Radial Multi-Point Solder Tip and Related Solder Device

This application claims the benefit of U.S. Provisional Application No. 63/683,906, filed on Aug. 16, 2024, and entitled “RADIAL MULTI-POINT SOLDER TIP AND RELATED SOLDER DEVICE,” which is incorporated herein by reference in its entirety.

A wire comb is a small component that facilitates the positioning of a number (e.g., two or more) of wires for soldering. Wire combs and soldering tips or fixtures can be used in combination in manufacturing. More recently, wire combs have been included as small plastic components that attach to a printed circuit board (“PCB”) to mount individual wires from multi-wire cables onto PCBs. These wire combs are mounted adjacent one or more ends of a PCB to permit the individual wires to be spaced apart yet held in place during a soldering, over-molding, or other process while permitting connecting the wires to the appropriate connections on the circuit board. After undergoing the appropriate soldering processes, the PCB and the wire comb are but two components in a finished PCB assembly (“PCBA”).

Aspects of the disclosure are described more fully hereinafter with reference to the accompanying drawings, which form a part hereof, and which show, by way of illustration, example features. The features can, however, be embodied in many different forms and should not be construed as limited to the combinations set forth herein; rather, these combinations are provided so that this disclosure will be thorough and complete, and will fully convey the scope. The following detailed description is, therefore, not to be taken in a limiting sense.

U.S. patent application Ser. No. 17/890,413 (the contents of which are incorporated by reference thereto), also assigned to Vertiv, is directed to a wire comb. The wire comb includes a flat body which includes a first end and a second end. The ends are connected by an arcuate section which has an upper and lower surface. The upper surface of the arcuate section has a wire mount area that includes at least one opening formed in the upper surface with each opening including a shape selected to receive and hold a wire within. A mounting feature extends from at least one of the first end and the second end. The mounting feature is adapted to engage a printed circuit board. That application is further directed to a circuit board assembly. The circuit board assembly includes a printed circuit board (“PCB”) that has an upper and a lower surface, opposing ends, and side edges. The circuit board assembly also includes a wire comb which is mounted on the upper surface of the PCB and also is mounted proximate to an end of the PCB. These wire combs are mounted adjacent one or more ends of a PCB in order to permit the individual wires to be spaced apart yet held in place during a soldering, over-molding or other process while permitting connecting the wires to the appropriate connections on the circuit board. After undergoing the appropriate soldering processes, the PCB and the wire comb are but two components in a finished PCB assembly (“PCBA”).

1 4 FIGS.- Currently, soldering wires directly to a PCBA can require a skilled workforce and can be time consuming. The present system (as shown collectively in), in one embodiment thereof, can provide a radial solder pad pattern for PCB layouts to simplify and control the length of individual conductors in a cable and their attachment (soldering) to a PCBA. The present system can reduce the time and effort by soldering multiple, radially-spaced leads at a single time rather than individually (e.g., one at a time). The multipoint radial soldering tip of the present system can allow the parallel soldering of multiple leads to a PCBA, greatly reducing the time and increasing joint quality. The radial pattern of a given soldering tip/fixture to be employed can vary in diameter, curvature depending on the number and/or position of the solder pads required.

The present multipoint radial soldering tip can provide major cost savings. The cost savings may be generated by reducing the manufacturing time and increasing the quality of the soldering joints. In an embodiment, the soldering process may be robot-controlled for faster speed, better temperature control, and/or more accurate positioning.

1 2 FIGS.- 3 4 FIGS.and 3 FIG. 4 FIG. 3 FIG. 100 100 100 102 104 106 200 100 100 200 100 202 204 206 200 208 210 206 illustrate a multipoint radial soldering tip(also referred to herein as a soldering tip or solder tip), in accordance with an example embodiment of the present disclosure. The soldering tipcan include a soldering head, a shank, and a number (e.g., two or more) of soldering feet.together illustrate a soldering systemutilizing a pair of the soldering tips, in accordance with an example embodiment of the present disclosure. It is to be understood than the soldering tipmay also be called a soldering fixture within the context of the present disclosure. The soldering system, in addition to the pair of soldering tips, includes a wire comband a printed circuit board assembly (“PCBA”)(also known simply as a circuit board) carrying a number (e.g., two or more) of radially-spaced (as described subsequently) solder pads, as shown in. The soldering systemcan include a cable, as shown in, supplying a number (e.g., two or more) of wiresfor bonding to the solder padsof.

102 100 102 210 206 102 108 110 110 108 110 108 108 110 112 108 110 1 2 FIGS.and The soldering headof the soldering tipcan be made of a thermally conductive and corrosion resistant material, such as copper, a copper alloy, an iron-plated copper-based material, or another suitable material. The soldering headcan be configured to transfer soldering/bonding energy from a soldering iron (as described subsequently) to specific soldering/bonding locations (e.g., respective wireand solder padpositions). The soldering headcan define an upper head surfaceand a curved forward extension, the curved forward extensiondescending from the upper head surface. The curved forward extensioncan be lengthwise convexly curved (i.e., curving convexly outward from the upper head surface, as seen from) and may also be referred to as a convex forward extension or as a convex band, within the context of the present disclosure. In an embodiment, the curved forward extension can be perpendicular to the upper head surfacewhile also convexly descending therefrom. The curved forward extensioncan define an extension faceobverse to the upper head surface. In an embodiment, the curved forward extensiondefines an arcuate shape. In an embodiment, the arcuate shape is less than 180° in radial expanse; 135° or less in radial expanse; or 120° or less in radial expanse.

106 112 110 106 206 106 102 102 106 102 106 102 106 106 102 106 106 102 The soldering feetcan be mechanically and thermally coupled to and protrude from the extension faceof the curved forward extension. The soldering feetcan be configured to transfer bonding energy (e.g., heat and/or ultrasound) to the respective solder pads. The soldering feet, as part of the soldering head, can be made of a similarly thermal conductive and corrosion resistant material as the rest of the soldering head. It is to be understood that the soldering feetcan be co-formed and/or co-molded with the rest of the soldering head(e.g., formed integrally therewith). In an embodiment, the soldering feetcan initially be integrally formed with the soldering head, but such soldering feetmay be replaced upon wear (e.g., replacement soldering feetmay be metallurgically and/or mechanically attached, as needed, thereby extending the lifetime of a given soldering head). In an embodiment, the soldering feetmay be separately formed and attached (e.g., metallurgically-welded, brazed, etc.; and/or mechanically), facilitating replacement thereof, given that the soldering feetmay wear out before the rest of the soldering head.

106 110 106 206 210 204 100 106 106 106 100 206 106 100 210 204 206 210 202 The respective soldering feetcan be radially spaced from one another along the arcuate shape defined by the curved forward extension. A number and a corresponding radial location of the respective soldering feetcan correspond to a number and a radial location of a number (e.g., two or more) of solder padsat which a number (e.g., two or more) of corresponding wirescan be attached to a PCBA. In an embodiment, soldering tipcan includes at least three or four soldering feet. In an embodiment, the number of soldering feetis at least 10. By including the soldering feet, the soldering tipcan be configured to solder in parallel at a number (e.g., two or more) of locations of solder padsvia the soldering feet. The soldering tipcan be more particularly configured to solder, in parallel, a number (e.g., two or more) of wiresto a PCBAat a set of radial locations of solder pads, with the positioning of the wiresoriented by the wire comb.

102 114 108 114 104 114 102 110 114 114 116 118 120 114 116 118 122 104 114 122 104 122 106 The soldering headcan further define a head shelf, with the upper head surfaceparticularly defined by the head shelf. The shankcan be coupled (e.g., permanently or removably affixed) to the head shelfof the soldering head, with the curved forward extensiondescending from the head shelf. The head shelfcan define a first flaring shelf edge, a second flaring shelf edge, and a curved outer shelf edge(also known as a curved shelf edge and/or a convex outer shelf edge), the head shelfeffectively having a “pie slice” shape. The first flaring shelf edgeand the second flaring shelf edgecan converge to form a shelf taper. The shankcan be operatively coupled to the head shelfproximate to the shelf taper. Mounting of the shankproximate to the shelf tapercan facilitate the placement of similar pressure/force on each of the soldering feet.

116 118 120 122 120 110 114 108 110 110 124 126 124 114 120 126 112 114 110 106 112 126 120 110 106 110 Further, the first flaring shelf edgeand the second flaring shelf edgecan connect with the curved shelf edge(e.g., the convex outer shelf edge) opposite the shelf taper. In an embodiment, below and/or from that curved shelf edge(e.g., proximate thereto), the curved forward extension(e.g., the convex band) can descend from the head shelfand, thus, below the upper head surface. The curved forward extensionor convex bandcan define an upper band portion(e.g., upper extension portion) and an opposing lower band portion(e.g., lower extension portion). The upper band portionthermally and mechanically can be coupled to the head shelf(also known as a shelf member) proximate to the convex outer shelf edge. Further, the lower band portioncan particularly define a band face(e.g., extension face) obverse to the shelf member, the convex banddefining a band curvature. In an embodiment, the soldering feetcan be mechanically and thermally coupled to and protrude from the band faceof the lower band portionalong a length of the band curvature. In an embodiment, the convex outer shelf edgeand the convex bandboth define an arcuate shape, the respective soldering feetradially spaced from one another along the arcuate shape defined by the convex band. It is to be understood that where generally equivalent terms have been established for various components, such equivalent terms can be interchangeably used throughout the specification and be within the scope of the present disclosure, as evidenced by using like part numbering for such equivalencies.

100 104 104 114 122 104 104 104 104 102 5 5 FIGS.A andB The soldering tipcan further include the shank. The shankcan be thermally and mechanically coupled to the shelf member(e.g., head shelf) proximate to the shelf taper. The shankcan be configured to mechanically and thermally couple with a soldering iron (described and schematically later with reference to). The shankcan, for example, be screw-threaded, clamped, etc., with the soldering iron in a manner that facilitates sufficient bonding energy transfer (e.g., heat and/or ultrasound) therebetween, as well as a providing an adequate and stable mechanical connection therewith. The shankcan be made of a thermally conductive and mechanically durable material. The shank material may further be corrosion resistant, as well. In an embodiment, the shankmay be separate from or integral with the soldering head(e.g., removably attached thereto; or permanently affixed or co-formed therewith).

5 5 FIGS.A andB 1 3 FIGS.- 300 300 100 300 100 302 100 302 302 302 100 100 302 100 100 illustrates a soldering unitor soldering apparatus, in accordance with an example embodiment of the present disclosure, incorporating the multipoint radial soldering tipof. The soldering unitcan generally include the soldering tipand a heated carrier unitoperatively coupled to the soldering tip. In an embodiment, the heated carrier unitcan be in the form of a soldering iron, as known in the art. The heated carrier unit, when, for example, in the form of a soldering iron, can include an extended carrier member and a heating element extending therethrough (not shown). The heated carrier unitcan be configured to convey bonding energy (e.g., heat and/or ultrasound) to the soldering tipand to carry and facilitate the locating of the soldering tip. In an embodiment, the heated carrier unitis mechanically couplable with the soldering tip, thereby allowing it to be able to carry and locate the soldering tip.

300 304 302 304 100 302 100 304 100 100 The soldering unitcan further include a unit controlleroperatively coupled with the heated carrier unit. At a minimum, the unit controlleris configured to control the supply of bonding energy, for example, in the form of heat and/or ultrasound, to the soldering tip, via the heated carrier unit, and to facilitate movement and/or placement of the soldering tip(e.g., manually and/or robotically). The unit controllermay further be a robotic control unit, thereby able to control the movement and/or placement of soldering tip, in addition to being configured to control the delivery of bonding energy to the soldering tip.

302 304 302 304 It is to be understood that the heated carrier unitand unit controllercan be equipped with all the necessary componentry and functionality to be configured to operate in the manner described. For example, the heated carrier unitcan be equipped with the energy source(s) (e.g., heating elements and/or ultrasonic units), sensors (e.g., temperature and/or vibration), mechanical support, thermal/electrical conductors and insulators, as appropriate, and communication components needed to achieve the expected functionality, as known to one of ordinary skill in the art. Likewise, the unit controllercan include, for example, any processors, memory, displays, input devices, communication links, robotically-controlled actuation, etc., as needed to achieve the desired functionality, as known to one of ordinary skill in the art.

Those having skill in the art will recognize that the state of the art has progressed to the point where there is little distinction left between hardware and software implementations of aspects of systems; the use of hardware or software is generally (but not always, in that in certain contexts the choice between hardware and software can become significant) a design choice representing cost vs. efficiency tradeoffs. Those having skill in the art will appreciate that there are various vehicles by which processes and/or systems and/or other technologies described herein can be implemented (e.g., hardware, software, and/or firmware), and that the preferred vehicle will vary with the context in which the processes and/or systems and/or other technologies are deployed. For example, if an implementer determines that speed and accuracy are paramount, the implementer may opt for a mainly hardware and/or firmware vehicle; alternatively, if flexibility is paramount, the implementer may opt for a mainly software implementation; or, yet again alternatively, the implementer may opt for some combination of hardware, software, and/or firmware. Hence, there are several possible vehicles by which the processes and/or devices and/or other technologies described herein may be implemented, none of which is inherently superior to the other in that any vehicle to be utilized is a choice dependent upon the context in which the vehicle will be deployed and the specific concerns (e.g., speed, flexibility, or predictability) of the implementer, any of which may vary. Those skilled in the art will recognize that optical aspects of implementations will typically employ optically-oriented hardware, software, and or firmware.

The foregoing detailed description has set forth various embodiments of the devices and/or processes via the use of block diagrams, flowcharts, and/or examples. Insofar as such block diagrams, flowcharts, and/or examples contain one or more functions and/or operations, it will be understood by those within the art that each function and/or operation within such block diagrams, flowcharts, or examples can be implemented, individually and/or collectively, by a wide range of hardware, software, firmware, or virtually any combination thereof. In one embodiment, several portions of the subject matter described herein may be implemented via Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs), digital signal processors (DSPs), or other integrated formats. However, those skilled in the art will recognize that some aspects of the embodiments disclosed herein, in whole or in part, can be equivalently implemented in integrated circuits, as one or more computer programs running on one or more computers (e.g., as one or more programs running on one or more computer systems), as one or more programs running on one or more processors (e.g., as one or more programs running on one or more microprocessors), as firmware, or as virtually any combination thereof, and that designing the circuitry and/or writing the code for the software and/or firmware would be well within the skill of one of skill in the art in light of this disclosure. In addition, those skilled in the art will appreciate that the mechanisms of the subject matter described herein are capable of being distributed as a program product in a variety of forms, and that an illustrative embodiment of the subject matter described herein applies regardless of the particular type of signal bearing medium used to actually carry out the distribution. Examples of a signal bearing medium include, but are not limited to, the following: a recordable type medium such as a floppy disk, a hard disk drive, a Compact Disc (CD), a Digital Video Disk (DVD), a digital tape, a computer memory, etc.; and a transmission type medium such as a digital and/or an analog communication medium (e.g., a fiber optic cable, a waveguide, a wired communications link, a wireless communication link, etc.).

In a general sense, those skilled in the art will recognize that the various aspects described herein which can be implemented, individually and/or collectively, by a wide range of hardware, software, firmware, or any combination thereof can be viewed as being composed of various types of “electrical circuitry.” Consequently, as used herein “electrical circuitry” includes, but is not limited to, electrical circuitry having at least one discrete electrical circuit, electrical circuitry having at least one integrated circuit, electrical circuitry having at least one application specific integrated circuit, electrical circuitry forming a general purpose computing device configured by a computer program (e.g., a general purpose computer configured by a computer program which at least partially carries out processes and/or devices described herein, or a microprocessor configured by a computer program which at least partially carries out processes and/or devices described herein), electrical circuitry forming a memory device (e.g., forms of random access memory), and/or electrical circuitry forming a communications device (e.g., a modem, communications switch, or optical-electrical equipment). Those having skill in the art will recognize that the subject matter described herein may be implemented in an analog or digital fashion or some combination thereof.

Those having skill in the art will recognize that it is common within the art to describe devices and/or processes in the fashion set forth herein, and thereafter use engineering practices to integrate such described devices and/or processes into data processing systems. That is, at least a portion of the devices and/or processes described herein can be integrated into a data processing system via a reasonable amount of experimentation. Those having skill in the art will recognize that a typical data processing system generally includes one or more of a system unit housing, a video display device, a memory such as volatile and non-volatile memory, processors such as microprocessors and digital signal processors, computational entities such as operating systems, drivers, graphical user interfaces, and applications programs, one or more interaction devices, such as a touch pad or screen, and/or control systems including feedback loops and control motors (e.g., feedback for sensing position and/or velocity; control motors for moving and/or adjusting components and/or quantities). A typical data processing system may be implemented utilizing any suitable commercially available components, such as those typically found in data computing/communication and/or network computing/communication systems.

The herein described subject matter sometimes illustrates different components contained within, or connected with, different other components. It is to be understood that such depicted architectures are merely exemplary, and that in fact many other architectures can be implemented which achieve the same functionality. In a conceptual sense, any arrangement of components to achieve the same functionality is effectively “associated” such that the desired functionality is achieved. Hence, any two components herein combined to achieve a particular functionality can be seen as “associated with” each other such that the desired functionality is achieved, irrespective of architectures or intermedial components. Likewise, any two components so associated can also be viewed as being “operably connected”, or “operably coupled”, to each other to achieve the desired functionality, and any two components capable of being so associated can also be viewed as being “operably couplable”, to each other to achieve the desired functionality. Specific examples of operably couplable include but are not limited to physically mateable and/or physically interacting components and/or wirelessly interactable and/or wirelessly interacting components and/or logically interacting and/or logically interactable components.

It is believed that the present disclosure and many of its attendant advantages will be understood by the foregoing description, and it will be apparent that various changes may be made in the form, construction and arrangement of the components without departing from the disclosed subject matter or without sacrificing all of its material advantages. The form described is merely explanatory, and it is the intention of the following claims to encompass and include such changes.

Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.