Cast Components and Methods of Manufacture

This application claims the benefit of U.S. Provisional Application No. 63/658,441, filed 11 Jun. 2024, entitled “CAST COMPONENTS AND METHODS OF MANUFACTURE,” the entire disclosure of which is hereby incorporated by reference.

The described embodiments relate generally to cast components that can be used in electronic devices and methods of manufacturing the same. More particularly, the present embodiments relate to cast components used for housings, structures, and/or electronic devices, which have improved cosmetic finishes, improved thermal properties, improved mechanical properties, and reduced environmental impact.

Electronic devices are widespread in society and can take a variety of forms, from wristwatches to computers. Components for these devices, such as enclosures, housings, chassis, and other components, can benefit from exhibiting different combinations of properties relating to the use of the device. The components of an electronic device can have a combination of properties, such as appearance, mechanical properties, thermal properties, electrical properties, cost, and environmental impact in order to function as desired. Various manufacturing processes can be used to form the components of an electronic device and can impart different properties on the components.

Casting is a manufacturing process that can be used to form components with minimal material waste and processing steps, thereby reducing the cost and environmental impact of producing the components. For example, casting can produce components with high material utilization, produce castings with near net shapes, and utilize a minimal number of processing steps (e.g., heat treatment steps, subtractive manufacturing steps, and the like). However, traditional casting processes and casting alloys can produce components with unsatisfactory cosmetic appearances and other unsatisfactory properties. Thus, it can be desirable to provide casting processes and alloys to achieve a desired combination of somewhat disparate properties.

One aspect of the present disclosure relates to a component for an electronic device, the component including an aluminum alloy including a plurality of silicon particles having spheroidal shapes and a silicon concentration of greater than 1.5 wt %.

In some examples, the silicon concentration can be from 7 wt % to 10 wt %. An L* value of the component can be at least 65. In some examples, the silicon concentration can be 3 wt % or less. In some examples, an L* value of the component can be at least 85 and a b* value of the component can be 0.5 or less.

In some examples, a mean cross-sectional area of the plurality of silicon particles can be at least 1 μm. A Vickers hardness value of the component can be at least 81. The component can have a thermal conductivity of at least 180 W/m·K.

Another aspect of the present disclosure relates to a method including casting a component from an aluminum alloy and performing a heat treatment on the component to concentrate silicon in the component into silicon particles having spheroidal shapes. After the heat treatment, the component can have an L* value of at least 65.

In some examples, the aluminum alloy can include silicon having a concentration of 3 wt % or less. The component can be cast using squeeze casting, sand casting, or die casting. In some examples, the method can further include anodizing the component after performing the heat treatment.

In some examples, the heat treatment can include heating the component to a temperature in a range from 450° C. to 480° C. The heat treatment can include heating the component to a temperature in a range from 450° C. to 550° C. In some examples, the heat treatment can include ageing the component at a temperature in a range from 150° C. to 230° C.

In yet another aspect of the present disclosure, an aluminum alloy cast component includes a plurality of silicon particles having spherical shapes. The silicon particles can have a concentration in the aluminum alloy in a range from 1.5 wt % to 3 wt %.

In some examples, a mean cross-sectional area of the plurality of silicon particles can be from 1 μmto 1.5 μm. A mean cross-sectional area of the plurality of silicon particles can be from 0.25 μmto 0.75 μm.

In some examples, the component can have an L* value of at least 87 and a b* value of 0.5 or less. The component can have a Vickers hardness value of at least 81 and a thermal conductivity of at least 180 W/m·K.

Reference will now be made in detail to representative embodiments illustrated in the accompanying drawings. It should be understood that the following descriptions are not intended to limit the embodiments to one preferred embodiment. To the contrary, it is intended to cover alternatives, modifications, and equivalents as can be included within the spirit and scope of the described embodiments as defined by the appended claims.

The following disclosure relates to cast components, electronic devices including cast components, alloys for cast components, and methods of forming cast components. As compared with traditional alloys for casting, the alloys described herein can have a decreased silicon concentration. Heat treatments can be performed on the cast components in order to concentrate silicon included in the alloys into spheroidal particles. For the purposes of this disclosure, spheroidal particles, particles having spheroidal shapes, or particles having spherical shapes can be sphere-shaped, semi-sphere-shaped, about sphere-shaped, approximately sphere-shaped, or within about 10% of being sphere-shaped. As a result of forming cast components from the alloys of the present disclosure and/or using the heat treatments of the present disclosure, the cast components can have improved cosmetics, mechanical properties, and thermal properties. Moreover, by casting components, as opposed to other manufacturing methods, the components can be formed with less material waste and less manufacturing processes and time.

The cast components can be shaped by various casting processes, such as squeeze casting, die casting, sand casting, or the like. Once the cast components are shaped, the as cast components can be cooled and subjected to a heat treatment, which can cause silicon in the cast components to concentrate into spheroidal particles. The heat treatment can be a two-step process. The first step can include raising the temperature of the cast components to a high temperature and then quenching the cast components. The second step can include an artificial aging process, which includes raising the temperatures of the cast components to a relatively low raised temperature. In some examples, the heat treatment can include the first step followed by the second step or can include either the first step or the second step alone. Performing the heat treatment on the cast components can provide the cast components with improved cosmetic, mechanical, and thermal properties.

The present disclosure describes cast components, alloys for cast components, and the like, which can have improved visual characteristics. In some examples, the visual characteristics of cast components can be measured using colorimetry spectrophotometer techniques and quantified according to color space standards, such as CIE 1976 L*a*b* by the International Commission on Illumination. The CIE 1976 L*a*b* color space model is used to characterize colors of an object according to color opponents: L* corresponding to an amount of lightness, a* corresponding to amounts of green and red, and b* corresponding to amounts of blue and yellow. Higher L* values correspond to greater amounts of lightness and lower L* values correspond to lesser amounts of lightness. Negative a* values indicate a green color, with more negative a* values indicating a greener color, and positive a* values indicate a red color, with more positive b* values indicating a redder color. Negative b* values indicate a blue color, with more negative b* values indicating a bluer color, and positive b* values indicate a yellow color, with more positive b* values indicating a yellower color.

These and other examples are discussed below with reference to. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these Figures is for explanatory purposes only and should not be construed as limiting. Furthermore, as used herein, a system, a method, an article, a component, a feature, or a sub-feature including at least one of a first option, a second option, or a third option should be understood as referring to a system, a method, an article, a component, a feature, or a sub-feature that can include one of each listed option (e.g., only one of the first option, only one of the second option, or only one of the third option), multiple of a single listed option (e.g., two or more of the first option), two options simultaneously (e.g., one of the first option and one of the second option), or combination thereof (e.g., two of the first option and one of the second option).

show a perspective view and an exploded view, respectively, of an example of an electronic device. The electronic deviceshown inis a mobile wireless communication device (e.g., a smart phone). The smart phone ofis merely one representative example of a device that can be used in conjunction with the systems and methods disclosed herein. The electronic devicecan correspond to any form of a wearable electronic device (e.g., watches, such as smart watches), a cellular telephone, a portable media player, a media storage device, a portable digital assistant (“PDA”), a tablet computer, a computer, a mobile communication device, a GPS unit, a remote control device, or another electronic device. The electronic devicecan be referred to as an electronic device, a device, a consumer device, a cellphone, a smart phone, or the like.

The electronic devicecan have a housing or an enclosure that includes a bandor a frame. The bandcan define an outer perimeter of the electronic device. The band, or portions thereof, can be or can include a metallic component (e.g., a cast component), as described herein. In some examples, the bandcan include several sidewall components, such as a first sidewall component, a second sidewall component, a third sidewall component(opposite the first sidewall component), and a fourth sidewall component(opposite the second sidewall component). The sidewall components,,,can be or can include components formed from cast materials and methods as described herein.

Any of the sidewall components,,,can form part of an antenna assembly (not shown in). As a result, a non-metal material or materials can separate the sidewall components,,,of the bandfrom one another in order to electrically isolate the sidewall components,,,. For example, a separating materialcan separate the first sidewall componentfrom the second sidewall component. The separating materialcan include a moldable non-metallic material, such as a polymeric material. In some examples, the non-metallic material can be electrically inert or insulating, such as plastics, resins, combinations thereof, or the like.

The electronic devicecan further include a display assemblythat can include a transparent protective cover that at least partially defines an exterior surface of the electronic device. The display assemblycan include multiple layers, with each layer providing a unique function. In some examples, the transparent protective cover can be formed from a transparent material, such as glass, plastic, sapphire, or similar transparent materials. In this regard, the transparent protective cover can be referred to as a transparent cover, a protective cover, or a cover glass (e.g., when the protective transparent cover includes glass). The electronic devicecan further include a portdesigned to receive a connector of a cable assembly. The portcan extend through an opening in a sidewall component,,,and is illustrated extending through the third sidewall componentin. The portcan allow the electronic deviceto communicate data information (send and receive), and also allow the electronic deviceto receive electrical energy to charge a battery assembly of the electronic device. Accordingly, the portcan include terminals that electrically couple to the connector.

The electronic devicecan include several control inputs designed to provide a command to the electronic device. For example, the electronic devicecan include a control input. The control inputcan be used to adjust the visual information presented on the display assembly, to adjust the volume of sound output by an audio module of the electronic device, or the like. The control inputcan include a switch, a sensor, a button, or the like, and can be configured to generate a command to a processor circuit. The control inputcan at least partially extend through an opening in a sidewall component,,,. For example, as illustrated in, the second sidewall componentcan include or define an openingthat receives a control input, which can be the same as or similar to the control input.

The electronic devicecan include internal components, such as processors, memory, circuit boards, batteries, and sensors. Such components can be disposed within an internal volume defined, at least partially, by the band, and can be affixed to the band, via internal surfaces, attachment features, threaded connectors, studs, posts, and/or other fixing features (collectively referred to as fixing features). The fixing features can be formed into, defined by, or otherwise part of the band. In examples in which the bandis formed as a cast component, the fixing features of the bandcan be formed during casting or can be machined into the bandafter casting.

As illustrated in, the electronic devicecan include internal components, such as a system in package (SiP)including one or more integrated circuits, such as a processors, sensors, and memory. The electronic devicecan also include a batteryhoused in the internal volume of the electronic device. The electronic devicecan include one or more sensors, such as optical or other sensors, which can sense or otherwise detect information regarding the environment external to the internal volume of the electronic device. Additional components, such as a haptic engine, can be included in the electronic device.

The electronic devicecan include a chassis, which can provide structural support to the electronic device. The chassiscan include a rigid material, such as a metal, or can include a composite construction. The chassiscan be coupled to the band. The chassiscan provide an electrical grounding path for components of the electronic deviceelectrically coupled to the chassis. The electronic devicecan alternatively or additionally include a back plate, which can include cladding layers and/or other attachment features, such that one or more components of the electronic devicecan be attached to the back plate, for example, by welding. The back platecan form conductive pathways for connecting components of the electronic device. In some examples, the back platecan be attached to the bandof the electronic deviceby one or more attachment features. The chassisand/or the back platecan be or can include components formed from cast materials and methods as described herein.

An exterior surface of the electronic devicecan further be defined by a back coverthat can be coupled to the band. The back coverand the bandcan collectively form an enclosure or housing of the electronic devicewith the enclosure or housing (including the bandand the back cover) at least partially defining an internal volume. The back covercan include a material that is transparent to any desired range of wavelengths of electromagnetic radiation, such as visible light. In some examples, the back covercan include a material that can allow for inductive charging through the back cover. In some examples, the back covercan include a material such as metals, glass, plastic, and/or sapphire. The back covercan be or can include components formed from cast materials and methods as described herein.

Any number or variety of components of an electronic device, such as the electronic device, can be formed from the cast materials and methods described in the present disclosure. For example, the band(including any of the sidewall components,,,), the chassis, the back plate, and/or the back covercan include components formed from cast materials and methods as described herein. The cast materials described herein can have improved cosmetics, mechanical properties, and thermal properties as compared to cast materials formed from traditional casting alloys and by traditional casting methods. Further, forming components of the electronic deviceby casting, as opposed to other manufacturing processes, can reduce material waste, processing steps, and processing time for forming the cast components.

shows a flow diagram of a methodof forming a cast component. In block, a component is cast. The cast component can be any component, such as a component that can be used in an electronic device. The cast component can be shaped using any suitable casting process, such as squeeze casting, die casting, sand casting, or the like. Specifically, a molten metal material can be poured or injected into a mold representative of a desired end shape, solidified, and removed from the mold to form the cast component. Heat and pressure can be applied to the metal material as the metal material is injected into, or while the metal material is positioned within the mold. The metal material can include an aluminum alloy or other suitable metallic material.

In examples in which the cast component is formed from an aluminum alloy, the aluminum alloy can include silicon. Including silicon in the aluminum alloy can improve the flowability and moldability of the aluminum alloy and can reduce the melting temperature of the aluminum alloy. This can be used to reduce porosity in the metal of the cast component and improve the suitability of the aluminum alloy for casting. However, including a higher concentration of silicon in the aluminum alloy can traditionally cause various cosmetic defects to be present in the case component. For example, higher concentrations of silicon in the aluminum alloy can result in the cast component having a coral-like or sponge-like microstructure, a dull appearance (e.g., a low L* value), a poor response to anodization, a chalky texture, and the like. In some examples, the aluminum alloy can include a silicon concentration in a range from about 1 wt % to about 12 wt %, at least about 1.5 wt %, 3 wt % or less, from about 7 wt % to about 11 wt %, from about 7 wt % to about 10 wt %, or the like.

In some examples, the aluminum alloy can include a silicon concentration in a range from about 6 wt % to about 12 wt %, from about 7 wt % to about 11 wt %, from about 7 wt % to about 10 wt %, or the like. Concentrations of silicon in these ranges can produce an as-cast component with a poor microstructure and visual characteristics. For example, the as-cast components can have a coral-like or sponge-like microstructure, a dull appearance (e.g., an L* value in a range from about 30 to about 40, from about 32 to about 38, from about 34 to about 36, at least about 35 or the like), a poor response to anodization, a chalky texture, and the like. The coral-like or sponge-like microstructure can be caused by aluminum-silicon mixed phases that extend in a coral-like or sponge-like pattern through the as-cast components. However, subsequent heat treatments, discussed below, can be performed on the as-cast component to improve both the visual characteristics and the microstructure of the cast components. For example, after heat treatments are performed on the cast components, the cast components can have a solid microstructure with spheroidal silicon particles. The cast components can have an improved anodization response and a smooth texture. The cast components can have an L* value in a range from about 60 to about 70, from about 62 to about 68, in a range from about 64 to about 66, at least about 65, or the like. Performing the heat treatments on the as-cast components can cause silicon in the as-cast components to concentrate into spheroidal particles within the cast components.

In some examples, the aluminum alloy can include a silicon concentration in a range from about 1 wt % to about 5 wt %, from about 1.2 wt % to about 3.5 wt %, from about 1.5 wt % to about 3 wt %, from about 2 wt % to about 3 wt %, at least about 1.2 wt %, at least about 1.5 wt %, 3.5 wt % or less, 3 wt % or less, or the like. Concentrations of silicon in these reduced ranges can produce an as-cast component with a solid microstructure and good visual characteristics. The as-cast components with reduced silicon concentrations can have a solid microstructure with spheroidal silicon particles, a good anodization response, and a smooth texture. The as-cast components can have an L* value in a range from about 80 to about 90, from about 85 to about 90, from about 86 to about 89, at least about 85, at least about 86, or the like. The as-cast components can have a b* value in a range from about 0.3 to about 0.65, from about 0.35 to about 0.6, about 0.6 or less, or the like. Subsequent heat treatments, discussed below, can be performed on the as-cast components to further improve visual characteristics and the microstructure of the cast components. For example, after heat treatments are performed on the cast components, the cast components have an L* value in a range from about 80 to about 95, from about 85 to about 92, from about 86 to about 91, at least about 86, at least about 87, at least about 89, or the like. The cast components can have a b* value in a range from about 0.1 to about 2.2, from about 0.1 to about 1.5, from about 0.15 to about 0.6, about 0.6 or less, about 0.5 or less, about 0.4 or less, or the like. Performing the heat treatments on the as-cast components can cause silicon in the as-cast components to concentrate into spheroidal particles and can cause the spheroidal particles to grow to a lesser number of spheroidal particles with greater areas in a cross-sectional view within the cast components.

In block, a heat treatment is performed on the as-cast component. Generally, the heat treatment can be a two-step heat treatment. The first step can include a high-temperature heat treatment. The second step can include a low-temperature ageing. The heat treatment can include the first step followed by the second step, the second step followed by the first step, or either the first step or the second step alone.

The first step of the heat treatment at blockcan include a high-temperature heat treatment, which can be followed by a quenching process. In some examples, the first step can be performed at a temperature in a range from about 450° C. to about 550° C., from about 480° C. to about 530° C., from about 450° C. to about 480° C., from about 465° C. to about 475° C., from about 480° C. to about 500° C., from about 530° C. to about 550° C., from about 535° C. to about 545° C., about 470° C., about 540° C., or the like. The first step of the heat treatment can be performed for about 30 minutes about 2 hours, about 24 hours, a period in a range from about 1 hour to about 25 hours, from about 1.5 hours to about 2.5 hours, from about 0.5 hours to about 2 hours, from about 15 minutes to about 45 minutes, from about 22 hours to about 26 hours, or the like.

Performing the first step of the heat treatment can cause silicon in the cast component to concentrate within the cast component into spheroidal particles, which can improve the microstructure of the cast component. Specifically, concentrating silicon in the cast component into spheroidal particles can improve (e.g., increase) an L* value of the cast component. In examples in which the as-cast component includes a coral or sponge-like microstructure, concentrating the silicon into spheroidal particles can replace the coral or sponge-like microstructure and increase a solidity of the cast component. This can improve an anodization response of the cast component. Further, performing the first step of the heat treatment can increase a hardness of the cast component. For example, after performing the first step of the heat treatment, the cast component can have a Vickers hardness value of greater than about 81, greater than about 90, greater than about 100, or the like.

The second step of the heat treatment at blockcan include a high-temperature heat treatment. In some examples, the second step can be performed at a temperature in a range from about 150° C. to about 230° C., from about 150° C. to about 185° C., from about 170° C. to about 190° C., from about 185° C. to about 195° C., about 180° C., about 190° C., or the like. The second step of the heat treatment can be performed for about 6 hours, about 2 hours, a period in a range from about 5 hours to about 7 hours, from about 5.5 hours to about 6.5 hours, from about 1.5 hours to about 2.5 hours, or the like. Performing the second step of the heat treatment can increase a hardness of the cast component. For example, after performing the second step of the heat treatment, the cast component can have a Vickers hardness value of at least about 81, at least about 90, at least about 100, or the like.

Performance of each of the first step of the heat treatment and the second step of the heat treatment can increase an L* value (e.g., a brightness) of the cast component, thermal properties of the cast component (e.g., a thermal conductivity), and mechanical properties of the cast component (e.g., a Vickers hardness, an anodization response, and the like), but can also increase a b* value (e.g., a yellowness) of the cast component. Performing the first step of the heat treatment at a relatively lower temperature (e.g., a temperature of about 470° C. or in a range from about 450° C. to about 480° C., as opposed to a temperature of about 540° C. or in a range from about 530° C. to about 550° C.), or for a shorter duration (e.g., about 2 hours or in a range from about 1.5 hours to about 2.5 hours as opposed to about 24 hours or in a range from about 22 hours to about 26 hours) can prevent the b* value of the cast component from becoming undesirably high, while still providing a desired L* value, thermal properties, and mechanical properties. Further, in some examples, the first step of the heat treatment alone can be performed, or the second step of the heat treatment alone can be performed.

In an example in which the cast component is heated to a temperature of about 540° C. or in a range from about 530° C. to about 550° C. for about 2 hours or in a range from about 1.5 hours to about 2.5 hours and is subjected to ageing at a temperature of about 180° C. or in a range from about 150° C. to about 230° C. for about 6 hours or in a range from about 5.5 hours to about 6.5 hours, the cast component can have an L* value in a range from about 86 to about 92, from about 88 to about 91, or the like and a b* value in a range from about 1.5 to about 2, from about 1.7 to about 1.9, or the like. In an example in which the cast component is heated to a temperature of about 540° C. or in a range from about 530° C. to about 550° C. for about 24 hours or in a range from about 22 hours to about 26 hours and is subjected to ageing at a temperature of about 180° C. or in a range from about 150° C. to about 230° C. for about 6 hours or in a range from about 5.5 hours to about 6.5 hours, the cast component can have an L* value in a range from about 86 to about 92, from about 88.5 to about 91, or the like and a b* value in a range from about 1.75 to about 2.25, from about 1.8 to about 2.2, or the like. In an example in which the cast component is heated to a temperature of about 470° C. or in a range from about 450° C. to about 480° C. for about 24 hours or in a range from about 22 hours to about 26 hours without a second ageing step, the cast component can have an L* value in a range from about 87 to about 91, from about 88 to about 89, or the like and a b* value in a range from about 0.1 to about 0.3, from about 0.15 to about 0.25, or the like. In an example in which the cast component is heated to a temperature of about 470° C. or in a range from about 450° C. to about 480° C. for about 24 hours or in a range from about 22 hours to about 26 hours and is subjected to ageing at a temperature of about 180° C. or in a range from about 150° C. to about 230° C. for about 6 hours or in a range from about 5.5 hours to about 6.5 hours, the cast component can have an L* value in a range from about 87 to about 91, from about 88 to about 89, or the like and a b* value in a range from about 0.3 to about 0.6, from about 0.35 to about 0.45, or the like. In an example in which the cast component is heated to a temperature of about 540° C. or in a range from about 530° C. to about 550° C. for about 24 hours or in a range from about 22 hours to about 26 hours without a second ageing step, the cast component can have an L* value in a range from about 86 to about 92, from about 89 to about 91, or the like and a b* value in a range from about 0.75 to about 1.5, from about 0.9 to about 1.2, or the like. In an example in which the cast component is heated to a temperature of about 540° C. or in a range from about 530° C. to about 550° C. for about 2 hours or in a range from about 1.5 hours to about 2.5 hours without a second ageing step, the cast component can have an L* value in a range from about 86 to about 92, from about 88.5 to about 91, or the like and a b* value in a range from about 0.75 to about 1.5, from about 0.85 to about 1.2, or the like. In an example in which the cast component is subjected to ageing at a temperature of about 180° C. or in a range from about 150° C. to about 230° C. for about 6 hours or in a range from about 5.5 hours to about 6.5 hours without a first heat treatment step, the cast component can have an L* value in a range from about 85 to about 89, from about 86 to about 88, or the like and a b* value in a range from about 0.25 to about 1.75, from about 0.4 to about 1.5, or the like. In an example in which the cast component is not subjected to the heat treatment of block, the cast component can have an L* value in a range from about 85 to about 89, from about 86 to about 88.5, or the like and a b* value in a range from about 0.25 to about 0.75, from about 0.3 to about 0.6, or the like. In each of these examples, the cast component can include a silicon concentration in a range of about 1.2 wt % to about 3.5 wt % or in a range from about 1.5 wt % to about 3 wt %. The cast components in each of these examples can include a* values in a range from about −0.15 to about −0.4, from about −0.2 to about −0.3, or the like.

Providing a cast component with an L* value of greater than about 85, greater than about 87, or the like and a b* value of 1.5 or less, 1.2 or less, 1 or less, 0.5 or less, or the like can be desirable to cast components with cosmetics acceptable for exterior electronic device applications. As such, the silicon concentration, the first heat treatment step, and the second heat treatment step can be optimized in order to provide cast components with at least these L* and b* values.

The cast components can further include improved thermal and mechanical properties. For example, performing a first step on the cast component at a temperature of about 490° C. or in a range from about 480° C. to about 500° C. for about 30 minutes or in a range from about 15 minutes to about 45 minutes and performing a second step on the cast component at a temperature of about 190° C. or in a range from about 185° C. to about 195° C. for about 2 hours or in a range from about 1.5 hours to about 2.5 hours can provide the cast component with a thermal conductivity of about 180 W/m·K, greater than about 170 W/m·K, in a range from about 170 W/m·K to about 190 W/m·K, or the like. Subjecting the cast components to any of the first heat treatment step at the higher temperature, the first step at the lower temperature followed by the second step, or the second step alone can provide the cast components with Vickers hardness values of at least about 81, at least about 90, or at least about 100.

Performing the first step of the heat treatment of blockat a relatively lower temperature, such as a temperature of about 470° C. or in a range from about 450° C. to about 480° C., can provide several benefits. For example, performing the first step at a temperature of greater than about 465° C. (e.g., in a range from about 480° C. to about 530° C.) can cause magnesium silicide (MgSi) in the cast component to dissolve, which can increase the strength of the cast component. Performing the first step at a relatively low temperature can avoid other intermetallics, such as β-AlFeSifrom dissolving, which can be beneficial to the structure of the cast component. Further, blistering and other dimensional concerns (e.g., distortion caused by quenching the cast component from a higher temperature) that can occur at higher temperatures can be prevented by performing the first step at a relatively lower temperature.

In block, the cast component is anodized. As described previously, the cast component can have an improved microstructure, which can result in an improved anodization response of the cast component. Anodizing the cast component can increase resistance of the cast component to corrosion and wear, improve cosmetics of the cast component (e.g., provide a more even surface texture to the cast components, alter a color of the cast components, or the like), and the like. In examples in which the heat treatment of blockis performed, the cast component can be anodized after performing the heat treatment of blockon the cast component, as the heat treatment can improve the anodization response of the cast component.

Blocksandcan be optional, and either or both of blocksandcan be omitted in some examples. Additional manufacturing processes can be performed throughout the method. For example, additional shaping processes, such as subtractive manufacturing processes (e.g., CNC processes or the like) can be performed between blocksand, between blocksand, or after block. In some examples, the cast components can be painted, plated, or the like in order to provide a desired finish on the cast components.

illustrate microscopic cross-sectional views of a cast material. The cast materialcan be an aluminum alloy having a silicon concentration in a range from about 7 wt % to about 11 wt %. The cast materialcan be an as-cast material that has not been subjected to the heat treatments of blockof the method, discussed above with respect to. The cast materialcan include an aluminum materialand an aluminum-silicon mixed phase. The cast materialcan be anodized and can include a substrate regionand an anodized region(e.g., a metal oxide coating). The cast materialcan include solid regions, which have good anodization responses, and sponge-like regionsthat have a sponge-like or coral-like microstructure and have poor anodization responses. The aluminum-silicon mixed phasecan cause the cast materialto have the sponge-like or coral-like microstructure, which has poor brightness and poor anodization characteristics. The aluminum-silicon mixed phasecan be a web-like structure that extends through the aluminum materialof the cast materialand separates the aluminum materialinto discrete portions of material, as opposed to the solid regions. The cast materialcan have a relatively dull appearance, with an L* value in a range from about 30 to about 40, from about 32 to about 38, from about 34 to about 36, at least about 35 or the like.

Reducing the silicon concentration in the cast materialcan reduce or eliminate the presence of the aluminum-silicon mixed phase. For example, reducing the silicon concentration in the cast materialto within a range from about 1.2 wt % to about 3.5 wt % or from about 1.5 wt % to about 3 wt % can reduce or eliminate the presence of the aluminum-silicon mixed phaseand the sponge-like regions. This can provide a continuous aluminum materialwith spheroidal silicon particles, increase the brightness of the cast material, and improve the anodization characteristics of the cast material. Further, subjecting the cast materialto heat treatments, such as the heat treatments of blockof the method, discussed above with respect to, can concentrate silicon in the cast materialinto spheroidal particles. This can reduce or eliminate the presence of the aluminum-silicon mixed phaseand the sponge-like regions, provide a continuous aluminum materialwith spheroidal silicon particles, increase the brightness of the cast material, and improve the anodization characteristics of the cast material.

illustrates a microscopic cross-sectional view of a cast material. The cast materialcan be an aluminum alloy having a silicon concentration in a range from about 7 wt % to about 11 wt %. The cast materialcan be the same as or similar to the cast material, discussed above with respect to, except that the cast materialis subjected to a heat treatment of blockof the method, discussed above with respect to. The cast materialcan include an aluminum materialand spheroidal silicon particles. The cast materialcan be anodized and can include a substrate regionand an anodized region(e.g., a metal oxide coating).

Subjecting the cast materialto the heat treatments of blockof the method, discussed above with respect to, can cause silicon in the cast materialto concentrate into the spheroidal silicon particles. This can reduce or eliminate the sponge-like regions, illustrated in, and provide a solid aluminum materialwith interspersed spheroidal silicon particles. This can increase the brightness of the cast materialand improve the anodization characteristics of the cast material. The cast materialcan have an L* value in a range from about 60 to about 70, from about 62 to about 68, in a range from about 64 to about 66, at least about 65, or the like.

illustrates a microscopic cross-sectional view of a cast material. The cast materialcan be an aluminum alloy having a silicon concentration in a range from about 1.2 wt % to about 3.5 wt %. The cast materialcan be the same as or similar to the cast material, discussed above with respect to, except that the cast materialhas a lower concentration of silicon. The cast materialcan be an as-cast material that has not been subjected to the heat treatments of blockof the method, discussed above with respect to. The cast materialcan include an aluminum materialand spheroidal silicon particles. The cast materialcan be anodized and can include a substrate regionand an anodized region(e.g., a metal oxide coating).

Reducing the silicon concentration in the cast materialcan cause silicon in the cast materialto concentrate into the spheroidal silicon particles. This can reduce or eliminate the sponge-like regions, illustrated in, and provide a solid aluminum materialwith interspersed spheroidal silicon particles. This can increase the brightness of the cast materialand improve the anodization characteristics of the cast material. The cast materialcan have an L* value in a range from about 80 to about 90, from about 85 to about 90, from about 86 to about 89, at least about 85, at least about 86, or the like.

illustrate microscopic cross-sectional views of cast materials,,, respectively. The cast materialis an example of an as-cast material that has not been subjected to the heat treatments of blockof the method, discussed above with respect to. The cast materialis an example of a cast material that has been subjected to the first step of the heat treatment of blockof the method, discussed above with respect to, at a relatively low temperature of about 470° C. or in a range from about 450° C. to about 480° C. for about 24 hours or in a range from about 22 hours to about 26 hours. The cast materialis an example of a cast material that has been subjected to the first step of the heat treatment of blockof the methodat a relatively high temperature of about 540° C. or in a range from about 530° C. to about 550° C. for about 24 hours or in a range from about 22 hours to about 26 hours. Each of the cast materials,,can include the same aluminum alloys, and can include silicon concentrations in a range from about 1.2 wt % to about 3.5 wt %. Each of the cast materials,,can be relatively solid, and the cast materials,,can have good cosmetic, thermal, and mechanical properties. Each of the cast materials,,can have good anodization responses. Performing the heat treatments to form the cast materials,can improve mechanical properties (e.g., a hardness) of the cast materials,and can improve a brightness of the cast materials,relative to the cast material.