Display Device and Foldable Electronic Device Including the Same

This application claims priority from Korean Patent Application No. 10-2024-0182057 filed on Dec. 9, 2024 in the Korean Intellectual Property Office, and all the benefits accruing therefrom under 35 U.S.C. 119, the contents of which in its entirety are herein incorporated by reference.

The present disclosure relates to a display device and a foldable electronic device including the same.

As the information society develops, the demand for display devices for displaying images has increased and diversified. The display devices may be liquid crystal displays (LCDs), field emission displays (FEDs), or light emitting displays (LEDs). The light emitting display may include an organic light emitting display including organic light emitting diode elements as light emitting elements, an inorganic light emitting display including inorganic light emitting diode elements as light emitting elements, or the like.

Recently, in order to increase portability of the display devices and provide wide display screens, bendable display devices in which a display area is bendable or foldable display devices in which a display area is foldable have been released.

Aspects of the present disclosure provide a display device having improved impact resistance, and a foldable electronic device including the same.

However, aspects of the present disclosure are not restricted to those set forth herein. The above and other aspects of the present disclosure will become more apparent to one of ordinary skill in the art to which the present disclosure pertains by referencing the detailed description of the present disclosure given below.

According to an aspect of the present disclosure, there is provided a display device including a display panel, and a panel support member disposed on the display panel and including a folding portion and a non-folding portion disposed on at least one side of the folding portion. The folding portion includes a plurality of slits penetrating through the panel support member and a plurality of bars disposed alternately with the plurality of slits. The panel support member further includes a plating layer covering at least a portion of the folding portion and including a metal material, and the plating layer is disposed on inner side surfaces of the plurality of slits.

In an embodiment, the metal material of the plating layer includes at least one of nickel, chromium, copper, zinc, gold, silver, palladium, tin, aluminum, iron, cobalt, and alloys thereof.

In an embodiment, a width of a slit of the plurality of slits is greater than or equal to a thickness of the panel support member excluding the plating layer.

In an embodiment, the plating layer includes a first side surface plating layer disposed on one side of a slit of the plurality of slits and a second side surface plating layer disposed on another side of the slit. The panel support member includes an opening disposed in a space between the first side surface plating layer and the second side surface plating layer, and a width of the opening is smaller than a width of the slit.

In an embodiment, the width of the opening is 50 μm or less.

In an embodiment, a thickness of the plating layer is smaller than half a thickness of the panel support member excluding the plating layer.

In an embodiment, the thickness of the plating layer is 40 μm or less.

In an embodiment, the plating layer is further disposed on at least one of an upper surface and a lower surface of the panel support member.

In an embodiment, the plating layer includes side surface plating layers disposed on inner side surfaces of the plurality of slits. The plating layer further includes at least one of an upper surface plating layer disposed on the upper surface of the panel support member and a lower surface plating layer disposed on the lower surface of the panel support member.

In an embodiment, the upper surface plating layer is disposed on the folding portion and is not disposed on the non-folding portion.

In an embodiment, the panel support member includes a metal plate or a fiber polymer.

According to an aspect of the present disclosure, there is provided a display device including a display panel, and a panel support member disposed on the display panel and including a folding portion and a non-folding portion disposed on at least one side of the folding portion. The folding portion includes a plurality of slits penetrating through the panel support member and a plurality of bars disposed alternately with the plurality of slits. The panel support member further includes a plating layer covering at least a portion of the folding portion, and the plating layer includes side surface plating layers disposed on inner side surfaces of the plurality of slits.

In an embodiment, the plating layer further includes an upper surface plating layer disposed on an upper surface of the panel support member and a lower surface plating layer disposed on a lower surface of the panel support member. Each of the upper surface plating layer and the lower surface plating layer is disposed on the plurality of bars.

In an embodiment, the upper surface plating layer and the lower surface plating layer are not disposed on the non-folding portion.

In an embodiment, a thickness of the panel support member in an area overlapping the folding portion is greater than a thickness of the panel support member in an area overlapping the non-folding portion.

In an embodiment, at least one of the upper surface plating layer and the lower surface plating layer is further disposed on the non-folding portion.

In an embodiment, a thickness of the plating layer is smaller than half a thickness of the panel support member excluding the plating layer.

In an embodiment, the plating layer includes a metal material.

In an embodiment, the panel support member includes a metal plate or a fiber polymer.

According to an aspect of the present disclosure, there is provided a foldable electronic device including a display device. The display device includes a display panel, a window member disposed above the display panel, an upper protection member disposed on the window member, a cover window disposed on the upper protection member, a panel protection member disposed below the display panel, and a panel support member disposed below the panel protection member and including a folding portion and a non-folding portion disposed on at least one side of the folding portion. The folding portion includes a plurality of slits penetrating through the panel support member and a plurality of bars disposed alternately with the plurality of slits. The panel support member further includes a plating layer covering at least a portion of the folding portion and including a metal material, and the plating layer is disposed on inner side surfaces of the plurality of slits.

With a display device and a foldable electronic device including the same according to an embodiment of the present disclosure, impact resistance may be improved.

The effects of the present disclosure are not limited to the aforementioned effects, and various other effects are included in the present specification.

The inventive concept will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the inventive concept are shown. The inventive concept may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art.

It will also be understood that when a layer is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. The same reference numbers indicate the same components throughout the specification.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

1 FIG. 2 FIG. 10 10 is a perspective view illustrating an unfolded state of a display deviceaccording to an embodiment.is a perspective view illustrating a folded state of the display deviceaccording to an embodiment.

1 2 FIGS.and 1 1 1 Referring to, an electronic devicedisplays a moving image or a still image. The electronic devicemay refer to all electronic devices that provide display screens. For example, televisions, laptop computers, monitors, billboards, the Internet of Things (IoT), mobile phones, smartphones, tablet personal computers (PCs), electronic watches, smart watches, watch phones, head mounted displays, mobile communication terminals, electronic notebooks, electronic books, portable multimedia players (PMPs), navigation devices, game machines, digital cameras, camcorders, and the like, that provide display screens, may be included in the electronic device.

1 10 10 The electronic devicemay include the display deviceproviding a display screen. The display deviceis a device that displays a moving image or a still image. Examples of the display device may include an inorganic light emitting diode display, an organic light emitting display, a quantum dot light emitting display, a plasma display, a field emission display, and the like. Hereinafter, a case where an organic light emitting diode display is applied as an example of the display device will be described by way of example, but the present disclosure is not limited thereto, and the same technical spirit may be applied to other display devices if applicable.

10 1 2 10 1 2 1 FIG. 2 FIG. A first state of a display devicethat is not folded at folding lines FLand FLand is unfolded is illustrated in, and a second state of the display devicethat is folded at the folding lines FLand FLis illustrated in.

10 10 10 1 2 The display devicemay have a quadrangular shape such as a rectangular shape in plan view. Each of corners of the display devicemay have a right-angled shape in plan view or a round shape in plan view. A front surface of the display devicemay include two short sides disposed in a first direction DRand two long sides disposed in a second direction DR.

1 2 1 2 3 1 2 1 2 3 3 3 In the drawings, the first direction DRand the second direction DRare horizontal directions, respectively, and cross each other. For example, the first direction DRand the second direction DRmay be orthogonal to each other. In addition, a third direction DRmay be a perpendicular direction crossing, for example, orthogonal to, the first direction DRand the second direction DR. Unless otherwise defined, directions indicated by arrows of the first to third directions DR, DR, and DRmay be referred to as one side, and directions opposite to one side may be referred to as the other side. In addition, the terms “on”, “upper side”, “upper portion”, “top, and “upper surface” as used herein refer to a direction toward which an arrow of the third direction DRis directed in the drawings, and the terms “below”, “lower side”, “lower portion”, “bottom, and “lower surface” used as herein refer to a direction opposite to the direction toward which the arrow of the third direction DRis directed in the drawings.

10 10 10 The display devicemay include a display area DA and a non-display area NDA. A shape of the display area DA in plan view may follow the shape of the display devicein plan view. For example, when the shape of the display devicein plan view is the rectangular shape, the shape of the display area DA in plan view may also be a rectangular shape.

The display area DA may be an area displaying an image by including a plurality of pixels. The non-display area NDA may be an area that does not display an image because it does not include pixels. The non-display area NDA may be disposed around the display area DA. The non-display area NDA may be disposed to surround the display area DA, but an embodiment of the present disclosure is not limited thereto. The display area DA may be partially surrounded by the non-display area NDA.

10 10 10 10 10 2 FIG. The display devicemay be maintained in both a first state, which is an unfolded state, and a second state, which is a folded state. In an embodiment, the display devicemay be folded in an in-folding manner in which the display areas DA face each other as illustrated in. In this case, front surfaces of the display devicemay face each other when the display deviceis folded. In an embodiment, the display devicemay be folded in an out-folding manner so that rear surfaces thereof face each other.

10 1 2 10 1 2 10 1 2 10 The display devicemay include a folding area FDA, a first non-folding area NFA, and a second non-folding area NFA. The folding area FDA may be an area where the display deviceis bent or folded, and the first non-folding area NFAand the second non-folding area NFAmay be areas where the display deviceis not bent or folded. In an embodiment, the first non-folding area NFAand the second non-folding area NFAmay be flat areas of the display device.

1 2 1 2 10 1 1 2 2 The first non-folding area NFAmay be disposed on one side, for example, the left side, of the folding area FDA. The second non-folding area NFAmay be disposed on the other side, for example, the right side, of the folding area FDA. The folding area FDA is an area defined by the first folding line FLand the second folding line FL, and may be an area where the display deviceis bent with a predetermined curvature. The first folding line FLmay be a boundary between the folding area FDA and the first non-folding area NFA, and the second folding line FLmay be a boundary between the folding area FDA and the second non-folding area NFA.

1 2 2 10 2 10 1 10 1 2 FIGS.and The first folding line FLand the second folding line FLmay extend in the second direction DRas illustrated in, and in this case, the display devicemay be folded based on the second direction DR. For this reason, a length of the display devicein the first direction DRmay be reduced by approximately half, and thus, a user may conveniently carry the display device.

1 2 1 1 The first non-folding area NFAmay be disposed on one side, for example, the left side, of the folding area FDA. The second non-folding area NFAmay be disposed on the other side, for example, the right side, of the folding area FDA. Here, the left side may refer to one side in the first direction DR, and the right side may refer to the other side in the first direction DR.

1 2 2 2 1 1 2 1 1 2 2 2 1 1 2 FIGS.and When the first folding line FLand the second folding line FLextend in the second direction DRas illustrated in, a length of the folding area FDA in the second direction DRmay be greater than a length of the folding area FDA in the first direction DR. In addition, a length of the first non-folding area NFAin the second direction DRmay be greater than a length of the first non-folding area NFAin the first direction DR. A length of the second non-folding area NFAin the second direction DRmay be greater than a length of the second non-folding area NFAin the first direction DR.

1 2 1 2 1 2 FIGS.and Each of the display area DA and the non-display area NDA may overlap at least one of the folding area FDA, the first non-folding area NFA, and the second non-folding area NFA. It is illustrated inthat each of the display area DA and the non-display area NDA overlaps the folding area FDA, the first non-folding area NFA, and the second non-folding area NFA.

3 FIG. 4 FIG. 10 10 is a perspective view illustrating an unfolded state of a display deviceaccording to an embodiment.is a perspective view illustrating a folded state of the display deviceaccording to an embodiment.

3 4 FIGS.and 1 2 FIGS.and 3 FIG. 4 FIG. 10 1 2 10 1 2 Referring toin addition to, a first state of a display devicethat is not folded at folding lines FLand FLand is unfolded is illustrated in, and a second state of the display devicethat is folded at the folding lines FLand FLis illustrated in.

3 4 FIGS.and 1 2 FIGS.and 3 4 FIGS.and 1 2 FIGS.and 1 2 1 10 2 10 2 An embodiment ofis different from an embodiment ofin that the first folding line FLand the second folding line FLextend in the first direction DR, and the display deviceis folded in the second direction DR, and thus, a length of the display devicein the second direction DRis reduced by approximately half. Therefore, in, a description of contents overlapping those of an embodiment ofwill be omitted.

10 10 2 10 1 In the first state in which the display deviceis unfolded, long sides of the display devicemay extend along the second direction DR, and short sides of the display devicemay extend along the first direction DR.

1 2 1 10 1 3 4 FIGS.and The first folding line FLand the second folding line FLmay extend in the first direction DRas illustrated in, and in this case, the display devicemay be folded based on the first direction DR.

1 2 2 2 The first non-folding area NFAmay be disposed on one side, for example, the lower side, of the folding area FDA. The second non-folding area NFAmay be disposed on the other side, for example, the upper side, of the folding area FDA. Here, the upper side may refer to one side in the second direction DR, and the lower side may refer to the other side in the second direction DR.

1 2 1 1 2 1 2 1 1 2 2 2 1 3 4 FIGS.and When the first folding line FLand the second folding line FLextend in the first direction DRas illustrated in, a length of the folding area FDA in the first direction DRmay be greater than a length of the folding area FDA in the second direction DR. In addition, a length of the first non-folding area NFAin the second direction DRmay be greater than a length of the first non-folding area NFAin the first direction DR. A length of the second non-folding area NFAin the second direction DRmay be greater than a length of the second non-folding area NFAin the first direction DR.

5 FIG. 6 FIG. 5 FIG. 10 1 1 is an exploded perspective view illustrating the display deviceaccording to an embodiment.is a cross-sectional view taken along line X-X′ of.

5 6 FIGS.and 10 100 200 300 400 500 600 700 800 900 1000 1100 1200 Referring to, the display deviceaccording to an embodiment may include a cover window CCW, an upper protection member, a window member, a first adhesive member, a display panel, a panel protection member, a panel lower member, a panel support member, a second adhesive member, a lower viewing prevention member LPU, a digitizer member, a metal support member, a buffer member, and a third adhesive member.

400 400 400 The display panelmay be a panel that displays an image. The display panelmay be an organic light emitting display panel including organic light emitting layers, a quantum dot light emitting display panel including quantum dot light emitting layers, an inorganic light emitting display panel using inorganic semiconductor elements as light emitting elements, and a micro light emitting display panel using micro light emitting diodes as light emitting elements. Hereinafter, it will be mainly described that the display panelis an organic light emitting display panel, but the present disclosure is not limited thereto.

400 3 The display panelmay include a light transmission area LTA overlapping an optical device OPD in the third direction DR. The optical device OPD is an optical sensor that senses light, and may be, for example, a camera sensor, a proximity sensor, and an illuminance sensor. The light transmission area LTA may be a portion of the display area DA.

The light transmission area LTA may include a transmission area capable of transmitting light therethrough. In an embodiment, the light transmission area LTA may be a through hole penetrating through the display panel. Light transmittance of the light transmission area LTA may be higher than light transmittance of the display area DA excluding the light transmission area LTA. In addition, due to the transmission area of the light transmission area LTA, a density or a degree of integration of pixels in the light transmission area LTA may be lower than a density or a degree of integration of pixels in the display area DA excluding the light transmission area LTA. For example, the number of pixels per unit area in the light transmission area LTA may be smaller than the number of pixels per unit area in the display area DA excluding the light transmission area LTA. In an embodiment, pixels per inch (PPI) in the light transmission area LTA may be smaller than PPI in the display area DA excluding the light transmission area LTA.

200 400 300 200 200 The window membermay be attached to a front surface of the display panelby the first adhesive member. The window membermay be made of a transparent material such as glass or plastic. For example, the window membermay be an ultra thin glass (UTG) having a thickness of 0.1 mm or less or a transparent polyimide film.

300 200 300 200 400 200 400 300 300 300 The first adhesive membermay be disposed on a rear surface of the window member. For example, the first adhesive membermay be disposed between the window memberand the display panel. The window memberand the display panelmay be bonded to each other through the first adhesive member. The first adhesive membermay include a transparent adhesive such as a pressure sensitive adhesive (PSA) or an optically clear adhesive (OCA). The first adhesive membermay include an acrylic adhesive material.

100 200 100 200 100 200 The upper protection membermay be disposed on a front surface of the window member. The upper protection membermay be attached to the front surface of the window member. The upper protection membermay perform at least one of an anti-scattering function of the window member, an impact absorption function, an anti-scratch function, an anti-fingerprint function, and an anti-glare function.

100 100 100 In some embodiments, a light blocking pattern may be formed on a rear surface of the upper protection member. The light blocking pattern may be disposed at an edge of the upper protection memberor be disposed adjacent to the edge of the upper protection member. The light blocking pattern may include a light blocking material capable of blocking light. For example, the light blocking pattern may be made of an inorganic black pigment such as carbon black, an organic black pigment, or an opaque metal material.

100 10 10 10 The cover window CCW may be disposed on the upper protection member. The cover window CCW may be a protective film for protecting the display devicefrom external impact. The cover window CCW may be attached to the display devicethrough an adhesive member or removed from the display device. That is, the cover window CCW may be a changeable window. In an embodiment, the cover window CCW may include at least one of flexible polyethylene terephthalate (PET) and thermoplastic polyurethane (TPU), but is not limited thereto.

500 400 500 400 400 500 500 10 500 10 10 5 6 FIGS.and The panel protection membermay be disposed on a rear surface of the display panel. The panel protection membermay serve to support the display paneland protect the rear surface of the display panel. The panel protection membermay be made of plastic such as polyethylene terephthalate (PET) or polyimide. It is illustrated inthat the panel protection memberis also disposed in the folding area FDA of the display device, but an embodiment of the present disclosure is not limited thereto. For example, the panel protection membermay be removed in the folding area FDA of the display devicein order for the display deviceto be smoothly folded.

600 500 600 400 The panel lower membermay be disposed on a rear surface of the panel protection member. The panel lower membermay include at least one of a light blocking layer for absorbing light incident from the outside, a buffer layer for absorbing external impact, and a heat dissipation layer for efficiently dissipating heat of the display panel.

900 400 The light blocking layer blocks transmission of the light to prevent components such as the digitizer memberand the like disposed below the light blocking layer from being viewed from above the display panel. The light blocking layer may include a light absorbing material such as a black pigment or a black dye.

400 The buffer layer absorbs the external impact to prevent the display panelfrom being damaged. The buffer layer may be formed as a single layer or a plurality of layers. For example, the buffer layer may be made of a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene or may include a material having elasticity, such as a sponge formed by foaming rubber, a urethane-based material, or an acrylic material.

The heat dissipation layer may include a first heat dissipation layer including graphite, carbon nanotubes, or the like, and a second heat dissipation layer formed as a thin metal film such as copper, nickel, ferrite, or silver that may shield electromagnetic waves and has excellent thermal conductivity.

600 In some embodiments, the panel lower membermay be omitted.

700 600 700 700 400 700 400 The panel support membermay be disposed on a rear surface of the panel lower member. The panel support membermay be a rigid member whose shape or volume does not change easily due to an external pressure. Since the panel support memberis disposed on the rear surface of the display paneland is the rigid member whose shape or volume does not change easily due to the external pressure, the panel support membermay support the display panel.

700 700 700 900 700 400 900 In an embodiment, the panel support membermay be made of a polymer including carbon fiber or glass fiber. In this case, since the panel support memberis made of the polymer including the carbon fiber or the glass fiber, the panel support membermay pass magnetic fields or electromagnetic signals of the digitizer membertherethrough. Therefore, the panel support membercapable of supporting the display panelwithout lowering touch sensitivity of the digitizer membermay be provided.

700 700 700 In an embodiment, the panel support membermay be a metal plate. For example, the panel support memberis a metal plate, and may be made of a metal or a metal alloy. The panel support membermay include copper (Cu), aluminum (Al), stainless steel (SUS), and/or alloys thereof, but is not limited thereto.

700 3 400 3 10 The panel support membermay include a through hole STH overlapping the optical device OPD in the third direction DR. The through hole STH may overlap the light transmission area LTA of the display panelin the third direction DR. An area of the through hole STH may be greater than an area of the light transmission area LTA. The optical device OPD may sense light incident from a front surface of the display devicethrough the light transmission area LTA and the through hole STH.

700 700 10 The panel support membermay include a grating pattern disposed in the folding area FDA so as to be easily bent in the folding area FDA. The panel support membermay include the grating pattern disposed in the folding area FDA, and may thus be easily bent when the display deviceis folded.

700 800 810 820 700 10 The lower viewing prevention member LPU may be disposed on a rear surface of the panel support member. The lower viewing prevention member LPU may be disposed to overlap the folding area FDA. The lower viewing prevention member LPU may be disposed at the same layer as the second adhesive member. The lower viewing prevention member LPU may be disposed between a second-first adhesive memberand a second-second adhesive member. The lower viewing prevention member LPU may prevent the grating pattern of the panel support memberfrom being viewed to the outside. The lower viewing prevention member LPU may include a flexible material to reduce folding stress of the display device.

800 900 800 700 900 700 900 800 800 800 The second adhesive membermay be disposed on a front surface of the digitizer member. For example, the second adhesive membermay be disposed between the panel support memberand the digitizer member. The panel support memberand the digitizer membermay be bonded to each other through the second adhesive member. The second adhesive membermay include a transparent adhesive such as a pressure sensitive adhesive (PSA) or an optically clear adhesive (OCA). The second adhesive membermay include an acrylic adhesive material.

800 810 910 820 920 810 820 In some embodiments, the second adhesive membermay include the second-first adhesive memberoverlapping a first digitizer memberand the second-second adhesive memberoverlapping a second digitizer member. The second-first adhesive memberand the second-second adhesive membermay be disposed to be spaced apart from each other with the lower viewing prevention member LPU interposed therebetween.

900 910 920 910 920 700 910 920 700 800 The digitizer membermay include the first digitizer memberand the second digitizer member. The first digitizer memberand the second digitizer membermay be disposed on the rear surface of the panel support member. The first digitizer memberand the second digitizer membermay be attached to the rear surface of the panel support memberby the second adhesive member.

910 920 10 910 1 920 2 910 920 2 The first digitizer memberand the second digitizer membermay not be disposed in the folding area FDA in order to reduce the folding stress of the display device. The first digitizer membermay be disposed in the first non-folding area NFA, and the second digitizer membermay be disposed in the second non-folding area NFA. A gap between the first digitizer memberand the second digitizer membermay overlap the folding area FDA, and may be smaller than a width of the folding area FDA. The width of the folding area FDA may be a length of the folding area FDA in the second direction DR.

910 920 910 920 The first digitizer memberand the second digitizer membermay include electrode patterns for sensing approach or contact of an electronic pen such as a stylus pen supporting electromagnetic resonance (EMR). The first digitizer memberand the second digitizer membermay sense magnetic fields or electromagnetic signals emitted from the electronic pen based on the electrode patterns, and decide a point where the sensed magnetic field or electromagnetic signal is the greatest as a touch coordinate.

910 920 910 920 910 920 10 Magnetic metal powders may be disposed on a rear surface of the first digitizer memberand a rear surface of the second digitizer member. In this case, the magnetic fields or the electromagnetic signals passing through the first digitizer memberand the second digitizer membermay flow into the magnetic metal powders. Therefore, due to the magnetic metal powders, a phenomenon in which the magnetic fields or the electromagnetic signals of the first digitizer memberand the second digitizer memberare emitted to a rear surface of the display devicemay be reduced.

1000 1010 1020 1010 910 1020 920 The metal support membermay include a first metal support memberand a second metal support member. The first metal support membermay be disposed on the rear surface of the first digitizer member, and the second metal support membermay be disposed on the rear surface of the second digitizer member.

1010 1020 10 1010 1 1020 2 1010 1020 The first metal support memberand the second metal support membermay not be disposed in the folding area FDA in order to reduce the folding stress of the display device. The first metal support membermay be disposed in the first non-folding area NFA, and the second metal support membermay be disposed in the second non-folding area NFA. A gap between the first metal support memberand the second metal support membermay overlap the folding area FDA, and may be smaller than the width of the folding area FDA.

1010 1020 910 920 1010 1020 The first metal support memberand the second metal support membermay include a material having high rigidity in order to support the first digitizer memberand the second digitizer member, respectively. For example, the first metal support memberand the second metal support membermay include stainless steel such as SUS316.

1100 1110 1120 1110 1120 700 900 1110 1120 The buffer membermay include a first buffer memberand a second buffer member. The first buffer memberand the second buffer membermay absorb external impact to prevent the panel support memberand the digitizer memberfrom being damaged. The first buffer memberand the second buffer membermay include a material having elasticity, such as a sponge formed by foaming rubber, a urethane-based material, or an acrylic material.

1110 1010 1120 1020 1110 1120 10 1110 1 1120 2 1110 1120 The first buffer membermay be disposed on a rear surface of the first metal support member, and the second buffer membermay be disposed on a rear surface of the second metal support member. The first buffer memberand the second buffer membermay not be disposed in the folding area FDA in order to reduce the folding stress of the display device. The first buffer membermay be disposed in the first non-folding area NFA, and the second buffer membermay be disposed in the second non-folding area NFA. A gap between the first buffer memberand the second buffer membermay overlap the folding area FDA, and may be smaller than the width of the folding area FDA.

1200 1010 1020 1200 1010 1020 1200 1110 1120 1200 1110 1120 5 6 FIGS.and The third adhesive membermay be disposed on the rear surface of the first metal support memberand the rear surface of the second metal support member. The third adhesive membermay be disposed at an edge of the first metal support memberand an edge of the second metal support member. It is illustrated inthat the third adhesive membersare disposed on both sides of the first buffer memberand the second buffer member, but the present disclosure is not limited thereto. For example, the third adhesive membermay be disposed to surround the first buffer memberand the second buffer member.

1200 1010 1100 10 1200 10 The third adhesive membermay be a waterproof tape or a waterproof member attaching the rear surface of the first metal support memberto a front surface of a frame disposed on a rear surface of the buffer member. For this reason, permeation of moisture or dust into the display devicemay be prevented by the third adhesive member. That is, the display devicecapable of being waterproof and dustproof may be provided.

1200 1110 1120 10 3 1200 900 400 In an embodiment, the third adhesive memberdoes not surround the first buffer memberand the second buffer member, and may be disposed to overlap a magnet for maintaining the folding of the display devicein the third direction DR. In this case, the third adhesive membermay serve as a magnetism shielding member capable of shielding magnetism of the magnet in order to prevent the digitizer memberor the display panelfrom being affected by the magnetism.

7 FIG. 400 is a cross-sectional view illustrating an example of a display panelaccording to an embodiment.

7 FIG. 400 Referring to, the display panelmay include a substrate SUB, a display layer DISL disposed on the substrate SUB, and a touch sensing layer TDL disposed on the display layer DISL. The display layer DISL may include a thin film transistor layer TFTL, a light emitting element layer EML, and an encapsulation layer TFEL.

1 1 2 1 2 130 141 142 160 180 The thin film transistor layer TFTL may be disposed on the substrate SUB. The thin film transistor layer TFTL may include a barrier film BR, thin film transistors TFT, first capacitor electrodes CAE, second capacitor electrodes CAE, first anode connection electrodes ANDE, second anode connection electrodes ANDE, a gate insulating film, a first interlayer insulating film, a second interlayer insulating film, a first planarization film, and a second planarization film.

The substrate SUB may be made of an insulating material such as a polymer resin. For example, the substrate SUB may be made of polyimide. The substrate SUB may be a flexible substrate that may be bent, folded, and rolled.

172 The barrier film BR may be disposed on the substrate SUB. The barrier film BR is a film for protecting thin film transistors of the thin film transistor layer TFTL and light emitting layersof the light emitting element layer EML from moisture permeating through the substrate SUB vulnerable to moisture permeation. The barrier film BR may include a plurality of inorganic films that are alternately stacked. For example, the barrier film BR may be formed as multiple films in which one or more inorganic films of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked.

1 1 1 1 1 The thin film transistors TFTmay be disposed on the barrier film BR. Active layers ACTof the thin film transistors TFTmay be disposed on the barrier film BR. The active layer ACTof the thin film transistor TFTmay include polycrystalline silicon, single crystal silicon, low-temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor.

1 1 1 1 1 1 3 1 1 1 1 1 1 1 3 1 1 The active layer ACTmay include a channel region CHA, a source region TS, and a drain region TD. The channel region CHAmay be a region overlapping a gate electrode TGin the third direction DR, which is a thickness direction of the substrate SUB. The source region TSmay be disposed on one side of the channel region CHA, and the drain region TDmay be disposed on the other side of the channel region CHA. The source region TSand the drain region TDmay be regions that do not overlap the gate electrode TGin the third direction DR. The source region TSand the drain region TDmay be regions having conductivity by doping a silicon semiconductor or an oxide semiconductor with ions or impurities.

130 1 1 130 The gate insulating filmmay be disposed on the active layer ACTof the thin film transistor TFT. The gate insulating filmmay be formed as an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

1 1 1 130 1 1 3 1 1 1 1 1 1 7 FIG. The gate electrodes TGof the thin film transistors TFTand the first capacitor electrodes CAEmay be disposed on the gate insulating film. The gate electrode TGmay overlap the channel region CHAin the third direction DR. It is illustrated inthat the gate electrode TGand the first capacitor electrode CAEare disposed to be spaced apart from each other, but the gate electrode TGand the first capacitor electrode CAEmay also be connected to and formed integrally with each other. Each of the gate electrode TGand the first capacitor electrode CAEmay be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

141 1 1 1 141 141 The first interlayer insulating filmmay be disposed on the gate electrodes TGof the thin film transistors TFTand the first capacitor electrodes CAE. The first interlayer insulating filmmay be formed as an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer insulating filmmay be formed as a plurality of inorganic films.

2 141 2 1 3 1 1 2 1 3 141 1 2 141 1 2 2 The second capacitor electrodes CAEmay be disposed on the first interlayer insulating film. The second capacitor electrode CAEmay overlap the first capacitor electrode CAEin the third direction DR. In addition, when the gate electrode TGand the first capacitor electrode CAEare formed integrally with each other, the second capacitor electrode CAEmay overlap the gate electrode TGin the third direction DR. Since the first interlayer insulating filmhas a predetermined dielectric constant, a capacitor may be formed by the first capacitor electrode CAE, the second capacitor electrode CAE, and the first interlayer insulating filmdisposed between the first capacitor electrode CAEand the second capacitor electrode CAE. The second capacitor electrode CAEmay be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

142 2 142 142 The second interlayer insulating filmmay be disposed on the second capacitor electrodes CAE. The second interlayer insulating filmmay be formed as an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The second interlayer insulating filmmay be formed as a plurality of inorganic films.

1 142 1 1 1 1 130 141 142 1 The first anode connection electrodes ANDEmay be disposed on the second interlayer insulating film. The first anode connection electrode ANDEmay be connected to the drain region TDof the thin film transistor TFTthrough a first connection contact hole ANCTpenetrating through the gate insulating film, the first interlayer insulating film, and the second interlayer insulating film. The first anode connection electrode ANDEmay be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

160 1 1 160 The first planarization filmfor planarizing a step due to the thin film transistors TFTmay be disposed on the first anode connection electrodes ANDE. The first planarization filmmay be formed as an organic film made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

2 160 2 1 2 160 2 The second anode connection electrodes ANDEmay be disposed on the first planarization film. The second anode connection electrode ANDEmay be connected to the first anode connection electrode ANDEthrough a second connection contact hole ANCTpenetrating through the first planarization film. The second anode connection electrode ANDEmay be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

180 2 180 The second planarization filmmay be disposed on the second anode connection electrodes ANDE. The second planarization filmmay be formed as an organic film made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

190 180 171 172 173 The light emitting element layer EML including light emitting elements LEL and a bankmay be disposed on the second planarization film. Each of the light emitting elements LEL includes a pixel electrode, the light emitting layer, and a common electrode.

171 180 171 2 3 180 The pixel electrodemay be disposed on the second planarization film. The pixel electrodemay be connected to the second anode connection electrode ANDEthrough a third connection contact hole ANCTpenetrating through the second planarization film.

173 172 171 In a top emission structure in which light is emitted toward the common electrodebased on the light emitting layer, the pixel electrodemay be made of a metal material having high reflectivity, such as a stacked structure (Ti/Al/Ti) of aluminum (Al) and titanium (Ti), a stacked structure (ITO/Al/ITO) of aluminum (Al) and indium tin oxide (ITO), a stacked structure (ITO/Ag/ITO) of silver (Ag) and ITO, an APC alloy, and a stacked structure (ITO/APC/ITO) of an APC alloy and ITO. The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

190 171 180 1 2 190 171 190 The bankmay be formed to partition the pixel electrodeson the second planarization filmin order to define light emitting portions EAand EA. The bankmay be disposed to cover edges of the pixel electrode. The bankmay be formed as an organic film made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

1 2 171 172 173 171 173 172 Each of a first light emitting portion EAand a second light emitting portion EArefers to each area where the pixel electrode, the light emitting layer, and the common electrodeare sequentially stacked and holes from the pixel electrodeand electrons from the common electrodeare recombined with each other in the light emitting layerto emit light.

172 171 190 172 172 The light emitting layermay be disposed on the pixel electrodeand the bank. The light emitting layermay include an organic material to emit light of a predetermined color. For example, the light emitting layermay include a hole transporting layer, an organic material layer, and an electron transporting layer.

173 172 173 172 173 1 2 The common electrodemay be disposed on the light emitting layer. The common electrodemay be disposed to cover the light emitting layer. The common electrodemay be a common layer formed in common in the first light emitting portion EAand the second light emitting portion EA.

173 173 In the top emission structure, the common electrodemay be made of a transparent conductive material (TCO) such as ITO or indium zinc oxide (IZO) capable of transmitting light therethrough or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the common electrodeis made of the semi-transmissive conductive material, light emission efficiency may be increased by a micro cavity.

191 190 191 172 191 A spacermay be disposed on the bank. The spacermay serve to support a mask during a manufacturing process of manufacturing the light emitting layer. The spacermay be formed as an organic film made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

400 173 In some embodiments, the display panelmay further include a capping layer CPL disposed on the common electrode. The capping layer CPL may include an inorganic material. For example, the capping layer CPL may include at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride.

173 1 2 3 The encapsulation layer TFEL may be disposed on the common electrode. The encapsulation layer TFEL may include at least one inorganic film in order to prevent oxygen or moisture from permeating into the light emitting element layer EML. In addition, the encapsulation layer TFEL may include at least one organic film in order to protect the light emitting element layer EML from foreign substances such as dust. For example, the encapsulation layer TFEL may include a first encapsulation inorganic film TFE, an encapsulation organic film TFE, and a second encapsulation inorganic film TFE.

1 173 2 1 3 2 1 3 2 The first encapsulation inorganic film TFEmay be disposed on the common electrode, the encapsulation organic film TFEmay be disposed on the first encapsulation inorganic film TFE, and the second encapsulation inorganic film TFEmay be disposed on the encapsulation organic film TFE. Each of the first encapsulation inorganic film TFEand the second encapsulation inorganic film TFEmay be formed as multiple films in which one or more inorganic films of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. The encapsulation organic film TFEmay be an organic film made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

1 2 3 The touch sensing layer TDL may be disposed on the encapsulation layer TFEL. The touch sensing layer TDL includes a first touch insulating film TINS, connection electrodes BE, a second touch insulating film TINS, driving electrodes TE, sensing electrodes RE, and a third touch insulating film TINS.

1 1 The first touch insulating film TINSmay be disposed on the encapsulation layer TFEL. The first touch insulating film TINSmay be formed as an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

1 The connection electrodes BE may be disposed on the first touch insulating film TINS. The connection electrode BE may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

2 2 2 The second touch insulating film TINSmay be disposed on the connection electrodes BE. The second touch insulating film TINSmay be formed as an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. In an embodiment, the second touch insulating film TINSmay be formed as an organic film made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

2 The driving electrodes TE and the sensing electrodes RE may be disposed on the second touch insulating film TINS. Each of the driving electrodes TE and the sensing electrodes RE may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

3 1 2 The driving electrode TE and the sensing electrode RE may overlap the connection electrodes BE in the third direction DR. The driving electrode TE may be connected to the connection electrode BE through a touch contact hole TCNTpenetrating through the second touch insulating film TINS.

3 3 3 The third touch insulating film TINSmay be formed on the driving electrodes TE and the sensing electrodes RE. The third touch insulating film TINSmay serve to planarize a step formed due to the driving electrodes TE, the sensing electrodes RE, and the connection electrodes BE. The third touch insulating film TINSmay be formed as an organic film made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

8 FIG. 9 FIG. 8 FIG. 10 FIG. 8 FIG. 700 2 2 is a plan view illustrating a panel support memberaccording to an embodiment.is an enlarged view of area A of.is a cross-sectional view taken along line X-X′ of.

8 10 FIGS.to 700 710 720 730 710 720 1 730 2 Referring to, the panel support membermay include a folding portion, a first non-folding portion, and a second non-folding portion. The folding portionmay be disposed in the folding area FDA, the first non-folding portionmay be disposed in the first non-folding area NFA, and the second non-folding portionmay be disposed in the second non-folding area NFA.

710 1 2 720 730 In some embodiments, the folding area FDA may be an area where the folding portionis disposed, and the first and second non-folding areas NFAand NFAmay be areas where the first and second non-folding portionsandare disposed, respectively.

710 10 710 720 730 2 The folding portionmay be a portion that is folded when the display deviceis folded. The folding portionmay be disposed between the first non-folding portionand the second non-folding portionin the second direction DR.

720 730 10 720 710 2 730 710 2 The first non-folding portionand the second non-folding portionmay be portions that are not folded when the display deviceis folded. The first non-folding portionmay be disposed on one side of the folding portionin the second direction DR, and the second non-folding portionmay be disposed on the other side of the folding portionin the second direction DR.

700 720 730 720 2 8 FIG. In some embodiments, the through hole STH penetrating through the panel support membermay be disposed in the first non-folding portionor the second non-folding portion. For example, as illustrated in, the through hole STH may be disposed adjacent to one side of the first non-folding portionin the second direction DR.

710 710 The folding portionmay include a grating pattern. For example, the folding portionmay include a plurality of bars BAR and a plurality of slits SLT disposed between the plurality of bars BAR.

9 FIG. 2 1 710 720 730 As illustrated in, the plurality of bars BAR may include a plurality of horizontal bars each extending in the second direction DRand a plurality of vertical bars each extending in the first direction DR. The plurality of bars BAR of the folding portionmay be seamlessly connected to each other, and may seamlessly connect the first non-folding portionand the second non-folding portionto each other.

700 3 1 1 2 710 710 2 10 10 FIG. 9 FIG. Each of the plurality of slits SLT may be a hole penetrating and passing through the panel support memberin the third direction DR, as illustrated in. Each of the plurality of slits SLT may extend in the first direction DR, as illustrated in. For example, a length of each of the plurality of slits SLT in the first direction DRmay be greater than a length of each of the plurality of slits SLT in the second direction DR. The folding portionmay have flexibility by including the plurality of slits SLT. That is, the folding portionmay be stretched in the second direction DRwhen the display deviceis folded.

10 700 750 750 700 700 750 In the display deviceaccording to the present embodiment, the panel support membermay further include a plating layer. The plating layermay be formed by plating a body of the panel support member(the remaining portion of the panel support memberexcluding the plating layer) with a metal material.

750 750 750 700 The plating layermay be disposed inside the plurality of slits SLT. For example, the plating layermay be disposed on inner side surfaces of the plurality of slits SLT. As the plating layeris disposed on the inner side surfaces of the plurality of slits SLT, the panel support membermay include a plurality of openings OP having a smaller size than the plurality of slits SLT.

2 A width W_OP of each of the plurality of openings OP may be smaller than a width W_SLT of each of the plurality of slits SLT. Here, the width W_OP of each of the plurality of openings OP and the width W_SLT of each of the plurality of slits SLT refer to lengths of the opening OP and the slit SLT in a short-side direction (e.g., lengths of the opening OP and the slit SLT in the second direction DR), respectively.

10 FIG. 10 FIG. 1 700 750 1 700 750 It is illustrated inthat the width W_SLT of each of the plurality of slits SLT is smaller than a thickness THof the panel support memberexcluding the plating layer, but this is only for convenience of illustration, and the present disclosure is not limited thereto. That is, a relationship between the width W_SLT of each of the plurality of slits SLT and the thickness THof the panel support memberexcluding the plating layeris unrelated to that illustrated in.

1 700 750 1 700 750 In some embodiments, the width W_SLT of each of the plurality of slits SLT may be greater than or equal to the thickness THof the panel support memberexcluding the plating layer. In an embodiment, the width W_SLT of each of the plurality of slits SLT may be greater than or equal to 0.8 times the thickness THof the panel support memberexcluding the plating layer.

700 700 700 700 700 1 2 3 1 700 750 The plurality of slits SLT may be formed by processing the body of the panel support memberthrough a wet etching or sand blasting process. A processing process should be sufficiently performed from an upper surface of the panel support memberto a lower surface of the panel support memberso that the slits SLT penetrating through the panel support membermay be formed. Due to characteristics of the processing process, the body of the panel support memberis processed in the first direction DRand the second direction DR, which are horizontal directions, as well as a thickness direction (e.g., the third direction DR) in the processing process, and thus, it is not easy to make the width W_SLT of each of the plurality of slits SLT smaller than the thickness THof the panel support memberexcluding the plating layer.

1 700 750 1 700 750 In some cases, depending on a processing method, it is possible to make the width W_SLT of each of the plurality of slits SLT smaller than the thickness THof the panel support memberexcluding the plating layer, but it is not easy to make the width W_SLT of each of the plurality of slits SLT smaller than 0.8 times the thickness THof the panel support memberexcluding the plating layer. For example, a minimum value of the width W_SLT of each of the plurality of slits SLT may be approximately 80 μm.

10 750 700 750 700 10 750 700 10 10 700 11 12 FIGS.and The display deviceaccording to the present embodiment includes the plating layer, and thus, a width of the hole penetrating through the panel support membermay be minimized. For example, the plating layeris disposed on the inner side surfaces of the plurality of slits SLT, and thus, the width of the hole penetrating through the panel support membermay be reduced from the width W_SLT of each of the plurality of slits SLT to the width W_OP of each of the plurality of openings OP. That is, in the display deviceaccording to the present embodiment, by disposing the plating layeron the inner side surfaces of the plurality of slits SLT instead of reducing the width W_SLT of each of the plurality of slits SLT, it is possible to reduce the width of the hole penetrating through the panel support memberto the width W_OP of each of the plurality of openings OP. Accordingly, impact resistance of the display devicemay be enhanced. The reason why the impact resistance of the display deviceis enhanced when the width of the hole penetrating through the panel support memberis reduced will be described later with reference to.

750 750 In some embodiments, the plating layermay include a metal material. For example, the plating layermay include at least one of nickel, chromium, copper, zinc, gold, silver, palladium, tin, aluminum, iron, cobalt, and alloys thereof.

750 10 700 700 700 750 700 750 750 The plating layerof the display deviceaccording to the present embodiment includes the metal material, and thus, flexural strength of the panel support membermay be maintained or increased. For example, the flexural strength of the panel support membermay be affected by rigidity of a material of the outermost layer such as the upper and lower surfaces, inner side surfaces, and side surfaces of the panel support member. When the plating layerincludes such a metal material, the flexural strength of the panel support membermay be maintained or increased compared to when the plating layeris not included. In addition, the plating layermay have advantages such as durability, wear resistance, corrosion resistance, heat resistance, and adhesive strength higher than those of a case where a polymer material, an organic material, or the like, is coated.

750 750 9 FIG. 10 FIG. Although the plating layeris not illustrated on upper surfaces of the plurality of bars BAR for convenience of explanation in, the plating layermay also be disposed on upper and lower surfaces of the plurality of bars BAR, as illustrated in.

750 751 752 753 751 752 720 730 751 753 720 730 751 751 752 753 For example, the plating layermay include a side surface plating layer, an upper surface plating layer, and a lower surface plating layer. The side surface plating layermay be disposed on the inner side surface of each of the plurality of slits SLT. The upper surface plating layermay be disposed on the upper surface of each of the plurality of bars BAR, an upper surface of the first non-folding portion, an upper surface of the second non-folding portion, and an upper surface of the side surface plating layer. The lower surface plating layermay be disposed on the lower surface of each of the plurality of bars BAR, a lower surface of the first non-folding portion, a lower surface of the second non-folding portion, and a lower surface of the side surface plating layer. The side surface plating layer, the upper surface plating layer, and the lower surface plating layermay be integrally connected to each other.

10 FIG. 751 3 752 753 3 751 752 753 751 752 753 751 700 3 752 753 It is illustrated inthat the side surface plating layeris a vertical surface extending in the third direction DR, the upper surface plating layerand the lower surface plating layerare horizontal surfaces perpendicular to the third direction DR, and a thickness of each of the side surface plating layer, the upper surface plating layer, and the lower surface plating layeris constant, but the present disclosure is not limited thereto. That is, the thickness of each of the side surface plating layer, the upper surface plating layer, and the lower surface plating layermay not be constant depending on step coverage. For example, the side surface plating layermay have a thickness that decreases toward a center portion (a center portion of the panel support memberin the third direction DR), and may have a thickness that increases toward edge portions adjacent to the upper surface plating layerand the lower surface plating layer.

750 750 1 700 750 750 750 750 750 751 2 752 3 753 3 750 750 751 752 753 In some embodiments, a thickness TH_of the plating layermay be smaller than half the thickness THof the panel support memberexcluding the plating layer. For example, the thickness TH_of the plating layermay be approximately 40 μm or less. Here, the thickness TH_of the plating layerrefers to a length of the side surface plating layerin the second direction DR, a length of the upper surface plating layerin the third direction DR, and a length of the lower surface plating layerin the third direction DR. In addition, the thickness TH_of the plating layerrefers to a thickness at a portion where the thickness is the smallest when the thicknesses of the side surface plating layer, the upper surface plating layer, and the lower surface plating layerare not constant.

1 700 750 2 700 750 In some embodiments, the thickness THof the panel support memberexcluding the plating layermay be approximately 80 μm to 120 μm. A thickness THof the panel support memberincluding the plating layermay be approximately 100 μm to 150 μm.

In some embodiments, the width W_SLT of each of the plurality of slits SLT may be approximately 60 μm to 150 μm. The width W_OP of each of the plurality of openings OP may be approximately 10 μm to 100 μm. Suitably, the width W_OP of each of the plurality of openings OP may be approximately 50 μm or less.

10 752 753 1 700 750 The display deviceaccording to the present embodiment includes the upper surface plating layerand the lower surface plating layer, and it is thus possible to reduce the thickness THof the panel support memberexcluding the plating layer. Accordingly, it is also possible to reduce the width W_SLT of each of the plurality of slits SLT.

700 400 10 700 2 700 750 For example, an entire thickness of the panel support membermay have a predetermined range so that it is not excessively small or excessively great, in consideration of a degree of rigidity for supporting the display panel, foldability of the display device, and the like. An example of a value of the entire thickness of the panel support membermay be approximately 100 μm to 150 μm like the thickness THof the panel support memberincluding the plating layerdescribed above.

10 752 753 1 700 750 700 1 700 750 The display deviceaccording to the present embodiment includes the upper surface plating layerand the lower surface plating layer, and it is thus possible to reduce the thickness THof the panel support memberexcluding the plating layerwhile maintaining the entire thickness of the panel support member. An example of a value of the thickness THof the panel support memberexcluding the plating layermay be approximately 80 μm to 120 μm, as described above.

1 700 750 700 751 752 753 1 700 750 700 When the thickness THof the panel support memberexcluding the plating layeris reduced as described above, the width W_SLT of each of the plurality of slits SLT may also be reduced in a processing process of the slit SLT. Accordingly, separately from the reduction in the width of the hole penetrating through the panel support memberdue to the side surface plating layer, by disposing the upper surface plating layerand the lower surface plating layer, the thickness THof the panel support memberexcluding the plating layeris reduced, such that the width W_SLT of each of the plurality of slits SLT may be reduced, and for this reason, the width of the hole penetrating through the panel support membermay be further reduced.

750 1 700 750 2 700 750 750 700 Since the plating layerincludes the metal material, even though a difference between the thickness THof the panel support memberexcluding the plating layerand the thickness THof the panel support memberincluding the plating layeris replaced with the plating layer, physical properties of the panel support member, such as rigidity and an elastic modulus, may be maintained at a similar level.

11 FIG. 12 FIG. 10 10 is a cross-sectional view illustrating an impact resistance test of the display deviceaccording to an embodiment.is a cross-sectional view illustrating an impact resistance test of a display device′ according to a comparative example.

11 12 FIGS.and 6 FIG. 8 10 FIGS.to 10 700 700 10 700 700 Referring toin addition toand, the display deviceaccording to an embodiment may include the panel support memberand an upper member UM disposed above the panel support member. A display device′ according to a comparative example may include a panel support member′ and an upper member UM disposed above the panel support member′.

10 10 100 200 300 400 500 600 6 FIG. The upper member UM of each of the display devicesand′ according to an embodiment and a comparative example may include the cover window CCW, the upper protection member, the window member, the first adhesive member, the display panel, the panel protection member, and the panel lower memberas illustrated in.

700 10 700 700 10 700 750 8 10 FIGS.to 8 10 FIGS.to The panel support memberof the display deviceaccording to an embodiment is substantially the same as the panel support memberdescribed with reference to. The panel support member′ of the display device′ according to a comparative example is different from the panel support memberdescribed with reference toin that it does not include the plating layer.

11 12 FIGS.and 10 10 illustrate states in which an impact resistance test according to a pen drop is performed on the display devicesand′ according to an embodiment and a comparative example, respectively.

12 FIG. 10 750 700 As illustrated in, the display device′ according to a comparative example does not include the plating layer, and thus, a width HOL_W′ of a hole penetrating through the panel support memberis relatively great, such that deformation applied to the upper member UM due to impact caused by the pen drop may be great.

11 FIG. 10 750 700 As illustrated in, the display deviceaccording to an embodiment includes the plating layer, and thus, a width HOL_W of a hole penetrating through the panel support memberis relatively small, such that deformation applied to the upper member UM due to impact caused by the pen drop may be small.

10 10 400 10 400 10 For example, strain of the upper member UM in the display device′ according to a comparative example may be two times or more the strain of the upper member UM in the display deviceaccording to an embodiment. Accordingly, a bright spot may occur in the display panelincluded in the upper member UM in the display device′ according to a comparative example, whereas a bright spot may not occur in the display panelincluded in the upper member UM in the display deviceaccording to an embodiment.

10 750 700 10 10 700 10 As described above, the display deviceaccording to the present embodiment includes the plating layer, and thus, the width HOL_W of the hole penetrating through the panel support membermay be reduced, such that the impact resistance of the display devicemay be enhanced. For example, in the display deviceaccording to the present embodiment, the width HOL_W of the hole penetrating through the panel support membermay be defined as a width of the opening OP, and the width of the opening OP may be approximately 50 μm or less. When the width of the opening OP is approximately 50 μm or less, the strain of the upper member UM is reduced, such that the impact resistance of the display devicemay be enhanced.

Hereinafter, other embodiments of the display device according to an embodiment will be described. In the following embodiments, the same components as those of the above-described embodiment will be denoted by the same reference numerals, and an overlapping description thereof will be omitted or simplified and contents different from those described above will be mainly described.

13 FIG. 700 is a cross-sectional view illustrating a panel support memberaccording to an embodiment.

13 FIG. 10 FIG. 10 10 752 753 Referring to, a display deviceaccording to the present embodiment is different from the display deviceaccording to an embodiment described with reference toor the like in that it does not include the upper surface plating layerand the lower surface plating layer.

10 750 10 750 750 700 10 FIG. More specifically, in the display deviceaccording to the present embodiment, the plating layermay be disposed inside the plurality of slits SLT, similar to the display deviceaccording to an embodiment described with reference toor the like. For example, the plating layermay be disposed on inner side surfaces of the plurality of slits SLT. As the plating layeris disposed on the inner side surfaces of the plurality of slits SLT, the panel support membermay include a plurality of openings OP having a smaller size than the plurality of slits SLT. A width W_OP of each of the plurality of openings OP may be smaller than a width W_SLT of each of the plurality of slits SLT.

10 750 751 10 750 752 753 10 FIG. However, in the display deviceaccording to the present embodiment, the plating layermay include only the side surface plating layer. For example, in the display deviceaccording to the present embodiment, the plating layermay not include the upper surface plating layerand the lower surface plating layeraccording to an embodiment described with reference toor the like.

750 751 720 730 751 The plating layermay include only the side surface plating layerand thus, may be disposed on the inner side surfaces of the plurality of slits SLT but may not be disposed on the upper and lower surfaces of each of the plurality of bars BAR, the upper and lower surfaces of the first non-folding portion, the upper and lower surfaces of the second non-folding portion, and the upper and lower surfaces of the side surface plating layer.

750 700 720 730 The plating layerof the panel support memberaccording to the present embodiment may be formed by masking the upper and lower surfaces of each of the plurality of bars BAR, the upper and lower surfaces of the first non-folding portion, and the upper and lower surfaces of the second non-folding portion.

10 752 753 1 700 750 2 700 750 700 750 750 The display deviceaccording to the present embodiment does not include the upper surface plating layerand the lower surface plating layer, and thus, the thickness THof the panel support memberexcluding the plating layermay be the same as the thickness THof the panel support memberincluding the plating layer. That is, the entire thickness of the panel support membermay be the same regardless of whether or not it includes the thickness TH_of the plating layer.

10 700 750 750 700 Accordingly, in the display deviceaccording to the present embodiment, the thickness of the panel support membermay be kept constant regardless of the thickness TH_of the plating layer, and thus, an influence of rigidity and other physical properties of the panel support memberaccording to a yield of a plating process may be minimized.

14 FIG. 15 FIG. 700 700 is a cross-sectional view illustrating a panel support memberaccording to an embodiment.is a cross-sectional view illustrating a panel support memberaccording to an embodiment.

14 15 FIGS.and 10 FIG. 10 10 752 753 Referring to, a display deviceaccording to the present embodiment is different from the display deviceaccording to an embodiment described with reference toor the like in that it does not include any one of the upper surface plating layerand the lower surface plating layer.

10 750 10 750 750 700 10 FIG. More specifically, in the display deviceaccording to the present embodiment, the plating layermay be disposed inside the plurality of slits SLT, similar to the display deviceaccording to an embodiment described with reference toor the like. For example, the plating layermay be disposed on inner side surfaces of the plurality of slits SLT. As the plating layeris disposed on the inner side surfaces of the plurality of slits SLT, the panel support membermay include a plurality of openings OP having a smaller size than the plurality of slits SLT. A width W_OP of each of the plurality of openings OP may be smaller than a width W_SLT of each of the plurality of slits SLT.

10 750 752 753 751 However, in the display deviceaccording to the present embodiment, the plating layermay include only any one of the upper surface plating layerand the lower surface plating layerin addition to the side surface plating layer.

14 FIG. 10 750 752 753 750 751 753 720 730 751 720 730 751 In an embodiment, as illustrated in, in the display deviceaccording to the present embodiment, the plating layermay not include the upper surface plating layerand may include the lower surface plating layer. In this case, the plating layermay include the side surface plating layerand the lower surface plating layerand thus, may be disposed on the inner side surfaces of the plurality of slits SLT, the lower surface of each of the plurality of bars BAR, the lower surface of the first non-folding portion, the lower surface of the second non-folding portion, and the lower surface of the side surface plating layerbut may not be disposed on the upper surface of each of the plurality of bars BAR, the upper surface of the first non-folding portion, the upper surface of the second non-folding portion, and the upper surface of the side surface plating layer.

750 700 720 730 14 FIG. The plating layerof the panel support memberaccording to an embodiment ofmay be formed by masking the upper surface of each of the plurality of bars BAR, the upper surface of the first non-folding portion, and the upper surface of the second non-folding portion.

15 FIG. 10 750 753 752 750 751 752 720 730 751 720 730 751 In an embodiment, as illustrated in, in the display deviceaccording to the present embodiment, the plating layermay not include the lower surface plating layerand may include the upper surface plating layer. In this case, the plating layermay include the side surface plating layerand the upper surface plating layerand thus, may be disposed on the inner side surfaces of the plurality of slits SLT, the upper surface of each of the plurality of bars BAR, the upper surface of the first non-folding portion, the upper surface of the second non-folding portion, and the upper surface of the side surface plating layerbut may not be disposed on the lower surface of each of the plurality of bars BAR, the lower surface of the first non-folding portion, the lower surface of the second non-folding portion, and the lower surface of the side surface plating layer.

750 700 720 730 15 FIG. The plating layerof the panel support memberaccording to an embodiment ofmay be formed by masking the lower surface of each of the plurality of bars BAR, the lower surface of the first non-folding portion, and the lower surface of the second non-folding portion.

10 752 753 1 700 750 2 700 750 750 750 The display devicesaccording to the present embodiments include only any one of the upper surface plating layerand the lower surface plating layer, and thus, the thickness THof the panel support memberexcluding the plating layermay be smaller than the thickness THof the panel support memberincluding the plating layerby the thickness TH_of the plating layer.

10 750 750 700 700 700 Accordingly, in the display devicesaccording to the present embodiments, by adjusting the thickness TH_of the plating layer, it is possible to adjust the thickness of the panel support memberand it is possible to adjust rigidity and other properties of the panel support memberaccording to the thickness of the panel support member.

10 752 753 700 In addition, with the display devicesaccording to the present embodiments, any one of the upper surface plating layerand the lower surface plating layermay be omitted in consideration of a relationship with another member disposed on the upper surface or the lower surface of the panel support member, adhesive strength of an adhesive member, or the like.

16 FIG. 700 is a cross-sectional view illustrating a panel support memberaccording to an embodiment.

16 FIG. 10 FIG. 10 10 752 753 720 730 Referring to, a display deviceaccording to the present embodiment is different from the display deviceaccording to an embodiment described with reference toor the like in that the upper surface plating layerand the lower surface plating layerare not disposed on the non-folding portionsand.

10 750 10 750 750 700 10 FIG. More specifically, in the display deviceaccording to the present embodiment, the plating layermay be disposed inside the plurality of slits SLT, similar to the display deviceaccording to an embodiment described with reference toor the like. For example, the plating layermay be disposed on inner side surfaces of the plurality of slits SLT. As the plating layeris disposed on the inner side surfaces of the plurality of slits SLT, the panel support membermay include a plurality of openings OP having a smaller size than the plurality of slits SLT. A width W_OP of each of the plurality of openings OP may be smaller than a width W_SLT of each of the plurality of slits SLT.

10 750 720 730 750 710 752 753 710 720 730 However, in the display deviceaccording to the present embodiment, a disposition of the plating layerin the non-folding portionsandand a disposition of the plating layerin the folding portionmay be different from each other. For example, the upper surface plating layerand the lower surface plating layermay be disposed on the folding portion, and may not be disposed on the non-folding portionsand.

751 710 3 720 730 3 752 753 710 3 720 730 3 The side surface plating layermay overlap the folding portionin the third direction DR, and may not overlap the non-folding portionsandin the third direction DR. Each of the upper surface plating layerand the lower surface plating layermay overlap the folding portionin the third direction DR, and may not overlap the non-folding portionsandin the third direction DR.

752 753 752 720 730 753 720 730 The upper surface plating layermay be disposed on the upper surface of each of the plurality of bars BAR, and the lower surface plating layermay be disposed on the lower surface of each of the plurality of bars BAR. The upper surface plating layermay not be disposed on the upper surface of the first non-folding portionand the upper surface of the second non-folding portion, and the lower surface plating layermay not be disposed on the lower surface of the first non-folding portionand the lower surface of the second non-folding portion.

752 751 751 720 730 753 751 751 720 730 The upper surface plating layermay be disposed on upper surfaces of the side surface plating layersdisposed on both sides of each of the plurality of bars BAR, and may not be disposed on upper surfaces of the side surface plating layersadjacent to the first non-folding portionand the second non-folding portion. The lower surface plating layermay be disposed on lower surfaces of the side surface plating layersdisposed on both sides of each of the plurality of bars BAR, and may not be disposed on lower surfaces of the side surface plating layersadjacent to the first non-folding portionand the second non-folding portion.

750 700 720 730 The plating layerof the panel support memberaccording to the present embodiment may be formed by masking the upper and lower surfaces of the first non-folding portionand the upper and lower surfaces of the second non-folding portion.

10 750 720 730 550 710 700 720 730 700 710 1 700 750 720 730 1 700 750 710 In the display deviceaccording to the present embodiment, the disposition of the plating layerin the non-folding portionsandand the disposition of the plating layerin the folding portionare different from each other, and thus, a thickness of the panel support memberin the non-folding portionsandand a thickness of the panel support memberin the folding portionmay be different from each other. For example, the thickness THof the panel support memberexcluding the plating layerin the non-folding portionsandand the thickness THof the panel support memberexcluding the plating layerin the folding portionmay be the same as each other.

2 700 750 720 730 2 700 750 710 2 1 700 750 710 1 700 750 750 750 750 750 2 2 700 750 720 730 1 700 750 700 720 730 750 750 In an embodiment, the thickness THof the panel support memberincluding the plating layerin the non-folding portionsandand the thickness THof the panel support memberincluding the plating layerin the folding portionmay be different from each other. For example, a thickness TH_of the panel support memberincluding the plating layerin an area overlapping the folding portionmay be greater than the thickness THof the panel support memberexcluding the plating layerby the thickness TH_of the plating layer(e.g., two times the thickness TH_of the plating layer). A thickness TH_of the panel support memberincluding the plating layerin areas overlapping the non-folding portionsandmay be the same as the thickness THof the panel support memberexcluding the plating layer. That is, the entire thickness of the panel support memberin the areas overlapping the non-folding portionsandmay be the same regardless of whether or not it includes the thickness TH_of the plating layer.

10 750 720 730 750 710 720 730 710 750 710 720 730 752 753 710 710 720 730 In the display deviceaccording to the present embodiment, by making the disposition of the plating layerin the non-folding portionsandand the disposition of the plating layerin the folding portiondifferent from each other, it is possible to balance impact resistance in the non-folding portionsandand the folding portion. For example, when the plating layeris not included, the folding portionmay have lower impact resistance than the non-folding portionsand. Accordingly, by disposing the upper surface plating layerand the lower surface plating layeronly on the folding portionhaving relatively lower impact resistance, it is possible to balance the impact resistance in the folding portionand the non-folding portionsand.

In concluding the detailed description, those skilled in the art will appreciate that many variations and modifications can be made to the embodiments without substantially departing from the principles of the present disclosure. Therefore, the disclosed embodiments of the inventive concept are used in a generic and descriptive sense only and not for purposes of limitation.