidity or no greater than 40% humidity or no greater than 38% humidity or no greater than 36% humidity or no greater than 34% humidity or no greater than 32% humidity or no greater than 30% humidity. It will be appreciated that the drying humidity can be between any of the minimum and maximum values noted above.

Drying may be done at a particular temperature that may facilitate improved performance and/or manufacturing of the abrasive article. In an embodiment, the drying temperature can be at least 40° C. or at least 41° C. or at least 42° C. or at least 43° C. or at least 44° C. or at least 45° C. or at least 46° C. or at least 47° C. or at least 48° C. or at least 49° C. or at least 50° C. or at least 51° C. or at least 52° C. or at least 53° C. or at least 54° C. or at least 55° C. or at least 56° C. or at least 57° C. or at least 58° C. or at least 59° C. or at least 60° C. In an embodiment, the drying temperature can be no greater than 80° C. no greater than 79° C. or no greater than 78° C. or no greater than 77° C. or no greater than 76° C. or no greater than 75° C. or no greater than 74° C. or no greater than 73° C. or no greater than 72° C. or no greater than 71° C. or no greater than 70° C. or no greater than 69° C. or no greater than 68° C. or no greater than 67° C. or no greater than 66° C. or no greater than 65° C. or no greater than 64° C. or no greater than 63° C. or no greater than 62° C. or no greater than 61° C. or no greater than 60° C. or no greater than 59° C. or no greater than 58° C. or no greater than 57° C. or no greater than 56° C. or no greater than 55° C. or no greater than 54° C. or no greater than 53° C. or no greater than 52° C. or no greater than 51° C. or no greater than 50° C. It will be appreciated that the drying temperature can be between any of the minimum and maximum values noted above.