Communication Component

This application claims priority to U.S. Provisional Application Ser. No. 63/669,229 filed Jul. 9, 2024, and Taiwan Application Serial Number 114122850, filed Jun. 18, 2025, the disclosures of which are incorporated herein by reference in their entireties.

The present disclosure relates to a communication component.

In modern coaxial communication systems, how to achieve structural stability of the overall communication component is one of the most critical concerns in the related field. In addition, minimizing the overall size of the SFP module is also one of the major research directions emphasized by researchers. However, existing communication components fail to effectively overcome issues such as the detachment of high-speed signal terminals of cables caused by external impact. Moreover, if a user intends to monitor the signal status of the SFP module, additional cables and monitoring devices must currently be installed. This significantly increases the overall system size and production cost.

Therefore, how to propose a communication component that can solve the aforementioned problems is one of the problems that the industry is currently eager to invest in research and development resources to solve.

In view of this, one purpose of the present disclosure is to provide a communication component that can solve the aforementioned problems.

In order to achieve the above objective, according to an embodiment of the present disclosure, a communication component includes a conductive part and a controlling module. The conductive part includes a metal main body, a first lower ground pin, a first upper ground pin, a second lower ground pin, and a second upper ground pin. The first lower ground pin is disposed on the metal main body. The first upper ground pin is disposed on the metal main body and located over the first lower ground pin. The second lower ground pin is disposed on the metal main body and located at a side of the first lower ground pin. The second upper ground pin is disposed on the metal main body and located over the second lower ground pin. The controlling module is connected to the conductive part. The controlling module includes a circuit board, a first ground pad, a second ground pad, and a plurality of terminal contact pads. The circuit board contacts the first lower ground pin, the first upper ground pin, the second lower ground pin, and the second upper ground pin. The first ground pad and the second ground pad are disposed at two sides of the circuit board. The first ground pad contacts the first lower ground pin and the first upper ground pin. The second ground pad contacts the second lower ground pin and the second upper ground pin. The terminal contact pads are disposed on the circuit board and located between the first ground pad and the second ground pad.

In one or more embodiments of the present disclosure, the first lower ground pin, the first upper ground pin, the second lower ground pin, and the second upper ground pin jointly clamp the circuit board.

In one or more embodiments of the present disclosure, the communication component further includes a plurality of cables electrically connected to the terminal contact pads individually.

In one or more embodiments of the present disclosure, each of the cables includes a signal terminal and a connector. The signal terminal is located at an end of each of the cables and contacts one of the terminal contact pads. The connector is disposed at the other end of each of the cables.

In one or more embodiments of the present disclosure, the conductive part further includes a middle ground pin disposed on the metal main body, the first upper ground pin, the second upper ground pin, and the signal terminal contact an upper surface of the circuit board. The first lower ground pin, the second lower ground pin, and the middle ground pin contact a lower surface of the circuit board.

In one or more embodiments of the present disclosure, the conductive part further has a plurality of terminal holes running through the metal main body, and the cables pass through the terminal holes.

In one or more embodiments of the present disclosure, the terminal holes are located between the first upper ground pin and the second upper ground pin.

In one or more embodiments of the present disclosure, the conductive part further includes a middle ground pin disposed on the metal main body. The middle ground pin is located between the first lower ground pin and the second lower ground pin.

In one or more embodiments of the present disclosure, the middle ground pin, the first lower ground pin, the first upper ground pin, the second lower ground pin, and the second upper ground pin protrude from a side surface of the conductive part.

In one or more embodiments of the present disclosure, the first ground pad, the second ground pad, and the terminal contact pads are located on a first end portion of the circuit board.

In order to achieve the above objective, according to an embodiment of the present disclosure, a communication component includes a conductive part, a controlling module, and a plurality of cables. The conductive part includes a metal main body, a first lower ground pin, a first upper ground pin, a second lower ground pin, and a second upper ground pin. The first lower ground pin and the first upper ground pin are connected to the metal main body and protrude from a side surface of the conductive part. The first upper ground pin is located over the first lower ground pin. The second lower ground pin and the second upper ground pin are connected to the metal main body and protrude from the side surface of the conductive part. The second upper ground pin is located over the second lower ground pin. The controlling module is connected to the conductive part. The controlling module includes a circuit board, a first ground pad, a second ground pad, a plurality of terminal contact pads, a first chip, and a second chip. The circuit board contacts the first lower ground pin, the first upper ground pin, the second lower ground pin, and the second upper ground pin. The first ground pad and the second ground pad are disposed at two sides of the circuit board. The first ground pad contacts the first lower ground pin and the first upper ground pin. The second ground pad contacts the second lower ground pin and the second upper ground pin. The plurality of terminal contact pads are disposed on the circuit board and located between the first ground pad and the second ground pad. The first chip and the second chip are electrically connected to the terminal contact pads. The plurality of cables are electrically connected to the terminal contact pads individually.

In one or more embodiments of the present disclosure, the cables and the controlling module are located on opposite sides of the conductive part.

In one or more embodiments of the present disclosure, the cables include a plurality of signal terminals respectively contacting the terminal contact pads individually.

In one or more embodiments of the present disclosure, the controlling module further includes a processing unit connected to the first chip and the second chip. The processing unit is configured to perform at least one of: adjusting an output signal of the first chip and the second chip; turning off the first chip and the second chip when no input signal is received by the first chip and the second chip; and constantly turning on the first chip and the second chip when the input signal is received by the first chip and the second chip.

In one or more embodiments of the present disclosure, the first chip and the second chip are cable driver chips. The processing unit is configured to: control the first chip and the second chip to receive a transmitter input signal; control the first chip and the second chip to generate a transmitter output signal to one of the cables based on the transmitter input signal; and control the first chip and the second chip to generate a transmitter loop signal to another one of the cables based on the transmitter output signal, and the transmitter loop signal being identical to the transmitter output signal.

In one or more embodiments of the present disclosure, the cables include a first cable, a second cable, a third cable, and a fourth cable. The first cable transmits the transmitter output signal from the first chip. The second cable transmits the transmitter loop signal from the first chip. The third cable transmits the transmitter output signal from the second chip. The fourth cable transmits the transmitter loop signal from the second chip.

In one or more embodiments of the present disclosure, the first chip and the second chip are equalizer chips. The processing unit is configured to: control the first chip and the second chip to receive a receiver input signal from one of the cables; control the first chip and the second chip to generate a receiver output signal based on the receiver input signal; and control the first chip and the second chip to generate a receiver loop signal to another one of the cables based on the receiver input signal, and the receiver loop signal being identical to the receiver output signal.

In one or more embodiments of the present disclosure, the cables comprise a first cable, a second cable, a third cable, and a fourth cable. The first cable transmits the receiver input signal to the first chip. The second cable transmits the receiver loop signal from the first chip. The third cable transmits the receiver input signal to the second chip. The fourth cable transmits the receiver loop signal from the second chip.

In one or more embodiments of the present disclosure, the first chip is a cable driver chip and the second chip is an equalizer chip. The processing unit is configured to: control the first chip to receive a transmitter input signal; control the first chip to generate a transmitter output signal based on the transmitter input signal; control the first chip to generate a transmitter loop signal based on the transmitter output signal, and the transmitter loop signal being identical to the transmitter output signal; control the second chip to receive a receiver input signal; control the second chip to generate a receiver output signal based on the receiver input signal; and control the second chip to generate a receiver loop signal based on the receiver input signal, and the receiver loop signal being identical to the receiver output signal.

In one or more embodiments of the present disclosure, the cables comprise a first cable, a second cable, a third cable, and a fourth cable. The first cable transmits the transmitter output signal from the first chip. The second cable transmits the transmitter loop signal from the first chip. The third cable transmits the receiver input signal to the second chip. The fourth cable transmits the receiver loop signal from the second chip.

In summary, in the communication component of the present disclosure, since the first ground pad and the second ground pad are disposed at two sides of the circuit board and the terminal contact pads are located between the first ground pad and the second ground pad, when the first ground pad contacts the first lower ground pin and the first upper ground pin and the second ground pad contacts the second lower ground pin and the second upper ground pin, the first lower ground pin, the first upper ground pin, the second lower ground pin, and the second upper ground pin can jointly clamp the circuit board, so as to reduce stress caused by external collision and provide sufficient support to the controlling module, thereby preventing the signal terminals of the cables from being detached from the circuit board. In the communication component of the present disclosure, since the first lower ground pin, the first upper ground pin, the second lower ground pin, and the second upper ground pin are located at corners of the circuit board, the conductive (terminal) contact pads can be concentrated at the center of an end of the circuit board, thereby increasing the conductive area on the circuit board. In the communication component of the present disclosure, since the cable driver chip is capable of generating a loop signal identical to the output signal and the equalizer chip is capable of generating a loop signal in a direction opposite to that of the input signal transmission, the loop signal can be used to monitor the output signal without requiring additional cables and monitoring equipment, thereby reducing the occupied space of the entire system. Overall, the communication component of the present disclosure not only enhances the structural stability of the entire assembly but also effectively reduces the overall volume of the communication component.

It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the invention as claimed.

Hereinafter, a plurality of embodiments of the present disclosure will be disclosed in diagrams. For the sake of clarity, many details in practice will be described in the following description. However, it should be understood that these details in practice should not limit the present disclosure. In other words, in some embodiments of the present disclosure, these details in practice are unnecessary. In addition, for simplicity of the drawings, some conventionally used structures and elements will be shown in a simple schematic manner in the drawings. The same reference numbers are used in the drawings and the description to refer to the same or like parts.

100 Hereinafter, the structure and function of each component included in a communication componentof this embodiment and the connection relationship between the components will be described in detail.

1 FIG. 1 FIG. 1 FIG. 100 100 110 1 2 3 4 1 2 3 4 110 1 2 3 4 110 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 110 110 Reference is made to.illustrates a perspective view of a communication componentin accordance with an embodiment of the present disclosure. As shown in, in this embodiment, the communication componentincludes a conductive part, a first cable CB, a second cable CB, a third cable CB, a fourth cable CB, an upper cover UCV, a lower cover LCV, a housing CS, and a pull tab PT. The first cable CB, the second cable CB, the third cable CB, and the fourth cable CBare connected to the conductive part. Specifically, an end of each of the first cable CB, the second cable CB, the third cable CB, and the fourth cable CBis connected to the conductive part. The first cable CB, the second cable CB, the third cable CB, and the fourth cable CBrespectively include a first connector CN, a second connector CN, a third connector CN, and a fourth connector CN. The first connector CN, the second connector CN, the third connector CN, and the fourth connector CNare respectively located at an end of each of the first cable CB, the second cable CB, the third cable CB, and the fourth cable CBaway from the conductive part. The upper cover UCV and the lower cover LCV cover the conductive part. The housing CS wraps the upper cover UCV and the lower cover LCV. Specifically, the housing CS wraps a portion of the upper cover UCV and a portion of the lower cover LCV. The pull tab PT is located on the upper cover UCV.

2 FIG. 2 FIG. 2 FIG. 100 100 110 1 2 3 4 Reference is made to.is an exploded view of the communication componentin accordance with an embodiment of the present disclosure. As shown in, in this embodiment, the communication componentfurther includes a bail BL, a latch key KY, and a plurality of fixing parts FP. The bail BL surrounds an end of the upper cover UCV and the lower cover LCV. Two ends of the bail BL are adjacent to an upper surface of the upper cover UCV. The two ends of the bail BL are pivotally connected to an end of the pull tab PT. The latch key KY is disposed on the lower cover LCV. Two ends of the latch key KY seesaw relative to the lower cover LCV. Specifically, a pivot axis of the latch key KY extends parallel to a direction (e.g., the Y-direction), and the two ends of the latch key KY are arranged along a direction (e.g., the X-direction). An end of the latch key KY is connected to the bail BL, whereas the other end of the latch key KY is engaged with an SFP Cage. In a usage scenario, when a user swings the pull tab PT, the bail BL is lifted generally along a direction (e.g., the Z-direction) and drives the two ends of the latch key KY to seesaw relative to the lower cover LCV, thereby disengaging the other end of the latch key KY from the SFP Cage. Accordingly, the conductive part, the first cable CB, the second cable CB, the third cable CB, and the fourth cable CBcan be detached from the SFP Cage along a direction (e.g., the X-direction).

2 FIG. 2 FIG. 100 120 110 120 120 120 120 Reference is made again to. As shown in, in this embodiment, the communication componentfurther includes a controlling module. The plurality of fixing parts FP are configured to fix the upper cover UCV and the lower cover LCV to the conductive part. The fixing parts FP are further configured to fix the controlling moduleand the upper cover UCV to each other. In some embodiments, the controlling moduleis separated from the upper cover UCV by a distance. In other words, the controlling moduleis not flush against the upper cover UCV. In some embodiments, the controlling moduleis elongated generally along a direction (e.g., the X-direction).

3 FIG. 3 FIG. 3 FIG. 110 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 110 110 111 112 113 114 115 116 112 113 114 115 116 111 112 113 114 115 116 111 110 110 112 113 114 115 116 110 110 114 112 113 112 113 112 115 113 116 112 113 a a Reference is made to.is an exploded view of a conductive part, a first cable CB, a second cable CB, a third cable CB, and a fourth cable CBin accordance with an embodiment of the present disclosure. As shown in, in this embodiment, the first cable CB, the second cable CB, the third cable CB, and the fourth cable CBrespectively include a first signal terminal T, a second signal terminal T, a third signal terminal T, and a fourth signal terminal T. The first signal terminal T, the second signal terminal T, the third signal terminal T, and the fourth signal terminal Tare respectively located at an end of the first cable CB, the second cable CB, the third cable CB, and the fourth cable CBclose to the conductive part. The conductive partincludes a metal main body, a first lower ground pin, a second lower ground pin, a first upper ground pin, a second upper ground pin, and a middle ground pin. The first lower ground pin, the second lower ground pin, the first upper ground pin, the second upper ground pin, and the middle ground pinare disposed on the metal main body. Specifically, the first lower ground pin, the second lower ground pin, the first upper ground pin, the second upper ground pin, and the middle ground pinare connected to the metal main bodyand are disposed on a side surfaceof the conductive part. In some embodiments, the first lower ground pin, the second lower ground pin, the first upper ground pin, the second upper ground pin, and the middle ground pinprotrude from the side surfaceof the conductive part. The first upper ground pinis located over the first lower ground pin. The second lower ground pinis located at a side of the first lower ground pin. In some embodiments, a height of the second lower ground pinalong a direction (e.g., the Z-direction) is identical to a height of the first lower ground pinalong the direction (e.g., the Z-direction). The second upper ground pinis located over the second lower ground pin. The middle ground pinis located between the first lower ground pinand the second lower ground pin.

3 FIG. 3 FIG. 2 FIG. 3 FIG. 110 110 117 110 110 110 117 111 1 2 3 4 117 117 114 115 t t Reference is made again to. As shown in, in this embodiment, the conductive partfurther has a top surface, a plurality of fixing holes FH, and a plurality of terminal holes. The fixing holes FH are at least located on the top surface. In some embodiments, the fixing holes FH are also located on a bottom surface (not shown) of the conductive part. As shown inand, the upper cover UCV and the lower cover LCV are fastened to the conductive partby screwing the fixing parts FP into the fixing holes FH. The terminal holesrun through the metal main body. The first cable CB, the second cable CB, the third cable CB, and the fourth cable CBpass through the terminal holes. The terminal holesare located between the first upper ground pinand the second upper ground pin.

4 FIG. 4 FIG. 4 FIG. 110 1 2 3 4 120 120 110 120 121 122 123 124 125 121 121 121 121 121 110 121 121 110 122 123 124 121 121 125 121 121 121 112 114 113 115 122 123 121 122 123 121 124 122 123 120 1 2 121 1 2 124 Reference is made to.is an exploded view of the conductive part, the first cable CB, the second cable CB, the third cable CB, the fourth cable CB, and a controlling modulein accordance with an embodiment of the present disclosure. As shown in, in this embodiment, the controlling moduleis configured to be connected to the conductive part. The controlling moduleincludes a circuit board, a first ground pad, a second ground pad, a plurality of terminal contact pads, and a plurality of gold fingers. Specifically, the circuit boardhas a first end portionA and a second end portionB. The first end portionA is located at an end of the circuit boardclose to the conductive part, and the second end portionB is located at an end of the circuit boardaway from the conductive part. The first ground pad, the second ground pad, and the terminal contact padsare located on the first end portionA of the circuit board. The plurality of gold fingersare located at the second end portionB of the circuit board. The circuit boardcontacts the first lower ground pin, the first upper ground pin, the second lower ground pin, and the second upper ground pin. The first ground padand the second ground padare disposed at two sides of the circuit board. Specifically, the first ground padand the second ground padare located at two sides of the first end portionA. The plurality of terminal contact padsare located between the first ground padand the second ground pad. The controlling modulefurther includes a first chip CPand a second chip CPdisposed on the circuit board. The first chip CPand the second chip CPare electrically connected to the terminal contact pads.

122 123 124 121 121 125 121 121 In some embodiments, the first ground pad, the second ground pad, and the terminal contact padsare arranged on the first end portionA of the circuit boardalong a direction (e.g., the Y-direction). In some embodiments, the plurality of gold fingersare arranged on the second end portionB of the circuit boardalong a direction (e.g., the Y-direction).

5 FIG. 5 FIG. 5 FIG. 4 FIG. 5 FIG. 110 120 1 2 3 4 110 120 110 1 2 3 4 120 110 122 112 114 123 113 115 1 1 2 2 3 3 4 4 124 1 1 2 2 3 3 4 4 124 Reference is made to.is a perspective view of the conductive partand the controlling modulein accordance with an embodiment of the present disclosure. As shown in, in this embodiment, the first cable CB, the second cable CB, the third cable CB, and the fourth cable CBare located on a side of the conductive part, whereas the controlling moduleis located on the other side of the conductive part. In other words, the composite of the first cable CB, the second cable CB, the third cable CB, and the fourth cable CBand the controlling moduleare located on opposite sides of the conductive part. As shown inand, the first ground padcontacts the first lower ground pinand the first upper ground pin, and the second ground padcontacts the second lower ground pinand the second upper ground pin. The first signal terminal Tof the first cable CB, the second signal terminal Tof the second cable CB, the third signal terminal Tof the third cable CB, and the fourth signal terminal Tof the fourth cable CBcontact the terminal contact pads. Accordingly, the first signal terminal Tof the first cable CB, the second signal terminal Tof the second cable CB, the third signal terminal Tof the third cable CB, and the fourth signal terminal Tof the fourth cable CBare electrically connected to the terminal contact pads.

6 FIG. 6 FIG. 6 FIG. 100 112 114 113 115 121 120 112 114 113 115 121 116 121 114 115 1 2 3 4 121 112 113 116 121 100 Reference is made to.is a cross-sectional view of the communication componentin accordance with an embodiment of the present disclosure. As shown in, in this embodiment, the first lower ground pin, the first upper ground pin, the second lower ground pin, and the second upper ground pinjointly clamp the circuit boardof the controlling module. In detail, the first lower ground pin, the first upper ground pin, the second lower ground pin, and the second upper ground pinclamp portions of the circuit boardlocated at its corners, and the middle ground pinsupports a middle portion of the circuit board. In some embodiments, the first upper ground pin, the second upper ground pin, the first signal terminal T, the second signal terminal T, the third signal terminal T, and the fourth signal terminal Tcontact an upper surface of the circuit board, and the first lower ground pin, the second lower ground pin, and the middle ground pincontact a lower surface of the circuit board. This ensures that the overall structure of the communication componentis stable and not easily disassembled, thereby preventing failures or damages.

7 FIG. 7 FIG. 7 FIG. 1 1 121 124 1 2 121 1 2 1 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 Reference is made to.is a functional block diagram of a communication system Sin accordance with an embodiment of the present disclosure. As shown in, in this embodiment, the communication system Sincludes the circuit board, the terminal contact pads, a first chip CP, a second chip CP, and a processing unit MCU. The processing unit MCU is disposed on the circuit boardand is connected to the first chip CPand the second chip CP. In the communication system S, the first chip CPand the second chip CPare respectively a cable driver chip CDand a cable driver chip CD. The cable driver chip CDand the cable driver chip CDare configured to receive input signals from a coaxial transmitter module (not shown) and generate output signals and loop signals based on the input signals. The processing unit MCU is configured to adjust the output signals of the cable driver chip CDand the cable driver chip CD. Specifically, the processing unit MCU may adjust the intensity of the output signals from the cable driver chip CDand the cable driver chip CDto be greater or less than the intensity of the input signals. In some embodiments, the processing unit MCU is configured to turn off the cable driver chip CDand the cable driver chip CDwhen no input signal is received by the cable driver chip CDand the cable driver chip CD. Specifically, when the processing unit MCU detects that no input signal is transmitted to the cable driver chip CDand the cable driver chip CD, the processing unit MCU can automatically power off the cable driver chip CDand the cable driver chip CDto conserve energy. In some embodiments, the processing unit MCU is configured to constantly turn on the cable driver chip CDand the cable driver chip CDwhen the input signal is received by the cable driver chip CDand the cable driver chip CD. Specifically, the processing unit MCU can maintain the cable driver chip CDand the cable driver chip CDin an operating state, so that upon receiving the input signals, the cable driver chip CDand the cable driver chip CDcan promptly process the input signals and generate the corresponding output signals and loop signals.

7 FIG. 7 FIG. 1 2 1 2 1 2 1 2 1 2 1 2 Reference is again made to. As shown in, in this embodiment, the processing unit MCU is configured to control the first chip CPand the second chip CPto receive the input signals. Specifically, the processing unit MCU controls the cable driver chip CDand the cable driver chip CDto respectively receive a transmitter input signal TIA and a transmitter input signal TIB. Next, the processing unit MCU is configured to control the first chip CPand the second chip CPto generate output signals based on the input signals. Specifically, the processing unit MCU controls the cable driver chip CDand the cable driver chip CDto generate a transmitter output signal TOPA and a transmitter output signal TOPB based on the transmitter input signal TIA and the transmitter input signal TIB, respectively. Next, the processing unit MCU is configured to control the first chip CPand the second chip CPto generate loop signals based on the output signals. Specifically, the processing unit MCU controls the cable driver chip CDand the cable driver chip CDto generate a transmitter loop signal TLPA and a transmitter loop signal TLPB based on the transmitter output signal TOPA and the transmitter output signal TOPB, respectively. The transmitter loop signal TLPA is identical to the transmitter output signal TOPA, and the transmitter loop signal TLPB is identical to the transmitter output signal TOPB.

7 FIG. 124 1 1 1 124 2 2 2 124 3 3 3 124 4 4 4 Reference is again made to. The transmitter output signal TOPA is transmitted through the terminal contact padto the first cable CB, so that the first cable CBtransmits a transmitter output signal TOPidentical to the transmitter output signal TOPA. The transmitter loop signal TLPA is transmitted through the terminal contact padto the second cable CB, so that the second cable CBtransmits a transmitter output signal TOPidentical to the transmitter loop signal TLPA. The transmitter output signal TOPB is transmitted through the terminal contact padto the third cable CB, so that the third cable CBtransmits a transmitter output signal TOPidentical to the transmitter output signal TOPB. The transmitter loop signal TLPB is transmitted through the terminal contact padto the fourth cable CB, so that the fourth cable CBtransmits a transmitter output signal TOPidentical to the transmitter loop signal TLPB.

1 1 3 2 4 100 In a usage scenario, by the structural configuration of the communication system S, a user may monitor the output signals of the first cable CBand the third cable CB, based on the input signals from the coaxial transmitter module, merely through the second cable CBand the fourth cable CBof the communication component, without installing additional cables or monitoring equipment.

8 FIG. 8 FIG. 8 FIG. 2 2 121 124 1 2 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 Reference is made to.is a functional block diagram of the communication system Sin accordance with an embodiment of the present disclosure. As shown in, in this embodiment, the communication system Sincludes the circuit board, the terminal contact pads, the first chip CP, the second chip CP, and the processing unit MCU. In the communication system S, the first chip CPand the second chip CPare respectively an equalizer chip EQand an equalizer chip EQ. The equalizer chip EQand the equalizer chip EQare configured to receive input signals from a coaxial receiver module (not shown) and to generate output signals and loop signals based on the input signals. The processing unit MCU is configured to adjust the output signals of the equalizer chip EQand the equalizer chip EQ. Specifically, the processing unit MCU may adjust the intensity of the output signals from the equalizer chip EQand the equalizer chip EQto be greater or less than the intensity of the input signals. In some embodiments, the processing unit MCU is configured to turn off the equalizer chip EQand the equalizer chip EQwhen no input signal is received by the equalizer chip EQand the equalizer chip EQ. Specifically, when the processing unit MCU detects that no input signal is transmitted to the equalizer chip EQand the equalizer chip EQ, the processing unit MCU can automatically power off the equalizer chip EQand the equalizer chip EQto conserve energy. In some embodiments, the processing unit MCU is configured to constantly turn on the equalizer chip EQand the equalizer chip EQwhen the input signal is received by the equalizer chip EQand the equalizer chip EQ. Specifically, the processing unit MCU can maintain the equalizer chip EQand the equalizer chip EQin an operating state, so that upon receiving the input signals, the equalizer chip EQand the equalizer chip EQcan promptly process the input signals and generate the corresponding output signals and loop signals.

8 FIG. 8 FIG. 1 2 1 2 1 2 1 3 1 2 1 2 1 2 1 3 1 2 1 2 1 2 1 2 1 2 1 2 1 2 Reference is again made to. As shown in, in this embodiment, the processing unit MCU is configured to control the first chip CPand the second chip CPto receive the input signals. Specifically, the processing unit MCU controls the equalizer chip EQand the equalizer chip EQto receive a receiver input signal RIPand a receiver input signal RIP, respectively. More specifically, the first cable CBand the third cable CBrespectively transmit the receiver input signal RIPand the receiver input signal RIP, and the processing unit MCU controls the equalizer chip EQand the equalizer chip EQto respectively receive the receiver input signal RIPand the receiver input signal RIPfrom the first cable CBand the third cable CB. Next, the processing unit MCU is configured to control the first chip CPand the second chip CPto generate output signals based on the input signals. Specifically, the processing unit MCU controls the equalizer chip EQand the equalizer chip EQto generate a receiver output signal ROA and a receiver output signal ROB based on the receiver input signal RIPand the receiver input signal RIP, respectively. Next, the processing unit MCU is configured to control the first chip CPand the second chip CPto generate loop signals based on the output signals. Specifically, the processing unit MCU controls the equalizer chip EQand the equalizer chip EQto generate a receiver loop signal RLPand a receiver loop signal RLPbased on the receiver output signal ROA and the receiver output signal ROB, respectively. The receiver loop signal RLPis identical to the receiver output signal ROA, and the receiver loop signal RLPis identical to the receiver output signal ROB.

8 FIG. 1 1 124 1 1 1 1 124 2 2 1 2 3 124 2 2 2 2 124 4 4 2 Reference is again made to. The receiver input signal RIPis transmitted from the first cable CBthrough the terminal contact padto the equalizer chip EQ, so that the equalizer chip EQgenerates a receiver output signal ROA identical to the receiver input signal RIP. The receiver loop signal RLPis transmitted through the terminal contact padto the second cable CB, so that the second cable CBtransmits the receiver loop signal RLPidentical to the receiver output signal ROA. The receiver input signal RIPis transmitted from the third cable CBthrough the terminal contact padto the equalizer chip EQ, so that the equalizer chip EQgenerates a receiver output signal ROB identical to the receiver input signal RIP. The receiver loop signal RLPis transmitted through the terminal contact padto the fourth cable CB, so that the fourth cable CBtransmits the receiver loop signal RLPidentical to the receiver output signal ROB.

2 1 3 2 4 100 In a usage scenario, by the structural configuration of the communication system S, a user may monitor the output signals of the first cable CBand the third cable CB, based on the input signals from the coaxial receiver module, merely through the second cable CBand the fourth cable CBof the communication component, without installing additional cables or monitoring equipment.

9 FIG. 9 FIG. 9 FIG. 9 FIG. 7 FIG. 9 FIG. 8 FIG. 3 3 121 124 1 2 3 1 2 1 2 1 2 1 1 2 2 Reference is made to.is a functional block diagram of the communication system Sin accordance with an embodiment of the present disclosure. As shown in, in this embodiment, the communication system Sincludes the circuit board, the terminal contact pads, the first chip CP, the second chip CP, and the processing unit MCU. In the communication system S, the first chip CPand the second chip CPare respectively the cable driver chip CDand the equalizer chip EQ. The cable driver chip CDand the equalizer chip EQare configured to respectively receive input signals from a coaxial transmitter module (not shown) and a coaxial receiver module (not shown), and to generate output signals and loop signals based on the input signals. Since the cable driver chip CDinis identical to the cable driver chip CDin, and the equalizer chip EQinis identical to the equalizer chip EQin, repeated description is omitted herein.

9 FIG. 9 FIG. 1 2 1 2 2 1 2 1 2 2 1 2 1 2 2 2 Reference is again made to. As shown in, in this embodiment, the processing unit MCU is configured to control the first chip CPand the second chip CPto receive the input signals. Specifically, the processing unit MCU controls the cable driver chip CDand the equalizer chip EQto respectively receive the transmitter input signal TIA and the receiver input signal RIP. Next, the processing unit MCU is configured to control the first chip CPand the second chip CPto generate output signals based on the input signals. Specifically, the processing unit MCU controls the cable driver chip CDand the equalizer chip EQto respectively generate the transmitter output signal TOPA and the receiver output signal ROB based on the transmitter input signal TIA and the receiver input signal RIP. Next, the processing unit MCU is configured to control the first chip CPand the second chip CPto generate loop signals based on the output signals. Specifically, the processing unit MCU controls the cable driver chip CDand the equalizer chip EQto respectively generate the transmitter loop signal TLPA and the receiver loop signal RLPbased on the transmitter output signal TOPA and the receiver output signal ROB. The transmitter loop signal TLPA is identical to the transmitter output signal TOPA, and the receiver loop signal RLPis identical to the receiver output signal ROB.

9 FIG. 124 1 1 1 124 2 2 2 2 3 124 2 2 2 2 124 4 4 2 Reference is again made to. The transmitter output signal TOPA is transmitted through the terminal contact padto the first cable CB, so that the first cable CBtransmits the transmitter output signal TOPidentical to the transmitter output signal TOPA. The transmitter loop signal TLPA is transmitted through the terminal contact padto the second cable CB, so that the second cable CBtransmits the transmitter output signal TOPidentical to the transmitter loop signal TLPA. The receiver input signal RIPis transmitted from the third cable CBthrough the terminal contact padto the equalizer chip EQ, so that the equalizer chip EQgenerates the receiver output signal ROB identical to the receiver input signal RIP. The receiver loop signal RLPis transmitted through the terminal contact padto the fourth cable CB, so that the fourth cable CBtransmits the receiver loop signal RLPidentical to the receiver output signal ROB.

3 1 3 2 4 100 In a usage scenario, by the structural configuration of the communication system S, a user may monitor the output signals of the first cable CBand the third cable CB, based on the input signals from the coaxial transmitter module and the coaxial receiver module, merely through the second cable CBand the fourth cable CBof the communication component, without installing additional cables or monitoring equipment.

2 2 In some embodiments, the processing unit MCU may be controlled by another controlling unit (not shown) under the IC communication protocol. In some embodiments, the communication protocol IC may adopt the Inter-Integrated Circuit protocol, for example.

In some embodiments, the processing unit MCU may be, for example, a microprocessor or another type of processing unit.

From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the communication component of the present disclosure, since the first ground pad and the second ground pad are disposed at two sides of the circuit board and the terminal contact pads are located between the first ground pad and the second ground pad, when the first ground pad contacts the first lower ground pin and the first upper ground pin and the second ground pad contacts the second lower ground pin and the second upper ground pin, the first lower ground pin, the first upper ground pin, the second lower ground pin, and the second upper ground pin can jointly clamp the circuit board, so as to reduce stress caused by external collision and provide sufficient support to the controlling module, thereby preventing the signal terminals of the cables from being detached from the circuit board. In the communication component of the present disclosure, since the first lower ground pin, the first upper ground pin, the second lower ground pin, and the second upper ground pin are located at corners of the circuit board, the conductive (terminal) contact pads can be concentrated at the center of an end of the circuit board, thereby increasing the conductive area on the circuit board. In the communication component of the present disclosure, since the cable driver chip is capable of generating a loop signal identical to the output signal and the equalizer chip is capable of generating a loop signal in a direction opposite to that of the input signal transmission, the loop signal can be used to monitor the output signal without requiring additional cables and monitoring equipment, thereby reducing the occupied space of the entire system. Overall, the communication component of the present disclosure not only enhances the structural stability of the entire assembly but also effectively reduces the overall volume of the communication component.

Although the present disclosure has been described with reference to the above embodiments, it is not intended to limit the present disclosure. Various modifications and refinements may be made by those skilled in the art without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be defined by the appended claims.