Power Control Apparatus

This application claims priority to European Application No. 24212207.5, filed on Nov. 11, 2024, as well as European Application No. 24220806.4, filed on Dec. 17, 2024. The disclosure of both applications is specifically incorporated herein by reference.

The invention relates to a power control apparatus. In particular, the present invention relates to an apparatus that controls power supply by evaluating the current supplied by the power control apparatus.

Electrical loads connected to a power supply system often require control of the supplied electrical power, particularly to protect the connected electrical loads. Such loads may need protection from overload and overcurrent. Additionally, electrical loads connected to a power supply system must sometimes be turned on or off. Therefore, the electrical power supplied to these loads needs to be conditioned during both the turn-on and turn-off phases. A connected load may also have different operational modes, each requiring adaptation or conditioning of the supplied electrical power.

Conventional electrical protection devices often use current sensors to measure the current flowing to the connected load, enabling detection of critical situations and automatic triggering of an electronic or electromechanical switch if a critical situation is detected. A current measurement element, such as a Hall sensor, can measure the electrical current and provide corresponding measurement values to an integrated controller, which may switch off relevant components of the protection device if the measured current values exceed a predetermined threshold. Some conventional protection devices use semiconductor switches, such as MOSFETs, to protect connected loads against over-currents or overloads.

However, these conventional protection devices typically require sensor elements in the current supply path to measure the electrical current flowing to the connected load. These sensor elements can cause additional energy losses and may hinder the miniaturization of the electrical protection device.

In particular, when electrical current is monitored by a lossy electrically conductive component, such as an inductor, it may result in energy losses that must then be dissipated as heat. This heat may cause a temperature-dependent effects, for example within the switching elements of a device controlling the power flow.

Accordingly, the objective of the present invention is to provide a power control apparatus that can control the electrical power supplied while accounting for temperature-dependent effects. In particular, the invention aims to offer a concept for compensating for variations caused by changes in temperature or other influencing factors.

This objective is achieved by the features of the independent claim. Further advantageous embodiments are subject matter of the dependent claims

In an aspect of the present invention, a power control apparatus is provided. The power control apparatus may be configured for controlling electrical power supplied to a connected load. The apparatus comprises an input terminal, an output terminal, a semiconductor switching stage through which the connected load receives the load current, an evaluation circuit and a thermal compensation unit. The input terminal may be configured to be connected to an electrical power source. The output terminal may be configured to be connected to the load. The semiconductor stage comprises two power switching modules. Each power switching module may comprise one or more power switching elements such as a semiconductor switch. The individual switching elements of a power switching module may be arranged in parallel. The two power switching modules may be arranged in series between the input terminal and the output terminal. In particular, the two power switching modules have opposite orientations. Accordingly, by this opposite orientation of the two power switching modules, the power switching stage is able to interrupt an electrical current independent of the polarity of the applied voltage. The evaluation circuit is adapted to evaluate a current between the input terminal and the output terminal. In particular, the evaluation circuit may be adapted to evaluate the voltage drop over the semiconductor switching stage. Thus, a switching status of the semiconductor switching stage may be controlled or influenced based on the evaluation performed by the evaluation circuit. Especially, the evaluation circuit may provide an output signal based on the evaluated current. The thermal compensation unit is adapted to adjust the output signal provided by the evaluation circuit. In particular, the thermal compensation unit may adjust the output signal or parameters of a signal-processing stage based on a temperature in the power path between the input terminal and the output terminal. In this context, temperature compensation may refer to an adaptation of the signal-evaluation parameters rather than an adjustment of the switching behaviour of the semiconductor elements themselves.

The present invention is based on the finding that at least some properties of electronic components such as semiconductor switches or signals which relate to the sensed properties such as a current, voltage or the like, may vary depending on the temperature. Thus, when designing devices with such temperature-dependent properties, the devices must be dimensioned so that they can handle these variations even under the most unfavourable conditions. This may lead to huge safety margins, making devices large and expensive.

The present invention therefore takes into account these findings and aims to provide a concept for controlling a power control apparatus more reliable even under the conditions of the temperature variations. For this purpose, the present invention introduces a concept of temperature compensation for signals which serve as a basis for controlling the power control apparatus. Due to such a temperature compensation of the control signals, the operation of the control strategy can be performed more precisely in view of the real temperature conditions and the related deviations of the individual components. Thus, safety margins can be reduced.

In a possible embodiment, the power control apparatus may comprise at least one conductive or inductive elements in the current path between the input terminal and the output terminal. In particular, such a conductive or inductive element may be positioned between the input terminal and the semiconductor switching stage and/or between the semiconductor switching stage and the output terminal. Accordingly, a voltage drop over the conductive or inductive elements may be analysed by the evaluation circuit in order to identify conditions of the current flowing through the power control apparatus between the input terminal and the output terminal. For example, a conductive element may be used in order to analyse an amplitude of the current between the input terminal and the output terminal. Additionally or alternatively, an inductive element may be used in order to analyse a gradient of the current between the input terminal and the output terminal.

In a possible embodiment, the temperature in the power path between the input terminal and the output terminal may comprise a temperature of the semiconductor switching stage. In this way, temperature-dependent properties related to the semiconductor switches in the semiconductor switching stage may be considered for the operational strategy of the power control apparatus.

In a possible embodiment, the thermal compensation unit may comprise a temperature-dependent resistor. For example, such a temperature-dependent resistor may be located nearby or close to the semiconductor switching stage so as to sense representative thermal conditions relevant for the signal derived from the current path, while remaining electrically separated from the power switching devices. Alternatively, another temperature-dependent device may be used. Further, it may be also possible to use a combination of one or more conventional resistors together with one or more temperature-dependent devices, specifically temperature-dependent resistors.

In a possible embodiment, the thermal compensation unit may comprise a compensation network with multiple electronic components such as resistors and/or capacitors. Accordingly, the compensation network may be adapted to selectively connect individually one or more of these electronic devices to an output port providing the output signal. Accordingly, by controlling the connection of the individual electronic components such as resistors or capacitors to this output port, the electronic properties at this output port may be adapted. In particular, the connection of the electronic components to the output port may be controlled based on a temperature, specifically a temperature of the semiconductor switching stage or another relevant position in connection with temperature-dependent properties.

In a possible embodiment, the power control apparatus may comprise a processing unit. The processing unit may be realised, for example, by a processor and a related memory storing instructions which causes the processor to perform desired operations. Furthermore, the processing unit may be realised, for example, by a field programmable gate array (FPGA) or another device which is capable to perform the desired operations. The processing device may be configured to control the compensation network. In particular, the processing unit may control the compensation network based on a temperature, for example a temperature in the power path between the input terminal and the output terminal. In this way, the control unit may selectively connect the individual electronic components of the compensation network to the output port.

In a possible embodiment, the power control apparatus may comprise at least one temperature sensor. The at least one temperature sensor may be configured to provide a sensor signal that corresponds to a temperature, specifically to a temperature in the power path between the input terminal and the output terminal. For example, such temperature sensor may be a temperature-dependent resistor or another temperature-dependent electronic component. In this way, the temperature at the relevant spatial positions in the power control apparatus can be monitored and the temperature compensation can be applied based on the sensed temperature.

Additionally or alternatively, it may be also possible to apply a temperature model in the processing unit. For example, the processing unit may determine a temperature in the current path between the input terminal and the output terminal based on other parameters, such as a sensed current, specifically a sensed current over time. In such an approach, the temperature may be calculated, for example, based on a predetermined formula or based on data stored in a memory, for example a lookup table or the like.

In a possible embodiment, the thermal compensation unit may comprise a configuration unit. Such a configuration unit may be configured to adjust degree of thermal compensation for the output signal. Accordingly, the thermal compensation performed by the thermal compensation unit may be adjusted, specifically adjusted based on further requirements or constraints. In this way, the operational properties of the power control apparatus can be further fit to the desired operational properties.

In a possible embodiment, the configuration unit may comprise a communication interface. Such a communication interface may be configured to establish a communication to a remote device. For example, the communication interface may be used to receive data for adjusting the thermal compensation. Additionally or alternatively, the communication interface may be also used for providing an output signal or outputting appropriate data. For example, the communication interface may output data related to the current temperature, in particular the temperature used for the temperature compensation. Further, the communication interface may output an indication if a predetermined threshold is exceeded.

In a possible embodiment, the configuration unit may comprise an input unit for receiving at least one input parameter. Such input parameter may be received, for example, from a user. Additionally or alternatively, the input parameter may be received from a remote device. In case the input parameter shall be received from a user, the input unit may include, for example, one or more switches, jumpers or the like. Accordingly, the user can easily configure these switches jumpers or the like in order to set a desired configuration. In such a case, the current configuration can be easily recognised at any point in time by the user in order to verify the configuration.

In a possible embodiment, the power control apparatus may comprise a memory for providing a relationship between the temperature, in particular the temperature in the power path between the input terminal and the output terminal, and the degree of thermal compensation for the output signal. In particular, such a memory may be a non-volatile memory. For example, the data stored in this memory may be re-written based on data received by the communication interface. Alternatively, the memory may be a memory which can be written only once. In this case, it can be ensured that the stored data cannot be manipulated at a later point in time.

1 FIG. 1 1 11 12 11 2 12 3 2 3 shows a schematic diagram illustrating the basic principle underlying power control apparatusaccording to an embodiment. Power control apparatuscomprises an input terminaland an output terminal. Input terminalmay be connected to an electrical power source, which could be a DC or AC power source. Output terminalmay be connected to an electrical load, which operates using power provided by power source. For example, electrical loadcould be an electric machine.

1 20 11 12 20 21 22 21 22 21 22 20 11 12 Power control apparatusalso includes a semiconductor switching stage, arranged in a current path between input terminaland output terminal. Semiconductor switching stagecomprises two switching modulesand, each of which includes at least one semiconductor switching element. If switching modulesandcomprise multiple switching elements, these may be arranged in parallel. The switching elements might be MOSFETs or other suitable semiconductor devices. Importantly, the orientation of the switching elements in moduleis opposite to that in module, allowing semiconductor switching stageto interrupt the voltage between terminalsandregardless of polarity.

31 11 20 32 20 12 31 32 311 321 312 322 Additionally, a first electrical componentis located between input terminaland semiconductor switching stage, while a second electrical componentis positioned between semiconductor switching stageand output terminal. These componentsandmay include conductive elementsand, such as components with specific ohmic resistance. Alternatively, they could contain inductive elementsand, like coils with specific inductance.

11 12 40 42 31 32 To evaluate the magnitude or gradient of the electrical current, it may not be necessary to consider its polarity between input terminaland output terminal. Accordingly, evaluation circuitmay include a rectifying circuitthat rectifies input signals, such as voltage drops across componentsand.

1 40 11 12 40 41 40 40 11 12 1 11 40 2 12 40 40 21 22 20 40 21 22 1 FIG. Power control apparatusalso comprises an evaluation circuit, which assesses the current between input terminaland output terminal. For example, evaluation circuitmay generate an output signal based on the current between these terminals. This output may appear at an output portof evaluation circuit. Evaluation circuitmay be electrically connected to input terminaland/or output terminal. As shown in, a first diode Dlinks input terminalwith evaluation circuit, while a second diode Dconnects output terminalto evaluation circuit. Evaluation circuitis grounded to the same virtual ground as the connection point between switching modulesandin semiconductor switching stage. Evaluation circuitmay also receive control signals for the switching elements within modulesand.

40 50 41 40 50 1 41 40 50 20 50 20 11 12 11 12 1 FIG. The output signal from evaluation circuitmay be sent to a trigger and control device. For example, output portof evaluation circuitcould be electrically connected to an input port of trigger and control device. As illustrated in, capacitor Cmay be connected between output portof evaluation circuitand the virtual ground. Trigger and control devicegenerates appropriate control signals, which are applied to the control terminals of the semiconductor switches within semiconductor switching stage. Specifically, trigger and control devicemay cause semiconductor switching stageto interrupt the electrical connection between input terminaland output terminalupon detecting a predetermined condition. This condition could be, for instance, a current between input and output terminalsandthat exceeds a specified threshold, or an increase in the current gradient beyond a defined limit.

11 12 31 32 312 322 To assess the gradient of electric current between input terminaland output terminal, componentsandmay include inductive elementsand, such as coils or similar devices.

2 FIG. 1 FIG. 1 31 32 312 322 312 322 312 11 20 322 20 12 shows a schematic diagram of power control apparatusaccording to another embodiment. This apparatus is largely similar to the previously described power control apparatus inbut differs in that both electrical componentsandnow contain coilsand, respectively, which are magnetically coupled. Specifically, coilsandare positioned so that the magnetic field of the first coil, located between input terminaland semiconductor switching stage, and the second coil, situated between semiconductor switching stageand output terminal, constructively superimpose.

3 FIG. 2 FIG. 1 1 312 322 312 322 312 322 shows a top view of power control apparatusaccording to an embodiment. In this embodiment, power control apparatusincludes two magnetically coupled coilsand, as described in relation to. Coilsandmay be positioned one above the other. Alternatively, coilsandcould have a bifilar configuration.

1 20 20 100 312 322 20 20 312 322 312 322 20 Power control apparatusalso includes semiconductor switching stage, as previously described. Semiconductor switching stagemay be arranged, for instance, on a printed circuit board. Coilsandmight be positioned above semiconductor switching stage, effectively situating semiconductor switching stagebetween coilsandand the printed circuit board. Alternatively, coilsand/orcould encircle semiconductor switching stage, with the switching stage located within the loop formed by either or both coils.

4 FIG. 1 1 312 322 330 312 322 330 312 322 shows a cross-sectional view of power control apparatusaccording to a further embodiment. Power control apparatusin this embodiment also comprises two magnetically coupled coilsand, as already described above. In this embodiment, a magnetic coremay be arranged within coilsand. This magnetic coremay comprise a magnetically conductive material, such as ferrite or a similar material, to enhance the magnetic coupling between coilsand.

330 312 322 20 330 312 322 20 330 11 12 The magnetic coreis electrically isolated from the windings of both coiland coil, as well as from semiconductor switching stage. This isolation may be achieved using appropriate insulating material, such as an insulating lacquer. Alternatively, insulating elements, such as an insulating film or foil, may be positioned between magnetic coreand the windings of coilsandand/or semiconductor switching stage. In principle, magnetic coremay be entirely electrically isolated from all other components within the current path between input terminaland output terminal.

330 330 20 312 322 330 20 312 322 1 340 340 330 20 312 322 340 Magnetic coremay also have thermally conductive properties. Specifically, magnetic coremay be thermally coupled with semiconductor switching stageand/or coilsand. This allows magnetic coreto dissipate heat generated by semiconductor switching stageand/or coilsand. Optionally, power control apparatusmay include a cooling element, which could provide additional cooling. Cooling elementmay be thermally coupled to magnetic core, allowing it to transfer heat from semiconductor switching stageand/or coilsandto cooling element.

340 340 Cooling elementcould be a passive device, such as a heatsink, potentially with cooling fins for heat dissipation. Alternatively, cooling elementcould include an active cooler, such as a fan.

4 FIG. 1 312 322 330 312 322 20 312 322 20 40 50 As shown in, some components of power control apparatusmay be embedded within a moulding material. For instance, coilsandalong with magnetic corecould be enclosed by moulding material. Optionally, the coilsandand semiconductor switching stagecould also be embedded. The entire assembly, including coilsand, semiconductor switching stage, and additional components like evaluation circuitand trigger and control device, may be encased in the moulding material.

The moulding material may have electrical insulating properties and may also be thermally conductive to aid in dissipating heat from individual components to the surrounding environment.

5 FIG. 1 FIG. 1 1 313 11 20 313 313 shows power control apparatusaccording to a further embodiment. In this version, power control apparatusdiffers from the previously described apparatus (as shown in) by having a conductive elementpositioned between input terminaland semiconductor switching stage. Conductive elementmay comprise a linear or nearly linear conductive line, such as a conductive path on a printed circuit board. For example, this conductive path may be a signal line made of copper or another conductive material. Alternatively, conductive elementcould also be implemented as a conductive wire.

314 313 314 314 313 In addition, an induction elementmay be located adjacent to conductive element. Induction elementmay be formed by one or more loops—specifically, closed loops—of an electrically conductive material. For example, induction elementcould be made using a conductive path on a printed circuit board, forming one or more loops near conductive element.

313 11 20 314 40 40 314 313 11 12 When current flows through conductive elementfrom input terminalinto semiconductor switching stage, it generates a surrounding magnetic field. This magnetic field can be detected by induction element, where it may induce a current. The resulting current or voltage may then be provided to evaluation circuit. Evaluation circuitcan analyse the output from induction elementto assess the current through conductive element, thereby determining the current between input terminaland output terminal.

5 FIG. 40 42 42 314 11 12 As depicted in, evaluation circuitmay include a rectifying circuit. Rectifying circuitcan rectify the output signal from induction element, thus producing a signal corresponding to the current between input terminaland output terminal.

5 FIG. 313 314 11 20 20 12 313 314 20 11 20 20 12 Althoughshows conductive elementand induction elementbetween input terminaland semiconductor switching stage, these elements could also be positioned between semiconductor switching stageand output terminal. It may also be possible to place a conductive elementand an induction elementon both sides of semiconductor switching stage: one pair between input terminaland the semiconductor switching stage, and another pair between the semiconductor switching stageand output terminal.

6 FIG. 1 314 314 314 313 100 313 314 314 100 a b a b provides a cross-sectional view of power control apparatusin another embodiment. In this embodiment induction elementis divided into two sections,and. These sections are positioned on opposite sides of conductive elementand may be located on a printed circuit board. Both conductive elementand induction elementsandcould be implemented as conductive paths on printed circuit board.

315 313 314 314 315 315 313 314 314 315 313 314 314 100 a b a b a b One or more coupling elementsmay also be added to the assembly with conductive elementand induction elementsand. These coupling elementsmay comprise magnetically conductive material, such as ferrite. Importantly, coupling elementsare electrically isolated from conductive elementand induction elementsand, possibly through an insulating coating or foil. A coupling elementcould be situated above or below the arrangement of conductive elementand induction elementsand, potentially on the opposite side of printed circuit board.

313 314 11 12 11 12 In addition to the configurations of conductive elementand induction elementdescribed above, other setups, such as planar transformers or flat-type transformers, may be used to transfer current in the path between input terminaland output terminalto a separate galvanically isolated section. This setup could produce an output signal that corresponds to the current between input terminaland output terminal.

7 FIG. 1 40 314 40 shows a schematic circuit diagram of power control apparatusaccording to an embodiment. This figure illustrates one exemplary circuit structure of the evaluation circuit, showing how current-representative signals may be obtained and processed. The signals provided by induction elementsare processed in an analogue manner within the evaluation circuit. In particular, the evaluation circuit may comprise one or more rectifier stages, filter elements, and amplifier or comparator stages configured to evaluate the amplitude and/or time-dependent gradient of the current-representative signals. The analogue processing enables a fast and noise-resistant current evaluation without the need for digital sampling or conversion, allowing precise and continuous detection of current variations even at high switching frequencies.

1 313 314 313 314 313 314 40 In this embodiment, power control apparatusutilises the previously described configuration of conductive elementand induction element. In particular, a single conductive elementmay generate a magnetic field that is coupled into two induction elementsarranged in a balanced or symmetrical manner with respect to the conductive element. The two induction elementsmay each provide a signal that is representative of the same load current but with opposite polarity, thereby allowing a differential or symmetrical evaluation within the evaluation circuit.

313 314 314 40 11 12 In some embodiments, the conductive elementand the induction elementsmay be realised as parts of a single integrated component, for example as a composite magnetic structure or as a common substrate carrying both the current path and the inductive windings. This arrangement improves common-mode rejection and accuracy of the current determination. The output signal provided by induction elementmay be rectified, and processed by evaluation circuit. This signal may then be used to assess the gradient of current flowing between input terminaland output terminal.

40 1 313 20 2 20 12 11 12 Additionally, evaluation circuitmay be connected via diode Dto the connection point between conductive elementand semiconductor switching stage. It may also connect via diode Dto the point between semiconductor switching stageand output terminal. These signals can be utilised to evaluate the amplitude of the current flowing between input terminaland output terminal.

40 41 1 1 41 50 The output signal from evaluation circuitmay be provided at an output terminal, which may also connect to capacitor C. The opposite terminal of capacitor Cmay be connected to virtual ground. The output signal at output terminalmay then be received by trigger and control circuit.

1 20 20 1 Some components of power control apparatusmay exhibit temperature-dependent properties. For instance, the resistance of the semiconductor switches within semiconductor switching stage, when in a closed (conductive) state, may vary depending on the temperature of each respective semiconductor and, consequently, on the temperature of semiconductor switching stage. This dependency might be linear or follow another specific function. Additionally, other elements within power control apparatusmay also exhibit temperature-related dependencies.

1 20 42 7 FIG. To account for this temperature dependency, power control apparatusmay apply a suitable temperature compensation mechanism. For example, a temperature-dependent resistor T may be used, positioned near or close to semiconductor switching stage. As illustrated in, temperature-dependent resistor T may be arranged in parallel with an additional resistor R. Both temperature-dependent resistor T and additional resistor R could be placed in parallel between the two output terminals of rectifier circuit.

40 314 40 In this arrangement, the temperature-dependent resistor T forms part of an analogue compensation network associated with the evaluation circuit. The compensation network may influence the amplitude or slope of the signal derived from the induction elements, thereby maintaining a substantially constant response of the evaluation circuitover temperature. Such compensation therefore acts on the level of the signal processing rather than on the power-switching characteristics themselves, ensuring stable and reliable current detection over a wide operating temperature range.

8 FIG. 7 FIG. 8 FIG. 1 313 314 shows a schematic circuit diagram of a further embodiment of power control apparatus. In contrast to the embodiment illustrated in, in which a single conductive elementis provided whose magnetic field is coupled into two induction elementsarranged symmetrically, the embodiment ofutilises two separate sensing arrangements.

11 20 313 314 12 20 313 314 A first sensing arrangement is located between the input terminaland the semiconductor switching stage, comprising a conductive elementand an induction elementmagnetically coupled thereto. A second sensing arrangement is located between the output terminaland the semiconductor switching stage, likewise comprising a conductive elementand an induction elementmagnetically coupled thereto.

314 313 40 20 Each induction elementmay provide a respective signal representative of the current flowing through the associated conductive element. These signals may be rectified and/or supplied to the evaluation circuit, which may process the signals jointly or differentially in order to determine the overall load current or to monitor asymmetries between the input and output sides of the semiconductor switching stage.

313 314 20 In some embodiments, each pair of elementsandmay be realised as a common integrated component, or may be implemented on a shared substrate or magnetic core. This embodiment allows a symmetrical detection of current on both sides of the semiconductor switching stage, which can further improve noise immunity and temperature stability of the overall current evaluation.

40 50 7 FIG. The further configuration of the evaluation circuit, the trigger and control circuit, and the temperature-compensation arrangement may correspond to that described with reference to.

9 FIG. 1 1 43 41 40 43 43 40 20 shows a schematic diagram of power control apparatusaccording to a further embodiment. In this version, power control apparatusincludes a thermal compensation unit, located at output portof evaluation circuit. In a simple configuration, thermal compensation unitmay consist of at least one temperature-dependent resistor T, as described previously. In operation, the thermal compensation unitinteracts with the output stage of evaluation circuitto adjust signal levels or time constants according to the sensed temperature. The compensation thus acts on the characteristics of the analogue evaluation signal rather than on the electrical conduction behaviour of the switching stage, thereby maintaining a consistent signal response across a wide temperature range.

43 1 2 1 2 8 FIG. 8 FIG. Alternatively, thermal compensation unitmay include a compensation network, as depicted in. This compensation network could contain multiple elements, such as resistors or capacitors. Although the example inillustrates a network with two resistors Rnand Rnand two capacitors Cnand Cn, any other number or combination of elements could be possible. Furthermore, each path of the compensation network may contain a combination of multiple electronic components.

1 4 1 4 Each path in the compensation network may be individually activated or deactivated. For this purpose, each path may include a switch SW-SW. The switches SW-SWcould be semiconductor switches, such as MOSFETs.

1 4 A path can be activated by closing the respective switch SW-SW, and deactivated by opening the switch. Any suitable combination of paths may be applied, and it could be possible to activate multiple paths in parallel.

410 1 4 410 1 20 20 410 420 1 20 11 12 1 20 Control unitcould manage the operation of each switch SW-SW, providing individual control signals for each switch. Control unitmay consider the temperature of power control apparatus, particularly the temperature of semiconductor switching stageand/or other components. For example, one or more temperature sensors could be positioned appropriately—such as close to semiconductor switching stage—to provide temperature readings. The sensor signal could be sent to control unitvia an appropriate interface. Alternatively, it may be possible to estimate the temperature of power control apparatus, specifically semiconductor switching stage, using a temperature model. For instance, based on the current flowing between input terminaland output terminal, power control apparatuscould calculate an estimated temperature of semiconductor switching stage.

410 420 420 421 Additionally, control unitmay receive other relevant data or information, potentially through interface, which could also receive signals from a temperature sensor. Alternatively, a separate interfacecould be used to collect additional data. This data could specify the degree of temperature dependency required for the compensation network, enabling an adjustment of the temperature-dependent function accordingly. This information could be provided digitally, possibly via a communication protocol, or manually configured through an input device. Such an input device could include switches, jumpers, or similar controls, allowing users to easily configure these to achieve the desired setup.

In summary, the present invention relates to a power control apparatus for controlling electrical current between an input terminal and an output terminal. The current in the path between these two terminals can be monitored, with the monitoring signal corresponding to the current in the path being adjustable based on the temperature within the control apparatus.