Package Structure

This application claims priority of Taiwan Patent Application No. TW 113140728, filed on Oct. 25, 2024, the entirety of which is incorporated by reference herein.

The present disclosure relate to a packaging structure, and, in particular, it relates to a packaging structure including a photodegradation prevention layer.

As the size of packaging structures becomes smaller, existing packaging structures often have problems such as insufficient bonding reliability and electrical failure. Therefore, it is limited in applications requiring high light-emitting efficiency and high brightness.

Therefore, although existing packaging structures have gradually met their intended uses, they still do not fully meet the requirements in all aspects. Therefore, there are still some problems to be overcome regarding the packaging structure.

The packaging structure of the present disclosure may include a photodegradation prevention layer disposed on the dielectric layer to prevent the light emitted by the light emitting element from damaging various elements in the package structure, such as the dielectric layer, and causing degradation of the various elements. For example, the photodegradation prevention layer may include metal or a Bragg reflector to effectively prevent the elements disposed under the photodegradation prevention layer from being damaged by the light emitted by the light-emitting element. Therefore, the packaging structure of the present disclosure can improve light-emitting efficiency, improve bonding reliability, and/or avoid electrical failure.

In some embodiments, a packaging structure is provided. The packaging structure includes a dielectric layer, a redistribution layer, a plurality of light-emitting elements, a photodegradation prevention layer, and a cover layer. The redistribution layer is disposed on the dielectric layer. The plurality of light-emitting elements is disposed on the redistribution layer and electrically connected to the redistribution layer.

The photodegradation prevention layer is disposed on the dielectric layer and surrounds the plurality of light-emitting elements. The cover layer is disposed on the plurality of light-emitting elements and the photodegradation prevention layer. The area of the photodegradation prevention layer accounts for at least 50% of the area of the cover layer.

The packaging structure of the present disclosure may be applied in various types of electronic apparatus. In order to make the features and advantages of some embodiments of the present disclosure more understand, some embodiments of the present disclosure are listed below in conjunction with the accompanying drawings, and are described in detail as follows.

Packaging structures of various embodiments of the present disclosure will be described in detail below. It should be understood that the following description provides many different embodiments for implementing various aspects of some embodiments of the present disclosure. The specific elements and arrangements described below are merely to clearly describe some embodiments of the present disclosure. Of course, these are only used as examples rather than limitations of the present disclosure. Furthermore, similar or corresponding reference numerals may be used in different embodiments to designate similar or corresponding elements in order to clearly describe the present disclosure. However, the use of these similar or corresponding reference numerals is only for the purpose of simply and clearly description of some embodiments of the present disclosure, and does not imply any correlation between the different embodiments or structures discussed.

It should be understood that relative terms, such as “lower”, “bottom”, “higher”, or “top” may be used in various embodiments to describe the relative relationship of one element of the drawings to another element. It will be understood that if the device in the drawings were turned upside down, elements described on the “lower” side would become elements on the “upper” side. The embodiments of the present disclosure can be understood together with the drawings, and the drawings of the present disclosure are also regarded as a portion of the disclosure. Furthermore, when it is mentioned that a first material layer is located on or over a second material layer, it may include the embodiment which the first material layer and the second material layer are in direct contact and the embodiment which the first material layer and the second material layer are not in direct contact with each other, that is one or more layers of other materials is between the first material layer and the second material layer. However, if the first material layer is directly on the second material layer, it means that the first material layer and the second material layer are in direct contact. In addition, it should be understood that ordinal numbers such as “first”, “second”, and the like used in the description and claims are used to modify elements and are not intended to imply and represent the element(s) have any previous ordinal numbers, and do not represent the order of a certain element and another element, or the order of the manufacturing method, and the use of these ordinal numbers is only used to clearly distinguished an element with a certain name and another element with the same name. The claims and the specification may not use the same terms, for example, a first element in the specification may be a second element in the claim.

Herein, the terms “approximately”, “about”, and “substantially” generally mean within 10%, within 5%, within 3%, within 2%, within 1%, or within 0.5% of a given value or range. The given value is an approximate value, that is, “approximately”, “about”, and “substantially” can still be implied without the specific description of “approximately”, “about”, and “substantially”. The term “between a first value and a second value” or “a first value ˜ a second value” means that the range includes the first value, the second value, and other values in between. Furthermore, any two values or directions used for comparison may have certain tolerance. If the first value is equal to the second value, it implies that there may be a tolerance within about 10%, within 5%, within 3%, within 2%, within 1%, or within 0.5% between the first value and the second value. If the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees. If the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

1 2 3 3 Herein, the respective directions are not limited to three axes of the rectangular coordinate system, such as the X-axis, the Y-axis, and the Z-axis, and may be interpreted in a broader sense. For example, the X-axis, the Y-axis, and the Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other, but the present disclosure is not limited thereto. For ease of description, hereinafter, the X-axis represents a first direction D(width direction), the Y-axis represents a second direction D(length direction), and the Z-axis represents a third direction D(thickness/depth direction). In some embodiments, the schematic top views of the present disclosure are schematic top views observing the XY plane, and the schematic cross-sectional views of the present disclosure are schematic cross-sectional views observing the XZ plane. In some embodiments, the third direction Dmay be a normal direction of the light-emitting element. In some embodiments, the terms “a distance between a first element and a second element” means that the distance is between a first boundary of the first element and a second boundary of the second element, wherein the second boundary is the boundary closest to the first element.

1 FIG. 2 3 FIGS.and 2 FIG. 1 FIG. 3 FIG. 1 FIG. 1 3 FIGS.to 1 1 1 46 44 10 30 20 Referring to, it is a schematic top view of a packaging structureaccording to some embodiments of the present disclosure. Meanwhile, referring to, they are schematic cross-sectional views of the packaging structureaccording to some embodiments of the present disclosure.shows a schematic cross-sectional view taken along line segment Ia-Ia′ in, andshows a schematic cross-sectional view taken along line segment Ib-Ib′ in. As shown in, in some embodiments, the packaging structuremay include a dielectric layer, a redistribution layer, a plurality of light-emitting elements, a photodegradation prevention layer, and a cover layer.

1 3 FIGS.to 46 46 As shown in, in some embodiments, the dielectric layermay include an oxide such as silicon oxide, a nitride such as silicon nitride, an oxynitride such as silicon oxynitride, a polymer, a resin, the like, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the polymer may include polyimide (PI), polybenzoxazole (PBO), benzocyclobutene (BCB), the like, or a combination thereof, but the present disclosure is not limited thereto. For example, the dielectric layermay include polybenzoxazole.

1 3 FIGS.to 44 46 44 As shown in, in some embodiments, the redistribution layermay be disposed on the dielectric layer. In some embodiments, the redistribution layermay include a conductive material. In some embodiments, the conductive material may include a metal, a conductive metal oxide, a conductive metal nitride, the like, or a combination thereof, but the present disclosure is not limited thereto. For example, the metal may include tin (Sn), copper (Cu), gold (Au), silver (Ag), nickel (Ni), indium (In), platinum (Pt), palladium (Pd), iridium (Ir), titanium (Ti), chromium (Cr), tungsten (W), aluminum (Al), molybdenum (Mo), titanium (Ti), magnesium (Mg), zinc (Zn), alloys thereof, compounds thereof, or a combination thereof, but the present disclosure is not limited thereto. For example, the conductive metal oxide may be a transparent conductive oxide (TCO). For example, the transparent conductive oxide may include indium tin oxide (ITO), antimony zinc oxide (AZO), tin oxide (SnO), zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), the like, or a combination thereof, but the present disclosure is not limited thereto. For example, the conductive metal nitride may include TIN, WN, TaN, the like, or a combination thereof, but the present disclosure is not limited thereto.

1 3 FIGS.to 10 44 10 44 1 10 3 10 10 As shown in, in some embodiments, the plurality of light-emitting elementsmay be disposed on the redistribution layer, and the plurality of light-emitting elementsmay be electrically connected to the redistribution layer. In some embodiments, in the first direction D, the light-emitting elementsmay be arranged spaced apart from each other. In some embodiments, in the third direction D, the light-emitting elementmay emit light upward. In some embodiments, the light-emitting elementmay be a light-emitting diode (LED), a mini light-emitting diode (mini LED), a micro light-emitting diode (micro LED), the like, or a combination thereof, but the present disclosure is not limited thereto.

10 10 1 10 1 3 FIGS.to In some embodiments, the light-emitting elementmay emit a red light, a green light, a blue light, an ultraviolet light (UV light) or light of other suitable wavelengths. In some embodiments, the number of the light-emitting elementsin the packaging structuremay be 1 to 100. For ease of description, three light-emitting elementsare shown inand subsequent drawings, but the present disclosure is not limited thereto.

10 10 10 10 10 10 10 10 12 12 12 10 10 10 10 44 12 12 12 12 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 In some embodiments, the light-emitting elementsmay include a red light-emitting elementR emitting the red light, a green light-emitting elementG emitting the green light, and a blue light-emitting elementB emitting the blue light. In some embodiments, the green light-emitting elementG may be disposed between the red light-emitting elementR and the blue light-emitting elementB. In some embodiments, the light-emitting elementmay include a growth substrate (not shown), a semiconductor stack (not shown), an insulating layer (not shown), a functional layer such as a reflective layer (not shown), and two bonding pads. In some embodiments, the semiconductor stack may include a first semiconductor layer (not shown), a light-emitting layer (not shown), and a second semiconductor layer (not shown) stacked in sequence, and the first semiconductor layer and the second semiconductor layer have different conductivity types. In some embodiments, the bonding padmay be electrically connected to the semiconductor stack. In some embodiments, the bonding padmay include the aforementioned conductive material. In some embodiments, the light-emitting element(for example, the red light-emitting elementR, the green light-emitting elementG, and the blue light-emitting elementB) may be electrically connected to the redistribution layervia the bonding pads(for example, bonding padsR, bonding padsG, and bonding padsB). In some embodiments, the light-emitting elementmay be devoid of a growth substrate (not shown), for example, the light-emitting elementmay include the semiconductor stack but does not include a growth substrate on which the semiconductor stack is grown. In some embodiments, the light-emitting surfaces of the red light-emitting elementR, the blue light-emitting elementB, and the green light-emitting elementG have a roughened structure. In some embodiments, the light-emitting surface of the blue light-emitting elementB or the green light-emitting elementG has a uniform roughened structure. The blue light-emitting elementB and the green light-emitting elementG have upper surfaces with periodically arranged concave-convex patterns. For example, the blue light-emitting elementB and the green light-emitting elementG are devoid of a growth substrate such as a patterned sapphire substrate (PSS), and their light-emitting surfaces have periodically arranged concave-convex patterns generated by laser lifting-off the patterned sapphire substrate. Specifically, the aforementioned concavo-convex patterns can be used to enhance light extraction and adjust the angle of direction of the blue light-emitting elementB and the green light-emitting elementG. In some embodiments, the light-emitting surface of the red light-emitting elementR has a non-uniform roughened structure (for example, non-uniform patterns). In some embodiments, a chemical etching may be used to produce the non-uniform roughened structure on the light-emitting surface of the red light-emitting elementR.

1 3 FIGS.to 30 46 30 10 10 46 42 30 30 10 30 12 10 30 12 3 30 44 As shown in, in some embodiments, the photodegradation prevention layermay be disposed on the dielectric layer, and the photodegradation prevention layermay surround the plurality of light-emitting elementsto prevent the light emitted by the light-emitting elementsfrom irradiating the dielectric layerand an intermediate layerbelow the photodegradation prevention layer. In some embodiments, the photodegradation prevention layermay surround the bottom of the light-emitting element. In some embodiments, the photodegradation prevention layermay surround the bonding padsof the light-emitting element. That is, the photodegradation prevention layermay cover at least a portion of the side surface or all of the side surface of the bonding pad. In some embodiments, in the third direction D, the photodegradation prevention layermay at least partially overlap the redistribution layer.

30 30 44 30 13 15 FIGS.to In some embodiments, the photodegradation prevention layermay include a metal, but the present disclosure is not limited thereto. For example, the metal may include tin (Sn), copper (Cu), gold (Au), silver (Ag), nickel (Ni), indium (In), platinum (Pt), palladium (Pd), iridium (Ir), titanium (Ti), chromium (Cr), tungsten (W), aluminum (Al), molybdenum (Mo), titanium (Ti), magnesium (Mg), zinc (Zn), alloys thereof, compounds thereof, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the material of the photodegradation prevention layermay be the same as or different from the material of the redistribution layer. In other embodiments, the photodegradation preventing layer (for example, the photodegradation prevention layer′ shown in) may include a Bragg reflector.

1 3 FIGS.to 3 10 30 10 30 1 30 3 30 1 3 1 30 1 30 As shown in, in some embodiments, in the normal direction (third direction D) of the light-emitting element, a top surface of the photodegradation prevention layermay be flush with or lower than a top surface of the light-emitting element. Accordingly, the photodegradation prevention layercan be prevented from affecting the visual effect of the packaging structure. For example, the photodegradation prevention layercan be prevented from reflecting light and causing problems such as bright spots and bright lines. In some embodiments, in the third direction D, the photodegradation prevention layermay have a thickness t. In some embodiments, in the third direction D, the thickness tof the photodegradation prevention layermay be less than or equal to 5000 angstroms (Å). For example, the thickness tof the photodegradation prevention layermay be 5000 angstroms, 4500 angstroms, 4000 angstroms, 3500 angstroms, 3000 angstroms, 2500 angstroms, 2000 angstroms, 1000 angstroms, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto.

1 3 FIGS.to 20 10 30 20 10 30 20 20 10 20 3 20 20 As shown in, in some embodiments, the cover layermay be disposed on the plurality of light-emitting elementsand the photodegradation prevention layer. In some embodiments, the cover layermay cover the top surface and a side surface of the light-emitting elementand the top surface and a side surface of the photodegradation prevention layer. In some embodiments, the cover layermay include an oxide such as silicon oxide, a nitride such as silicon nitride, an oxynitride such as silicon oxynitride, a polymer, a resin, the like, or a combination thereof, but the present disclosure is not limited thereto. For example, the cover layermay include hybrid-silicone. In some embodiments, the light emitted by the light-emitting elementis transmitted sequentially from the light-emitting surface and the cover layerall the way outward (for example, toward the third direction D). Therefore, the light transmittance (for example, the light transmittance in a range of the visible light) of the cover layermay be greater than or equal to 80% to provide a better display effect, but the present disclosure is not limited thereto. For example, the light transmittance of the cover layermay be 80%, 85%, 90%, 95%, 100% or any range of values between the aforementioned values.

1 FIG. 30 20 30 20 20 1 30 1 30 30 10 1 1 30 46 42 10 1 As shown in, in some embodiments, in a top view, an area of the photodegradation prevention layermay account for (occupy) at least 50% of an area of the cover layer. For example, the area of the photodegradation prevention layermay be 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 97%, 99%, 100% of the area of the cover layer, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the area of the cover layermay be substantially equal to the area of the packaging structure. In some embodiments, the area of the photodegradation prevention layermay account for at least 50% of the area of the packaging structure. Accordingly, since the photodegradation prevention layerhas a sufficient top-view area, the photodegradation prevention layercan effectively prevent the light emitted by the light-emitting elementin the packaging structurefrom damaging other elements in the packaging structure. For example, the photodegradation prevention layercan prevent the dielectric layerand the intermediate layer (for example, the intermediate layer) from being degraded after being irradiated by the light emitted from the light-emitting element, thereby increasing the reliability of the packaging structure.

1 FIG. 1 1 30 1 30 20 1 20 1 1 1 30 3 30 20 3 20 1 2 2 30 2 30 20 2 20 2 2 2 30 4 30 20 4 20 2 1 1 2 2 As shown in, in some embodiments, in a top view, in the first direction D, a distance sbetween an edgeEof the photodegradation prevention layerand an edgeEof the cover layermay be less than 20 um. In some embodiments, the distance smay be greater than or equal to 0 (zero). In some embodiments, in a top view, in the first direction D, a distance s′ between an edgeEof the photodegradation prevention layerand an edgeEof the cover layermay be less than 20 um. In some embodiments, the distance s′ may be greater than or equal to 0. In some embodiments, in a top view, in the second direction D, a distance sbetween an edgeEof the photodegradation prevention layerand an edgeEof the cover layermay be less than 20 um. In some embodiments, the distance smay be greater than or equal to 0. In some embodiments, in a top view, in the second direction D, a distance s′ between an edgeEof the photodegradation prevention layerand an edgeEof the cover layermay be less than 20 um. In some embodiments, the distance s′ may be greater than or equal to 0. For example, each of the distances s, s′, s, s′ may be 0, 1 um, 2 um, 5 um, 10 um, 15 um, 19 um, 19.9 um, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto.

30 1 1 2 2 1 1 30 1 1 2 2 1 In some embodiments, when the photodegradation prevention layermay include a metal, each of the distances s, s′, s, s′ may be greater than 0 to improve the process margin (process window) of the cutting process and the reliability of the packaging structure. The packaging structurecan be obtained by performing a cutting process. In some embodiments, when the photodegradation prevention layermay include a metal, each of the distances s, s′, s, s′ may be greater than or equal to 10 um to correspond to the blade width or laser beam diameter of the cutting process, thereby further improving the process margin of the cutting process and the reliability of the packaging structure.

5 30 1 1 2 2 10 13 15 FIGS.to In other embodiments (for example, the packaging structureshown in), when the photodegradation prevention layer′ may include a Bragg reflector, at least one or each of the distances s, s′, s, s′ may be equal to 0 to increase the area of the Bragg reflector and fully avoid the light emitted by the light-emitting elementfrom damaging other elements in the packaging structure, thereby improving the reliability of the packaging structure.

1 FIG. 2 FIG. 20 30 30 44 30 44 As shown inand, in some embodiments, a patterned metal layer may be formed on the cover layer, wherein the patterned metal layer may serve as the photodegradation prevention layer. Next, another patterned metal layer may be formed on the photodegradation prevention layer, wherein the other patterned metal layer may serve as the redistribution layer. Accordingly, the photodegradation prevention layerand the redistribution layercan be formed at the same time.

2 FIG. 3 FIG. 30 20 30 20 30 20 3 30 44 44 20 44 20 44 20 42 44 20 As shown inand, in some embodiments, the photodegradation prevention layermay be in direct contact with the cover layer. In some embodiments, a bottom surface of the photodegradation prevention layermay be flush with a bottom surface of the cover layer(that is, the bottom surface of the photodegradation prevention layeris coplanar with the bottom surface of the cover layer). In some embodiments, in the third direction D, the top surface of the photodegradation prevention layermay be higher than a top surface of the redistribution layer. In some embodiments, the redistribution layermay be spaced apart from the cover layerby a distance. In other words, the redistribution layermay not directly contact the cover layer. In some embodiments, the redistribution layermay be physically separated from the cover layer. In some embodiments, the intermediate layermay be disposed between the redistribution layerand the cover layer.

2 3 FIGS.and 1 30 10 30 10 3 1 30 10 3 3 3 3 3 30 30 30 10 As shown in, in some embodiments, in the first direction D, the photodegradation prevention layermay be spaced apart from the light-emitting elementclosest to the photodegradation prevention layeramong the plurality of light-emitting elementsby a distance s. For example, in the first direction D, the photodegradation prevention layermay be spaced apart from the blue light-emitting elementB by the distance s. In some embodiments, the distance smay be less than or equal to 10 um. In some embodiments, the distance smay be greater than or equal to 0. For example, the distance smay be 0 um, 1 um, 2 um, 3 um, 4 um, 5 um, 6 um, 7 um, 8 um, 9 um, 10 um, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the distance smay be greater than or equal to 5 um. Accordingly, the area of the photodegradation prevention layercan be increased while maintaining the process margin of the photodegradation prevention layer, thereby improving the blocking effect of the photodegradation prevention layeron the light emitted from the light-emitting element.

2 3 FIGS.and 1 42 42 44 42 46 30 10 42 44 42 46 42 30 42 20 10 30 42 As shown in, in some embodiments, the packaging structuremay further include the intermediate layer. In some embodiments, the intermediate layermay be disposed on the redistribution layer. In some embodiments, the intermediate layermay be disposed between the dielectric layerand the photodegradation prevention layer. In some embodiments, the light-emitting elementmay be in direct contact with the intermediate layerand the redistribution layer. In some embodiments, the material of the intermediate layermay be the same as or different from the material of the dielectric layer. For example, the intermediate layermay include polybenzoxazole. In some embodiments, the photodegradation prevention layermay be disposed on the intermediate layer. In some embodiments, the cover layermay be in direct contact with the light-emitting element, the photodegradation prevention layer, and the intermediate layer.

2 FIG. 3 FIG. 1 50 52 46 44 50 52 50 52 44 10 44 52 1 52 50 52 52 1 10 52 3 52 52 2 As shown inand, in some embodiments, the packaging structuremay further include a filling material layerand metal pillars. In some embodiments, the dielectric layermay be disposed between the redistribution layerand the filling material layer. In some embodiments, the metal pillarsmay be disposed in the filling material layer, and the metal pillarsmay be electrically connected to the redistribution layer. In other words, since the light-emitting element, the redistribution layer, and the metal pillarscan be electrically connected to each other, the packaging structurecan be electrically connected to an external element through the metal pillars. In some embodiments, the filling material layermay include a molding material. In some embodiments, the molding material may include epoxy, silicone, the like, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the metal pillarsmay include the conductive material. The metal pillarscan significantly increase the thickness and volume of the metal layer in the packaging structureso as to improve current distribution, heat dissipation of the light-emitting elementsuch as LED, stress release, pressure buffering during subsequent die bonding, and element life. In some embodiments, the metal pillarsmay be formed by an electroplating process, a evaporation process, a screen printing process, a vacuum spraying process, the like, or a combination thereof. In some embodiments, in the third direction D, a thickness of the metal pillarsmay be between 5 um and 100 um. For example, the material of the metal pillarsmay include a metal, a metal alloy, a metal compound, or a combination thereof. For example, the metal may be tin (Sn), copper (Cu), gold (Au), silver (Ag), nickel (Ni), indium (In), platinum (Pt), palladium (Pd), iridium (Ir), titanium (Ti), chromium (Cr), tungsten (W), aluminum (Al), molybdenum (Mo), titanium (Ti), magnesium (Mg), zinc (Zn), germanium (Ge), or an alloy thereof. For example, the metal compound may be tantalum nitride (TaN), titanium nitride (TiN), tungsten silicide (WSi), indium tin oxide (ITO), and the like.

44 52 1 10 10 10 44 52 1 Accordingly, the redistribution layerand the metal pillarsin the packaging structurecan be used together as an extended electrode of the light-emitting elementto improve the light-emitting efficiency, improve the bonding reliability, and/or avoid electrical failure. Specifically, the alignment during bonding processes such as a fusion bonding is difficult to align, and results in reduced light-emitting efficiency of the light-emitting element, insufficient bonding reliability, and even electrical failure of the light-emitting element. In addition, since bonding processes such as fusion bonding require precise alignment, the process margin is also limited. Therefore, based on the present disclosure, the use of the redistribution layerand the metal pillarsas the extended electrodes of the packaging structurecan effectively avoid the aforementioned problems existing in the pad-to-pad (point-to-point) bonding structure.

4 FIG. 5 6 FIGS.and 5 FIG. 4 FIG. 6 FIG. 4 FIG. 2 2 Referring to, it is a schematic top view of a packaging structureaccording to some embodiments of the present disclosure. Referring to, they are schematic cross-sectional views of the packaging structureaccording to some embodiments of the present disclosure. Wherein,shows a schematic cross-sectional view taken along line segment IIa-IIa′ in, andshows a schematic cross-sectional view taken along line segment IIb-IIb′ in.

4 FIG. 20 44 30 2 30 44 As shown in, in some embodiments, a patterned metal layer may be formed on the cover layer, wherein a portion of the patterned metal layer may serve as the redistribution layer, and the remaining portion of the patterned metal layer may serve as the photodegradation prevention layer. Accordingly, the process of forming the packaging structurecan be simplified, and the photodegradation prevention layerand the redistribution layercan be formed at the same time.

4 FIG. 5 6 FIGS.and 3 30 44 30 20 44 20 30 20 44 20 3 30 44 30 44 30 44 1 2 30 44 4 4 4 4 As shown in, in some embodiments, in the third direction D, the photodegradation prevention layermay not overlap the redistribution layer. As shown in, in some embodiments, the photodegradation prevention layermay be in direct contact with the cover layer, and the redistribution layermay be in direct contact with the cover layer. In some embodiments, the top surface of the photodegradation prevention layermay be in direct contact with the bottom surface of the cover layer, and the top surface of the redistribution layermay be in direct contact with the bottom surface of the cover layer. In some embodiments, in the third direction D, the top surface of the photodegradation prevention layermay be flush with the top surface of the redistribution layer. In some embodiments, the photodegradation prevention layermay surround the redistribution layer. In some embodiments, the photodegradation prevention layermay be physically separated from the redistribution layer. In other words, in the first direction Dand/or the second direction D, the photodegradation prevention layermay be spaced apart from the redistribution layerby a distance sor s′. In some embodiments, each of distances sand s′ may be greater than 0.

5 6 FIGS.and 30 44 30 44 46 30 44 30 44 30 44 30 44 42 2 2 46 4 4 30 44 46 1 30 20 As shown in, in some embodiments, the photodegradation prevention layerand the redistribution layermay be disposed on the same layer. That is, the photodegradation prevention layerand the redistribution layermay be together disposed on the dielectric layer. In some embodiments, the bottom surface of the photodegradation prevention layermay be flush with a bottom surface of the redistribution layer. In some embodiments, the photodegradation prevention layerand the redistribution layermay be formed by the same process step or by different process steps. For example, the photodegradation prevention layerand the redistribution layermay be formed by the same process step, and the photodegradation prevention layerand the redistribution layermay include the same material. In some embodiments, the intermediate layermay be omitted in the packaging structureto reduce the overall thickness of the packaging structureand/or simplify the process. In some embodiments, a portion of the dielectric layermay be exposed from the distances sand s′ between the photodegradation prevention layerand the redistribution layer. In some embodiments, a portion of the dielectric layermay be exposed from the distance sbetween an edge of the photodegradation prevention layerand an edge of the cover layer.

7 FIG. 8 FIG. 9 FIG. 8 FIG. 7 FIG. 9 FIG. 7 FIG. 3 3 Referring to, it is a schematic top view of a packaging structureaccording to some embodiments of the present disclosure. Referring toand, they are schematic cross-sectional views of the packaging structureaccording to some embodiments of the present disclosure. Wherein,shows a schematic cross-sectional view taken along line segment IIIa-IIIa′ in, andshows a schematic cross-sectional view taken along line segment IIIb-IIIb′ in.

7 8 FIGS.and 20 44 30 3 30 44 As shown in, in some embodiments, a patterned metal layer may be formed on the cover layer, wherein the patterned metal layer may serve as both the redistribution layerand the photodegradation prevention layer. Accordingly, the process of forming the packaging structurecan be simplified, and the photodegradation prevention layerand the redistribution layercan be formed at the same time.

7 FIG. 30 44 44 30 44 30 20 20 3 44 30 3 44 10 52 44 52 44 3 As shown in, in some embodiments, the photodegradation prevention layermay be directly connected to the redistribution layer. In some embodiments, the redistribution layermay substantially function as the photodegradation prevention layer. Therefore, in a top view, an area of the redistribution layer(the photodegradation prevention layer) may account for at least 50% of the area of the cover layer. In some embodiments, the area of the cover layermay be substantially equal to the area of the packaging structure. In some embodiments, the area of the redistribution layer(the photodegradation prevention layer) may account for at least 50% of the area of the packaging structure. Accordingly, the bonding margin between the redistribution layerand the light-emitting elementcan be improved. In addition, the bonding margin between the metal pillarsand the redistribution layerand/or the bonding area between the metal pillarsand the redistribution layermay be increased. Therefore, the reliability of the packaging structureis improved.

8 9 FIGS.and 30 44 20 30 10 10 20 30 20 30 10 30 10 3 10 42 3 3 46 30 44 46 1 30 44 20 As shown in, in some embodiments, the photodegradation prevention layer, that is, the redistribution layer, may be in direct contact with the cover layer. In some embodiments, the photodegradation prevention layermay cover the bottom surfaces of the plurality of light-emitting elements. In some embodiments, the projection range of the light-emitting elementson the cover layermay be located within the projection range of the photodegradation prevention layeron the cover layer. Accordingly, since the photodegradation prevention layercan cover the bottom surfaces of the plurality of light-emitting elements, the photodegradation prevention layercan effectively block the light emitted by the light-emitting elementfrom damaging other elements in the packaging structure. Specifically, it is possible to prevent the light emitted from the light-emitting elementfrom being reflected or scattered and irradiating other elements, thereby preventing the other elements from being degraded. In some embodiments, the intermediate layermay be omitted in the packaging structureto reduce the overall thickness of the packaging structureand/or simplify the process. In some embodiments, a portion of the dielectric layermay be exposed from the photodegradation prevention layerand the redistribution layer. That is, the portion of the dielectric layermay be exposed from the distance sbetween the edge of the photodegradation prevention layer(the redistribution layer) and the edge of the cover layer.

10 FIG. 11 12 FIGS.and 11 FIG. 10 FIG. 12 FIG. 10 FIG. 4 4 Referring to, it is a schematic top view of a packaging structureaccording to some embodiments of the present disclosure. Referring to, they are schematic cross-sectional views of the packaging structureaccording to some embodiments of the present disclosure. Wherein,is a schematic cross-sectional view taken along line segment IVa-IVa′ in, andis a schematic cross-sectional view taken along line segment IVb-IVb′ in.

10 FIG. 20 30 30 44 30 44 As shown in, in some embodiments, a patterned metal layer may be formed on the cover layer, wherein the patterned metal layer may serve as the photodegradation prevention layer. Next, another patterned metal layer may be formed on the photodegradation prevention layer, wherein the other patterned metal layer may serve as the redistribution layer. Accordingly, the photodegradation prevention layerand the redistribution layercan be formed at the same time.

10 FIG. 44 20 44 20 20 4 44 4 44 44 10 4 4 As shown in, in some embodiments, in a top view, the area of the redistribution layermay accounts for at least 50% of the area of the cover layer. For example, the area of the redistribution layermay be 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 97%, 99%, 100% of the area of the cover layer, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. In some embodiments, the area of the cover layermay be substantially equal to the area of the top view of the packaging structure. In some embodiments, the area of the redistribution layermay account for at least 50% of the area of the top view of the packaging structure. Accordingly, since the redistribution layerhas a sufficient top-view area, the redistribution layercan effectively prevent the light emitted from the light-emitting elementin the packaging structurefrom damaging other elements in the packaging structure.

44 30 44 30 20 20 30 44 30 44 10 4 4 In some embodiments, the area of the redistribution layermay be larger than the area of the photodegradation prevention layer. In some embodiments, the difference between the area of the redistribution layerand the area of the photodegradation prevention layermay be greater than 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 44% of the area of the cover layer, or any value or any range of values between the aforementioned values, but the present disclosure is not limited thereto. For example, when the area of the cover layermay be 100%, the area of the photodegradation prevention layermay be at least 50%, and the area of the redistribution layermay be at least 55%. Accordingly, by providing the photodegradation prevention layerand the redistribution layer, it is possible to effectively prevent the light emitted by the light-emitting elementin the packaging structurefrom damaging other elements in the packaging structure.

11 12 FIGS.and 11 12 FIGS.and 30 20 30 20 30 44 44 30 46 As shown in, in some embodiments, the photodegradation prevention layermay be in direct contact with the cover layer. In some embodiments, the bottom surface of the photodegradation prevention layermay be flush with the bottom surface of the cover layer. As shown in, in some embodiments, the photodegradation prevention layermay be disposed on the redistribution layer, and the redistribution layermay be disposed between the photodegradation prevention layerand the dielectric layer.

11 FIG. 12 FIG. 44 10 10 20 44 20 44 10 44 30 10 4 10 As shown inand, in some embodiments, the redistribution layermay cover the bottom surfaces of the plurality of light-emitting elements. In some embodiments, the projection range of the light-emitting elementon the cover layermay be located within the projection range of the redistribution layeron the cover layer. Accordingly, since the redistribution layercan cover the bottom surfaces of the plurality of light-emitting elements, both the redistribution layerand the photodegradation prevention layercan effectively block the light emitted by the light-emitting elementfrom damaging other elements in the packaging structure. Specifically, it is possible to prevent the light emitted from the light-emitting elementfrom being reflected or scattered and irradiating other elements, thereby preventing the other elements from being degraded.

13 FIG. 14 15 FIGS.and 14 FIG. 13 FIG. 15 FIG. 13 FIG. 5 5 Referring to, it is a schematic top view of a packaging structureaccording to some embodiments of the present disclosure. Referring to, they are schematic cross-sectional views of the packaging structureaccording to some embodiments of the present disclosure. Wherein,shows a schematic cross-sectional view taken along the line segment Va-Va′ in, andshows a schematic cross-sectional view taken along the line segment Vb-Vb′ in.

13 FIG. 20 30 1 30 1 30 20 1 20 1 30 3 30 20 3 20 2 30 2 30 20 2 20 2 30 4 30 20 4 20 30 30 10 As shown in, in some embodiments, a Bragg reflector may be formed on the cover layer, wherein the Bragg reflector may serve as a photodegradation prevention layer′. In some embodiments, in the first direction D, an edge′Eof the photodegradation prevention layer′ may be flush with the edgeEof the cover layer. In some embodiments, in the first direction D, an edge′Eof the photodegradation prevention layer′ may be flush with the edgeEof the cover layer. In some embodiments, in the second direction D, an edge′Eof the photodegradation prevention layer′ may be flush with the edgeEof the cover layer. In some embodiments, in the second direction D, an edge′Eof the photodegradation prevention layer′ may be flush with the edgeEof the cover layer. Accordingly, an area of the photodegradation prevention layer′ can be increased to enhance the blocking effect of the photodegradation prevention layer′ on the light emitted by the light-emitting element.

14 15 FIGS.and 30 20 30 30 44 30 10 10 20 30 20 30 10 30 10 5 10 30 44 10 44 30 As shown in, in some embodiments, a top surface of the photodegradation prevention layer′ may be in direct contact with the bottom surface of the cover layer. In some embodiments, the photodegradation prevention layer′ may include the Bragg reflector, and the photodegradation prevention layer′ may be disposed on the redistribution layer. In some embodiments, the photodegradation prevention layer′ may cover the bottom surfaces of the plurality of light-emitting elements. In some embodiments, the projection range of the light-emitting elementon the cover layermay be located within the projection range of the photodegradation prevention layer′ on the cover layer. Accordingly, since the photodegradation prevention layer′ can cover the bottom surfaces of the plurality of light-emitting elements, the photodegradation prevention layer′ can effectively block the light emitted by the light-emitting elementfrom damaging other elements in the packaging structure. Specifically, it is possible to prevent the light emitted from the light-emitting elementfrom being reflected or scattered and irradiating other elements, thereby preventing the other elements from being degraded. In some embodiments, the photodegradation prevention layer′ may cover a portion of the top surface of the redistribution layer, and the light-emitting elementmay be disposed on the remaining portion of the top surface of the redistribution layer, wherein the remaining portion is exposed by the photodegradation prevention layer′.

In some embodiments, the packaging structure of the present disclosure may be applied to applications requiring high light-emitting efficiency and high brightness.

16 FIG. 16 FIG. 6 6 1 5 1 5 6 6 6 6 1 6 60 1 60 60 1 60 6 62 62 1 60 Referring to, it is a schematic cross-sectional view of a display deviceaccording to some embodiments of the present disclosure. In some embodiments, the display devicemay include one or more of the packaging structurestoor any combination thereof. The packaging structurestocan be used as a pixel unit and applied in the display device. In some embodiments, the display devicemay further include an additional conductive layer, an additional insulating layer, an additional element, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the number of packaging structures in the display devicemay be 1 to 10000. For the convenience of description,shows that the display deviceincludes three packaging structures, but the present disclosure is not limited thereto. In some embodiments, the display devicemay include a circuit board, and the packaging structuremay be disposed on the circuit board. For example, the circuit boardmay be a printed circuit board (PCB). In some embodiments, the packaging structureand the circuit boardmay be electrically connected by a bonding material. In some embodiments, the display devicemay include a packaging material, and the packaging materialmay cover a top surface and a side surface of the packaging structureand a top surface of the circuit board.

17 FIG. 17 FIG. 7 7 6 6 7 7 6 Referring to, it is a schematic top view of a spliced display deviceaccording to some embodiments of the present disclosure. In some embodiments, the spliced display devicemay include multiple display devices. In some embodiments, the number of display devicesin the spliced display devicemay be 1 to 10000. For ease of description,shows that the spliced display deviceincludes nine display devices, but the present disclosure is not limited thereto.

Accordingly, the present disclosure improves the light-emitting efficiency of the packaging structure, improves the bonding reliability, and/or avoids electrical failure by providing the photodegradation prevention layer. For example, the problem of the dielectric layer and/or the intermediate layer being degraded after being irradiated by light from the light-emitting element can be avoided. Furthermore, since the reliability of the intermediate layer can be improved, the bonding reliability between the intermediate layer and the cover layer can be improved accordingly. Furthermore, since the reliability of the intermediate layer itself and the bonding reliability between the intermediate layer and the cover layer can be improved, external moisture and impurities can be prevented from entering the packaging structure, thereby improving the light-emitting efficiency, electrical stability, and/or reliability of the packaging structure.

The features among the various embodiments may be arbitrarily combined as long as they do not violate or conflict with the spirit of the disclosure. In addition, the scope of the present disclosure is not limited to the process, machine, manufacturing, material composition, device, method, and step in the specific embodiments described in the specification. A person of ordinary skill in the art will understand current and future processes, machine, manufacturing, material composition, device, method, and step from the content disclosed in some embodiments of the present disclosure, as long as the current or future processes, machine, manufacturing, material composition, device, method, and step performs substantially the same functions or obtain substantially the same results as the present disclosure. Therefore, the scope of the present disclosure includes the abovementioned process, machine, manufacturing, material composition, device, method, and steps. It is not necessary for any embodiment or claim of the present disclosure to achieve all of the objects, advantages, and/or features disclosed herein.

The foregoing outlines features of several embodiments of the present disclosure, so that a person of ordinary skill in the art may better understand the aspects of the present disclosure. A person of ordinary skill in the art should appreciate that the present disclosure may be readily used as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. A person of ordinary skill in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.