Coil Electronic Component

This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0140870 filed in the Korean Intellectual Property Office on Oct. 16, 2024, the entire contents of which are incorporated herein by reference.

The present disclosure relates to a coil electronic component.

As power consumption increases as a function of a mobile device has diversified in recent years, a coil electronic component having small loss and excellent efficiency is adopted around power management integrated circuit (PMIC) to increase a battery life in mobile devices.

There is a growing demand for a thin power inductor in order to slim products and increase the degree of freedom in component arrangement. Among them, the thin-film inductor can be manufactured by forming a coil on a support member with sputtering or plating. The support member can be deformed by heat or pressure during a process of manufacturing the thin-film inductor. When the support member is deformed, the alignment of the coil may be distracted, exposing the coil to the outside or causing a short, which may reduce the reliability of the thin-film inductor.

One aspect of an embodiment attempts to provide a coil electronic component having enhanced reliability.

However, the problems to be solved by the embodiments are not limited to the above-mentioned problems, but can be variously extended within the scope of the technical spirit included in the embodiments.

An embodiment of the present disclosure provides a coil electronic component, which includes: a support member made of glass material and including a first surface and a second surface; a coil pattern disposed on the support member; and a body including a magnetic material and surrounding the support member and the coil pattern, in which the coil pattern may include a first coil pattern disposed on the first surface of the support member, and a second coil pattern disposed on the second surface of the support member, and connected to the first coil pattern.

A partition wall may be disposed between adjacent coils of the coil pattern.

The partition wall may be made of glass material.

The support member and the partition wall may include glass of the same material.

The support member and the partition wall may include photosensitive glass.

The coil electronic component may further include an insulating film disposed between the coil pattern and the body.

The support member may include a through-hole, and the through-hole may be filled with a magnetic material.

The support member may include a via, and the first coil pattern and the second coil pattern may be connected to each other the via.

The first coil pattern may include a first lead out portion exposed from one surface of the body, and the second coil pattern may include a second lead out portion exposed from the other surface of the body.

The coil electronic component may further include: a first external electrode disposed outside the body, and connected to the first lead out portion; and a second external electrode disposed outside the body, and connected to the second lead out portion.

The coil electronic component may further include a surface insulating layer disposed on an outer surface of the body.

According to an embodiment, a coil electronic component with enhanced reliability can be provided.

Hereinafter, embodiments of the present disclosure will be described in detail so as to be easily implemented by those skilled in the art, with reference to the accompanying drawings. The drawings and description are to be regarded as illustrative in nature and not restrictive. Like reference numerals designate like elements throughout the specification. Further, some components in the drawing may be exaggerated, omitted, or schematically illustrated, and a size of each component does not reflect the actual size entirely.

It is to be understood that the accompanying drawings are just used for easily understanding the embodiments disclosed in this specification and a technical spirit disclosed in this specification is not limited by the accompanying drawings and all changes, equivalents, or substitutes included in the spirit and the technical scope of the present disclosure are included.

Terms including an ordinary number, such as first and second, are used for describing various components, but the components are not limited by the terms. The terms are used only to discriminate one component from another component.

Further, it will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present. In addition, to be referred to as “on” or “on” a reference portion is located above or below the reference portion, and does not particularly mean to “above” or “on” the direction opposite to gravity.

Throughout the specification, it should be understood that the term “include” or “have” indicates that a feature, a number, a step, an operation, a component, a part or the combination thereof described in the specification is present, but does not exclude a possibility of presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof, in advance. Accordingly, unless explicitly described to the contrary, the word “comprise”, and variations such as “comprises” or “comprising”, will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.

Further, throughout the specification, “plan view” means that a target part is viewed from the top, and “cross-sectional view” means that a cross section vertically cutting the target part is viewed from the side.

In addition, throughout the specification, the term “connected” does not mean that two or more components are directly connected, but may mean being indirectly connected to the two or more components through other components, and electrically connected, or may be referred to as different names according to a location or function, but may be integrated.

1 FIG. 2 FIG. 1 FIG. 3 FIG. 1 FIG. is a perspective view schematically illustrating a coil electronic component according to an embodiment,is a schematic cross-sectional view taken along line I-I′ of, andis a schematic cross-sectional view taken along line II-II′ of.

1 2 3 FIGS.,, and 1000 100 200 300 700 800 900 Referring to, the coil electronic componentincludes a body, a coil, a support member, a first external electrode, a second external electrode, and a surface insulation layer.

100 100 100 The bodymay have a substantially rectangular parallelepiped shape, but the embodiment is not limited thereto. Due to shrinkage of magnetic power, etc., during sintering, the bodymay not have a perfect rectangular parallelepiped shape, but may have a substantially rectangular parallelepiped shape. For example, the bodyhas a substantially rectangular parallelepiped shape, but portions corresponding to a corner or a vertex may have a round shape.

1 2 100 3 4 100 5 6 In the present embodiment, for convenience of description, two surfaces of the body opposing each other in a length direction (L-axis direction) will be defined as a first surface Sand a second surface S, two surfaces of the bodyopposing each other in the width direction (W-axis direction) will be defined as a third surface Sand a fourth surface S, and two surfaces of the bodyopposing each other in the thickness direction (T-axis direction) will be defined as a fifth surface Sand a sixth surface S.

1000 1000 1000 1000 1000 1000 1000 A length of the coil electronic componentmay mean, based on an optical microscope or a scanning electron microscope (SEM) photograph of a cross-section taken along the length direction (L-axis direction)-thickness direction (T-axis direction) at a center of the coil electronic componentin the width direction (W-axis direction), a maximum value among lengths of a plurality of line segments which connect two outermost boundary lines opposing each other in the length direction (L-axis direction) of the coil electronic componentshown the above-described cross-sectional photo, respectively, and are parallel to the length direction (L-axis direction). Alternatively, the length of the coil electronic componentmay mean a minimum value among lengths of a plurality of line segments which connect two outermost boundary lines opposing each other in the length direction (L-axis direction) of the coil electronic componentshown in the cross-sectional photograph, respectively, and are parallel to the length direction (L-axis direction). Alternatively, the length of the coil electronic componentmay mean an arithmetic mean value of lengths of at least two line segments among the plurality of line segments, which connect two outermost boundary lines opposing each other in the length direction (L-axis direction) of the coil electronic componentshown in the above-described cross-sectional photo, and are parallel to the length direction (L-axis direction), respectively.

1000 1000 1000 1000 1000 1000 1000 A thickness of the coil electronic componentmay mean, based on an optical microscope or scanning electron microscope (SEM) photograph of a cross-section taken along the length direction (L-axis direction)-thickness direction (T-axis direction) at a center of the coil electronic componentin the width direction (W-axis direction), a maximum value of lengths of a plurality of line segments which connect two outermost boundary lines opposing each other in the thickness direction (T-axis direction) of the coil electronic componentshown the above-described cross-sectional photo, respectively, and are parallel to the thickness direction (T-axis direction). Alternatively, the thickness of the coil electronic componentmay mean a minimum value among lengths of a plurality of line segments which connect two outermost boundary lines opposing each other in the thickness direction (T-axis direction) of the coil electronic componentshown in the cross-sectional photograph, respectively, and are parallel to the thickness direction (T-axis direction). Alternatively, the thickness of the coil electronic componentmay mean an arithmetic mean value of lengths of at least two line segments among a plurality of line segments, which connect two outermost boundary lines opposing each other in the thickness direction (T-axis direction) of the coil electronic componentshown in the above-described cross-sectional photograph, and are parallel to the thickness direction (T-axis direction), respectively.

1000 1000 1000 1000 1000 1000 1000 A width of the coil electronic componentmay mean, based on an optical microscope or a scanning electron microscope (SEM) photograph of a cross-section taken along the length direction (L-axis direction)-width direction (W-axis direction) at a center of the coil electronic componentin the thickness direction (T-axis direction), a maximum value of lengths of a plurality of line segments which connect two outermost boundary lines opposing each other in the width direction (W-axis direction) of the coil electronic componentshown the above-described cross-sectional photograph, respectively, and are parallel to the width direction (W-axis direction). Alternatively, the width of the coil electronic componentmay mean a minimum value among lengths of a plurality of line segments which connect two outermost boundary lines opposing each other in the width direction (W-axis direction) of the coil electronic componentshown in the cross-sectional photograph, respectively, and are parallel to the width direction (W-axis direction). Alternatively, the width of the coil electronic componentmay mean an arithmetic mean value of lengths of at least two line segments among a plurality of line segments, which connect two outermost boundary lines opposing each other in the thickness direction (T-axis direction) of the coil electronic componentshown in the above-described cross-sectional photograph, and are parallel to the thickness direction (T-axis direction), respectively.

1000 1000 1000 1000 1000 Each of the length, the width, and the thickness of the coil electronic componentmay also be measured using a micrometer measurement method. In the micrometer measurement method, a zero point is set with a micrometer providing repeatability and reproducibility (Gage R&R), the coil electronic componentaccording to the present embodiment is inserted between tips of the micrometer, and a measuring lever of the micrometer is turned for the measurement. When measuring the length of the coil electronic componentby the micrometer measurement method, the length of the coil electronic componentmay mean a value measured once or mean an arithmetic average of values measured a plurality of times. This may be equally applied to measuring the width and the thickness of the coil electronic component.

100 1000 200 200 700 800 The bodyconstitutes an exterior of the coil electronic component, and is a space where a magnetic path, which is a path through which the magnetic flux generated by the coilpasses, is formed, when a current is applied to the coilthrough the first external electrodeand the second external electrode.

100 200 300 100 The bodysurrounds and encapsulates the coiland the support member, and includes a magnetic material. The bodymay include magnetic particles, and an insulating material may be interposed between the magnetic particles.

50 50 50 The magnetic material may include a first metal magnetic particle, a second metal magnetic particle having a smaller particle size than the first metal magnetic particle, and a third metal magnetic particle having a smaller particle size than the second metal magnetic particle. An average particle diameter Dof the first metal magnetic particle may be in a range from about 5 μm to about 30 μm, an average particle diameter Dof the second metal magnetic particle may be in a range from about 1 μm to about 5 μm, and an average particle diameter Dof the third metal magnetic particle may be in a range from about 0.05 μm to about 0.5 μm.

The magnetic particle may be ferrite particles or metal magnetic particles exhibiting magnetic properties.

The ferrite particles may include, for example, at least one of spinel-type ferrites such as Mg—Zn-based, Mn—Zn-based, Mn—Mg-based, Cu—Zn-based, Mg—Mn—Sr-based, Ni—Zn-based ferrites, hexagonal ferrites such as Ba—Zn-based, Ba—Mg-based, Ba—Ni-based, Ba—Co-based, Ba—Ni—Co-based ferrites, garnet-type ferrites such as Y-based ferrites and Li-based ferrites.

The metal magnetic particles may be composed of two or more types of powders having different compositions, and may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, metal magnetic particles may be at least one of pure iron, Fe—Si-based alloy, Fe—Si—Al-based alloy, Fe—Ni-based alloy, Fe—Ni-Mo-based alloy, Fe—Ni—Mo—Cu-based alloy, Fe—Co-based alloy, Fe—Ni—Co-based alloy, Fe—Cr-based alloy, Fe—Cr—Si-based alloy, Fe—Si—Cu—Nb-based alloy, Fe—Ni—Cr-based alloy, Fe—Cr—Al-based alloy. Here, different compositions of the metal magnetic particles may mean different contents.

90 50 50 The metal magnetic particle may be amorphous or crystalline. For example, the metal magnetic particle may be an Fe—Si—B—Cr-based amorphous alloy, but the embodiment is not limited thereto. The metal magnetic particle may have an average diameter in a range from about 0.1 μm to about 30 μm, but the embodiment is not limited thereto. In the present specification, the average diameter may mean a particle size distribution expressed by D, D, or the like. The particle size distribution is well known to those skilled in the art as an index indicating what size (particle size) particles are included in what proportion in a particle group to be measured. D(a particle size corresponding to 50 % of a cumulative volume of the particle size distribution) refers to an average particle diameter.

300 100 200 The metal magnetic particles may be two or more types of different metal magnetic particles. Here, by different types of metal magnetic particles, it is meant that the metal magnetic particles are distinguished from each other in at least one of average particle size, composition, component ratio, crystallinity, and shape. The insulating material may include epoxy, polyimide, liquid crystal polymer, etc., alone or in combination, but the embodiment is not limited thereto. The support memberis disposed inside the body, and supports the coil.

300 200 200 When viewed in the thickness direction (T-axis direction), the support membermay have the same shape as a shape formed by the edges of the coil, or may have a rectangular shape wider than the coil. However, the embodiment is not limited thereto.

300 The support membermay include glass.

300 300 2 2 3 2 2 3 2 2 2 3 2 2 2 3 2 2 3 2 3 2 2 3 For example, the glass included in the support membermay be SiO—BO-based glass, SiO—BO—KO-based glass, SiO—BO—LiO—CaO-based glass, SiO—BO—LiO—CaO—ZnO-based glass, and BiO—BO—SiO—AlO-based glass. As another example, the support membermay be made of photosensitive glass including silica, lithium (Li) oxide, aluminum (Al), and cerium (Ce) oxide.

300 2 4 2 3 3 4 In an embodiment, the glass included in the support membermay also include. The filler included in the glass may include, for example, quartz, alumina, magnesia, silica, forsterite (MgSiO), steatite (HMg(SiO)), and zirconia.

300 320 330 310 300 310 110 100 The support membermay include a first support surfaceand a second support surfaceopposite each other in the thickness direction (T-axis direction). A through-holemay be at a center of the support member, and the through-holemay be filled with a magnetic material to form a coreof the body.

200 100 1000 1000 200 200 The coilis embedded in the bodyexhibit the characteristics of the coil electronic component. For example, when the coil electronic componentaccording to the embodiment is used as a power inductor, when current is applied to the coil, the coilmay serve to stabilize the power of an electronic device by storing an electric field in the form of a magnetic field to maintain an output voltage.

200 When viewed in the thickness direction (T-axis direction), the coilmay be spiral.

200 320 330 300 200 210 220 210 220 230 210 220 200 The coilmay be disposed on the first support surfaceand the second support surfaceof the support member. The coilmay include a first coil patternand a second coil pattern, and the first coil patternand the second coil patternmay be connected to each other through a via. The first coil patternand the second coil patternconnected in this manner may comprise a spiral coilhaving one or more turns.

210 320 300 The first coil patternis disposed on the first support surfaceof the support member.

210 213 213 1 100 700 The first coil patternincludes a first lead out portion. The first lead out portionmay be exposed from the first surface Sof the bodyand may be electrically connected to the first external electrode.

220 330 300 The second coil patternis disposed on the second support surfaceof the support member.

220 223 223 2 100 800 200 230 The second coil patternincludes a second lead out portion. The second lead out portionmay be exposed from the second surface Sof the bodyand may be electrically connected to the second external electrode. The coiland the viamay be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof, respectively, but the embodiment is not limited thereto.

400 210 220 400 110 1 210 400 110 2 220 A partition wallis disposed between adjacent coils of the first coil patternand the second coil pattern. The partition wallis disposed between the coreand the innermost coil Cof the first coil pattern, and the partition wallis disposed between the coreand the innermost coil Cof the second coil pattern.

400 300 The partition wallmay have a shape extending from a surface of the support memberin the thickness direction (T-axis direction).

400 400 The partition wallmay be made of an electrically insulating material. The partition wallmay be made of glass.

400 300 The partition wallmay include the same glass as the support member. In this case, glass is stronger than polymer, so it is less likely to cause current leakage or short in the coil.

200 100 200 400 210 220 200 300 121 122 An insulating film IF may be disposed between the coiland the body. The insulating film IF may be formed along the surface of the coil. Since the partition wallis disposed between the adjacent coils of the coil patternsand, the insulating film IF is not present in that area, and no insulating film IF is present where the coiland the support memberare connected to the first external electrodeand the second external electrode.

200 100 300 The insulating film IF is for insulating the coilfrom the bodymay include a known insulating material such as parylene, etc. Any insulating material may be used in the insulating film IF, and there is no particular limitation. For example, the insulating film IF may be a polyurethane resin, a polyester resin, an epoxy resin, or a polyamideimide resin. The insulating film IF may be formed by a method such as vapor deposition, etc., but is not limited thereto. For example, the insulating film IF may be formed by stacking insulating films on both surfaces of the support member.

700 800 100 200 The first external electrodeand the second external electrodeare disposed outside the body, and connected to the coil.

700 1 100 213 200 700 6 100 The first external electrodemay be disposed on the first surface Sof the body, and connected to the first lead out portionof the coil. The first external electrodecovers a portion of the sixth surface Sof the body.

700 1 100 3 4 5 6 In another embodiment, the first external electrodemay cover the first surface Sof the body, and may also cover at least one of a portion of the third surface S, a portion of the fourth surface S, a portion of the fifth surface S, and a portion of the sixth surface S.

800 2 100 223 200 800 6 100 The second external electrodemay be disposed on the second surface Sof the body, and connected to the second lead out portionof the coil. The second external electrodecovers a portion of the sixth surface Sof the body.

800 2 100 3 4 5 6 In another embodiment, the second external electrodemay cover the second surface Sof the body, and may also cover at least a portion of a portion of the third surface S, a portion of the fourth surface S, a portion of the fifth surface S, and a portion of the sixth surface S.

700 701 702 703 The first external electrodemay include a first metal layer, a second metal layer, and a third metal layer.

701 213 1 6 702 701 703 702 701 The first metal layermay be a plating layer in contact with the first lead out portionand outer surfaces, i.e., the first surface Sand the sixth surface Sof the body, and include copper (Cu). The second metal layermay be a plating layer covering the first metal layer, and include nickel (Ni). The third metal layermay be a plating layer covering the second metal layer, and include tin (Sn). However, the embodiment is not limited to a three-layer structure, and a two-layer structure with only one metal layer added onto the first metal layeris also possible.

800 801 802 803 The second external electrodemay include a first metal layer, a second metal layer, and a third metal layer.

801 223 2 6 802 801 803 802 801 The first metal layermay be a plating layer in contact with the second lead out portionand outer surfaces, i.e., the second surface Sand the sixth surface Sof the body, and include copper (Cu). The second metal layermay be a plating layer covering the first metal layer, and include nickel (Ni). The third metal layermay be a plating layer covering the second metal layer, and include tin (Sn). However, the embodiment is not limited to a three-layer structure, and a two-layer structure with only one metal layer added onto the first metal layeris also possible.

700 800 700 800 700 800 700 800 100 100 100 100 700 800 As another example, the first external electrodeand the second external electrodemay include a metal and glass. The metal may be, for example, a conductive metal including copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb) alone, or alloys thereof. The glass component included in the first external electrodeand the second external electrodemay be a mixture of oxides. The glass component may include, for example, a silicon oxide, a boron oxide, an aluminum oxide, a transition metal oxide, an alkaline metal oxide, an alkaline-earth metal oxide, or combinations thereof. Here, the transition metal may be selected from zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), or nickel (Ni), the alkaline metal may be selected from lithium (Li), sodium (Na), or potassium (K), and the alkaline-earth metal may be selected from magnesium (Mg), calcium (Ca), strontium (Sr), or barium (Ba). The method for forming the first external electrodeand the second external electrodeis not particularly limited. For example, the first external electrodeand the second external electrodemay be formed by dipping the bodyinto a conductive paste containing metal and glass, or by printing a conductive paste on a surface of the bodyby, e.g., screen printing method or gravure printing method. Further, various methods, such as applying a conductive paste on the surface of the body, or transferring a dry film formed by drying the conductive paste on the body, may be used to form the first external electrodeand the second external electrode.

900 3 4 5 6 100 900 6 100 700 800 6 100 900 700 800 The surface insulating layermay be disposed on the third surface S, the fourth surface S, the fifth surface S, and the sixth surface Sof the body. However, the surface insulating layermay partially cover the sixth surface Sof the body. That is, the first external electrodeand the second external electrodemay be disposed on the sixth surface Sof the body, and the surface insulating layermay not cover the first external electrodeand the second external electrode.

900 3 4 5 6 100 700 800 As described above, the surface insulating layeris disposed on at least a portion of the third surface S, the fourth surface S, the fifth surface S, and the sixth surface Sof the bodyto prevent electrical shorts between other electronic components and the first and second external electrodeand.

900 700 800 The surface insulating layermay be used as a resist when forming the first external electrodeand the second external electrodeby electroplating, but is not limited thereto.

900 900 2 x x The surface insulating layermay include polymer resin, pigment, filler, etc. The polymer resin may include a thermosetting polymer resin such as epoxy or a thermoplastic polymer resin such as acryl. Pigments capable of producing color such as black, may include carbon black, black manganese (Mn)-based spinel powder, etc. and the surface insulation layer may further include additives such as SiOand talc, for control of strength and/or coefficient of thermal expansion For example, the surface insulating layermay include a thermoplastic resin such as a polystyrene-based resin, a vinyl acetate-based resin, a polyester-based resin, a polyethylene-based resin, a polypropylene-based resin, a polyamide-based resin, a rubber-based resin, an acryl-based resin, or the like, a thermosetting resin such as a phenol-based resin, an epoxy-based resin, a urethane-based resin, a melamine-based resin, an alkyd-based resin, a photosensitive resin, parylene, SiOor SiN.

900 900 100 100 The surface insulating layermay be formed through a process such as screen printing, pad printing, dipping, spray printing, etc. For example, the surface insulating layermay be formed, by applying a liquid insulating resin to a surface of the body, or by stacking an insulating film such as a dry film on the surface of the body, or through a thin-film process such as vapor deposition, etc. In the case of the insulating films, Ajinomoto Build-up Film (ABF) or polyimide film, or the like, may be used.

4 11 FIGS.to are drawings sequentially illustrating a method for manufacturing a coil electronic component according to an embodiment.

4 FIG. 300 Referring to, a support membermade of glass material is provided.

5 FIG. 111 300 111 300 300 Referring to, a trenchis formed by etching the support member. For example, the trenchmay be formed by irradiating a laser beam onto the support memberor performing a wet etch process on the support member.

111 111 The trenchmay be formed to have various patterns. For example, the trenchmay be formed to be spiral.

400 111 A partition wallmay be formed between the trenches.

300 111 300 111 111 111 Since the support memberis made of glass, the trenchmay be formed to have a relatively high aspect ratio. That is, when a laser beam is irradiated onto the support membermade of glass, the straightness of the laser beam is excellent, thereby increasing the aspect ratio of the trench. For example, the aspect ratio of the trenchmay be 3:1 or more or 20:1 or less. As a result, since the trenchesmay be disposed at a relatively high density, and disposed to be closer to each other with a fine pitch.

Unlike the embodiment, when an insulating film is disposed on the support member, and then a trench is formed by irradiating a laser beam onto the insulating film, it is difficult to increase the aspect ratio of the trench due to scattering of the laser beam. In this case, the pitch of the trench may not be as fine as in the present embodiment.

6 FIG. 200 111 111 200 200 111 210 220 213 223 Referring to, a coilis formed by filling the trenchwith metal. The metal filled in the trenchforms the coil. For example, the coilmay be formed by plating the trenchwith copper (Cu). As a result, a first coil pattern, a second coil pattern, a first lead out portion, a second lead out portion, etc., may be formed.

7 FIG. 310 300 310 300 300 303 213 305 223 300 Referring to, a through-holeis formed by etching a central portion of the support member. For example, the through-holemay be formed by irradiating a laser beam onto the center of the support memberor performing the wet etch process on the support member. Furthermore, an areafacing the first lead out portionand an areafacing the second lead out portionmay be etched on the support member.

8 FIG. 200 200 213 223 400 303 305 Referring to, an insulating film IF is formed on the coil. As a result, the surface of the coilexcept for portions of the first lead out portionand the second lead out portionmay be covered with the insulating film IF and the partition wall. The insulating film IF may not be formed in the areasand.

9 FIG. 8 FIG. 10 FIG. 100 200 300 310 300 110 303 305 200 100 900 100 700 800 Referring to, a bodyis formed to surround the coiland the support member. During this process, the through-holeof the support memberis filled with a magnetic material to form a core. Furthermore, the areasand(see) may be filled with the magnetic material. For example, sheets of magnetic material may be disposed at an upper portion and a lower portion of the coil, and then pressed and cured to form the body. Referring to, a surface insulating layeris formed on an outer surface of the bodyexcept for portion where a first external electrodeand a second external electrodeare to be formed.

11 FIG. 1000 700 800 100 1 6 100 700 2 6 100 800 1 6 100 700 2 6 800 700 213 800 223 Referring to, a coil electronic componentis manufactured by forming the first external electrodeand the second external electrodeare formed on an outer surface of the body. For example, a conductive paste is applied to a first surface Sand a sixth surface Sof the bodyand then cured to form the first external electrode, and a conductive paste is applied to a second surface Sand a sixth surface Sof the bodyand then cured to form the second external electrode. As another example, the first surface Sand the sixth surface Sof the bodyare plated with metal to form the first external electrode, and the second surface Sand the sixth surface Sof the body are plated with the metal to form the second external electrode. Thus, the first external electrodeis connected to the first lead out portion, and the second external electrodeis connected to the second lead out portion. Although the embodiment of the present disclosure is described hereinabove, the present disclosure is not limited thereto, and various modifications can be made within the scopes of the claims, and the description of the present disclosure and the accompanying drawings, and belongs to the scope of the present disclosure, of course.

1000 : Coil electron component 100 : Body 200 : Coil 210 : First coil pattern 220 : Second coil pattern 230 : Via 213 : First lead out portion 223 : Second lead out portion 300 : Supporting member 700 : First external electrode 800 : Second external electrode 900 : Surface insulating layer