Electronic Component Module

This application claims benefit of priority to International Patent Application No. PCT/JP2024/017397, filed May 10, 2024, and to Japanese Patent Application No. 2023-096991, filed Sep. 13, 2023, the entire contents of each are incorporated herein by reference.

The present disclosure relates to an electronic component module.

An electronic component module includes a substrate including a surface provided with wiring, and a plurality of electronic components mounted on the surface of the substrate. An electronic component module according to Japanese Unexamined Patent Application Publication No. 11-135566 includes a substrate including a surface provided with a hole. The hole accommodates an electronic component (semiconductor bare chip). That is, the electronic component does not project from the surface of the substrate. This enables a thickness reduction (size reduction) of the electronic component module.

However, the technique according to Japanese Unexamined Patent Application Publication No. 11-135566 restricts the electronic component in size so as to be accommodated in the hole. Such circumstances raise a need for development of an electronic component module that can be reduced in size even if an electronic component is larger than a hole.

The present disclosure has been achieved in view of the above, and provides an electronic component module that can be reduced in size.

An electronic component module according to the present disclosure includes an electronic component, and a multilayer wiring board disposed in a first direction of the electronic component and including a surface positioned in a second direction opposing the first direction as a disposition surface provided with the electronic component. The multilayer wiring board includes a plurality of wiring layers and a plurality of insulating layers stacked alternately in the first direction. The disposition surface is provided with a hole. The plurality of wiring layers includes a front surface wiring layer constituting the disposition surface and a bottom surface wiring layer constituting a bottom surface of the hole. The electronic component includes an electric circuit, an outer contour portion containing the electric circuit and forming an outer contour of the electronic component, and an electrode provided on an outer surface of the outer contour portion and connecting the electric circuit and the wiring layers. The outer contour portion includes an outer contour portion body disposed on the front surface wiring layer, a first facing surface constituting a surface in the first direction of the outer contour portion body and facing the front surface wiring layer, a projection projecting in the first direction from the outer contour portion body and disposed in the hole, and a second facing surface constituting an end surface in the first direction of the projection and facing the bottom surface wiring layer. The electrode includes a first electrode provided on the first facing surface and connected to the front surface wiring layer, and a second electrode provided on the second facing surface and connected to the bottom surface wiring layer.

The electronic component module is reduced in size in the present disclosure.

Detailed description is made hereinafter to power amplifiers according to embodiments of the present disclosure with reference to the drawings. These embodiments do not limit the present disclosure. The embodiments are provided exemplarily, and any partial replacement or any combination is obviously applicable between configurations exemplified in different embodiments. After description of a first embodiment, only different features will be described without repeatedly describing features in common with a second embodiment. In particular, identical or similar functional effects achieved by an identical or similar configuration will not be referred to in each embodiment.

1 FIG. 100 1 40 40 41 42 41 42 2 1 is a plan view of an electronic component module according to the first embodiment. An electronic component moduleaccording to the first embodiment includes a multilayer wiring boardand two electronic components. The two electronic componentsinclude an integrated circuitand a filter device. The integrated circuitand the filter deviceare disposed on an identical planar surface (front surface) of the multilayer wiring board.

2 41 42 1 42 41 2 1 Hereinafter, a direction parallel to the front surfacewill be referred to as a planar direction. The planar direction includes an array direction in which the integrated circuitand the filter deviceare aligned. The array direction includes a first array direction Yin which the filter deviceis disposed when viewed from the integrated circuit, and a second array direction Yopposing the first array direction Y. The planar direction also includes a width direction Z crossing the array direction.

2 FIG. 1 FIG. 3 FIG. 1 FIG. 2 3 FIGS.and 2 3 FIGS.and 1 10 20 10 20 1 is a schematic view of a section taken along line II-II in.is a schematic view of a section taken along line III-III in. As shown in, the multilayer wiring boardincludes a plurality of wiring layersand a plurality of insulating layersstacked alternately.show sections of the wiring layersand the insulating layersprovided continuously in the planar direction for easier comprehension of a structure of the multilayer wiring board, although the sections are actually provided intermittently in the planar direction.

10 20 1 1 42 2 Hereinafter, assume that the wiring layersand the insulating layersare stacked in a stacking direction. The stacking direction includes a first direction Xin which the multilayer wiring boardis disposed when viewed from the filter device, and a second direction Xopposing the first direction.

1 2 2 3 1 2 40 3 The multilayer wiring boardincludes the front surfacefacing in the second direction Xand a rear surfacefacing in the first direction X. The front surfaceis provided with the electronic components. The rear surfaceis provided with no electronic component.

10 20 10 11 12 13 14 20 21 22 23 24 The wiring layersand the insulating layerseach include four layers. That is, the plurality of wiring layersincludes a first wiring layer, a second wiring layer, a third wiring layer, and a fourth wiring layer. The plurality of insulating layersincludes a first insulating layer, a second insulating layer, a third insulating layer, and a fourth insulating layer.

11 21 12 22 13 23 14 24 1 11 40 2 24 3 The first wiring layer, the first insulating layer, the second wiring layer, the second insulating layer, the third wiring layer, the third insulating layer, the fourth wiring layer, and the fourth insulating layerare stacked in the mentioned order in a first direction Z. Accordingly, the first wiring layerserves as a disposition layer provided with the electronic componentsand constitutes the front surface. The fourth insulating layerconstitutes the rear surface.

2 1 30 30 1 2 1 30 1 11 21 12 22 30 13 31 30 3 FIG. The front surfaceof the multilayer wiring boardis provided with a hole. As shown in, the holehas a depth Lsmaller than a thickness Lin the stacking direction of the multilayer wiring board. That is, the holedoes not penetrate the multilayer wiring board. Each of the first wiring layer (front surface wiring layer), the first insulating layer, the second wiring layer, and the second insulating layeris partially penetrated by the hole. The third wiring layer (bottom surface wiring layer)constitutes a bottom surfaceof the hole.

4 FIG. 4 FIG. 2 30 is a plan view from the second direction of the multilayer wiring board according to the first embodiment. As shown in, when viewed from the second direction X, the holehas an oblong shape and is longer in the width direction Z than in the array direction.

11 11 11 11 11 30 13 13 13 13 13 31 a b c d a b c d The first wiring layerincludes an end portionof a first wiring line, an end portionof a second wiring line, and end portionsandof two ground wiring lines, and the end portions are disposed around an edge of the hole. The third wiring layerincludes an end portionof a third wiring line, an end portionof a fourth wiring line, and end portionsandof two ground wiring lines, and the end portions are disposed on the bottom surface.

42 42 43 50 43 60 50 42 3 1 30 3 1 42 30 43 2 FIG. 3 FIG. 3 FIG. 3 FIG. The filter deviceis configured to restrict a band of a received electrical signal. As shown in, the filter deviceincludes an electric circuit, an outer contour portioncontaining the electric circuit, and an electrodeprovided on an outer surface of the outer contour portion. As shown in, the filter devicehas a height (size in the stacking direction) Llarger than the depth L(see) of the hole(L>L). That is, the filter deviceis larger than the hole. Note thatdoes not show the electric circuit.

2 FIG. 43 44 45 42 42 44 45 44 45 As shown in, the electric circuitincludes a first LC filter (first electric circuit), and a second LC filter (second electric circuit). The filter deviceaccording to the present embodiment thus has two functions. In other words, the filter deviceis obtained by combining (integrating) two filter devices. The first LC filterand the second LC filterare different in pass band from each other in the present embodiment. The first LC filterand the second LC filtermay alternatively be identical in pass band in the present disclosure.

50 51 52 1 51 50 51 52 51 52 50 The outer contour portionincludes an outer contour portion body, and a projectionprojecting in the first direction Xfrom the outer contour portion body. The outer contour portionis made of a resin material. The outer contour portion bodyand the projectionare thus integrated so as not to be isolated from each other. The outer contour portion bodyand the projectionare each formed into a cubic shape. The outer contour portionaccording to the present disclosure may be applied to a ceramic package.

51 2 11 51 53 1 53 2 11 52 30 52 1 54 31 13 30 The outer contour portion bodyis disposed on the front surface(first wiring layer). The outer contour portion bodyincludes a first facing surfacefacing in the first direction X. The first facing surfacefaces the front surface(first wiring layer). The projectionis accommodated in the hole. The projectionincludes an end surface in the first direction Xserving as a second facing surfacefacing the bottom surface(third wiring layer) of the hole.

2 FIG. 44 51 45 52 44 51 52 50 In, the first LC filteris disposed in the outer contour portion bodyand the second LC filteris disposed in the projection. However, the present disclosure is not limited to the disposition. The first LC filtermay be exemplarily disposed in both the outer contour portion bodyand the projection, without any limitation on positioning of the electric circuit disposed in the outer contour portion.

5 FIG. 5 FIG. 52 53 53 54 60 61 53 62 54 is a plan view from the first direction of the filter device (electronic component) according to the first embodiment. As shown in, the projectionis disposed in the center of the first facing surface. The first facing surfacethus has a rectangular frame shape (annular shape). The second facing surfacehas an oblong shape. The electrodeincludes a first electrodeprovided on the first facing surfaceand a second electrodeprovided on the second facing surface.

61 44 11 61 11 70 61 61 11 61 11 61 61 11 11 2 3 FIGS.and 3 FIG. 3 FIG. 2 FIG. a a b b c d c d. The first electrodeis provided to connect the first LC filterand the first wiring layer (front surface wiring layer). The first electrodeis joined to the first wiring layerby solder(see). The first electrodeincludes an input electrode(see) joined to the end portion, an output electrode(see) joined to the end portion, and two ground electrodesand(see) joined to the end portionsand

62 45 13 62 13 70 62 62 31 62 31 62 62 31 31 2 3 FIGS.and 3 FIG. 3 FIG. 2 FIG. a a b b c d c d. The second electrodeis provided to connect the second LC filterand the third wiring layer (bottom surface wiring layer). The second electrodeis joined to the third wiring layerby solder(see). The second electrodeincludes an input electrode(see) joined to an end portion, an output electrode(see) joined to an end portion, and two ground electrodesand(see) joined to end portionsand

40 42 30 40 42 2 2 4 100 40 42 30 3 FIG. As described above, the electronic component(filter device) is partially accommodated in the holein the first embodiment. The electronic component(filter device) projecting in the second direction Xfrom the front surfaceaccordingly has a small projecting amount L(see). That is, the electronic component moduleis reduced in size even when the electronic component(filter device) is larger than the hole.

42 44 45 44 45 2 2 42 2 100 The filter devicehas the two functions (the first LC filterand the second LC filter). Provision of two components (an electronic component including the first LC filterand an electronic component including the second LC filter) will lead to an increase in the number of components. Furthermore, the two components will be disposed on the front surfaceto occupy a large area on the front surface. The present embodiment thus avoids such an increase in the number of components. Furthermore, the filter deviceoccupies a small area on the front surface. The electronic component modulecan thus be reduced in size in the planar direction.

40 3 The first embodiment has been described above. The following second embodiment will describe an exemplary case where the electronic componentsare provided on the rear surface.

6 FIG. 100 1 1 11 30 13 31 42 1 51 11 52 30 1 61 11 62 13 is a sectional view of an electronic component module according to the second embodiment, taken along an imaginary plane extending in a stacking direction and an array direction. The second embodiment provides an electronic component moduleA in common with embodimentin that a multilayer wiring boardA includes a first wiring layer (front surface wiring layer)provided with a holeA and that a third wiring layerconstitutes a bottom surfaceA. A filter deviceis in common with embodimentin that an outer contour portion bodyis disposed on the first wiring layerand that a projectionis disposed in the holeA. The second embodiment is in common with embodimentin that a first electrodeis connected to the first wiring layer (front surface wiring layer)and that a second electrodeis connected to the third wiring layer (bottom surface wiring layer).

1 1 1 24 14 1 10 3 1 41 14 The multilayer wiring boardA according to the second embodiment is, however, different from the multilayer wiring boardaccording to the first embodiment in that the multilayer wiring boardA includes no fourth insulating layer. Accordingly, a fourth wiring layeris disposed closest to an end in the first direction Xamong a plurality of wiring layers, to serve as a rear surface wiring layer constituting a rear surfaceof the multilayer wiring boardA. The second embodiment is different from the first embodiment in that an integrated circuitis disposed on the fourth wiring layer(rear surface wiring layer).

100 42 2 2 100 Also in the electronic component moduleA according to the second embodiment, the filter deviceprojecting in a second direction Xfrom a front surfaceaccordingly has a small projecting amount. Similarly to the first embodiment, the second embodiment thus achieves a reduction in size of the electronic component moduleA.

40 40 The embodiment has been described above. The present disclosure is, however, not limited to the exemplification according to the embodiment. For example, the present embodiment provides the two electronic components. However, the present disclosure has only to provide at least one electronic component.

61 44 53 61 53 54 62 53 54 Furthermore, the first electrodeconnected to the first LC filter (first electric circuit)is entirely provided on the first facing surfacein the present embodiment. However, the first electrodemay alternatively be disposed partially on the first facing surfaceand partially on the second facing surfacein the present disclosure. In a similar manner, the second electrodemay alternatively be disposed partially on the first facing surfaceand partially on the second facing surface.

42 40 40 53 54 The filter devicehaving the two functions (two electric circuits) exemplifies the electronic componentaccording to the present embodiment. However, the present disclosure may alternatively provide an electronic component having a single function or an electronic component having three or more functions. When the electronic componenthas a single function (electric circuit), a plurality of electrodes connected to the single electric circuit is disposed partially on the first facing surfaceand partially on the second facing surface.

7 FIG. 7 FIG. 51 52 1 2 50 51 52 51 1 2 is a view from a direction opposing the second facing surface of an electronic component according to a variation. The outer contour portion bodyaccording to the embodiment is larger than the projectionin sizes in the array direction (the first array direction Yand the second array direction Y) and in the width direction Z. However, the present disclosure is not limited to this configuration. As shown in, there may be exemplarily provided an outer contour portionB including an outer contour portion bodyB and a projectionB that is larger than the outer contour portion bodyB in size in the array direction (the first array direction Yand the second array direction Y). That is, the present disclosure does not particularly restrict the sizes of the outer contour portion body and the projection.

51 52 The outer contour portion bodyand the projectionaccording to the embodiment each have the oblong shape when viewed in the stacking direction. However, the outer contour portion body and the projection according to the present disclosure may each have a polygonal shape such as a triangular shape, or a circular shape, when viewed in the stacking direction.

(1) An electronic component module including an electronic component; and a multilayer wiring board disposed in a first direction of the electronic component and including a surface positioned in a second direction opposing the first direction as a disposition surface provided with the electronic component. The multilayer wiring board includes a plurality of wiring layers and a plurality of insulating layers stacked alternately in the first direction. The disposition surface is provided with a hole. The plurality of wiring layers includes a front surface wiring layer constituting the disposition surface, and a bottom surface wiring layer constituting a bottom surface of the hole. The electronic component includes an electric circuit, an outer contour portion containing the electric circuit and forming an outer contour of the electronic component, and an electrode provided on an outer surface of the outer contour portion and connecting the electric circuit and the wiring layers. The outer contour portion includes an outer contour portion body disposed on the front surface wiring layer, a first facing surface constituting a surface in the first direction of the outer contour portion body and facing the front surface wiring layer, a projection projecting in the first direction from the outer contour portion body and disposed in the hole, and a second facing surface constituting an end surface in the first direction of the projection and facing the bottom surface wiring layer. The electrode includes a first electrode provided on the first facing surface and connected to the front surface wiring layer, and a second electrode provided on the second facing surface and connected to the bottom surface wiring layer. (2) The electronic component module according to (1), in which the electric circuit includes a first electric circuit, and a second electric circuit not connected to the first electric circuit. The first electrode connects the first electric circuit and the front surface wiring layer, and the second electrode connects the second electric circuit and the bottom surface wiring layer. (3) The electronic component module according to (2), in which the first electric circuit is a first LC filter, the second electric circuit is a second LC filter, and the first LC filter and the second LC filter are different from each other in pass band. (4) The electronic component module according to (2), in which the first electric circuit is a first LC filter, the second electric circuit is a second LC filter, and the first LC filter and the second LC filter are identical in pass band. (5) The electronic component module according to any one of (1) to (4), in which the outer contour portion is made of a resin material, and the outer contour body portion and the projection are integrated with each other. (6) The electronic component module according to any one of (1) to (5), the electronic component module further including an integrated circuit disposed on the front surface wiring layer. (7) The electronic component module according to any one of (1) to (5), in which the plurality of wiring layers includes a rear surface wiring layer disposed closest to an end in the first direction among the plurality of wiring layers, to constitute a rear surface of the multilayer wiring board, and the rear surface wiring layer is provided with an integrated circuit. The present disclosure may be achieved by combining the following configurations.