Deposition Apparatus and Inspection Method

This application claims priority to Korean Patent Application No. 10-2024-0086524, filed on Jul. 2, 2024, and all the benefits accruing therefrom under 35 U.S.C. § 119, the content of which in its entirety is herein incorporated by reference.

Embodiments of the disclosure relate to a deposition apparatus and a method of inspecting the deposition apparatus.

An organic light-emitting display device utilizes the phenomenon that electrons injected from a cathode and holes injected from an anode recombine in an organic thin film to form excitons, and light of a particular wavelength is generated as energy is released when the excitons relax from an excited state to the ground state.

In a manufacturing process of an organic light-emitting display device, vacuum deposition using a deposition apparatus may be used as a method for depositing an organic material or metal used as electrodes. The vacuum deposition may be carried out by placing a substrate on which an organic thin film is to be deposited on an electrostatic chuck placed inside a vacuum chamber, bring a mask assembly having a same pattern as the pattern of the thin film to be formed into contact with the substrate, and then evaporating or sublimating a deposition material such as an organic material using a deposition module to deposit the organic material on the substrate.

In a manufacturing process of an organic light-emitting display device, if particles exist on a surface of an electrostatic chuck or a mask assembly is not located at the right position during a process of depositing a deposition material, a defect may occur in the organic light-emitting display device.

Embodiments of the disclosure provide a deposition apparatus that can inspect whether an electrostatic chuck and a mask assembly inside a chamber is normal or not, and an inspection method by the deposition apparatus.

However, embodiments of the disclosure are not restricted to those set forth herein. The above and other embodiments of the disclosure will become more apparent to one of ordinary skill in the art to which the disclosure pertains by referencing the detailed description of the disclosure given below.

According to an embodiment of the disclosure, a deposition apparatus includes an electrostatic chuck which supports a substrate, a mask assembly disposed on a surface of the substrate, a deposition module disposed to be movable in a horizontal direction intersecting a thickness direction of the mask assembly, where the deposition module discharges a deposition material to the mask assembly, and a camera which captures an image of the electrostatic chuck or the mask assembly, where the deposition module is in a deposition position overlapping the mask assembly in the thickness direction of the mask assembly while the deposition module discharges the deposition material, and is in a standby position not overlapping the mask assembly in the thickness direction of the mask assembly while the deposition module does not discharge the deposition material, and where the camera captures the image of the electrostatic chuck or the mask assembly when the deposition module is in the standby position.

In an embodiment, the camera may overlap the deposition module in the thickness direction of the mask assembly when the deposition module is in the deposition position, and may not overlap the deposition module in the thickness direction of the mask assembly when the deposition module is in the standby position.

In an embodiment, the camera under the deposition module may be disposed below the mask assembly to overlap the mask assembly in the thickness direction.

In an embodiment, the deposition apparatus may further include a chamber which accommodates the electrostatic chuck, the mask assembly, the deposition module and the camera, and a connection module disposed inside the chamber, where the connection module connects an outside of the chamber with an inside of the deposition module.

In an embodiment, the camera may be disposed inside the connection module.

In an embodiment, the connection module may include a first fixing member disposed on an inner surface of the chamber located below the mask assembly, where the first fixing member provides a passage with the outside of the chamber, a first rotating member with one end rotatably connected to the first fixing member, where a first communication space is defined in the first rotating member to communicate with the outside of the chamber, a second fixing member disposed on the deposition module, where the second fixing member provides a passage with the inside of the deposition module, and a second rotating member with one end rotatably connected to an opposite end of the first rotating member and an opposite end rotatably connected to the second fixing member, where a second communication space is defined in the second rotating member to communicate with the first communication space and the inside of the deposition module.

In an embodiment, the connection module may further include a rotating connection member which rotatably connects the opposite end of the first rotating member with the one end of the second rotating member.

In an embodiment, the camera may be disposed inside the one end of the first rotating member.

In an embodiment, the camera may be disposed in a way such that a lens thereof faces the mask assembly, and an observation window may be disposed on an upper side of the one end of the first rotating member.

In an embodiment, the deposition module may include a rail extending in the horizontal direction; a main body disposed to be movable along the rail; and a deposition nozzle disposed on the main body to discharge the deposition material to the mask assembly.

In an embodiment, the deposition apparatus may further include an analysis unit which analyzes the image captured by the camera to determine whether the electrostatic chuck or the mask assembly is normal or not.

According to an embodiment of the disclosure, an inspection method for a deposition apparatus includes moving a deposition module to a standby position, firstly capturing, by a camera, an image of an electrostatic chuck, placing a mask assembly under the electrostatic chuck, and firstly capturing, by the camera, an image of the mask assembly.

In an embodiment, the deposition module may not overlap the electrostatic chuck or the mask assembly in a thickness direction of the electrostatic chuck or the mask assembly when the deposition module is in the standby position.

In an embodiment, the camera may be disposed below the electrostatic chuck or the mask assembly to overlap the electrostatic chuck or the mask assembly.

In an embodiment, the inspection method may further include after the firstly capturing, by the camera, the image of the mask assembly, placing a substrate on the electrostatic chuck.

In an embodiment, the inspection method may further include after the placing the substrate on the electrostatic chuck, moving the deposition module to a deposition position and discharging a deposition material to the mask assembly.

In an embodiment, the deposition module may overlap the electrostatic chuck or the mask assembly in a thickness direction of the electrostatic chuck or the mask assembly when the deposition module is in the deposition position.

In an embodiment, the inspection method may further include after the discharging a deposition material to the mask assembly, moving the deposition module to the standby position.

In an embodiment, the inspection method may further include after the moving the deposition module to the standby position, unloading the substrate from the electrostatic chuck, and secondly capturing, by the camera, an image of the mask assembly.

In an embodiment, the inspection method may further include after the capturing, by the camera, the image of the mask assembly, unloading the mask assembly, and secondly capturing, by the camera, an image of the electrostatic chuck.

According to an embodiment of the disclosure, it is possible to inspect, by a deposition apparatus, whether an electrostatic chuck and a mask assembly inside a chamber is normal or not, thereby effectively preventing failure in a process of depositing a deposition material onto a substrate.

The effects according to the embodiments of the disclosure are not limited to those mentioned above and more various effects are included in the following description of the disclosure.

The invention now will be described more fully hereinafter with reference to the accompanying drawings, in which various embodiments are shown. This invention may, however, be embodied in many different forms, and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout.

It will be understood that when an element is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present.

It will be understood that, although the terms “first,” “second,” “third” etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, “a first element,” “component,” “region,” “layer” or “section” discussed below could be termed a second element, component, region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a”, “an,” “the,” and “at least one” do not denote a limitation of quantity, and are intended to include both the singular and plural, unless the context clearly indicates otherwise. Thus, reference to “an” element in a claim followed by reference to “the” element is inclusive of one element and a plurality of the elements. For example, “an element” has the same meaning as “at least one element,” unless the context clearly indicates otherwise. “At least one” is not to be construed as limiting “a” or “an.” “Or” means “and/or.” As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms “comprises” and/or “comprising,” or “includes” and/or “including” when used in this specification, specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and/or groups thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or “top,” may be used herein to describe one element's relationship to another element as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. For example, if the device in one of the figures is turned over, elements described as being on the “lower” side of other elements would then be oriented on “upper” sides of the other elements. The term “lower,” can therefore, encompasses both an orientation of “lower” and “upper,” depending on the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as “below” or “beneath” other elements would then be oriented “above” the other elements. The terms “below” or “beneath” can, therefore, encompass both an orientation of above and below.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Embodiments are described herein with reference to schematic illustrations of idealized embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region illustrated or described as flat may, typically, have rough and/or nonlinear features. Moreover, sharp angles that are illustrated may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the present claims.

Hereinafter, embodiments of the disclosure will be described in detail with reference to the accompanying drawings.

1 FIG. 2 FIG. 1 FIG. 10 is a view showing a deposition apparatusaccording to an embodiment of the disclosure.is a cross-sectional view taken along the line A-A′ of.

1 2 FIGS.and 10 10 100 200 210 300 400 500 600 700 Referring to, a deposition apparatusaccording to an embodiment of the disclosure may deposit an organic material or a metal used as an electrode on a substrate S. In an embodiment, the deposition devicemay include a chamber, an electrostatic chuck, a substrate holder, a mask assembly, a deposition module, a connection module, a camera, and an analysis unit.

100 100 100 100 100 100 100 100 200 210 300 400 500 600 700 The chambermay provide or define a space for performing a deposition process. The inside (or an inner space) of the chambermay be maintained under vacuum while performing the deposition process. Maintaining the inside of the chamberunder vacuum may mean maintaining the pressure inside the chamberat a low pressure, which is a pressure lower than a predetermined pressure. The chambermay include an inlet/outlet (not shown) for loading/unloading a substrate S. In addition, the chambermay include a vacuum pump (not shown) for controlling the pressure inside the chamberand discharging a deposition material that is not deposited on the substrate S, and an exhaust port (not shown) connected to the vacuum pump. The chambermay accommodate at least one selected from the electrostatic chuck, the substrate holder, the mask assembly, the deposition module, the connection module, the cameraand the analysis unit.

The substrate S on which the organic material or metal used as the electrode is deposited may be provided as an insulating substrate, a semiconductor substrate, a display device substrate, etc., but the disclosure is not limited thereto. According to an embodiment, the substrate S may be a substrate used in an organic light-emitting display device, for example. A predetermined structure may be formed on the substrate S via a deposition process. Depending on the fabrication process of the organic light-emitting display device, the structure formed on the substrate S via the deposition process can be formed in various ways. For example, in a process of forming a hole injection layer, a pixel-defining film and an anode electrode may be formed on the substrate S. In addition, in a process of forming an organic light-emitting layer, not only a pixel-defining layer and an anode electrode, but also a hole injection layer and a hole transport layer may be formed on the substrate S.

200 200 100 200 100 200 200 200 200 200 200 200 200 300 300 The electrostatic chuckmay support the substrate S. The electrostatic chuckmay be disposed inside the chamber. According to an embodiment of the disclosure, the electrostatic chuckmay be disposed on the upper side (or an upper portion of the inner space) in the chamber, and the substrate S may be seated under the electrostatic chuckand supported by the electrostatic chuck. The electrostatic chuckmay chuck or dechuck the substrate S by electrostatic force. The electrostatic chuckmay be a bipolar type or a monopolar type. A bipolar-type electrostatic chuckmay include two electrode plates, and the substrate S may be chucked when a voltage is applied between the two electrode plates. A monopolar-type electrostatic chuckmay include only one electrode plate, and the substrate S may be chucked when a voltage is applied between the electrode plate and the substrate S. The electrostatic chuckmay dechuck the substrate S after the deposition process has been performed. In an embodiment, the electrostatic chuckmay include a fixing member. The fixing member may assist in fixing the substrate S and the mask assembly, and may maintain a constant distance between the substrate S and the mask assembly. The fixing member may have a detachable frame structure.

210 200 300 210 210 210 The substrate holdermay be disposed between the electrostatic chuckand the mask assembly. There may be a plurality of substrate holders, that is, the substrate holdermay be provided in plural, and the plurality of substrate holdersmay hold the substrate S.

300 400 300 300 310 320 310 400 320 310 320 400 300 300 300 300 300 200 The mask assemblymay define a region where a deposition material discharged from the deposition moduleis to be deposited on the substrate S. The mask assemblymay be disposed under the substrate. The mask assemblymay include mask portions, transmissive portions, and mask sidewalls (not shown). The mask portionsmay cover some regions of the substrate S to prevent the deposition material discharged from the deposition modulefrom being deposited at those regions. The transmissive portionsmay be open regions formed between the mask portionsthat expose some regions of the substrate S. The deposition material may be sprayed onto the exposed regions of the substrate S exposed by the transmissive portions, such that the deposition material may be deposited on the exposed regions of the substrate S. The deposition material sprayed from the deposition modulemay form a predetermined pattern through the mask assemblyand may be deposited on the substrate S. The mask sidewalls may be located in the edges of the mask assemblyto effectively prevent the deposition material from spreading to areas other than the substrate S. The mask assemblymay be a mother glass mask such as a fine metal mask (FMM) or may include a plurality of segmented masks, but the disclosure is not limited thereto. The mask assemblymay be fixed closely to the substrate S, and the gap between the mask assemblyand the substrate S may be adjusted by the electrostatic chuckand the fixing member.

3 FIG. 1 FIG. 4 FIG. 1 FIG. 400 500 500 is a view showing the deposition moduleand the connection moduleof.is a view showing the connection moduleof.

3 4 FIGS.and 400 400 100 400 200 100 400 100 400 400 100 400 410 420 430 Referring to, an embodiment of the deposition modulemay discharge a deposition material to be deposited on the substrate S. The deposition modulemay be disposed inside the chamberin a way such that the deposition modulefaces the substrate S. According to an embodiment of the disclosure, where the electrostatic chuckon which the substrate S is seated is placed on the upper side in the chamber, the deposition modulemay be placed on the lower side in the chamber. The deposition modulemay be placed in a way such that the deposition modulecan move horizontally in the chamber. The deposition modulemay include a rail, a main body, and a deposition nozzle.

410 420 430 420 430 410 100 410 410 100 3 FIG. The railmay support at least one selected from the main bodyand the deposition nozzlein a way such that the main bodyor the deposition nozzlecan move horizontally. The railmay extend horizontally inside the chamber. There may be a plurality of rails, which are spaced apart from each other and extend in the first direction. The first direction may be the back-and-forth direction in. The railmay be disposed on the lower side in the chamber.

420 410 410 420 410 420 430 420 410 420 420 410 3 FIG. The main bodymay be disposed on the railand may move in the first direction along the rail. In other words, the main bodymay move in the back-and-forth direction ofalong the rail. The main bodymay support the deposition nozzle. An actuator (not shown) for moving the main bodyalong the railmay be provided on the main body, such that the main bodycan move along the railby the operation of the actuator.

430 430 420 420 430 420 430 430 3 FIG. The deposition nozzlemay discharge a deposition material and supply the deposition material to the substrate S. The deposition nozzlemay be disposed on the upper surface of the main bodyand supported by the main body. The deposition nozzlemay extend in a second direction from the upper surface of the main body. The second direction may refer to a direction that is horizontally orthogonal to the first direction and may be the left-to-right direction in. The deposition nozzlemay be connected to a deposition material storage (not shown) and may receive the deposition material stored in the deposition material storage to discharge it. The deposition nozzlemay discharge the deposition material upward to supply the deposition material to the substrate S.

400 400 300 400 300 400 300 300 400 300 300 420 410 300 420 300 2 FIG. The deposition modulemay move to a deposition position when the deposition moduledischarges the deposition material to the mask assembly, and may move to a standby position when the deposition moduledoes not discharge the deposition material to the mask assembly. The deposition position may be a position where the deposition moduleoverlaps the mask assemblyin a thickness direction of the mask assembly, and the standby position may be a position where the deposition moduledoes not overlap the mask assemblyin the thickness direction of the mask assembly. In an embodiment, for example, the deposition position may be the position where the main bodyis moved along the railand is located directly below the mask assemblyas shown in, and the standby position may be the position where the main bodyis moved to the front or rear in the first direction along the rail and is located not directly below the mask assembly.

500 100 100 420 500 510 520 530 540 550 4 FIG. In an embodiment, the connection modulemay be disposed inside the chamberand may connect the outside of the chamberwith the inside of the main body. In an embodiment, as shown in, the connection modulemay include a first fixing member, a first rotating member, a rotating connection member, a second rotating member, and a second fixing member.

510 100 100 510 100 510 100 300 100 510 100 510 100 100 100 The first fixing membermay provide a passage connecting the outside of the chamberwith the inside of the chamber. The first fixing membermay have a hollow cylindrical structure and may be fixed to the lower surface in the chamber. The first fixing membermay be disposed on the lower surface in the chamberlocated directly below the mask assembly. A through hole is defined or formed on the lower surface in the chamber, and the first fixing membermay be disposed on the lower surface in the chambersuch that the hollow portion of the first fixing memberis connected to the through hole of the chamber, thereby connecting the outside of the chamberwith the inside of the chamber.

520 510 520 520 510 510 520 510 100 521 520 521 600 600 200 300 The first rotating membermay be rotatably connected to the upper portion of the first fixing member. The first rotating membermay be provided as a rectangular block extending in a direction, and a first communication space may be formed therein. The first rotating membermay have one side rotatably connected to the first fixing member, such that the first communication space therein may be connected to the hollow portion of the first fixing member. As the first communication space of the first rotating memberis connected to the hollow portion of the first fixing member, the first communication space may be connected to the outside of the chamber. An observation windowmay be formed at the upper portion of one side of the first rotating member. The observation windowcan provide the field of view of the camerawhen the cameracaptures images of the electrostatic chuckor the mask assembly.

530 520 530 520 530 520 530 520 The rotating connection membermay be rotatably connected to the first rotating member. The rotating connection membermay have a hollow cylindrical structure, and its lower portion may be rotatably connected to the other side of the first rotating member. Since the lower portion of the rotating connection membermay be rotatably connected to the other side of the first rotating member, and the hollow portion of the rotating connection membermay be communicated with the first communication space in the first rotating member.

540 530 540 540 530 530 540 530 540 550 The second rotating membermay be rotatably connected to the upper portion of the rotating connection member. The second rotating membermay be provided as a rectangular block extending in a direction, and a second communication space may be formed therein. The second rotating membermay have one side rotatably connected to the upper portion of the rotating connection member, such that the second communication space therein may be connected to the hollow portion of the rotating connection member. As the second communication space of the second rotating memberis connected to the hollow portion of the rotating connection member, the second communication space may be connected to the first communication space. The other side of the second rotating membermay be rotatably connected to the second fixing member.

550 420 550 420 420 550 420 550 420 420 550 550 540 550 540 420 550 The second fixing membermay provide a passage with the inside of the main body. The second fixing membermay have a hollow cylindrical structure and may be fixed to the lower face of the main body. A through hole is defined or formed in the lower face of the main body, and the upper portion of the second fixing memberis disposed on the lower face of the main bodysuch that the hollow portion of the second fixing memberis connected to the through hole of the main body, thereby connecting the inside of the main bodywith the second fixing member. As the lower portion of the second fixing memberis rotatably connected to the other side of the second rotating member, the hollow portion of the second fixing membermay be connected to the second communication space. In other words, the second communication space of the second rotating membermay be communicated with the inside of the main bodyby the second fixing member.

600 200 300 600 300 400 600 500 600 520 520 300 600 300 600 520 300 600 521 520 600 200 300 420 420 420 600 600 200 300 600 200 300 420 The cameramay capture images of the electrostatic chuckor the mask assembly. The cameramay be disposed such that it is located directly below the mask assemblyunder the deposition module. The cameramay be disposed inside the connection module. For example, the cameramay be disposed inside one end of the first rotating member. Since the one side of the first rotating memberis positioned directly below the mask assembly, the cameramay be disposed directly below the mask assembly. The cameramay be disposed inside the one side of the first rotating memberin a way such that the lens faces the mask assembly. In other words, the lens of the cameramay be disposed to face the observation windowof the first rotating member. The cameramay capture images of the electrostatic chuckor the mask assemblywhen the main bodyis moved to the standby position. When the main bodyis moved to the deposition position, the main bodyis located above the camera, and thus the cameramay not effectively capture images of the electrostatic chuckor the mask assembly. Accordingly, the cameramay capture images of the electrostatic chuckor the mask assemblyonly when the main bodyis moved to the standby position.

700 600 200 300 700 220 300 700 600 220 300 700 The analysis unitreceives and analyzes the images captured by the camera, and may determine whether the electrostatic chuckor the mask assemblyis normal based on the analysis results. In an embodiment, for example, the analysis unitmay store images when the electrostatic chuckand the mask assemblyare normal, and the analysis unitmay receive the images captured by the cameraand compare the images with previously stored images, thereby determining whether the electrostatic chuckand the mask assemblyare normal or not. In an embodiment, the analysis unitmay include a circuitry configured to perform the operations described above.

5 FIG. 10 is a flowchart for illustrating an inspection method by a deposition apparatusaccording to an embodiment of the disclosure.

5 FIG. 10 1 2 3 4 5 6 7 8 9 10 11 Referring to, an inspection method by the deposition apparatusaccording to an embodiment of the disclosure may include: performing a first deposition standby process (S), firstly inspecting an electrostatic chuck (S), placing a mask assembly (S), firstly inspecting the mask assembly (S), placing a substrate (S), performing a deposition process (S), performing a second deposition standby process (S), unloading the substrate (S), secondly inspecting the mask assembly (S), unloading the mask assembly (S), and secondly inspecting the electrostatic chuck (S).

6 FIG. 5 FIG. 1 2 is a view showing the first deposition standby process Sand the firstly inspecting an electrostatic chuck Sof.

6 FIG. 6 FIG. 6 FIG. 6 FIG. 1 400 1 420 400 410 420 420 520 540 500 Referring to, in the first deposition standby process S, the deposition modulemay move to a standby position. In the first deposition standby process S, the main bodyof the deposition modulemay be moved to the rear side along the railinsuch that the main bodymay be located at the standby position. As the main bodymoves to the rear side in, the first rotating memberand the second rotating memberrotate in a way such that the connection modulemay extend to the rear side as shown in.

2 600 200 420 1 420 600 600 200 420 200 600 700 700 200 200 200 200 6 FIG. In the firstly inspecting an electrostatic chuck S, the cameramay capture an image of the electrostatic chuck. Since the main bodyis moved to the rear inin the first deposition standby process S, the main bodyis not positioned above the camera, such that the cameramay effectively capture an image of the electrostatic chuckwithout being blocked by the main body. The captured image of the electrostatic chuckcaptured by the cameramay be transmitted to the analysis unit. The analysis unitmay compare the transmitted captured image of the electrostatic chuckwith the previously stored image of the normal electrostatic chuckand analyze the transmitted captured image of the electrostatic chuckto determine whether the electrostatic chuckis normal or not.

7 FIG. 5 FIG. 3 4 is a view showing the pacing a mask assembly Sand the firstly inspecting the mask assembly Sof.

7 FIG. 3 300 200 3 300 200 200 300 200 200 Referring to, in the placing the mask assembly S, the mask assemblymay be placed under the electrostatic chuck. In the placing the mask assembly S, the mask assemblymay be placed under the electrostatic chuckat a certain distance from the electrostatic chuck. The mask assemblymay be fixed to a predetermined position or location under the electrostatic chuckby a fixing member of the electrostatic chuck.

4 600 300 420 1 420 600 600 300 300 600 700 700 300 300 300 300 7 FIG. In the firstly inspecting the mask assembly S, the cameramay capture an image of the mask assembly. Since the main bodyis moved to the rear inin the first deposition standby S, the main bodyis not positioned above the camera, to allow the camerato capture an image of the mask assembly. The captured image of the mask assemblycaptured by the cameramay be transmitted to the analysis unit. The analysis unitmay compare the transmitted captured image of the mask assemblywith the previously stored image of the normal mask assemblyand analyze the transmitted captured image of the mask assemblyto determine whether the mask assemblyis normal or not.

8 FIG. 5 FIG. 5 is a view showing the placing the substrate Sof.

8 FIG. 5 200 5 200 300 5 200 300 Referring to, in the placing the substrate S, the substrate S may be disposed on the electrostatic chuck. In the placing the substrate S, the substrate S may be placed under the electrostatic chuckand on the mask assembly. In other words, in the placing the substrate S, the substrate S may be placed between the electrostatic chuckand the mask assembly.

200 600 300 300 600 700 700 700 300 After the substrate S is placed on the electrostatic chuck, the cameramay further capture the substrate S and the mask assembly. The captured images of the substrate S and the mask assemblycaptured by the cameramay be to the analysis unit, and the analysis unitmay analyze the transmitted images to determine whether the substrate is correctly placed on the electrostatic chuck. In addition, the analysis unitmay analyze the transmitted images to determine whether the substrate S and the mask assemblyare correctly aligned.

9 FIG. 5 FIG. 6 is a view showing the deposition process Sof.

9 FIG. 9 FIG. 9 FIG. 6 400 420 400 410 420 300 420 520 540 520 540 500 520 540 420 300 430 300 320 Referring to, in performing the deposition process S, the deposition modulemay be moved to a deposition position and a deposition material may be discharged. In the deposition S+, the main bodyof the deposition modulemay be moved to the front along the railinsuch that the main bodymay be located directly below the mask assembly. As the main bodymoves to the front in, the first rotating memberand the second rotating membermay rotate in a way such that the first rotating memberand the second rotating membermay overlap each other. In other words, the overall length of the connection modulecan be reduced as the first rotating memberand the second rotating memberoverlap each other. Once the main bodyis moved to the deposition position, the deposition material may be discharged toward the mask assemblythrough the deposition nozzle. The deposition material discharged to the mask assemblymay pass through the transmissive portionsto be deposited on the substrate S.

10 FIG. 5 FIG. 7 is a view showing the second deposition standby process Sof.

10 FIG. 10 FIG. 10 FIG. 10 FIG. 7 400 7 420 400 410 420 420 520 540 500 Referring to, in the second deposition standby process S, the deposition modulemay move to the standby position again. In the second deposition standby process S, the main bodyof the deposition modulemay be moved to the rear side along the railinsuch that the main bodymay be located at the standby position. As the main bodymoves to the rear side in, the first rotating memberand the second rotating memberrotate in a way such that the connection modulemay extend to the rear side as shown in.

11 FIG. 5 FIG. 8 9 is a view showing the unloading the substrate Sand the secondly inspecting a mask assembly Sof.

11 FIG. 8 200 8 200 300 100 Referring to, in the unloading the substrate S, the substrate S may be unloaded from the electrostatic chuck. In the unloading the substrate S, the substrate S disposed between the electrostatic chuckand the mask assemblymay be taken out to the outside of the chamber.

9 600 300 420 7 420 600 600 300 300 600 700 700 300 300 300 300 700 200 11 FIG. In the secondly inspecting the mask assembly S, the cameramay capture an image of the mask assemblyagain. Since the main bodyis moved to the rear inin the second deposition standby process S, the main bodyis not positioned above the camera, to allow the camerato capture an image of the mask assembly. The captured image of the mask assemblycaptured by the cameraagain may be transmitted to the analysis unit. The analysis unitmay compare the transmitted captured image of the mask assemblywith the previously stored image of the normal mask assemblyand analyze the transmitted captured image of the mask assemblyto determine again whether the mask assemblyis normal or not. In addition, the analysis unitmay analyze the transmitted images to determine whether the substrate S is unloaded properly from the electrostatic chuck.

12 FIG. 5 FIG. 10 11 is a view showing the unloading the mask assembly Sand the secondly inspecting the electrostatic chuck Sof.

12 FIG. 10 300 10 300 200 100 Referring to, in the unloading the mask assembly S, the mask assemblymay be unloaded. In the unloading the mask assembly S, the mask assemblyplaced under the electrostatic chuckmay be taken out of the outside of the chamber.

11 600 200 420 7 420 600 600 200 200 600 700 700 200 200 200 200 12 FIG. In the secondly inspecting the electrostatic chuck S, the cameramay capture the electrostatic chuckagain. Since the main bodyis moved to the rear inin the second deposition standby process S, the main bodyis not positioned above the camera, to allow the camerato capture an image of the electrostatic chuck. The captured image of the electrostatic chuckcaptured again by the cameramay be transmitted to the analysis unit. The analysis unitmay compare the transmitted captured image of the electrostatic chuckwith the previously stored image of the normal electrostatic chuckand analyze the transmitted captured image of the electrostatic chuckto determine again whether the electrostatic chuckis normal or not.

The display device according to one embodiment of the present disclosure can be applied to various electronic devices. The electronic device according to the one embodiment of the present disclosure includes the display device described above, and may further include modules or devices having additional functions in addition to the display device.

13 FIG. is a block diagram of an electronic device according to one embodiment of the present disclosure.

13 FIG. 10000 10001 10002 10003 10004 Referring to, the electronic deviceaccording to one embodiment of the present disclosure may include a display module, a processor, a memory, and a power module.

10002 The processormay include at least one of a central processing unit (CPU), an application processor (AP), a graphic processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

10003 10002 10001 10002 10003 10001 10001 The memorymay store data information necessary for the operation of the processoror the display module. When the processorexecutes an application stored in the memory, an image data signal and/or an input control signal is transmitted to the display module, and the display modulecan process the received signal and output image information through a display screen.

10004 10000 The power modulemay include a power supply module such as, for example a power adapter or a battery, and a power conversion module that converts the power supplied by the power supply module to generate power necessary for the operation of the electronic device.

10000 10001 10002 10003 10004 10000 At least one of the components of the electronic deviceaccording to the one embodiment of the present disclosure may be included in the display device according to the embodiments of the present disclosure. In addition, some modules of the individual modules functionally included in one module may be included in the display device, and other modules may be provided separately from the display device. For example, the display device may include the display module, and the processor, the memory, and the power modulemay be provided in the form of other devices within the electronic deviceother than the display device.

14 FIG. is a schematic diagram of an electronic device according to various embodiments of the present disclosure.

14 FIG. 10000 1 10000 1 10000 1 10000 1 10000 1 10000 2 10000 2 10000 2 10000 3 a b c d e a b c Referring to, various electronic devices to which display devices according to embodiments of the present disclosure are applied may include not only image display electronic devices such as a smart phone_, a tablet PC (personal computer)_, a laptop_, a TV_, and a desk monitor_, but also wearable electronic devices including display modules such as, for example smart glasses_, a head mounted display_, and a smart watch_, and vehicle electronic devices_including display modules such as a CID (Center Information Display) and a room mirror display arranged on a dashboard, center fascia, and dashboard of an automobile.

According to embodiments of the disclosure, as described herein, it is possible to inspect, by a deposition apparatus, whether an electrostatic chuck and a mask assembly inside a chamber is normal or not, thereby effectively preventing failure in a process of depositing a deposition material onto a substrate.

The invention should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art.

While the invention has been particularly shown and described with reference to embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit or scope of the invention as defined by the following claims.