Light Emitting Display Device and Method of Manufacturing the Same

This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0145720 filed at the Korean Intellectual Property Office on Oct. 23, 2024, the entire contents of which are incorporated herein by reference.

The present disclosure relates to a light emitting display device and a method of manufacturing the same, and more particularly, to a light emitting display device including a light emitting device and a method of manufacturing the same.

A light emitting display device may include light emitting devices corresponding to pixels. An image may be displayed by controlling the brightness of each of the light emitting devices included in the light emitting display device. Unlike light receiving display devices such as liquid crystal displays, light emitting display devices do not require a light source such as a backlight, so their thickness and weight may be reduced. In addition, since the light emitting display device has the characteristics of high luminance, contrast ratio, color reproduction, and response speed, the image quality may be improved.

To provide high-quality images, light emitting display devices are being applied to various electronic devices such as mobile devices such as smartphones, tablets, laptop computers, monitors, and televisions, and are also being applied to automobile display devices.

A mask may be used when forming a light emitting layer in a light emitting display device. The mask may be supported by a spacer. The spacer that supports the mask may be pressed or stamped by the mask, resulting in defects such as dark spots.

Embodiments attempt to provide a display device capable of reducing defects such as dark spots by preventing the spacer from being pressed or stamped, and a method of manufacturing the same.

A light emitting display device according to an embodiment includes a substrate, a transistor positioned on the substrate, an insulating layer positioned on the transistor, a pixel electrode positioned on the insulating layer and electrically connected to the transistor, a pixel defining layer positioned on the insulating layer and having an opening overlapping the pixel electrode, a spacer positioned on the pixel defining layer, and a protective layer positioned on the spacer. The protective layer includes a first layer positioned on the spacer and a second layer positioned on the first layer.

The spacer may include a central portion including a center of the spacer, a step portion surrounding the central portion, and a peripheral portion surrounding the step portion, and the step portion may have a concave step in a direction of the pixel defining layer.

The protective layer may include a body positioned on the central portion and a protective layer wing positioned on the step portion.

The body may contact the central portion, and the protective layer wing may be spaced apart from the step portion.

A thickness of the wing may be smaller than a thickness of the body.

The end of the wing may have an internal angle of 30° to 50°.

The protective layer may not be positioned on the peripheral portion.

The protective layer may include a metal oxide.

The light emitting display device may include an intermediate layer positioned on at least one of the pixel electrode, the pixel defining layer, the spacer and the protective layer, and including a light emitting layer and a functional layer, and a common electrode positioned on the intermediate layer, wherein the protective layer may be positioned between the spacer and the intermediate layer.

The light emitting display device may include an encapsulation substrate positioned on the common electrode, a filler positioned between at least one of the substrate and the common electrode and the encapsulation substrate, and a sealing member positioned at an edge of the substrate and bonding the substrate and the encapsulation substrate.

An electronic device according to an embodiment includes a light emitting display device. The light emitting display device includes a substrate, a transistor positioned on the substrate, an insulating layer positioned on the transistor, a pixel electrode positioned on the insulating layer and electrically connected to the transistor, a pixel defining layer positioned on the insulating layer and having an opening overlapping the pixel electrode, a spacer positioned on the pixel defining layer, and a protective layer positioned on the spacer. The protective layer includes a first layer positioned on the spacer and a second layer positioned on the first layer.

A method of manufacturing a light emitting display device according to an embodiment includes forming a transistor on a substrate, forming an insulating layer on the transistor, forming a pixel electrode electrically connected to the transistor on the insulating layer, forming a pixel defining layer having an opening overlapping the pixel electrode on the insulating layer, forming a spacer on the pixel defining layer, and forming a protective layer on the spacer.

The forming of the protective layer includes forming a first layer on the spacer and forming a second layer on the first layer.

The forming of the protective layer may include forming a preliminary first layer on the spacer, etching the preliminary first layer to form an etched preliminary first layer, forming a preliminary second layer on the etched preliminary first layer and the spacer, and etching together the etched preliminary first layer and the preliminary second layer to form a first layer and a second layer.

The forming of the preliminary first layer may include depositing a first metal oxide on the spacer, and the forming of the preliminary second layer may include depositing a second metal oxide on the etched preliminary first layer and the spacer.

The method of manufacturing the light emitting display device may further include forming a step portion by ashing a portion of the spacer.

The forming of the step portion may include plasma-treating the surface of the step portion.

The forming of the step portion may be performed by ashing a region where the spacer does not overlap the etched preliminary first layer.

The spacer may include a central portion including a center of the spacer, a step portion surrounding the central portion, and a peripheral portion surrounding the step portion, and the forming of the first layer and the second layer may include etching the etched preliminary first layer and the preliminary second layer formed on the peripheral portion.

The etching of the preliminary first layer may include forming a first layer wing positioned on the step portion.

The forming of the second layer may include forming a second layer wing positioned on the first layer wing to form a protective layer wing.

The forming of the protective layer wing may include etching the preliminary first layer and the preliminary second layer so that the end of the protective layer wing has an inner angle of 30° to 50°.

According to embodiments, the spacer of the light emitting display device may be prevented from being pressed or stamped, thereby preventing the filler from penetrating into the common electrode, light emitting device, etc. Therefore, it is possible to suppress the occurrence of dark spots due to pressing and stamping of the spacer. Additionally, it is possible to suppress outgassing in the spacer and the pixel defining layer of the display device. Therefore, the occurrence of dots that can be seen from the outside may be prevented. Accordingly, the image quality of the display device may be improved, and defects in the display area of the display device may be reduced.

According to a method of manufacturing a display device according to an embodiment, the spacer of the display device may be prevented from being pressed or stamped, thereby preventing the filler from penetrating into the common electrode, light emitting device, etc. Additionally, it is possible to suppress outgassing in the spacer and the pixel defining layer. Therefore, defects such as dark spots and dot visibility may be prevented. Accordingly, a display device having improved image quality and reduced defects in the display area may be provided.

The present disclosure will be described in detail hereinafter with reference to the accompanying drawings, in which embodiments of the present disclosure are shown. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present disclosure.

The drawings and description are to be regarded as illustrative in nature and not restrictive, and like reference numerals designate like elements throughout the specification.

Further, since sizes and thicknesses of components shown in the accompanying drawings may be arbitrarily given to facilitate understanding and ease of description, the disclosure is not limited to the illustrated sizes and thicknesses. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. In the drawings, to facilitate understanding and ease of description, the thicknesses of some layers and regions may be exaggerated.

It should be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” another element, it may be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present. Further, when an element is referred to as being “on” or “above” a reference element, it may be positioned above or below the reference element, and it may not necessarily be referred to as being positioned “on” or “above” it in a direction opposite to gravity.

In addition, unless explicitly described to the contrary, the words “comprise” and “includes,” and variations such as “comprises” and “comprising,” should be understood to imply the inclusion of stated elements but not the exclusion of any other elements.

In addition, the phrase “on a plane” means a view from a position above the object (e.g., from the top), and the phrase “in a cross-section” means a view of a cross-section of the object which is vertically cut from the side.

1 FIG. 2 FIG. is a schematic perspective view of an electronic device including a display device according to an embodiment.is a schematic perspective view of a display device according to an embodiment.

1 2 FIGS.and 1 1 Referring to, an electronic devicemay include a display screen capable of displaying an image in a third direction (z) corresponding to a front on a plane defined by a first direction (x) and a second direction (y). For example, the electronic devicemay include a television, a mobile phone, a smartphone, a tablet, a notebook computer, a monitor, a multimedia player, a billboard, an electronic watch, a smartwatch, a watch phone, a head mounted display (HMD), a mobile communication terminal, an electronic notebook, an electronic book, a portable multimedia player (PMP), a navigation game machine, a digital camera, a camcorder, and the like.

1 2 3 The electronic devicemay include a cover window, a housing, a display device, etc.

2 2 2 1 2 2 The cover windowmay include an insulating pattern. For example, the cover windowmay include glass, plastic or a combination thereof. The front of the cover windowmay define the front of the electronic device. The region corresponding to the display screen in the cover windowmay be optically transparent. The cover windowis positioned on the display device and may protect the display device from external impacts, etc., and may transmit an image displayed by the display device.

3 3 3 2 3 2 1 1 3 1 2 1 2 3 The housingmay be made of a material having relatively high rigidity. For example, the housingmay include a plurality of frames or plates made of glass, plastic, or metal, or a combination thereof. The housingmay be coupled with the cover window, and the coupled housingand cover windowmay form the exterior of the electronic deviceand provide an internal space of the electronic device. For example, the housingmay form the back and side of the electronic device, and the cover windowmay form the front of the electronic device. A display device, etc. may be positioned in the internal space defined by the cover windowand the housing, and the display device, etc. may be protected from the external environment.

1 The display device may display an image and provide a display screen of the electronic device. The display device may be a light emitting display device such as an organic light emitting display device, an inorganic light emitting display device, or a quantum-dot light emitting display device.

1 1 1 1 FIG. The electronic devicemay have various shapes. For example, the electronic devicemay be a quadrangle with rounded corners when viewed from the front as illustrated in. In addition, the electronic devicemay have a shape such as a rectangle, square, other polygon, circle, or oval.

1 1 1 FIG. 2 FIG. The electronic deviceand the display device may include a display area DA and a non-display area NA, respectively. The display area DA and the non-display area NA illustrated inmay correspond to the display area DA and the non-display area NA of the display device illustrated in, respectively. The display area DA is the area where the image is displayed and may correspond to the display screen. The non-display area NA may be an area where the image is not displayed. The display area DA may occupy most of the area based on the center of the front of the electronic device, and the non-display area NA may surround the display area DA.

1 FIG. 1 2 3 2 3 1 2 3 2 3 1 1 2 3 2 3 As shown in, the display area DA may include a first display area DA, a second display area DA, and a third display area DA. The second display area DAand the third display area DAmay be areas where components such as sensors and cameras are disposed at the back for adding various functions to the electronic device. The second display area DAand the third display area DAmay correspond to a component area. The second display area DAand the third display area DAmay be surrounded by the first display area DA. Not only the first display area DA, but also the second display area DAand the third display area DAmay all display images. The positions and numbers of the second display area DAand the third display area DAmay be varied.

1 1 To describe the display device in more detail, the display device may provide a display screen in the electronic device. The display device may detect or capture the front of the electronic device. The display device may have a flat form similar to an electronic device.

10 20 10 30 The display device may include a display panel, a flexible printed circuit boardbonded to the display panel, and a driving unit including an integrated circuit chip.

10 1 1 2 3 1 2 3 2 FIG. 1 FIG. 2 FIG. 1 FIG. The display panelmay include the display area DA corresponding to a screen on which an image is displayed and the non-display area NA in which circuits and signal lines for generating and transmitting various signals applied to the display area DA are disposed. The non-display area NA may surround the display area DA. In, each of the inner side and outer side of the dotted rectangle may correspond to the display area DA and the non-display area NA, and may correspond to the display area DA and the non-display area NA of the electronic devicedescribed with reference to. In, for convenience of description, the first display area DA, the second display area DA, and the third display area DAare not separated, but the display area DA may include the first display area DA, the second display area DA, and the third display area DAas in.

10 Pixels PX may be disposed in a matrix in the display area DA of the display panel. Additionally, signal lines such as gate lines, data lines, and driving voltage lines may be disposed in the display area DA. The gate line may extend in the first direction x, and the data line and driving voltage line may extend in the second direction y. Signal lines such as a gate line, a data line, and a driving voltage line are connected to each pixel PX, so that each pixel PX may receive a gate signal (also referred to a scan signal), a data voltage, and a driving voltage from the signal lines. Each pixel PX may include a light emitting device and a pixel circuit connected thereto. The pixel circuit may generate a driving current based on signals applied through signal lines such as gate lines and data lines, and may apply the driving current to the light emitting device.

1 FIG. A touch sensor may be disposed in the display area DA to detect a user's contact and non-contact touch. In, the display area DA is shown as a quadrangle, but the display area DA may have various shapes other than a quadrangle, such as a polygon, circle, or oval.

10 10 10 20 20 A pad portion PP in which pads for receiving signals from the outside of the display panelare arranged may be positioned in the non-display area NA of the display panel. The pad portion PP may be positioned in the first direction (x) along any one edge of the display panel. The flexible printed circuit boardmay be bonded to the pad portion PP, and pads of the flexible printed circuit boardmay be electrically connected to pads of the pad portion PP.

10 10 10 30 30 10 30 20 10 A driving unit that generates and processes various signals for driving the display panelmay be positioned in the non-display area NA of the display panel. The driving unit may include a data driver that applies a data voltage to data lines, a gate driver that applies a gate signal to gate lines, and a signal controller that controls the data driver and the gate driver. The pixels PX may receive a data voltage according to a gate signal generated by the gate driver. The gate driver may be integrated into the display paneland may be positioned on at least one side of the display area DA. The data driver and the signal controller may be provided as the integrated circuit chip (also referred to a driving IC chip or driving IC), and the integrated circuit chipmay be mounted on the non-display area NA of the display panel. The integrated circuit chipmay be mounted on the flexible printed circuit boardor the like and electrically connected to the display panel.

3 FIG. 1 FIG. is a schematic cross-sectional view taken along line I-I′ of.

3 FIG. 110 110 510 400 110 510 40 110 510 Referring to, the light emitting display device may include a substrate, a display layer DL positioned on the substrate, and an encapsulation substratepositioned on the display layer DL. A fillermay be positioned between at least one of the substrateand the display layer DL and the encapsulation substrate, and a sealing membermay be positioned at the edge of the substrateand the edge of the encapsulation substrate.

110 110 The substratemay be a rigid substrate including a material such as glass. The substratemay be a flexible substrate including a polymer resin such as polyimide, polyamide, or polyethylene terephthalate.

510 110 510 510 The encapsulation substratemay be formed of substantially the same material as the substrate. For example, the encapsulation substratemay be a rigid substrate including a material such as glass. For example, the encapsulation substratemay be a flexible substrate including a polymer resin.

400 110 510 400 110 400 510 The fillermay be positioned between at least one of the substrateand the display layer DL and the encapsulation substrate. One surface of the fillermay be in contact with at least one of the substrateand a capping layer of the display layer DL, and the other surface of the fillermay be in contact with the encapsulation substrate.

400 110 510 110 510 510 400 510 510 110 400 110 110 510 400 The fillermay fill the space between at least one of the substrateand the display layer DL and the encapsulation substrateto increase the compression resistance between the substrateand the encapsulation substrate, or between the display layer DL and the encapsulation substrate. The fillermay be formed by printing or applying a filler material on the encapsulation substrate, bonding the encapsulation substrateto the substrate, and then curing it. The fillermay be formed by printing or applying a filler material on the substrate, bonding the substrateto the encapsulation substrate, and then curing it. The fillermay include an organic material such as an epoxy resin, a polyacrylate resin, a phenolic resin, a polyester resin, etc.

110 510 40 40 110 510 110 510 40 1 2 FIGS.and The substrateand the encapsulation substratemay be bonded and sealed by the sealing member. The sealing membermay be formed at the edge of the substrateand the edge of the encapsulation substrateto bond the substrateand the encapsulation substrate. For example, the sealing membermay be positioned in the non-display area described with reference to.

40 510 110 110 510 40 110 510 The sealing memberformed at the edge of the encapsulation substratemay be positioned at the edge of the substrateon which the display layer DL is formed. After the substrateand the encapsulation substrateare overlapped, a laser is irradiated on the sealing memberto cure it, thereby bonding the substrateand the encapsulation substrate.

40 40 40 2 The sealing membermay include a photocurable material. The sealing membermay include frit. The frit may refer to glass raw material in powder form, and may also refer to a paste state containing laser or infrared absorbers, organic binders, fillers, etc., in silicon dioxide (SiO). The sealing membermay include an epoxy acrylate-based resin, a polyester acrylate-based resin, a urethane acrylate-based resin, a polybutadiene acrylate-based resin, a silicone acrylate-based resin, an alkyl acrylate-based resin, and the like.

4 FIG. 4 FIG. is a schematic cross-sectional view showing a portion of a display area of a display device according to an embodiment.shows a portion of the display device corresponding to approximately two pixel areas.

4 FIG. 120 110 120 110 110 120 x x x y Referring to, a buffer layermay be positioned on the substrate. The buffer layermay block impurities from the substratewhen forming a semiconductor layer, thereby improving the characteristics of the semiconductor layer, and may alleviate stress on the semiconductor layer by planarizing the surface of the substrate. The buffer layermay be an inorganic insulating layer that may include an inorganic insulating material such as silicon nitride (SiN), silicon oxide (SiO), or silicon oxynitride (SiON), and may have a single-layer structure or a multi-layer structure.

110 120 110 A transistor TR may be positioned on the substrate. For example, the transistor TR may be positioned on the buffer layerwhich is positioned on the substrate.

110 A semiconductor layer AL of the transistor TR may be positioned on the substrate. The semiconductor layer AL may include a first semiconductor region, a second semiconductor region, and a channel region positioned between the first semiconductor region and the second semiconductor region. The semiconductor layer AL may include any one of amorphous silicon, polycrystalline silicon, and oxide semiconductor. For example, the semiconductor layer AL may include low-temperature polycrystalline silicon (LTPS) or an oxide semiconductor material including at least one of zinc (Zn), indium (In), gallium (Ga), and tin (Sn). For example, the semiconductor layer AL may include indium gallium zinc oxide IGZO.

130 130 130 A first gate insulating layermay be positioned on the semiconductor layer AL. The first gate insulating layermay include an inorganic insulating material such as silicon nitride, silicon oxide, or silicon oxynitride. The first gate insulating layermay have a single-layer structure or a multi-layer structure.

130 A gate conductive layer that may include a gate electrode GE of the transistor TR, etc., may be positioned on the first gate insulating layer. The gate conductive layer may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a single-layer structure or a multi-layer structure.

140 140 140 A second gate insulating layermay be positioned on the gate conductive layer. The second gate insulating layermay include an inorganic insulating material such as silicon nitride, silicon oxide, or silicon oxynitride. The second gate insulating layermay have a single-layer structure or a multi-layer structure.

160 140 160 160 160 An interlayer insulating layermay be positioned on the second gate insulating layer. The interlayer insulating layermay include an inorganic insulating material such as silicon nitride, silicon oxide, or silicon oxynitride. The interlayer insulating layermay have a single-layer structure or a multi-layer structure. An additional gate conductive layer may be positioned on the interlayer insulating layer.

160 130 140 160 A data conductive layer that may include a first electrode SE and a second electrode DE of the transistor TR may be positioned on the interlayer insulating layer. The first electrode SE and the second electrode DE may be connected to the first semiconductor region and the second semiconductor region of the semiconductor layer AL, respectively, through contact holes formed in the insulating layers,, and. One of the first electrode SE and the second electrode DE may be a source electrode and the other may be a drain electrode.

The data conductive layer may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu), and the like, and may have a single-layer structure or a multi-layer structure. For example, the data conductive layer may include a lower layer including a refractory metal, such as molybdenum, chromium, tantalum, or titanium, an intermediate layer including a low-resistivity metal, such as aluminum, copper, or silver, and an upper layer including a refractory metal. For example, the data conductive layer may have a triple-layer structure such as titanium (Ti)/aluminum (Al)/titanium (Ti).

180 180 180 180 140 An insulating layermay be positioned on the data conductive layer. The insulating layerpositioned on the data conductive layer may be provided as a planarized layer. For example, the insulating layerprovided as a planarized layer may be positioned on the transistor TR including the semiconductor layer AL, the gate electrode GE, the first electrode SE, and the second electrode DE. The insulating layermay be positioned on the second gate insulating layer.

180 The insulating layermay include an organic insulating material including a common general polymer, such as a poly(methyl methacrylate) or a polystyrene, a polymer derivative having a phenol-based group, an acryl-based polymer, an imide-based polymer (e.g., polyimide), or a siloxane-based polymer.

180 180 In an embodiment, a light emitting device ED may be positioned on the insulating layer. For example, the light emitting device ED is positioned on the insulating layerprovided as a planarized layer and may be electrically connected to the transistor TR.

1 1 1 1 180 1 1 1 The light emitting device ED may include a pixel electrode E. For example, the pixel electrode Emay be an anode of the light emitting device. The pixel electrode Emay be electrically connected to the transistor TR. For example, the pixel electrode Emay be connected to the second electrode DE of the transistor TR through a contact hole formed in the insulating layer. The pixel electrode Emay be formed of a reflective conductive material or a semi-transparent conductive material, or may be formed of a transparent conductive material. The pixel electrode Emay include a metal or metal alloy such as lithium (Li), calcium (Ca), aluminum (Al), silver (Ag), magnesium (Mg), or gold (Au). The pixel electrode Emay be multilayered, and may have a triple-layer structure such as indium tin oxide (ITO)/silver (Ag)/ITO, for example.

190 1 180 1 190 A pixel defining layerhaving an opening overlapping the pixel electrode Emay be positioned on the insulating layer. The pixel electrode Emay be positioned in an opening of the pixel defining layer. The opening may correspond to the light emitting region of the light emitting device.

190 The pixel defining layermay include an organic insulating material including a common general polymer, such as a poly(methyl methacrylate) or a polystyrene, a polymer derivative having a phenol-based group, an acryl-based polymer, an imide-based polymer, or a siloxane-based polymer.

195 190 195 190 195 190 190 195 190 195 A spacermay be positioned on the pixel defining layer. The spaceris positioned on the pixel defining layerand may support a mask for forming a light emitting layer, which will be described later. The spacermay be formed of substantially the same material as the pixel defining layer. For example, the pixel defining layerand the spacermay be formed of the same material in the same process. The pixel defining layerand the spacermay be formed integrally by one process, but may also be formed separately by separate processes.

200 195 200 195 200 210 195 220 210 A protective layermay be positioned on the spacer. The protective layermay be positioned between the spacerand an intermediate layer EM. In an embodiment, the protective layermay include a first layerpositioned on the spacerand a second layerpositioned on the first layer.

1 190 195 200 The intermediate layer EM may be positioned on at least one of the pixel electrode E, the pixel defining layer, the spacer, and the protective layer. The intermediate layer EM may include a light emitting layer EL and a functional layer FL.

190 1 190 The light emitting layer EL is a layer in which electro-optic transfer occurs through a combination of electrons and holes, and may include at least one of an organic material and an inorganic material that emits light of a predetermined color. The light emitting layer EL may be positioned in the opening of the pixel defining layerand may overlap the pixel electrode E. A portion of the light emitting layer EL may be positioned on the pixel defining layer. The light emitting layer EL may include an organic light emitting diode or an inorganic light emitting diode.

1 1 2 2 1 2 190 190 1 FIG. The functional layer FL may include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. The functional layer FL may include a first functional layer FLpositioned between the pixel electrode Eand the light emitting layer EL, and a second functional layer FLpositioned between the light emitting layer EL and a common electrode E. The first functional layer FLmay include at least one of a hole injection layer and a hole transport layer. The second functional layer FLmay include at least one of an electron transport layer and an electron injection layer. The functional layer FL may be positioned across the entire display area DA as described with reference to. The functional layer FL may be positioned in the opening of the pixel defining layer. The functional layer FL may be disposed outside the opening of the pixel defining layer.

2 1 2 2 1 2 FIGS.and The common electrode Emay be disposed on the intermediate layer EM. The pixel electrode Emay be an anode of the light emitting device ED, and the common electrode Emay be a cathode of the light emitting device ED. The common electrode Emay be positioned across the entire display area DA as described with reference to.

2 2 The common electrode Emay include a metal or metal alloy having a low work function, such as calcium (Ca), barium (Ba), magnesium (Mg), aluminum (Al), or silver (Ag). For example, light transparency may be achieved by forming a thin layer of a metal or metal alloy having the low work function. The common electrode Emay include a transparent conductive oxide such as ITO or indium zinc oxide IZO.

2 1 1 2 1 2 The common electrode Emay form the light emitting device ED together with the pixel electrode Eand the intermediate layer EM. For example, the pixel electrode E, the light emitting layer EL, and the common electrode Emay form the light emitting device ED. The light emitting device ED may include the functional layer FL including the first functional layer FLand the second functional layer FL.

190 The light emitting layer EL may include the light emitting layers ELa and ELb that display different colors. For example, the light emitting layer EL may include a first light emitting layer ELa that displays a first color and a second light emitting layer ELb that displays a second color different from the first color. For example, the first light emitting layer ELa and the second light emitting layer ELb may each display different colors among red, green, and blue. The first light emitting layer ELa and the second light emitting layer ELb may be spaced apart from each other with the pixel defining layertherebetween.

1 1 1 1 190 b b b The pixel electrode Emay include a first pixel electrode Ela and a second pixel electrode E. The first light emitting layer ELa may be positioned on the first pixel electrode Ela. The second light emitting layer ELb may be positioned on the second pixel electrode E. The first pixel electrode Ela and the second pixel electrode Emay be spaced apart from each other with the pixel defining layertherebetween.

2 1 2 1 2 b The first pixel electrode Ela, the first light emitting layer ELa, and the common electrode Emay form a first light emitting device EDa. The second pixel electrode E, the second light emitting layer ELb, and the common electrode Emay form a second light emitting device EDb. The first light emitting device EDa and the second light emitting device EDb may each include the functional layer FL including the first functional layer FLand the second functional layer FL.

1 FIG. The light emitting device ED may correspond to the pixel PX described with reference to. The first light emitting device EDa and the second light emitting device EDb correspond to different pixels and may display different colors. For example, the first light emitting device EDa and the second light emitting device EDb may each correspond to different pixels and may each display one of the colors red, green, and blue.

300 2 300 A capping layermay be positioned on the common electrode E. The capping layermay improve light efficiency by adjusting the refractive index.

400 300 400 510 The fillermay be positioned on the capping layer. The fillermay be positioned between the encapsulation substrateand the light emitting device ED to protect the light emitting device ED from external or internal impact.

510 400 510 510 300 The encapsulation substratemay be positioned on the filler. The encapsulation substratemay encapsulate the display layer DL, particularly the light emitting device ED, to prevent moisture or oxygen from penetrating from the outside. Instead of or together with the encapsulation substrate, a thin-film encapsulation layer including one or more inorganic layers and one or more organic layers may be positioned on the capping layer.

510 A touch sensor layer (not shown) may be positioned on the encapsulation substrate, and an anti-reflection layer (not shown) may be positioned on the touch sensor layer to reduce external light reflection.

5 FIG. 6 FIG. 5 FIG. is a schematic cross-sectional view of a spacer and a protective layer included in a display device according to an embodiment.is an enlarged view of region A of.

5 6 FIGS.and 4 FIG. In describing, cross-reference may be made to.

5 6 FIGS.and 200 195 210 220 Referring to, the protective layerpositioned on the spacermay include the first layerand the second layer.

195 196 195 197 196 198 197 196 195 197 196 197 196 198 190 198 197 195 198 196 195 196 197 198 The spacermay include a central portionincluding the center of the spacer, a step portionsurrounding the central portion, and a peripheral portionsurrounding the step portion. The central portionmay refer to a region from the center of the spacerto a predetermined distance. The step portionmay refer to a region from the outer edge of the central portionto a predetermined distance. The step portionmay have a concave step from the upper surface of the central portionand the peripheral portionin the direction of the pixel defining layer. The peripheral portionmay refer to a region from the outer edge of the step portionto the outer edge of the spacer. The height of the peripheral portionmay be less than the height of the central portion. The spacermay include the central portion, the step portion, and the peripheral portion.

4 FIG. 195 195 195 195 2 300 195 400 300 195 195 For example, the light emitting layer EL described with reference tomay be deposited using a mask such as a fine metal mask, and the mask may be in contact with the spacer. Pressure may be applied to the spacerby the mask, which may cause cracks to occur in the spacer. Cracks formed in the spacermay cause cracks to occur in the intermediate layer EM, the common electrode E, and the capping layerpositioned on the spacer. Materials of the fillerpositioned on the capping layermay flow into the intermediate layer EM through the cracks. Therefore, dark spots may occur in regions where the filler is introduced. In addition, outgassing may occur in the spacerdue to cracks formed in the spacer, resulting in dot stains.

200 195 195 195 However, the protective layermay be positioned on the spacerto prevent cracking of the spacerdue to a mask or the like. Accordingly, it is possible to prevent the filler from flowing into the intermediate layer through the cracks, and suppress outgassing from occurring through the cracks formed in the spacer. Therefore, it is possible to prevent the occurrence of dark spots or dot stains in the display area.

200 196 195 200 196 195 200 196 200 201 196 202 197 201 200 196 195 202 200 197 195 202 196 197 200 197 195 202 The protective layermay be positioned on the central portionof the spacer. The protective layermay completely cover the central portionof the spacer, and both sides of the protective layermay protrude laterally from the central portion. The protective layermay include a bodypositioned on the central portionand a wingpositioned on the step portion. The bodymay refer to a region of the protective layerpositioned on the central portionof the spacer. The wingmay refer to a region of the protective layerpositioned on the step portionof the spacer. The wingmay not overlap the central portion, but may overlap the step portion. The protective layermay prevent dark spots from occurring due to defects that may occur at the step portiondue to pressure being applied to the spacerby, for example, a mask for deposition of the light emitting layer EL, including the wing.

201 196 201 210 220 201 210 196 220 210 The bodymay contact the central portion. The bodymay include a body of the first layerand a body of the second layer. For example, the bodymay include a body of the first layerin contact with the central portionand a body of the second layerin contact with the body of the first layer.

202 197 202 210 210 202 210 197 197 220 210 197 197 202 197 197 The wingmay be spaced apart from the step portion. The wingmay include a wing of the first layerand a wing of the first layer. For example, the wingmay include a region of the first layerpositioned on the step portionand spaced apart from the step portionand a region of the second layerpositioned on the region of the first layerspaced apart from the step portion. The penetration of foreign substances into the step portionmay be prevented by the wingspaced apart from the step portion. Accordingly, dark spots caused by foreign substances penetrating the step portionmay be prevented.

202 201 202 202 202 202 201 202 202 201 In an embodiment, the thickness of the wingmay be less than the thickness of the body. The end of the wingmay have a chamfered shape. For example, the wingmay have an oblique inclined surface in the end direction of the wing. The inclined surface may be formed in the direction of the end of the wingfrom the boundary of the bodyand the wing. Accordingly, the thickness of the wingmay be less than the thickness of the body.

202 202 202 202 197 195 The end of the wingmay have an internal angle θ of about 30° to about 50°, about 35° to about 50°, or about 35° to about 45°. For example, the end of the wingmay have an inclined surface to have an inner angle within the above range. In the above inner angle range, the wingmay be prevented from becoming too thin. Accordingly, the wingmay be prevented from breaking, thereby preventing damage to the step portionof the spacer.

200 198 195 200 196 197 195 210 220 200 196 210 220 200 197 210 220 197 202 197 220 197 197 200 196 195 In an embodiment, the protective layermay not be formed on the peripheral portionof the spacer. For example, the protective layermay be formed on the central portionand on a portion of the step portionof the spacer. The first layerand the second layerof the protective layermay be positioned together on the central portion. The first layerand the second layerof the protective layermay be positioned together on the step portion. For example, the first layerand the second layermay be positioned on the step portionas the wingsspaced apart from the step portion. For example, a portion of the second layermay be positioned on the step portionin contact with the step portion. The protective layermay be formed only on the central portionof the spacer.

200 200 200 210 220 The protective layermay include a metal oxide. For example, the protective layermay include IGZO, IZO, indium zinc tin oxide (IZTO), ITO, zinc tin oxide (ZTO), or the like. The protective layermay include a metal oxide such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), or titanium (Ti). The first layerand the second layermay include the metal oxide described above.

2 6 FIGS.to 7 11 FIGS.to Hereinafter, a method of manufacturing a display device illustrated inwill be described with reference to.

7 11 FIGS.to are schematic cross-sectional views illustrating a method of manufacturing a light emitting display device according to an embodiment.

7 FIG. 120 110 110 120 110 120 130 130 140 140 Referring to, the buffer layermay be formed on the substrate. The transistor TR may be formed on the substrate. For example, the buffer layermay be formed on the substrate, and a semiconductor material layer of the transistor TR may be formed on the buffer layerand then patterned to form the semiconductor layer AL. The first gate insulating layermay be formed on the semiconductor layer AL. A conductive material layer may be formed on the first gate insulating layerand then patterned to form the gate conductive layer that may include the gate electrode GE of the transistor TR. The second gate insulating layermay be formed on the gate conductive layer. The conductive material layer may be formed on the second gate insulating layerand then patterned to form the data conductive layer that may include the first electrode SE of the transistor TR and the second electrode DE of the transistor TR.

160 180 160 180 180 180 The interlayer insulating layermay be formed on the first electrode SE and the second electrode DE. The insulating layermay be formed on the interlayer insulating layer. The insulating layermay be provided as a planarized layer. A contact hole overlapping at least one of the first electrode SE and the second electrode DE may be formed on the insulating layerthat may be provided as a planarized layer. A light emitting device that may be electrically connected to the transistor TR may be formed on the insulating layer.

180 1 1 180 A conductive material layer may be formed on the insulating layerthat may be provided as a planarized layer and then patterned to form the pixel electrode Eof the light emitting device. The pixel electrode Emay be electrically connected to the transistor TR through a contact hole formed in the insulating layer.

190 180 195 190 190 195 195 195 The pixel defining layermay be formed by coating an organic material layer on the insulating layerand then patterning it. The spacermay be formed on the pixel defining layer. The pixel defining layerand the spacermay be formed independently or simultaneously. The spacermay be formed to contact a fine metal mask to prevent the pre-formed structure from being damaged by the fine metal mask used during deposition of the light emitting layer. The spacermay have various planar shapes, such as a polygon such as a triangle or a circle.

195 195 A protective layer may be formed on the spacer. Forming the protective layer may include forming the first layer on the spacerand forming the second layer on the first layer.

195 195 197 195 The spacermay include the central portion, the step portion surrounding the central portion, and the peripheral portion surrounding the step portion. The central portion may refer to a region from the center of the spacerto a predetermined distance. The step portion may refer to a region from the outer edge of the central portion to a predetermined distance. The peripheral portion may refer to a region from the outer edge of the step portionto the outer edge of the spacer.

211 195 195 195 211 4 5 FIGS.and A preliminary first layermay be formed on the spacer. A first metal oxide may be deposited on the spacer. The first metal oxide may include substantially the same material as the metal oxide described with reference to. The first metal oxide may be entirely deposited on the spacerto form the preliminary first layer.

8 FIG. 195 211 195 211 195 211 211 Referring to, a first photoresist may be applied on the spaceron which the preliminary first layeris formed. The first photoresist may be a negative photoresist. The first photoresist may be applied to the central portion and the peripheral portion of the spaceron which the preliminary first layeris formed. Accordingly, the step portion may be etched. The first photoresist may also be applied to a portion above what will become the step portion of the spaceron which the preliminary first layeris formed. Accordingly, the preliminary first layerpositioned on a portion above what will become the step portion on which the first photoresist is applied may not be removed.

195 211 211 211 211 The spaceron which the first photoresist is applied may be etched. At least a portion of the preliminary first layerpositioned above what will become the step portion may be removed by etching. A portion of the preliminary first layerpositioned above what will become the step portion may not be etched. The unetched preliminary first layerabove what will become the step portion may be provided as a wing of the protective layer. For example, at least a portion of the preliminary first layermay be etched to form a portion of a wing positioned above what will become the step portion.

195 211 The etching may be performed by a wet process. For example, the spaceron which the first photoresist is applied may be placed in an etching solution to remove the preliminary first layerformed in the region of the portion where the first photoresist is not applied.

212 211 211 195 212 The first photoresist may be removed to form an etched preliminary first layerfrom which a portion of the preliminary first layeris removed. For example, a portion of the preliminary first layerpositioned at the step portion of the spacermay be removed to form the etched preliminary first layer.

9 FIG. 197 195 212 197 190 Referring to, an ashing process may be performed to form the step portionof the spaceron which the etched preliminary first layeris formed. Accordingly, the step portionmay have a concave hole in the direction of the pixel defining layer.

197 197 197 195 197 197 2 2 The forming of the step portionmay include plasma-treating the surface of the step portion. The ashing process may include plasma treatment using plasma. For example, the ashing process may be performed using helium (He) plasma, oxygen (O) plasma, nitrogen (N) plasma, or the like. Accordingly, the surface of the step portionof the spacermay be modified. Accordingly, outgassing, in which gas is released through the step portion, may be suppressed, and stains such as dots may be prevented from occurring due to outgassing through the step portion.

10 FIG. 5 6 FIGS.and 195 212 221 Referring to, a second metal oxide may be additionally deposited on the spaceron which the etched preliminary first layeris formed. Accordingly, a preliminary second layermay be formed. The second metal oxide may include substantially the same material as the metal oxide described with reference to.

221 212 195 197 195 197 197 197 221 197 197 A second photoresist may be applied on the preliminary second layerand on the etched preliminary first layer. The second photoresist may be a negative photoresist. The second photoresist may be applied to the central portion of the spacer. The second photoresist may also be applied to a portion of the step portionof the spacer. The second photoresist may also be applied to a portion of the step portion, so that a protective layer may be formed on the step portionand spaced apart from the step portion. The second photoresist may also be partially applied on the preliminary second layerpositioned on the step portionand in contact with the step portion.

11 FIG. 195 197 197 Referring to, the spacerto which the second photoresist is applied may be etched. At least a portion of the preliminary second layer positioned on the step portionmay be removed by etching. A portion of the preliminary second layer positioned on the step portionmay not be etched. The unetched preliminary second layer may form a wing of the second layer on a wing of the first layer. For example, a wing may be formed by forming the wing of the second layer positioned on the wing of the first layer.

195 198 210 220 The etching may be performed by a wet process. For example, the spaceron which the second photoresist is applied may be placed in an etching solution to remove the preliminary first layer and the preliminary second layer formed in the region of the portion where the second photoresist is not applied. Accordingly, the etched preliminary first layer and preliminary second layer positioned on the peripheral portionmay be removed to form the first layerand the second layer.

The preliminary first layer and the preliminary second layer may be etched so that the end of the wing have an internal angle of about 30° to about 50°, about 35° to about 50°, or about 35° to about 45°. Accordingly, the wing may have an appropriate thickness, so defects such as cracks in the wing caused by external forces may be suppressed.

210 220 200 210 220 200 200 The first layerand the second layerformed by etching the etched preliminary first layer and preliminary second layer may also be cured. Accordingly, the strength of the protective layerincluding the first layerand the second layermay be improved. Accordingly, even if a mask for forming a light emitting layer is positioned on the protective layer, defects such as cracks may not occur in the protective layer. For example, the curing may be performed by irradiating ultraviolet rays.

1 An intermediate layer including a light emitting layer and a functional layer may be formed on the pixel electrode E. The light emitting layer may be deposited using a fine metal mask. The functional layer may be fully deposited using an open mask. The functional layer may include two or more functional layers.

190 For example, a first functional layer, a light emitting layer, and a second functional layer may be formed sequentially. The first functional layer and the second functional layer may be fully deposited using an open mask. Accordingly, the first functional layer and the second functional layer may be formed over the entire display area. The light emitting layer may be deposited using a fine metal mask. The light emitting layer may be formed widely considering the margin of the deposition process, and accordingly, a portion of the light emitting layer may also be positioned on the pixel defining layer.

12 FIG.A 12 FIG.A 12 FIG.B 12 FIG.A is a photograph taken by an electron microscope of a portion of a spacer and a portion of a protective layer included in a display device according to an embodiment.is a photograph of a portion of the spacer and a portion of the protective layer manufactured by the method described above.is a line drawing of features shown in the photograph of.

12 12 FIGS.A andB 200 210 220 195 200 201 196 195 202 197 195 202 200 201 202 195 Referring to, the protective layerwith two layers, including the first layerand the second layer, is formed on the spacer. The protective layerincludes the bodypositioned at the central portionof the spacerand the wingpositioned at the step portionof the spacer. Additionally, the end of the wingincludes an inclined surface at a certain angle. Accordingly, it can be seen that the protective layermanufactured according to the above-described manufacturing process includes the bodyand the wingand is stably formed on the spacer.

A preliminary first protective unit was formed by depositing IGZO on a spacer including a central portion, a step portion, and a peripheral portion, and a first photoresist was applied to the central portion and a portion of the step portion. The spacer coated with the first photoresist was placed in an etching solution, and a wet etching process was performed to manufacture a spacer on which an etched preliminary first protective unit was deposited.

A preliminary second protective unit was formed by additionally depositing IGZO on the preliminary first protective unit, and a second photoresist was applied to the central portion and a portion of the step portion. The spacer coated with the second photoresist was placed in an etching solution, and a wet etching process was performed to manufacture a spacer having a protective layer including a first protective unit and a second protective unit deposited thereon.

A spacer with a protective layer deposited thereon was additionally manufactured using the same method as in Example 1.

IGZO was deposited on a spacer including a central portion, a step portion, and a peripheral portion, and the first photoresist was applied to the central portion and a portion of the step portion. A spacer coated with a first photosensitive agent was immersed in an etching solution, and a wet etching process was performed to manufacture a spacer with a preliminary protective layer deposited thereon.

The second photoresist was applied to the central portion and a portion of the step portion of the spacer on which the preliminary protective layer was deposited. A spacer coated with the second photoresist was placed in an etching solution and a wet etching process was performed to manufacture a spacer with a protective layer deposited thereon.

The angles of the end of the spacer with the protective layer manufactured according to the examples and comparative example deposited thereon were measured. The measured angles are shown in Table 1 below.

TABLE 1 Category Angle of end of spacer Average of angles Example 1 38.4° 41.4° Example 2 44.3° Example 3 41.4° Comparative 20.4° 20.4° Example 1

13 FIG.A 13 FIG.A 13 FIG.B 13 FIG.A 13 13 FIGS.A andB is a photograph taken by an electron microscope of a portion of a spacer and a portion of a protective layer included in a display device according to an embodiment.is a photograph taken by an electron microscope of a portion of a spacer having a protective layer formed according to Example 2.is a line drawing of features shown in the photograph of. Referring to, and Table 1, when the protective layer was formed as a two-layer structure including the first layer and the second layer, the angle at the end of the spacer was maintained at 40° to 50°. Therefore, the protective layer may have a strong structure, so defects such as cracks may be reduced.

14 FIG.A 14 FIG.B 14 FIG.A 14 is a photograph taken by an electron microscope of a portion of a spacer and a portion of a protective layer included in a display device according to a comparative example. FIG.A is a photograph taken by an electron microscope of a portion of a spacer having a protective layer formed according to Comparative Example 1.is a line drawing of features shown in the photograph of.

14 14 FIGS.A andB Referring to, and Table 1, when the protective layer was formed as a single layer, the angle at the end of the spacer decreased. Therefore, the protective layer may become weaker, which may increase defects such as cracks.

A display device according to an embodiment may be applied to various electronic devices. An electronic device according to an embodiment may include the display device, and may further include modules or devices having additional functions other than the display device.

15 FIG. 15 FIG. 1000 1100 1200 1300 1400 is a block diagram of an electronic device according to an embodiment. Referring to, the electronic deviceaccording to an embodiment may include a display module, a processor, a memory, and a power module.

1200 The processormay include at least one of a central processing unit (CPU), an application processor (AP), a graphic processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller

1300 1200 1100 1200 1300 1100 1100 The memorymay store data information necessary for operations of the processoror the display module. When the processorexecutes an application stored in the memory, video data signals and/or input control signals are transmitted to the display module, and the display modulecan process the received signals to output video information through the display screen.

1400 1000 The power modulemay include a power supply module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power necessary for the operation of the electronic device.

1100 1100 1200 1300 1400 1100 At least one of components of the electronic devicemay be included within the display device according to the above-described embodiments. Additionally, some of the individual modules that are functionally included within a single module may be incorporated into the display device, while others may be provided separately from the display device. For example, the display device may include the display module, while the processor, memory, and power modulemay be provided in a form of other devices within the electronic devicethat are not part of the display device.

16 FIG. shows schematic diagrams of electronic devices according to various embodiments

16 FIG. 1000 1 1000 1 1000 1 1000 1 1000 1 1000 2 1000 2 1000 2 1000 3 a b c d e a b c Referring to, various electronic devices with the display device according to the embodiments may include not only image display electronic devices such as smartphones_, tablet PCs_, laptops_, TVs_, desktop monitors_, but also wearable electronic devices with display modules such as smart glasses_, head-mounted displays_, smart watches_, as well as automotive electronic devices with display modules_such as those placed on car dashboards, center fascias, CID (Center Information Display), room mirror displays, and so on.

While the present disclosure has been described with reference to embodiments thereof, it will be apparent to those of ordinary skill in the art that various changes and modifications may be made thereto without departing from the scope and spirit of the present disclosure as set forth in the following claims.