Substrate Processing Equipment Having Measurement Module for Measuring Current/Voltage/Power of Output Power

This U.S. non-provisional patent application claims priority under 35 U.S.C. § 119 of Korean Patent Application No. 10-2024-0104755, filed on Aug. 6, 2024, the entire contents of which are hereby incorporated by reference.

The present invention relates to a substrate processing equipment, and more particularly, to a substrate processing equipment equipped with a current/voltage/power measurement module for measuring the current/voltage applied for generating and maintaining plasma during substrate processing using plasma, and further for measuring the power of incident and reflected waves.

A substrate processing equipment refers to an equipment that processes a substrate by forming a plasma state in a sealed processing space.

The substrate processing equipment may include a plasma source having various structures, such as Capacitively Coupled Plasma (CCP) and Inductively Coupled Plasma (ICP), depending on the plasma formation principle.

1 FIG. 10 11 12 For example, as shown in, a substrate processing equipment generally includes: a process chamber () that forms a sealed processing space (S) in which plasma is formed to process a substrate; a substrate support unit () which is disposed in the processing space (S) and on which a substrate (W) is placed; and a gas injection unit () that injects gas for performing a process into the processing space (S).

Meanwhile, various methods for monitoring the plasma state to control the plasma formed in the processing space (S) are suggested to perform uniform and reproducible substrate processing.

A VI probe is provided as a means for directly measuring the plasma state generated in the processing space (S) of a substrate processing equipment. Although the conventional VI probe secures accuracy in RF voltage/current measurement, it has a problem in that it is difficult to secure reliability for transmitted power measurement with the conventional technology that calculates transmitted power as IVcos(θ) by measuring the phase difference from the RF voltage and current waveforms.

That is, the conventional commercialized method for measuring transmitted power using phase difference (VI probe), which is used to measure the plasma state generated in the processing space (S) of the substrate processing equipment, has many difficulties in accurately measuring and controlling the RF power delivered to the plasma.

An object of the present invention is to provide a substrate processing equipment capable of measuring the power applied for plasma formation, which is configured to have both capacitor and inductor properties to detect scalar values, i.e., the amount of forward power and reflect power, rather than relying on the principle of vectors, such as detecting the phase difference between voltage and current for RF power measurement.

10 11 12 30 11 12 11 41 50 41 41 100 51 50 To achieve the above object, the present invention provides a substrate processing equipment comprising: a process chamberforming a sealed processing space S in which plasma is formed to perform substrate processing; a substrate support unitdisposed in the processing space S on which a substrate W is seated; a gas injection unitfor injecting a process gas into the processing space S; and at least one power sourcefor applying an RF current of a predetermined frequency to at least one of the substrate support unitand the gas injection unit, wherein the substrate support unitincludes a heaterfor heating the seated substrate W, an RF energy blocking partis installed above the heaterto minimize the transfer of RF energy to the heater, and a current/voltage/power measurement moduleis installed adjacent to a grounding wire, one end of which is connected to the RF energy blocking partand the other end is grounded, to measure the RF voltage, current, and power of an incident wave and a reflected wave generated by the plasma in the processing space S.

100 300 400 The current/voltage/power measurement modulemay include a first directional couplerfor measuring the power output by the incident wave and a second directional couplerfor measuring the power output by the reflected wave.

300 310 311 312 51 42 42 320 321 310 322 323 310 The first directional couplermay include: an LC combination circuit partin which a capacitance elementand an inductance element, which are disposed adjacent to the grounding wireand interact with a heater power line, are combined and which is wound based on a direction of the incident wave flowing through the heater power line; and a resistance element partincluding a first reference resistance elementhaving one end that is grounded and the other end connected to one end of the LC combination circuit part, and a second reference resistance elementhaving one end connected to a first output portand the other end connected to one end of the LC combination circuit part.

400 410 411 412 51 42 42 420 421 410 422 423 410 The second directional couplermay include: an LC combination circuit partin which a capacitance elementand an inductance element, which are disposed adjacent to the grounding wireand interact with the heater power line, are combined and which is wound based on a direction of the reflected wave flowing through the heater power line; and a resistance element partincluding a third reference resistance elementhaving one end that is grounded and the other end connected to one end of the LC combination circuit part, and a fourth reference resistance elementhaving one end connected to a second output portand the other end connected to one end of the LC combination circuit part.

300 330 320 310 The first directional couplermay include at least one filter partdisposed at a branch point between the resistance element partand the LC combination circuit part.

400 430 420 410 The second directional couplermay include at least one filter partdisposed at a branch point between the resistance element partand the LC combination circuit part.

220 210 42 42 311 300 411 400 311 411 210 312 300 412 400 340 440 220 311 411 a a a a. The equipment may further comprise a PCBhaving an insertion partwith an inner diameter greater than an outer diameter of the heater power lineso that at least a portion of the heater power lineis inserted therein, wherein the capacitance elementof the first directional couplerand the capacitance elementof the second directional couplercomprise a plurality of capacitance parts,spaced apart from each other along a circumferential direction on an inner circumferential surface of the insertion part, and the inductance elementof the first directional couplerand the inductance elementof the second directional couplercomprise winding parts,passing through the PCBand wound at least one time to connect the ends of adjacent capacitance parts,

340 440 341 441 220 342 442 220 341 441 The winding parts,may include metal pattern parts,formed on top and bottom surfaces of the PCBand vertical connection parts,passing through the PCBto electrically connect the metal pattern parts,.

500 510 210 210 720 510 The voltage measurement unitmay include: a capacitance partformed along a circumferential direction at a predetermined angle on at least one of an inner circumferential surface of the insertion partand top and bottom surfaces of an edge of the insertion part; and a third output port partconnected to the capacitance part.

520 530 510 720 740 At least one of a resistance element partand a third filter partmay be disposed between a branch point between the capacitance partand the third output port partand a first ground part.

600 610 220 500 210 500 710 610 The current measurement unitmay include: an inductance partpassing through the PCBconcentrically with the voltage measurement unitbut further from the inner circumferential surface of the insertion partthan the voltage measurement unitand winding at least one time; and a fourth output port partconnected to the inductance part.

620 630 610 710 730 At least one of a resistance element partand a fourth filter partmay be disposed between a branch point between the inductance partand the fourth output port partand a second ground part.

46 30 42 49 An RF filtermay be additionally installed to block RF energy generated by the RF current from the power sourcefrom being transmitted through the heater power lineto a heater power supply.

60 42 100 A plasma control unitmay be additionally installed, connected to the heater power line, to control the plasma generated in the processing space S using the current/voltage/power measured by the current/voltage/power measurement module.

100 60 The current/voltage/power measurement moduleand the plasma control unitmay be configured as a single module.

60 220 100 The plasma control unitmay be installed on the PCBof the current/voltage/power measurement module.

60 42 100 The present invention also discloses a current/voltage/power measurement module for a substrate processing equipment having the above configuration, wherein a plasma control unit, which is connected to the heater power lineand controls the plasma in the processing space S using the measured current/voltage/power, is configured as a single module with the current/voltage/power measurement module.

Hereinafter, a substrate processing equipment according to the present invention will be described with reference to the accompanying drawings.

First, the substrate processing equipment according to the present invention is an equipment that performs a predetermined function by forming plasma, and it can have various configurations depending on the application of the plasma.

For example, the substrate processing equipment according to the present invention is an equipment that performs substrate processing such as deposition and etching by forming plasma in a processing space S. It can have various configurations for plasma formation structures such as Inductively Coupled Plasma (ICP) and Capacitively Coupled Plasma (CCP).

1 FIG. 10 11 12 30 11 12 The substrate processing equipment, as an example shown in, may include: a process chamberthat forms a sealed processing space S in which plasma is formed to perform substrate processing; a substrate support unitdisposed in the processing space S on which a substrate W is seated; a gas injection unitthat injects a gas for performing a process into the processing space S; and at least one power sourcefor applying an RF current of a predetermined frequency to at least one of the substrate support unitand the gas injection unit.

10 The process chamberis a component that forms a sealed processing space S in which plasma is formed to perform substrate processing, and various configurations are possible.

10 For example, the process chambermay be composed of a container in which the processing space S is formed and an upper lid detachably coupled to the upper side of the container.

11 The substrate support unitis a component installed in the processing space S on which the substrate W is seated, and various configurations are possible.

11 For example, the substrate support unitmay include a susceptor part on which the substrate W is seated and a support rod part extending from the bottom surface of the susceptor part to support the susceptor part.

11 41 In particular, the substrate support unitis equipped with a heaterfor heating the seated substrate W.

41 11 46 49 The heateris a component installed in the substrate support unitthat is supplied with power by a heater power lineconnected to a heater power supplyto heat the seated substrate W, and various configurations are possible.

41 Furthermore, the heatermay be installed in various patterns to perform uniform substrate processing on the seated substrate W.

46 41 49 49 Meanwhile, as RF power is applied for plasma formation in the processing space S, RF energy can be transmitted through the heater power lineconnected to the heaterto the heater power supply, which can cause energy loss as well as damage or malfunction of the heater power supply.

46 46 30 42 49 41 Accordingly, it is preferable that the heater power lineis additionally provided with an RF filterto block RF energy generated by the RF current applied by the power sourcefrom being transmitted through the heater power lineto the heater power supplyfor supplying power to the heater.

46 46 30 49 The RF filteris a component installed on the heater power lineto block RF energy generated by the RF current applied by the power sourcefrom being transmitted to the heater power supply, and it may be configured by at least one of a coil and a capacitor.

12 The gas injection unitis a component for injecting a process gas into the processing space S, and various configurations are possible depending on the gas injection structure.

12 For example, the gas injection unitmay be configured as a showerhead that injects gas supplied through a gas supply pipe installed above it in a downward direction.

30 11 12 The power sourceis a component, of which one or more are installed to apply an RF current of a predetermined frequency to at least one of the substrate support unitand the gas injection unit, and various configurations are possible depending on the power application method and applied frequency.

30 10 11 12 20 30 110 The one or more RF power sourcesapply RF power to at least one of the process chamber, the gas support unit, and the gas injection unit, and a matching networkis installed between the RF power sourceand a power application line.

30 And the RF power sourcecan supply RF current of a predetermined frequency such as high frequency and low frequency depending on the process conditions.

49 42 Meanwhile, as described above, RF current is applied to form plasma in the processing space S, and the RF energy generated by the applied RF current can be transmitted to the heater power supplythrough the heater power line.

11 50 41 41 Accordingly, the substrate support unitmay have an RF energy blocking partinstalled above the heaterto minimize the transfer of RF energy to the heater.

50 41 41 The RF energy blocking partis a component installed above the heaterto minimize the transfer of RF energy to the heater, and various configurations are possible.

1 FIG. 50 41 As an example, as shown in, the RF energy blocking partmay be composed of a metallic mesh installed above the heater.

50 50 Meanwhile, since RF energy is transmitted to the RF energy blocking part, it is possible to measure the RF voltage, current, and the power of the incident and reflected waves generated by the plasma in the processing space S through the RF energy blocking part.

100 51 50 Accordingly, a current/voltage/power measurement modulemay be installed adjacent to a grounding wire, one end of which is connected to the RF energy blocking partand the other end is grounded, to measure the RF voltage, current, and power of the incident and reflected waves generated by the plasma in the processing space S.

100 51 1 FIG. The current/voltage/power measurement module, as shown in, is characterized by being installed adjacent to the grounding wireto measure the RF voltage, current, and power of the incident and reflected waves generated by the plasma in the processing space S.

100 Here, the current/voltage/power measurement modulecan have various configurations depending on the principles of measuring current, voltage, and particularly power.

100 300 51 400 42 500 51 600 51 7 8 FIGS.to For example, the current/voltage/power measurement module, as shown in, may include: a first directional couplerdisposed adjacent to the grounding wireto measure the power output by the incident wave; a second directional couplerdisposed adjacent to the heater power lineto measure the power output by the reflected wave; a voltage measurement unitdisposed adjacent to the grounding wireto measure the RF voltage using the capacitance principle; and a current measurement unitdisposed adjacent to the grounding wireto measure the RF current using the inductance principle.

500 51 The voltage measurement unitis a component disposed adjacent to the grounding wireto measure the RF voltage using the capacitance principle, and various configurations are possible.

500 510 42 720 510 8 FIG. For example, the voltage measurement unit, as shown in, may include a capacitance partdisposed adjacent to the heater power line, and a third output port partconnected to the capacitance partto measure the voltage of the incident wave.

510 42 42 The capacitance partis a component disposed adjacent to the heater power line, which can have various configurations, such as being composed of a capacitor conductor made of a material like copper that forms a capacitor in a circuit, installed at a predetermined distance from the outer circumferential surface of the heater power line.

42 Of course, a dielectric material for adjusting the dielectric constant may be formed between the outer circumferential surface of the heater power lineand the capacitor conductor.

720 510 42 The third output port partis a component connected to the capacitance partto measure the voltage of the incident wave applied to the heater power line, and various configurations are possible.

720 220 Particularly, the third output port partmay be formed in the shape of a wire at the edge of a PCB, which will be described later.

720 510 And it is preferable that the third output port partis connected to the midpoint based on the length of the capacitance part.

520 530 720 510 740 Meanwhile, at least one of a resistance element partand a third filter partmay be installed between a branch point between the third output port partand the capacitance partand a first ground part.

740 The first ground partis a component for grounding through coupling with an external terminal and may be configured similarly to the ground terminal described later.

520 530 720 530 The resistance element partand the third filter partare electrical elements installed to stably measure the voltage of the incident wave from the electrical signal output to the third output port part. The third filter partmay be configured by a combination of a resistor, a capacitor, a coil, and the like.

600 51 The current measurement unitis a component disposed adjacent to the grounding wireto measure the RF current using the inductance principle, and various configurations are possible.

600 610 42 710 610 42 8 FIG. For example, the current measurement unit, as shown in, may include an inductance partdisposed adjacent to the heater power line, and a fourth output port partconnected to the inductance partto measure the current flowing through the heater power line.

610 42 42 The inductance partis a component disposed adjacent to the heater power line, which can have various configurations, such as being composed of an inductance wire made of a material like copper that forms an inductance in a circuit, installed at a predetermined distance from the outer circumferential surface of the heater power line.

710 610 42 The fourth output port partis a component connected to the inductance partto measure the current flowing through the heater power line, and various configurations are possible.

710 220 Particularly, the fourth output port partmay be formed in the shape of a wire at the edge of the PCB, which will be described later.

710 610 And it is preferable that the fourth output port partis connected to one end based on the length of the inductance part.

620 630 710 610 730 Meanwhile, at least one of a resistance element partand a fourth filter partmay be installed between a branch point between the fourth output port partand the inductance partand a second ground part.

730 The second ground partis a component for grounding through coupling with an external terminal and may have a configuration similar to that of a ground terminal that will be described later.

620 630 520 530 620 630 710 630 The resistance element partand the fourth filter part(translator's note: original text mistakenly refers toand, corrected toandfor context) are electrical elements installed to stably measure the voltage of the incident wave from the electrical signal output to the fourth output port part. The fourth filter partmay be configured by a combination of a resistor, a capacitor, a coil, and the like.

300 51 The first directional coupleris a component disposed adjacent to the grounding wireto measure the power output by the incident wave, and various configurations are possible.

300 310 311 312 51 42 42 320 321 310 322 323 310 8 FIG. For example, the first directional coupler, as shown in, may include: an LC combination circuit partin which a capacitance elementand an inductance element, which are disposed adjacent to the grounding wireand interact with the heater power line, are combined and which is wound based on a direction of the incident wave flowing through the heater power line; and a resistance element partincluding a first reference resistance elementhaving one end that is grounded and the other end connected to one end of the LC combination circuit part, and a second reference resistance elementhaving one end connected to a first output portand the other end connected to one end of the LC combination circuit part.

310 311 312 51 42 42 311 312 The LC combination circuit partis a component in which a capacitance elementand an inductance element, which are disposed adjacent to the grounding wireand interact with the heater power line, are combined and wound based on the direction of the incident wave flowing through the heater power line, and various configurations are possible, such as the combination of the capacitance elementand the inductance element.

312 Particularly, it is preferable that the inductance elementhas a winding structure in a forward direction based on the traveling direction of the incident wave, i.e., a counter-clockwise direction, in consideration of measuring the power of the incident wave.

311 312 42 Also, considering a merged structure, if the capacitance elementand the inductance elementform one coil as a whole, a plate surface may be formed in a direction toward the outer circumferential surface of the heater power lineso that a portion of the coil forms the capacitor part.

310 311 312 The LC combination circuit partmay form one circuit by combining the capacitance elementand the inductance element.

320 321 310 322 323 310 The resistance element partincludes a first reference resistance elementhaving one end that is grounded and the other end connected to one end of the LC combination circuit part, and a second reference resistance elementhaving one end connected to the first output portand the other end connected to one end of the LC combination circuit part, and can have various configurations.

321 310 The first reference resistance element, having one end grounded and the other end connected to one end of the LC combination circuit part, may have a preset resistance value, e.g., 50 Ω.

321 220 324 220 Here, when the first reference resistance elementis installed on the PCB, it may be formed in the shape of a ground terminalat the edge of the PCB, which will be described later.

322 323 310 321 The second reference resistance element, having one end connected to the first output portand the other end connected to one end of the LC combination circuit part, may have a preset resistance value, e.g., the same resistance value as the first reference resistance element.

323 220 Here, the first output portmay be formed as a terminal at the edge of the PCB, which will be described later.

300 330 320 310 Meanwhile, the first directional couplermay have at least one filter partinstalled at a branch point between the resistance element partand the LC combination circuit part.

330 320 310 The filter partis an electric element installed at a branch point between the resistance element partand the LC combination circuit part, and may be composed of a capacitor, a coil, and the like.

400 51 The second directional coupleris a component disposed adjacent to the grounding wireto measure the power output by the reflected wave, and various configurations are possible.

400 410 411 412 51 42 42 420 421 410 422 423 410 8 FIG. For example, the second directional coupler, as shown in, may include: an LC combination circuit partin which a capacitance elementand an inductance element, which are disposed adjacent to the grounding wireand interact with the heater power line, are combined and which is wound based on a direction of the reflected wave flowing through the heater power line; and a resistance element partincluding a third reference resistance elementhaving one end that is grounded and the other end connected to one end of the LC combination circuit part, and a fourth reference resistance elementhaving one end connected to a second output portand the other end connected to one end of the LC combination circuit part.

410 411 412 The LC combination circuit partis a component combined with the capacitance elementand the inductance element, and various configurations are possible.

412 312 300 412 400 Particularly, it is preferable that the inductance elementhas a winding structure in a forward direction based on the traveling direction of the reflected wave, i.e., a counter-clockwise direction—since the incident wave and the reflected wave are in opposite directions, the winding direction of the inductance elementof the first directional couplerand the winding direction of the inductance elementof the second directional couplerare opposite to each other.

411 412 42 Also, considering a merged structure, if the capacitance elementand the inductance elementform one coil as a whole, a plate surface may be formed in a direction toward the outer circumferential surface of the heater power lineso that a portion of the coil forms the capacitor part.

410 411 412 The LC combination circuit partmay be combined with the capacitance elementand the inductance elementto form one circuit.

420 421 410 422 423 410 The resistance element partincludes a third reference resistance elementhaving one end that is grounded and the other end connected to one end of the LC combination circuit part, and a fourth reference resistance elementhaving one end connected to the second output portand the other end connected to one end of the LC combination circuit part, and can have various configurations.

421 410 The third reference resistance element, having one end grounded and the other end connected to one end of the LC combination circuit part, may have a preset resistance value, e.g., 50 Ω.

421 220 424 220 Here, when the third reference resistance elementis installed on the PCB, it may be formed in the shape of a ground terminalat the edge of the PCB, which will be described later.

422 423 410 421 The fourth reference resistance element, having one end connected to the second output portand the other end connected to one end of the LC combination circuit part, may have a preset resistance value, e.g., the same resistance value as the third reference resistance element.

423 220 Here, the second output portmay be formed as a terminal at the edge of the PCB, which will be described later.

400 430 420 410 Meanwhile, the second directional couplermay have at least one filter partinstalled at a branch point between the resistance element partand the LC combination circuit part.

430 420 410 The filter partis an electric element installed at a branch point between the resistance element partand the LC combination circuit part, and may be composed of a capacitor, a coil, and the like.

220 Meanwhile, the substrate processing equipment according to the present invention having the above-described configuration may be configured as one module by including one PCB.

220 210 42 42 That is, the substrate processing equipment according to the present invention may include the PCBin which an insertion parthaving an inner diameter greater than an outer diameter of the heater power lineis formed so that at least a portion of the heater power lineis inserted thereto.

210 42 311 411 312 412 The insertion partmay be formed in various shapes such as an arc or circle with one side opened, considering that the cross-sectional shape of the heater power lineis circular, so that the capacitance elements,and inductance elements,, which will be described later, have the same condition.

210 42 Alternatively, the insertion partmay have a polygonal shape depending on conditions, such as when the cross-section of the heater power lineis rectangular.

311 300 411 400 311 411 210 312 300 412 400 340 440 220 311 411 2 5 FIGS.to a a a a. Meanwhile, the capacitance elementof the first directional couplerand the capacitance elementof the second directional coupler, as shown in, may include a plurality of capacitance parts,spaced apart from each other along a circumferential direction on an inner circumferential surface of the insertion part, and the inductance elementof the first directional couplerand the inductance elementof the second directional couplermay include winding parts,passing through the PCBand wound at least one time to connect the ends of adjacent capacitance parts,

311 300 411 400 311 411 210 a a In a specific embodiment, the capacitance elementof the first directional couplerand the capacitance elementof the second directional couplermay include a plurality of capacitance parts,made of a conductive material such as copper, arranged along a predetermined arc angle on the inner circumferential surface of the insertion part.

311 411 210 a a The plurality of capacitance parts,may each have a rectangular shape in an unfolded state and be spaced at a predetermined distance from each other along the inner circumferential surface of the insertion part.

340 440 312 300 412 400 220 311 411 a a Meanwhile, the winding parts,are the inductance elementof the first directional couplerand the inductance elementof the second directional coupler, which pass through the PCBand are wound at least one time to connect the ends of adjacent capacitance parts,, and can have various configurations depending on the coil winding structure.

340 440 810 820 830 840 220 850 220 810 820 830 840 In a specific embodiment, the winding parts,may include metal pattern parts,,,formed on the top and bottom surfaces of the PCB, and a vertical connection partthat passes through the PCBvertically to electrically connect the metal pattern parts,,,.

810 820 830 840 220 850 The metal pattern parts,,,are metal patterns formed on the top and bottom surfaces of the PCBthat form one coil together with the vertical connection part, and can be formed in various patterns.

810 820 830 840 810 220 311 811 820 220 311 821 830 832 811 831 220 311 840 841 831 842 821 a a a For example, the metal pattern parts,,,may include: a first upper componentextending radially on the top surface of the PCBfrom the rear end of the capacitance partin a clockwise direction and having a first connection pointat its end; a first lower componentextending radially on the bottom surface of the PCBfrom the front end of the capacitance partin the clockwise direction and having a second connection pointat its end; a second lower componentconnecting a third connection pointset directly below the first connection pointto a fourth connection pointset on the bottom surface of the PCBbetween adjacent capacitance partsin the clockwise direction; and a second upper componentconnecting a fifth connection pointlocated directly above the fourth connection pointto a sixth connection pointset directly above the second connection point.

810 840 820 830 220 311 411 850 a a The first upper component, the second upper component, the first lower component, and the second lower componentare parts made of a conductive material such as copper on the top and bottom surfaces of the PCB, which form an inductance component as a whole together with the capacitance parts,and the vertical connection partthat will be described later, and can have various configurations.

811 842 850 810 840 820 830 Meanwhile, the first connection pointto the sixth connection pointare points set as portions where the vertical connection partis vertically connected to the first upper component, the second upper component, the first lower component, and the second lower component, and can have various configurations depending on the connection structure.

841 831 210 811 821 Particularly, the fifth connection pointand the fourth connection pointmay be formed closer to the inner peripheral surface of the insertion partthan the first connection pointand the second connection point.

850 220 810 820 830 840 850 811 832 842 821 841 831 The vertical connection partis a component that passes through the PCBvertically and electrically connects the metal pattern parts,,,, and may include a plurality of connection membersthat vertically and electrically connect the first connection pointand the third connection point, the sixth connection pointand the second connection point, and the fifth connection pointand the fourth connection point, respectively.

441 442 400 810 820 830 840 850 300 210 2 5 FIGS.to Meanwhile, the metal pattern partand vertical connection partof the second directional couplerare formed linearly symmetrical to the metal pattern parts,,,and vertical connection partof the first directional couplerwith respect to the center of the insertion part, as shown in, so a detailed description thereof will be omitted.

400 300 300 400 For reference, since the inductance component of the second directional coupleris opposite to that of the first directional coupler, if the first directional coupleris formed based on the clockwise direction, the second directional coupleris formed based on the counter-clockwise direction.

220 310 410 300 400 320 420 330 430 Meanwhile, in the PCB, the LC combination circuit parts,of the first directional couplerand the second directional couplermay be formed on one side, and the remaining components, such as the resistance element parts,and at least a portion of the filter parts,, may be formed on the other side.

220 310 410 210 320 420 Also, the PCBhaving the above-described configuration may have a rectangular planar shape and be divided into a first area on which the LC combination circuit parts,and the insertion partare formed, and a second area which adjoins the first area and on which the resistance element parts,are disposed.

310 410 320 420 390 490 220 Meanwhile, the LC combination circuit parts,disposed in the first area and the resistance element parts,disposed in the second area may be electrically connected by at least one wire pattern,formed on at least one of the top and bottom surfaces of the PCB.

390 490 220 310 410 320 420 Particularly, the wire patterns,may be appropriately arranged on the top and bottom surfaces of the PCBto effectively connect the LC combination circuit parts,in the first area and the resistance element parts,in the second area.

240 310 410 And between the first area and the second area, at least one wire patternfor blocking electromagnetic waves from the first area where the LC combination circuit parts,are installed may be formed on at least one of the top and bottom surfaces.

500 220 Meanwhile, the voltage measurement unitmay be integrated into the PCB.

510 210 210 220 Specifically, the capacitance partmay be formed along a circumferential direction at a predetermined angle on at least one of the inner circumferential surface of the insertion partand the top and bottom surfaces of the edge of the insertion partin the first area of the PCB.

510 311 310 300 411 410 400 210 Here, the capacitance partmay be located between the capacitance elementof the LC combination circuit partof the first directional couplerand the capacitance elementof the LC combination circuit partof the second directional coupler, based on the circumferential direction of the insertion part.

520 220 And the resistance element partmay be installed in the second area of the PCB.

520 510 590 220 And the resistance element partmay be electrically connected to the capacitance partby a wire patternformed on at least one of the top and bottom surfaces of the PCB.

530 220 590 520 510 Also, the third filter partmay be set at an arbitrary point on the PCB, which is a branch point from the wire patternbetween the resistance element partand the capacitance part.

600 220 Also, the current measurement unitmay be integrated into the PCB.

610 220 500 210 The inductance partmay be formed in the first area by passing through the PCB, concentric with the voltage measurement unitbut further from the inner circumferential surface of the insertion part, and winding at least one time.

610 611 210 220 612 220 611 611 613 614 220 Specifically, the inductance partmay include: a plurality of upper componentsextending in the radial direction of the insertion partand spaced apart in the circumferential direction on the top surface of the PCB; a lower componentconnecting a first lower connection point, located by passing through the PCBfrom a first upper connection point at one outer end of the upper component, and a second lower connection point at the inner other end of an adjacent upper component; a first connection partthat electrically connects the first upper connection point and the first lower connection point vertically; and a second connection partthat vertically and electrically connects a second upper connection point to a second lower connection point located by passing through the PCBfrom the second upper connection point.

620 220 Meanwhile, the resistance element partmay be installed in the second area of the PCB.

620 610 690 220 And the resistance element partmay be electrically connected to the inductance partby a wire patternformed on at least one of the top and bottom surfaces of the PCB.

630 220 690 620 610 And the fourth filter partmay be set at an arbitrary point on the PCB, which is a branch point from the wire patternbetween the resistance element partand the inductance part.

220 323 324 423 424 740 730 720 710 Meanwhile, on the PCB, the first output portand ground terminal, the second output portand ground terminal, the first ground part, the second ground part, the third output port, and the fourth output portmay be formed as terminals at the edge of the second area.

220 323 423 710 720 The terminals formed on the PCBcan be connected to an external module, and electrical signals are output through each output port,,,, enabling the measurement of current/voltage/power.

100 300 400 Meanwhile, the current/voltage/power measurement modulemay measure the power of the incident and reflected waves by using the first directional couplerand the second directional coupler.

300 400 However, since the electrical signals output through the first directional couplerand the second directional couplerare output with a lot of noise, proper extraction and verification are required.

100 51 Accordingly, the current/voltage/power measurement modulecan measure the voltage and current applied to the grounding wire, and the power of the incident and reflected waves, through a pre-established lookup table, relational expressions, etc., obtained from experiments performed in advance according to process conditions.

500 600 300 400 500 600 300 400 Meanwhile, in the present invention, although a configuration including all of the voltage measurement unit, the current measurement unit, the first directional couplerfor measuring incident wave power, and the second directional couplerfor measuring reflected wave power has been described, the present invention can, of course, be configured by a combination of at least one of the voltage measurement unit, the current measurement unit, the first directional coupler, and the second directional coupleras needed.

500 600 300 400 In particular, the present invention can, of course, implement a combination of at least one of the voltage measurement unit, the current measurement unit, the first directional coupler, and the second directional coupleron a single PCB as needed.

46 30 42 49 41 Meanwhile, as described above, an RF filtermay be additionally installed to block the RF energy generated by the RF current applied by the power sourcefrom being transmitted through the heater power lineto the heater power supplyfor supplying power to the heater.

100 46 At this time, the current/voltage/power measurement moduleand the RF filtermay be configured as a single module.

46 220 100 In particular, the RF filtermay be installed on the PCBthat constitutes the current/voltage/power measurement module.

100 51 Meanwhile, as described above, the current/voltage/power can be measured by the current/voltage/power measurement moduleinstalled adjacent to the grounding wire.

60 51 100 Accordingly, by additionally installing a plasma control unitconnected to the grounding wirethat controls the plasma generated in the processing space S using the current/voltage/power measured by the current/voltage/power measurement module, the plasma for substrate processing can be easily controlled.

60 100 The plasma control unitis a component that controls the plasma generated in the processing space S using the current/voltage/power measured by the current/voltage/power measurement module, and various configurations are possible.

60 52 51 52 For example, the plasma control unitmay be composed of a branch linebranched from the grounding wireand an electrical element having one end connected to the branch lineand the other end grounded.

100 And the electrical element may include a variable capacitor and/or a variable coil, whose values can be changed using the current/voltage/power measured by the current/voltage/power measurement module.

100 42 1 FIG. Meanwhile, the current/voltage/power measurement module, as shown in, may be installed adjacent to the power application linethat supplies power to the heater, either alternatively or additionally.

The above is a description of only some of the preferred embodiments that can be implemented by the present invention, and as is well known, the scope of the present invention should not be interpreted as being limited to the above embodiments, and all technical ideas that share the fundamental technical spirit of the present invention described above shall be included in the scope of the present invention.